JPH0775271B2 - Manufacturing method of electronic circuit device - Google Patents
Manufacturing method of electronic circuit deviceInfo
- Publication number
- JPH0775271B2 JPH0775271B2 JP63309501A JP30950188A JPH0775271B2 JP H0775271 B2 JPH0775271 B2 JP H0775271B2 JP 63309501 A JP63309501 A JP 63309501A JP 30950188 A JP30950188 A JP 30950188A JP H0775271 B2 JPH0775271 B2 JP H0775271B2
- Authority
- JP
- Japan
- Prior art keywords
- plate
- printed circuit
- circuit board
- soldering
- reflow soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 3
- 238000005476 soldering Methods 0.000 claims description 23
- 239000000758 substrate Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 15
- 239000000463 material Substances 0.000 description 14
- 239000011521 glass Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、熱容量の異なる板を平板状に組合せた基材板
上に所定の配線部を有するフレキシブル基板を接着して
成るプリント基板に回路部品を組込んだ電子回路装置の
製造法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board mounted on a printed circuit board by bonding a flexible board having a predetermined wiring portion on a base material plate in which plates having different heat capacities are combined in a flat plate shape. The present invention relates to a method of manufacturing an incorporated electronic circuit device.
従来の技術 近年、混成集積回路装置等の電子回路装置においては、
部品の消費電力からくる熱を効率良く放熱できる金属板
をベースとしたプリント基板が多方面で使用されてきて
いる。合せて、自由に折り曲げられ、機器をコンパクト
にできるフレキシブル基板も多く使用されている。この
両方の特性、すなわち放熱効率が良く、機器のコンパク
ト化が可能な構造としてフレキシブル基板を金属板に接
着させたプリント基板が考えられている。また、フェノ
ールやガラスエポキシ樹脂の基材板も、金属板と合せて
フレキシブル基板に接着され使用されているものがあ
る。2. Description of the Related Art In recent years, in electronic circuit devices such as hybrid integrated circuit devices,
A printed circuit board based on a metal plate that can efficiently dissipate heat generated from power consumption of components has been used in various fields. In addition, flexible substrates that can be freely bent to make devices compact are also widely used. A printed circuit board in which a flexible substrate is adhered to a metal plate has been considered as a structure that has both of these characteristics, that is, good heat dissipation efficiency and enables device compactness. In addition, there are some base plates made of phenol or glass epoxy resin that are used by being bonded to a flexible substrate together with a metal plate.
このプリント基板を用いた電子回路装置の一例を第４図
〜第７図の図面を用いて説明する。An example of an electronic circuit device using this printed board will be described with reference to FIGS. 4 to 7.
第４図は金属板及びフェノール板にフレキシブル基板を
接着した多数個取りプリント基板１の斜視図である。厚
み1.6mmのフェノール板３を外枠とし、このフェノール
板３の数箇所に四角形状に穴3cをあけてあり、その穴3c
を埋める様にフェノール板３と同一厚みのアルミニウム
（Al）板４が平板状にはめ込まれている。また、フレキ
シブル基板５がフェノール板3,Al板４とにまたがる様
に、フェノール板３とAl板４の表面に数箇所にわたり接
着されている。Al板４上のフレキシブル基板5aには回路
部品が実装されはんだ付けされる。ここで示した多数個
取りプリント基板１は３枚のプリント基板２から成り、
フェノール板３がフレキシブル基板５に接着されている
部分3aは、機器として構成されるプリント基板２の一部
として使用される。また、他の部分3bはプリント基板２
のケース等への組込みまでの補強板として使用され、フ
レキシブル基板５が容易に折れ曲ることを防止し、回路
部品の実装，リフローはんだ付け後は取り除かれる。第
６図に、回路部品７を実装し、リフローはんだ付けした
後、不必要な部分3bを取り除いたプリント基板２の斜視
図を示す。FIG. 4 is a perspective view of a multi-piece printed circuit board 1 in which a flexible board is adhered to a metal plate and a phenol plate. A phenol plate 3 with a thickness of 1.6 mm is used as an outer frame, and holes 3c are formed in a square shape in several places of this phenol plate 3.
An aluminum (Al) plate 4 having the same thickness as the phenol plate 3 is fitted in a flat plate shape so that Further, the flexible substrate 5 is adhered to the surfaces of the phenol plate 3 and the Al plate 4 at several points so that the flexible substrate 5 extends over the phenol plate 3 and the Al plate 4. Circuit components are mounted on the flexible substrate 5a on the Al plate 4 and soldered. The multi-piece printed circuit board 1 shown here is composed of three printed circuit boards 2.
The portion 3a where the phenol plate 3 is adhered to the flexible substrate 5 is used as a part of the printed circuit board 2 configured as a device. The other portion 3b is the printed circuit board 2
It is used as a reinforcing plate until it is incorporated into a case or the like, and prevents the flexible substrate 5 from being easily bent, and is removed after mounting circuit components and reflow soldering. FIG. 6 shows a perspective view of the printed circuit board 2 in which the unnecessary parts 3b are removed after the circuit components 7 are mounted and reflow soldered.
第５図（ａ），（ｂ）は第４図に示した多数個取りプリ
ント基板のＡ′−Ａ′及びＢ′−Ｂ′の断面図である。
また第７図はリフローはんだ付けの際の各部の温度分布
を示す図である。なお、第５図（ａ），（ｂ）の断面図
は、分かりやすく説明するためで縦方向の寸法は横方向
に比べ拡大している。5 (a) and 5 (b) are cross-sectional views of A'-A 'and B'-B' of the multi-piece printed circuit board shown in FIG.
Further, FIG. 7 is a view showing a temperature distribution of each part at the time of reflow soldering. The cross-sectional views of FIGS. 5 (a) and 5 (b) are enlarged in the vertical direction for the sake of easy understanding.
フレキシブル基板５は前述した様にフェノール板３の部
分3a,3b及びAl板４とにまたがる様に接着材６で接着さ
れており、フレキシブル基板５のAl板４上の部分5aに回
路部品７を実装しリフローはんだ付けされる。通常、リ
フローはんだ付けの際、プリント基板は全体を加熱され
る様なリフロー槽を通過させ、回路部品をリフローはん
だ付けする。その際、熱容量の多きなAl板４の温度を十
分上昇させるため、熱容量の小さなフェノール板３上の
温度は第７図に示す様にAl板４上の温度より高くなって
いた。As described above, the flexible substrate 5 is adhered with the adhesive 6 so as to straddle the portions 3a, 3b of the phenol plate 3 and the Al plate 4, and the circuit component 7 is attached to the portion 5a on the Al plate 4 of the flexible substrate 5. Mounted and reflow soldered. Usually, during reflow soldering, the printed circuit board is passed through a reflow bath in which the whole is heated to reflow solder the circuit components. At that time, in order to sufficiently raise the temperature of the Al plate 4 having a large heat capacity, the temperature on the phenol plate 3 having a small heat capacity was higher than the temperature on the Al plate 4 as shown in FIG.
発明が解決しようとする課題 上記の様な全体加熱リフロー槽でのリフローはんだ付け
では、基板材質である金属板の様な熱容量の大きな物
と、フェノールまたは、ガラスエポキシ樹脂等の基材板
の様な熱容量の小さな物が同時に加熱される際、材質が
異なる板の温度が不均一となる。特に第４図，第５図に
示した様なプリント基板構成であるとリフローはんだ付
けされる際、Al板４上にある回路部品７のはんだ付けに
必要な熱量を与えようとすると、フェノール板３の温度
が第７図に示す様に必要以上、上がりすぎ、基材が焼け
たり、基材板の反りが大きくなってフレキシブル基板５
の接着がはがれるという問題点があった。Problems to be Solved by the Invention In reflow soldering in the overall heating reflow bath as described above, a material having a large heat capacity such as a metal plate which is a substrate material, and a base plate such as phenol or glass epoxy resin When objects with a small heat capacity are simultaneously heated, the temperatures of the plates made of different materials become non-uniform. In particular, when the printed circuit board structure as shown in FIG. 4 and FIG. 5 is used for reflow soldering, when an amount of heat necessary for soldering the circuit component 7 on the Al plate 4 is applied, the phenol plate As shown in FIG. 7, the temperature of 3 is excessively increased more than necessary, the base material is burned, and the warp of the base material plate becomes large, so that the flexible substrate 5
There was a problem that the adhesiveness of the peeled off.
本発明は上記の問題点を鑑みて成されたものであり、熱
をあまり与えたくない基材板、すなわち回路部品のはん
だ付けに関係なく、熱に対して弱い部分の温度上昇をお
さえ、基材板の焼け，反りを防止しかつ回路部品が実装
されている金属板上のはんだ付けをも良好に行なうこと
を目的とする。The present invention has been made in view of the above problems, and suppresses the temperature rise of a weak portion to heat regardless of the soldering of a base plate that does not want to give much heat, that is, circuit components, The purpose of the invention is to prevent burning and warpage of the material plate and to perform good soldering on the metal plate on which the circuit components are mounted.
課題を解決するための手段 そこで、本発明はリフローはんだ付けの際、樹脂基材板
上に金属製等の当て板を配置し、熱に対して弱い基材の
温度上昇をおさえるものである。[Means for Solving the Problems] Therefore, in the present invention, during reflow soldering, a backing plate made of metal or the like is arranged on a resin base material plate to suppress the temperature rise of the base material which is weak against heat.
作 用 この構成により、リフローはんだ付け時の当て板は、材
質の異なる基材板を合せ持つプリント基板の熱に対して
弱い基材板の温度上昇をおさえることができ、基材板焼
け，反りを防止でき、プリント基板の品質，信頼性をそ
こなうことなくリフローはんだ付けができる。Operation With this configuration, the backing plate during reflow soldering can suppress the temperature rise of the base plate that is weak against the heat of the printed circuit board that has the base plates of different materials together, and the base plate burns and warps. This prevents reflow soldering without compromising the quality and reliability of the printed circuit board.
実施例 以下、第１図〜第３図の図面を用い、本発明の実施例を
説明する。Embodiments Embodiments of the present invention will be described below with reference to FIGS. 1 to 3.
第１図及び第２図（ａ），（ｂ）は、本発明の一実施例
を説明する図であり、第４図及び第５図（ａ），（ｂ）
と同一の部分については同一符号を付している。1 and 2 (a) and (b) are diagrams for explaining one embodiment of the present invention, and FIGS. 4 and 5 (a) and (b).
The same reference numerals are given to the same portions as.
第１図は、リフローはんだ付け時の当て板８を第４図で
説明した多数個取りプリント基板１上に配置して装着し
た状態を示す図である。多数個取りプリント基板１のAl
板４上に構成された回路部品７の実装部分を除き、ステ
ンレス製の厚さ0.5mmの当て板８を多数個取りプリント
基板１の上に配置して装着しているものである。この状
態でリフローはんだ付けが行なわれる。FIG. 1 is a view showing a state in which the contact plate 8 at the time of reflow soldering is arranged and mounted on the multi-piece printed circuit board 1 described in FIG. Multi-cavity printed circuit board 1 Al
Except for the mounting portion of the circuit component 7 formed on the plate 4, a large number of stainless steel contact plates 8 having a thickness of 0.5 mm are arranged and mounted on the printed circuit board 1. Reflow soldering is performed in this state.
第２図（ａ），（ｂ）は第１図のＡ−Ａ及びＢ−Ｂの断
面図であるが、熱容量の小さなフェノール板３の部分3
a,3b上にリフローはんだ付け用の当て板８があり、全体
加熱のリフロー槽で回路部品７をはんだ付けする際、Al
板４の上に構成されている回路部品７のはんだ付けに必
要な温度まで加熱しても、当て板８が当てがわれて配置
されているので、熱に対して弱いフェノール板3a,3bの
温度上昇は第３図に示す様におさえられ、フェノール板
３の焼け，反りを防止してリフローはんだ付けすること
ができる。そして、リフローはんだ付けを行なった後
は、当て板８を取り除き、プリント基板１を所定の形
状，大きさで切断することにより、第６図に示す様に、
プリント基板２上に回路部品が実装された電子回路装置
を得ることができる。2 (a) and 2 (b) are cross-sectional views taken along the lines AA and BB in FIG. 1, showing a portion 3 of the phenol plate 3 having a small heat capacity.
There is a reflow soldering contact plate 8 on a, 3b, and when soldering the circuit component 7 in the reflow bath for total heating,
Even if the circuit component 7 formed on the plate 4 is heated to the temperature required for soldering, the patch plate 8 is placed so that the phenol plates 3a and 3b are vulnerable to heat. The temperature rise is suppressed as shown in FIG. 3, and the phenol plate 3 can be prevented from being burnt or warped and can be reflow-soldered. After performing the reflow soldering, the contact plate 8 is removed, and the printed board 1 is cut into a predetermined shape and size, as shown in FIG.
An electronic circuit device in which circuit components are mounted on the printed board 2 can be obtained.
尚、本実施例では、当て板８にステンレス製の板を使用
したが、他のAlなどの金属でも良く、熱に対して強いセ
ラミック，耐熱ガラス，シリコン樹脂などの板でもよ
い。また、本実施例では、当て板８は多数個取りプリン
ト基板１の上に配置したが、下に配置してもよい。さら
に、上下双方に当て板８を当てがって配置することによ
り、より効率良く温度上昇をおさえることができる。In this embodiment, a stainless steel plate is used as the backing plate 8, but other metal such as Al may be used, or heat resistant ceramics, heat resistant glass, silicon resin, etc. may be used. Further, in the present embodiment, the contact plate 8 is arranged on the multi-piece printed circuit board 1, but it may be arranged below. Further, by disposing the contact plates 8 on both the upper and lower sides, the temperature rise can be suppressed more efficiently.
発明の効果 以上の説明から明らかな様に本発明によれば、材質が異
なり、熱容量も異なる基材を有するプリント基板のリフ
ローはんだ付けの際、熱に対して弱い基材板上に当て板
を配置することにより、基材焼け，反りを防止し、プリ
ント基板の品質、及び信頼性を損うことなくリフローは
んだ付けができる。EFFECTS OF THE INVENTION As is apparent from the above description, according to the present invention, when the reflow soldering of the printed circuit board having the base material of which the material is different and the heat capacity is also different, the backing plate is placed on the base plate weak against heat. By arranging them, the base material can be prevented from being burnt and warped, and the reflow soldering can be performed without impairing the quality and reliability of the printed circuit board.
第１図及び第２図（ａ），（ｂ）は本発明の一実施例を
説明するための図であり、第１図は多数個取りプリント
基板にリフローはんだ付け時の当て板を装着した斜視
図、第２図（ａ），（ｂ）は第１図のＡ−Ａ線,B−Ｂ線
で切断した断面図、第３図はリフローはんだ付けの際の
第２図（ａ）のａ部〜ｄ部の各部の温度分布図、第４図
及び第５図（ａ），（ｂ）は従来例を説明するための図
であり、第４図は多数個取りプリント基板の斜視図、第
５図（ａ），（ｂ）は第４図のＡ′−Ａ′線,B′−Ｂ′
線で切断した断面図、第６図は多数個取りプリント基板
を分割した後のプリント基板斜視図、第７図はリフロー
はんだ付けの際の第５図（ａ）のａ部〜ｄ部の各部の温
度分布図である。 １……多数個取りプリント基板、２……分割した後のプ
リント基板、３……フェノール板、４……アルミニウム
板、５……フレキシブル基板、６……接着材、７……回
路部品、８……当て板。1 and 2 (a) and (b) are views for explaining one embodiment of the present invention. FIG. 1 shows a multi-piece printed circuit board to which a backing plate for reflow soldering is attached. FIG. 2 (a) and FIG. 2 (b) are sectional views taken along the lines AA and BB of FIG. 1, and FIG. 3 is a view of FIG. 2 (a) during reflow soldering. FIGS. 4 and 5 (a) and (b) are views for explaining a conventional example, and FIG. 4 is a perspective view of a multi-piece printed circuit board. 5 (a) and 5 (b) are lines A'-A 'and B'-B' in FIG.
FIG. 6 is a sectional view taken along a line, FIG. 6 is a perspective view of a printed circuit board after dividing a multi-cavity printed circuit board, and FIG. 7 is each part from part a to part d of FIG. It is a temperature distribution diagram of. 1 ... Multi-piece printed circuit board, 2 ... Printed circuit board after division, 3 ... Phenolic plate, 4 ... Aluminum plate, 5 ... Flexible board, 6 ... Adhesive material, 7 ... Circuit parts, 8 …… A back plate.
Claims (1)
とともに、その金属板と樹脂基材板の表面にこの金属板
と樹脂基材板とにまたがるように所定の配線部を形成し
たフレキシブル基板を接着してプリント基板を構成し、
上記金属板に接着されたフレキシブル基板の上記配線部
にのみ回路部品をはんだ付けする際に、熱容量の小さい
上記樹脂基材板上にのみ当て板を配置し、この状態でリ
フローはんだ付けを行なうことを特徴とする電子回路装
置の製造法。1. A metal plate and a resin base plate are arranged in a flat plate shape, and a predetermined wiring portion is provided on the surface of the metal plate and the resin base plate so as to extend over the metal plate and the resin base plate. The formed flexible board is bonded to form a printed circuit board,
When soldering a circuit component only to the wiring part of the flexible substrate adhered to the metal plate, place a backing plate only on the resin base plate having a small heat capacity, and perform reflow soldering in this state. And a method for manufacturing an electronic circuit device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63309501A JPH0775271B2 (en) | 1988-12-07 | 1988-12-07 | Manufacturing method of electronic circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63309501A JPH0775271B2 (en) | 1988-12-07 | 1988-12-07 | Manufacturing method of electronic circuit device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02155291A JPH02155291A (en) | 1990-06-14 |
| JPH0775271B2 true JPH0775271B2 (en) | 1995-08-09 |
Family
ID=17993753
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63309501A Expired - Lifetime JPH0775271B2 (en) | 1988-12-07 | 1988-12-07 | Manufacturing method of electronic circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0775271B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6946758B2 (en) | 2001-01-09 | 2005-09-20 | Black & Decker Inc. | Dynamoelectric machine having encapsulated coil structure with one or more of phase change additives, insert molded features and insulated pinion |
| US7096566B2 (en) | 2001-01-09 | 2006-08-29 | Black & Decker Inc. | Method for making an encapsulated coil structure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6387794A (en) * | 1986-09-30 | 1988-04-19 | 富士通株式会社 | Reflow circuit board - soldering tool and soldering method |
-
1988
- 1988-12-07 JP JP63309501A patent/JPH0775271B2/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6946758B2 (en) | 2001-01-09 | 2005-09-20 | Black & Decker Inc. | Dynamoelectric machine having encapsulated coil structure with one or more of phase change additives, insert molded features and insulated pinion |
| US7096566B2 (en) | 2001-01-09 | 2006-08-29 | Black & Decker Inc. | Method for making an encapsulated coil structure |
| US7215048B2 (en) | 2001-01-09 | 2007-05-08 | Black & Decker Inc. | Dynamoelectric machine having encapsulated coil structure with one or more of phase change additives, insert molded features and insulated pinion |
| US7464455B2 (en) | 2001-01-09 | 2008-12-16 | Black & Decker Inc. | Method for forming an armature for an electric motor |
| US7591063B2 (en) | 2001-01-09 | 2009-09-22 | Black & Decker Inc. | Method of making an armature |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02155291A (en) | 1990-06-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0775271B2 (en) | Manufacturing method of electronic circuit device | |
| JPH05326761A (en) | Mounting structure of thermal conductive spacer | |
| JPH06181396A (en) | Heat pipe system cooling device for circuit board | |
| US20020014351A1 (en) | Module-mounting motherboard device | |
| WO1999002023A1 (en) | Device for a circuit board | |
| JP2000114608A (en) | Circuit board mounting method and circuit board mounting structure | |
| JP3648896B2 (en) | Semiconductor device | |
| JPH0316311Y2 (en) | ||
| KR102528723B1 (en) | Zig for reflow soldering of fpcb | |
| JP2728996B2 (en) | Multi-terminal connection structure | |
| JPH02263497A (en) | Manufacture of electronic circuit device | |
| JP2547861B2 (en) | Method of manufacturing thermal head | |
| JP3878858B2 (en) | Manufacturing method of resin substrate | |
| JPH06232514A (en) | Assembly method of heat dissipation type printed circuit board | |
| JP2813683B2 (en) | Substrate for mounting electronic components | |
| JPH08264910A (en) | Manufacture of printed wiring board with heat sink and method for mounting high-power component on the board | |
| JPH0223005Y2 (en) | ||
| JPH0724330B2 (en) | Hybrid integrated circuit device | |
| JP3680398B2 (en) | Printed wiring board | |
| JPH04255294A (en) | Heat dissipating structure and mounting method of heat dissipating plate | |
| JPH1126924A (en) | Method for soldering flexible printed wiring board and jig for soldering the same | |
| JP2007173542A (en) | Board structure, board manufacturing method, and electronic appliance | |
| JP2001168503A (en) | Printed wiring board | |
| JPH0615269U (en) | Lead array for hybrid integrated circuit device | |
| JPH03126287A (en) | Printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20070809 Year of fee payment: 12 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080809 Year of fee payment: 13 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080809 Year of fee payment: 13 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090809 Year of fee payment: 14 |
|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090809 Year of fee payment: 14 |