JPH0725523B2 - Titanium nitride thin film - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a titanium nitride thin film which is hard and has excellent wear resistance and can be used for various purposes, and a method for producing the same.

[0002]

2. Description of the Related Art A ceramic coating is widely applied to the surface of a material in order to improve the wear resistance or corrosion resistance of the material. The materials used for the ceramic coating are TiN, TiC, Si ₂ N
₃ , c-BN, HfN, CrN and the like. Among these, TiN and TiC have already been widely industrialized,
It is used as a hard and abrasion resistant film for dies, tools, machine parts, etc. Conventionally, as a coating technique that can be used to form the above-mentioned coating, a PVD method typified by an ion plating method, a sputter deposition method, plasma CVD, thermal CVD, laser CVD,
Various film forming methods such as ion implantation technology have been studied. Among them, the dynamic mixing method in which ion implantation and metal deposition are simultaneously used has excellent adhesion to the substrate, and at the same time, regardless of the substrate material and its crystal structure,
It has attracted attention as a technique capable of producing nitride-based, oxide-based, and carbide-based thin films.

TiN, which is one of the ceramic coating materials that has been industrialized, is also used.
Is a typical substance forming an interstitial compound, has a face-centered cubic crystal structure, and is known to have a lattice constant of 0.424 nm. TiN has a B1-type (NaCl-type) crystal structure in which N enters the Ti lattice as an interstitial solid solution. The composition region of TiNx can be widely set as 0.8 <x <1.16. When x is changed within this composition region,
It is known that the lattice constant of TiN changes within the range of 0.423 to 0.425.

[0004]

The present inventors have conducted research on titanium nitride thin films. Generally, when the lattice constant of TiN is within the range of 0.423 to 0.425 nm, the Vickers hardness is It is known that the hardness is about 800 to 1600 and wear resistance is insufficient. It is an object of the present invention to obtain a titanium nitride thin film having a hardness and wear resistance that are sufficient for practical use as a ceramic coating, and to provide a production method capable of producing such titanium nitride. It is a thing.

[0005]

The present invention has achieved the above object by the following means. (1) A titanium nitride thin film containing crystal particles of TiN having a face-centered cubic structure having a lattice constant in the range of 0.414 nm to 0.422 nm. (2) The titanium nitride thin film according to item (1), wherein the TiN crystal orientation of the crystal grains is oriented in the (111) plane. The titanium nitride thin film containing TiN having the face-centered cubic structure may have various crystal conditions, but among them, the crystal constant of TiN is 0.414 nm to 0.42.
The above object is achieved when the crystal particles of 2 nm are contained and when the size of the crystal particles of TiN contained in the titanium nitride thin film is within the optimum range. The titanium nitride thin film obtained by the present invention has a TiN crystal grain size of 1 or less.
Although it is 0 nm to 100 nm, the present invention is not limited to this range.

The titanium nitride thin film of the present invention can be formed on various substrates, and examples thereof include metals, ceramics and semiconductors. The thickness of the titanium nitride thin film to be formed can be various depending on its application, and is selected according to the properties that the ceramic coating should have. Further, in the method for producing a titanium nitride thin film of the present invention, there are some variations depending on the substrate temperature, the deposition rate of titanium, the acceleration voltage of the nitrogen ion beam, the current density, the degree of vacuum in the film forming chamber, etc. It is preferable to select the optimum conditions in consideration.

[0007]

[Operation] The titanium nitride thin film of the present invention has high hardness and high abrasion resistance, which does not appear to be brought about by the small lattice constant of the TiN crystal structure. Further, by controlling the temperature of the substrate during the film formation of the titanium nitride thin film, the irradiation angle of the nitrogen ion beam, the accelerating voltage, the current density, the vacuum degree of the film forming chamber, etc., the above range of the lattice constant was obtained. Although a titanium nitride thin film can be obtained, its mechanism of action has not been clarified.

[0008]

EXAMPLES The present invention will be specifically described below with reference to examples. However, the present invention is not limited to this embodiment. Example 1 The following examples are given to further clarify the features of the present invention. As a board, JIS standard SUS44
A 0C stainless steel plate piece was used. This substrate was held at a quenching temperature of 1050 ° C. for 1 hour and a tempering temperature of 40.
It heat-processed on condition that it hold | maintained at 0 degreeC for 1 hour. The hardness of the substrate is Rockwell hardness 55 to 57 (Vickers hardness:
550 to 650). This substrate was polished until the average roughness of the treated surface became a mirror surface of 0.5 μm or less, and ultrasonically cleaned with acetone, and then mounted on the thin film forming apparatus shown in FIG. However, FIG. 1 is a schematic view of the apparatus including the functional aspects.

In this device, the ultimate pressure is 4.0 ×
Nitrogen gas is introduced into the ion source at a pressure of 10 ^-6 torr or less to adjust the pressure in the film forming chamber to 2 to 3 × 10 ^-5 torr or less so that the substrate is irradiated with ions. In order to prevent the temperature rise of the substrate 1 due to ion beam irradiation, the copper substrate holder 2
Is cooled by a water cooling pipe 3. The substrate temperature can be controlled by attaching an infrared heater or an electric heater plate, but in this embodiment, the influence of the substrate temperature can be adjusted by installing an appropriate heat insulating material 4 between the substrate 1 and the substrate holder. I tried to lose it. When coating titanium nitride, the acceleration voltage was 10 kV and the ion current density was 0.
Sputter cleaning with nitrogen ions was performed at ² mA / cm ² and an irradiation angle of 90 degrees. Next, while monitoring with a crystal oscillation type film thickness meter, titanium 5 was vapor-deposited at a predetermined speed, and at the same time, a nitrogen ion beam 6 was irradiated at a predetermined current density to form a titanium nitride film. At that time, each setting condition was changed to form a 2 μm thick titanium nitride thin film. In addition,
The ion species contained in the ion beam are N ⁺ and N ₂ ⁺ , and the ratio of the numbers thereof is 2: 3.

A titanium nitride thin film was formed under the conditions shown in Table 1. The results of investigating the identification of various titanium nitride thin films by X-ray diffraction using CuKα rays are shown in FIGS. 2 to 4. 2 and 3
Diffraction pattern shows that the titanium nitride thin film is highly oriented on the (111) plane of TiN. The diffraction pattern in FIG. 4 shows that the titanium nitride thin film is highly oriented on the αTi (002) plane. The N / Ti atomic ratio in the titanium nitride thin film shown in the figure is a value actually measured from the EPMA quantitative analysis. Table 1 Titanium deposition rate: ~50 (Å / s) the irradiation angle of the ion beam: 90 ° accelerating voltage: 10 to 30 (kV) current density: 0.10~0.40 (mA / cm ²⁾ of the substrate turned Electric power: -10 (W / cm ² ) Substrate temperature: 180-410 (° C) Pressure in the film forming chamber: 3 × 10 ^-5 or less (torr)

FIG. 5 shows the relationship between the lattice spacing d obtained from the Black formula and the N / Ti atomic ratio in the titanium nitride thin film for the various titanium nitride thin films obtained in this experiment.
From the detailed analysis result of the X-ray diffraction, the surface spacing d = 2.
37Å and d = 2.36Å are αTi of hcp crystal structure
Corresponding to the spacing of (002) planes, the one having a spacing of 2.39Å to 2.46Å has face-centered cubic TiN
1) It was found that it corresponds to the interplanar spacing. FIG. 6 shows the relationship between the hardness Hv and the surface spacing d of the various titanium nitride thin films obtained. The hardness in the figure was measured with a micro Vickers hardness meter (load of 5 g). By optimizing the film forming conditions such as the N / Ti atomic ratio in the film, the electric power per unit area (W / cm ² ) supplied from the ion beam to the substrate, and the control of the substrate temperature, TiN (111 ) We have found that the surface spacing of the surfaces is controlled within a certain range.

[0012]

The titanium nitride thin film of the present invention has high hardness,
It has excellent wear resistance and can be formed on various substrates. Further, this titanium nitride thin film can be used as a diffusion prevention film in ICs and the like. Further, according to the present invention, the temperature of the substrate, the acceleration voltage of the nitrogen ion beam, the current density, the vacuum degree of the film forming chamber, etc. are controlled when the titanium nitride thin film is formed by irradiating the nitrogen ion beam while depositing Ti. The lattice constant is 0.
A titanium nitride thin film containing face-centered cubic TiN crystal grains in the range of 419 nm to 0.422 nm can be obtained with good reproducibility.

[Brief description of drawings]

FIG. 1 shows a schematic view of a film forming apparatus used in Example 1 of the present invention.

FIG. 2 shows an X-ray diffraction pattern by a CuKα ray of a titanium nitride thin film having an N / Ti atomic ratio of 1.1.

FIG. 3 shows an X-ray diffraction pattern by a CuKα ray of a titanium nitride thin film having an atomic ratio of N / Ti of 0.8.

FIG. 4 shows an X-ray diffraction pattern of a titanium nitride thin film highly oriented on the (111) plane of TiN.

FIG. 5 shows the relationship between the lattice spacing and the N / Ti atomic ratio in the titanium nitride thin film.

FIG. 6 shows the relationship between the plane spacing of the atomic network of various titanium nitride thin films and the micro Vickers hardness.

[Explanation of symbols]

 1 substrate 2 substrate holder 3 water-cooled pipe 4 heat insulating material 5 titanium vapor 6 nitrogen ion beam

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Masato Kiuchi 1-60-143 Tokiji, Nara City, Nara Prefecture (72) Inventor Akiyoshi Chatanihara 3-4-13, Satsukioka, Ikeda City, Osaka Prefecture Carpenter's House 112 (72) Inventor Hiroshi Nagasaka 11-1 Haneda-Asahi-cho, Ota-ku, Tokyo Koji Amamiya (56) References, Ebara Corporation Co., Ltd. Reference JP-A-3-274266 (JP, A)

Claims (2)

[Claims] 1. The lattice constant is 0.414 nm to 0.42.
A titanium nitride thin film, characterized by containing TiN crystal particles having a face-centered cubic structure in the range of 2 nm. 2. The TiN crystal orientation of the crystal grains is (1
The titanium nitride thin film according to claim 1, which is oriented in the (11) plane.