[go: up one dir, main page]

JPH0223005Y2 - - Google Patents

Info

Publication number
JPH0223005Y2
JPH0223005Y2 JP19872584U JP19872584U JPH0223005Y2 JP H0223005 Y2 JPH0223005 Y2 JP H0223005Y2 JP 19872584 U JP19872584 U JP 19872584U JP 19872584 U JP19872584 U JP 19872584U JP H0223005 Y2 JPH0223005 Y2 JP H0223005Y2
Authority
JP
Japan
Prior art keywords
pattern
spacer
circuit board
circuit pattern
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP19872584U
Other languages
Japanese (ja)
Other versions
JPS61117272U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19872584U priority Critical patent/JPH0223005Y2/ja
Publication of JPS61117272U publication Critical patent/JPS61117272U/ja
Application granted granted Critical
Publication of JPH0223005Y2 publication Critical patent/JPH0223005Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)

Description

【考案の詳細な説明】 「産業上の利用分野」 本考案は、可撓性回路基板に関し、特には、回
路パターン上に電子、電気部品或いはその他の部
品を可及的に水平に搭載するような用途に好適な
可撓性回路基板に関する。
[Detailed Description of the Invention] "Industrial Application Field" The present invention relates to flexible circuit boards, and in particular, to mounting electronic or electrical components or other components on a circuit pattern as horizontally as possible. The present invention relates to a flexible circuit board suitable for various uses.

「従来の技術」 この種の可撓性回路基板は、第2図に示すよう
に、ポリイミドフイルム、ポリイミドフイルム等
からなるシート状の可撓性ベース部材1に銅箔等
からなる所要の回路パターン2,3,4等を被着
し、更に、該回路パターンを保護するために絶縁
インクまたはカバーレイフイルム等の表面被覆材
5を形成し、必要に応じて、ベース部材1の裏面
には接着層6を介して補強部材7を設けるような
構造を備える。8及び9は搭載部品を示す。
``Prior Art'' This type of flexible circuit board, as shown in FIG. 2, 3, 4, etc., and further, a surface covering material 5 such as insulating ink or coverlay film is formed to protect the circuit pattern, and if necessary, adhesive is applied to the back surface of the base member 1. A structure is provided in which a reinforcing member 7 is provided through a layer 6. 8 and 9 indicate mounted parts.

「考案が解決しようとする問題点」 このような場合、搭載部品8,9の種類によつ
ては、可撓性回路基板に高いフラツト性が要求さ
れるため、回路パターン2,3,4とベース部材
1との間の段差でさえも問題になるような場合が
ある。即ち、第2図のように、回路パターン2上
に一端が配置されるように搭載された部品8は傾
斜することになり、また、回路パターン3,4間
にまたがつて配置、搭載された部品9は中間部が
垂れ下つた状態になり、平行性を得ることが困難
となる。そのため、従来、斯かる搭載部品の傾
斜、そり等を防止するため、別部品として用意し
たスペーサ部材を可撓性回路基板と部品との間に
介装するような手法もあるが、そのようにして
も、スペーサ部材の材質、厚み等によつては部品
の傾斜、そり等を完全に解消できず、且つ、その
場合、可撓性回路基板と部品との総体的な積層厚
が増し、実装上不都合を生ずる虞があつた。
"Problems to be solved by the invention" In such a case, depending on the type of mounted components 8 and 9, high flatness is required for the flexible circuit board, so the circuit patterns 2, 3, and 4 are Even a difference in level between the base member 1 and the base member 1 may sometimes become a problem. That is, as shown in FIG. 2, the component 8 mounted so that one end is placed on the circuit pattern 2 is inclined, and the component 8 is placed and mounted astride between the circuit patterns 3 and 4. The middle part of the part 9 becomes sagging, making it difficult to obtain parallelism. Therefore, in order to prevent such mounted components from tilting, warping, etc., there is a conventional method of inserting a spacer member prepared as a separate component between the flexible circuit board and the component, but this method is not possible. However, depending on the material, thickness, etc. of the spacer member, it may not be possible to completely eliminate tilting, warping, etc. of the component, and in that case, the overall laminated thickness of the flexible circuit board and the component may increase, making it difficult to mount the component. There was a risk that this would cause some inconvenience.

「問題点を解決する為の手段」 本考案は上記問題を解決するために為されたも
ので、そのため、本考案によれば、ベース部材の
少なくとも一方の面に所望の回路パターンを形成
した可撓性回路基板において、前記回路パターン
形成における余白部分に該回路パターンと同一面
をなすようなスペーサ用パターンを設けるように
構成したものである。
"Means for Solving the Problems" The present invention has been made to solve the above problems, and therefore, according to the present invention, it is possible to form a desired circuit pattern on at least one surface of the base member. In the flexible circuit board, a spacer pattern is provided on the same surface as the circuit pattern in a blank area where the circuit pattern is formed.

「作 用」 このようにベース部材上に回路パターンと混在
させてスペーサ用パターンを設けることにより、
回路パターンの存在する部分とそれ以外の部分と
の段差がなくなり、従つて、回路パターン上に配
置した部品の傾斜、そり等の発生を防止し且つ可
撓性回路基板自体の強度を好適に高め得る。
"Function" By providing the spacer pattern mixed with the circuit pattern on the base member in this way,
There is no difference in level between the part where the circuit pattern is present and the other parts, thus preventing the occurrence of tilting, warping, etc. of parts arranged on the circuit pattern, and suitably increasing the strength of the flexible circuit board itself. obtain.

「実施例」 本考案の一実施例を示す第1図に於いて、ベー
ス部材1の一方の面には、接着層を介して所要の
回路パターン2,3,4等を常法に従つて形成す
るものであるが、本考案に於いては、ベース部材
1上の回路パターン3の形成面に於ける余白部分
に、配置しようとする部品8,9に応じて、回路
パターン2に隣接させ、或いは、回路パターン
3,4に挟まれた部分に、スペーサ用パターン1
0,11を設けるものである。斯かるスペーサ用
パターン10,11は、例えばエツチングにより
銅箔から回路パターン2等を形成する際に、銅箔
を残置しておくことにより簡便に形成することが
できる。そして、回路パターン2,3,4等及び
スペーサ用パターン10,11の双方にわたつて
表面被覆材5を被着させるものである。
"Embodiment" In FIG. 1 showing an embodiment of the present invention, required circuit patterns 2, 3, 4, etc. are formed on one surface of a base member 1 via an adhesive layer in accordance with a conventional method. However, in the present invention, in the blank area on the surface of the circuit pattern 3 on the base member 1, the parts 8 and 9 to be placed are placed adjacent to the circuit pattern 2. , or the spacer pattern 1 is placed between the circuit patterns 3 and 4.
0 and 11 are provided. Such spacer patterns 10 and 11 can be easily formed by leaving the copper foil when forming the circuit pattern 2 etc. from the copper foil by etching, for example. Then, the surface covering material 5 is applied over both the circuit patterns 2, 3, 4, etc. and the spacer patterns 10, 11.

上記構造の可撓性回路基板によれば、図示の如
く、回路パターン2に一端がかかるように部品8
を搭載した場合、部品8はスペーサ用パターン1
0によつても支持されるので傾斜することがな
く、また、部品9の場合は、回路パターン3,4
に加えて他のスペーサ用パターン11によつても
支持されるので、従来の如く、部品8,9が傾斜
したり垂れ下がることがなくなる。しかも、スペ
ーサ用パターン10,11を設けることによつ
て、基板全体の強度も適度に高まることとなる。
According to the flexible circuit board having the above structure, as shown in the figure, the component 8 is placed so that one end thereof covers the circuit pattern 2.
When mounted, part 8 is spacer pattern 1
0, so it does not tilt, and in the case of component 9, the circuit patterns 3 and 4
In addition to this, the parts 8 and 9 are also supported by other spacer patterns 11, so that the parts 8 and 9 do not incline or hang down as in the conventional case. Furthermore, by providing the spacer patterns 10 and 11, the strength of the entire substrate can be appropriately increased.

「考案の効果」 以上のように、本考案によれば、回路パターン
面とスペーサ用パターンによつて部品搭載面が平
面化されるので、前述のように水平実装を要求さ
れる如き部品を回路パターン上に配置、搭載する
ような場合に、部品が傾斜したり、そつたりする
虞がなく、従つて、これら部品と可撓性回路基板
との間の所定の実装状態及び動作を確保できる。
また、別部品としての前述の如き傾斜、そりを防
止する為のスペーサを使用する必要がなく、且つ
スペーサ用パターンを設けることにより強度が増
すという利点も得られる。
"Effects of the Invention" As described above, according to the present invention, the component mounting surface is flattened by the circuit pattern surface and the spacer pattern. When arranged and mounted on a pattern, there is no risk that the components will be tilted or warped, and therefore a predetermined mounting state and operation between these components and the flexible circuit board can be ensured.
Further, it is not necessary to use a spacer as a separate component to prevent inclination and warping as described above, and the provision of a spacer pattern has the advantage that strength is increased.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案に係る可撓性回路基板の一実施
例を概念的に示す断面図、そして、第2図は従来
の可撓性回路基板を概念的に示す断面図である。 1:ベース部材、2,3,4:回路パターン、
5:表面被覆材、6:接着層、7:補強部材、1
0,11:スペーサ用パターン。
FIG. 1 is a sectional view conceptually showing an embodiment of a flexible circuit board according to the present invention, and FIG. 2 is a sectional view conceptually showing a conventional flexible circuit board. 1: Base member, 2, 3, 4: Circuit pattern,
5: Surface covering material, 6: Adhesive layer, 7: Reinforcing member, 1
0, 11: Spacer pattern.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ベース部材の少なくとも一方の面に所望の回路
パターンを形成した可撓性回路基板において、前
記回路パターン形成における余白部分に該回路パ
ターンと同一面をなすようなスペーサ用パターン
を設けてなる可撓性回路基板。
A flexible circuit board in which a desired circuit pattern is formed on at least one surface of a base member, and a spacer pattern is provided in a blank area where the circuit pattern is formed so as to be flush with the circuit pattern. circuit board.
JP19872584U 1984-12-29 1984-12-29 Expired JPH0223005Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19872584U JPH0223005Y2 (en) 1984-12-29 1984-12-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19872584U JPH0223005Y2 (en) 1984-12-29 1984-12-29

Publications (2)

Publication Number Publication Date
JPS61117272U JPS61117272U (en) 1986-07-24
JPH0223005Y2 true JPH0223005Y2 (en) 1990-06-21

Family

ID=30757982

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19872584U Expired JPH0223005Y2 (en) 1984-12-29 1984-12-29

Country Status (1)

Country Link
JP (1) JPH0223005Y2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5029953B2 (en) * 2006-10-27 2012-09-19 Nok株式会社 Seal structure
WO2009041087A1 (en) * 2007-09-26 2009-04-02 Nok Corporation Sealing structure

Also Published As

Publication number Publication date
JPS61117272U (en) 1986-07-24

Similar Documents

Publication Publication Date Title
US5294755A (en) Printed wiring board having shielding layer
JPH0223005Y2 (en)
JPH05327163A (en) Electronic component mounting structure
JPH021915Y2 (en)
JP2761871B2 (en) Printed board
JPH0345398A (en) Printed circuit board for ic card
US5030799A (en) Printed circuit board
JPH0737327Y2 (en) Printed wiring board
JPH057072A (en) Printed wiring board
JPH0260185A (en) circuit board
JPS61226994A (en) Flexible metal base circuit board
JP2705154B2 (en) Manufacturing method of printed wiring board
JPH08279680A (en) Multilayered printed wiring board
JP2001168503A (en) Printed wiring board
JPH0743018U (en) Board noise pattern structure
JPH01296690A (en) Printed board
JPH07302955A (en) Double-sided flexible printed board
JPH062730U (en) Printed wiring board
US5363274A (en) Memory card
JPH04101496A (en) Printed wiring board
JP3212933B2 (en) Composite circuit board
JP2681205B2 (en) Printed wiring board with membrane element
JPH08130361A (en) Printed wiring board
JPH0738228A (en) Wiring board
JPS63175494A (en) Molded printed wiring board