JPH07115553B2 - IC card manufacturing method - Google Patents
IC card manufacturing methodInfo
- Publication number
- JPH07115553B2 JPH07115553B2 JP60151778A JP15177885A JPH07115553B2 JP H07115553 B2 JPH07115553 B2 JP H07115553B2 JP 60151778 A JP60151778 A JP 60151778A JP 15177885 A JP15177885 A JP 15177885A JP H07115553 B2 JPH07115553 B2 JP H07115553B2
- Authority
- JP
- Japan
- Prior art keywords
- card
- external connection
- contact
- terminal
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000008188 pellet Substances 0.000 description 15
- 238000000034 method Methods 0.000 description 5
- 239000010949 copper Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
Description
【発明の詳細な説明】 ［発明の技術分野］ この発明はクレジットカード、身分証明カード等に用い
られるICカードの製造方法に関する。Description: TECHNICAL FIELD OF THE INVENTION The present invention relates to a method for manufacturing an IC card used for credit cards, identification cards and the like.
［従来技術とその問題点］ 近年、IC、LSI等の半導体チップを内蔵したICカードが
開発されている。このようなICカードは内部の半導体チ
ップの各電極パッドに接続された外部端子を有してお
り、この外部端子を形成する方法としては、従来、上面
フィルムに、スルーホールを設けてこのスルーホール内
に化学処理を施して無電解銅（Cu）めっきをした上、電
解銅（Cu）めっき、金（Au）めっき等を行なう方法が用
いられていた。しかし、このような方法では工程数が多
く、その作業が面倒なため作業に熟練を要し、製造コス
トが高くなるという問題がある。[Prior Art and its Problems] In recent years, IC cards having a built-in semiconductor chip such as IC and LSI have been developed. Such an IC card has an external terminal connected to each electrode pad of an internal semiconductor chip.As a method of forming this external terminal, conventionally, a through hole is provided in a top film to form this through hole. A method has been used in which a chemical treatment is applied to the inside to perform electroless copper (Cu) plating, followed by electrolytic copper (Cu) plating, gold (Au) plating, and the like. However, in such a method, there are many steps, and the work is troublesome, so that there is a problem that the work requires skill and the manufacturing cost becomes high.
［発明の目的］ この発明は上記のような事情を考慮してなされたもの
で、その目的とするところは、極めて簡単な作業で且つ
能率的に外部接続用接点を設けることができるICカード
の製造方法を提供することにある。[Object of the Invention] The present invention has been made in consideration of the above circumstances, and an object of the present invention is to provide an IC card in which contacts for external connection can be efficiently provided with extremely simple work. It is to provide a manufacturing method.
［発明の要点］ この発明は上記のような目的を達成するために、接続端
子（13b、21b）を有する配線基板（13、20）に半導体チ
ップ（２）を接続し、当該半導体チップが接続された配
線基板を樹脂性のカード部材（12、14〜17）で覆うこと
でカード本体（１）を形成し、その後、鍔状の頭部（4
a）の一面に突出部（4b）を有する金属性の外部接続接
点端子（18、22）を、前記頭部に熱圧着治具を接触させ
て前記突出部側からカード本体に加熱状態で圧入し、前
記突出部が配線基板の前記接続端子と接触するまで埋め
込み外部接続接点端子を形成するようにしてICカードを
製造するものである。In order to achieve the above-mentioned object, the present invention connects a semiconductor chip (2) to a wiring board (13, 20) having connection terminals (13b, 21b), and the semiconductor chip is connected. The card body (1) is formed by covering the formed wiring board with a resin-made card member (12, 14 to 17), and thereafter, a collar-shaped head (4
a) A metal external connection contact terminal (18, 22) having a protrusion (4b) on one surface is pressed into the card body from the protrusion side in a heated state by bringing a thermocompression bonding jig into contact with the head. Then, the IC card is manufactured by forming the embedded external connection contact terminal until the protrusion contacts the connection terminal of the wiring board.
［第１実施例］ 以下、第１図ないし第５図を参照して、この発明の第１
実施例を説明する。[First Embodiment] A first embodiment of the present invention will now be described with reference to FIGS. 1 to 5.
An example will be described.
第３図はICカードの外観図である。このICカード１は厚
さが約0.5mm前後のものであり、内部に後述するIC、LSI
等の集積回路ペレット２を備え、表面には磁気ストライ
プ部３および外部接続端子部４が設けられており、裏面
にはエンボス部５が設けられている。この場合、磁気ス
トライプ部３はカードの照合コード等の磁気情報を備え
たものである。エンボス部５はカードの所有者名および
所有者コード等の識別情報を表わすものであり、エンボ
ス加工により裏面に突出し、表面側は凹んでいる。第４
図および第５図は集積回路ペレット２を示す。この集積
回路ペレット２はシリコン基体６に形成されたアクティ
ブ領域6aの上面に所定の箇所に開口7a・・・が形成され
た酸化シリコン（SiO2）等の絶縁膜７を設け、その上面
にアルミニウム等を蒸着しエッチングにより回路以外の
部分を除去して電極８・・・を形成する。さらに、この
電極８・・・上に所定箇所に電極−８・・・を露出する
開口8a・・・が形成された酸化シリコン（SiO2）等の絶
縁膜９を設け、その上面にアルミニウム等を蒸着しこの
アルミニウム蒸着層をエッチングすることにより前記内
部電極パッド８・・・よりも大きい面積の外部電極パッ
ド10・・・を形成したものであり、この実施例では第４
図に示すように、外部電極パッド10・・・は集積回路ペ
レット２の最上面に４個づつ２列に配列されており、こ
の外部電極パッド・・・の境間には酸化シリコン（S
iO2）等の絶縁膜11が設けられている。この場合、４個
づつ２列に配列された外部電極パッド10・・・のうち、
例えば下側の２つの外部電極パッド10a、10bは、将来必
要になったときに使用するための予備の電極パッドであ
り、電極８には接続されていない。FIG. 3 is an external view of an IC card. This IC card 1 has a thickness of about 0.5 mm, and the IC and LSI described later
And the like, the magnetic stripe portion 3 and the external connection terminal portion 4 are provided on the front surface, and the embossed portion 5 is provided on the back surface. In this case, the magnetic stripe portion 3 is provided with magnetic information such as a card collation code. The embossed portion 5 represents identification information such as the owner name and owner code of the card, and is projected on the back surface by embossing and is recessed on the front surface side. Fourth
5 and 5 show an integrated circuit pellet 2. The integrated circuit pellet 2 provided with an insulating film 7 of silicon oxide or the like in which the opening 7a · · · are formed on the upper surface of the active region 6a formed in a silicon substrate 6 to a predetermined position (S i O 2), the upper surface Then, aluminum or the like is vapor-deposited and parts other than the circuit are removed by etching to form electrodes 8 ... Furthermore, an insulating film 9 of silicon oxide or the like in which the opening 8a ... are formed (S i O 2) to expose the electrode -8 ... at a predetermined position on the electrode 8 on ... provided, on its upper surface External electrode pads 10 having a larger area than the internal electrode pads 8 are formed by vapor-depositing aluminum or the like and etching the aluminum vapor-deposited layer.
As shown in the figure, the external electrode pads 10 ... Are arranged in two rows of four on the uppermost surface of the integrated circuit pellet 2. Silicon oxide (S
An insulating film 11 such as i O 2 ) is provided. In this case, among the external electrode pads 10 ...
For example, the lower two external electrode pads 10a and 10b are spare electrode pads for use when needed in the future and are not connected to the electrode 8.
第１図および第２図はICカード１の構成を示す。このIC
カード１は集積回路ペレット２を収納する上部インナー
コア12の下面に配線基板13を収納する中間インナーコア
14を接着すると共に、この中間インナーコア14の下面に
下部インナーコア15を接着し、その上下面に上面フィル
ム16および下面フィルム17をラミネートしたものであ
る。この場合、各インナーコア12、14、15はそれぞれ、
硬質の塩化ビニル等の樹脂よりなり、上部インナーコア
12には集積回路ペレット２を収納する収納部12aが形成
されており、中間インナーコア14には配線基板13を収納
する収納部14aが上部インナーコア12の収納部12aと対応
して形成されている。この中間インナーコア14の収納部
14a内に配置される配線基板13はフィルム状のシートで
あり、集積回路ペレット２よりも１回り大きく形成され
ており、その上面には内部接続端子13a・・・と外部接
続端子13b・・・とが配列形成されている。各内部接続
端子13aは集積回路ペレット２の各外部電極パッド10が
接続するものであり、各外部接続端子13bは外部接続端
子部４の各接点端子18a、18b、18c・・・18hがそれぞれ
接続するものである。即ち、配線基板13上には異方導電
性接着テープ19を介して半導体チップ２が接着され、こ
の異方導電性接着テープ19により各内部接続端子13aに
集積回路ペレット２の各外部電極パッド10が電気的に接
続されている。この異方導電性接着テープ19はホットメ
ルト型の絶縁性接着剤中にNi、An、カーボン等の導電性
粒子を混入したものであり、配線基板13の上面に集積回
路ベレット２が接着されると、上下に対向する電極端子
のみが電気的に導通し、隣接する他の電極端子とは導通
しないようになっている。また、配線基板13の各外部接
続端子13bに接続される外部接続端子４の各接点端子18
a、18b、18c・・・18hは導電性金属により形成されたも
ので、それぞれ、平板状の頭部4aの下面中央にピン状の
突出部4bを一体に形成したものである。熱圧着治具を各
接点端子18a、18b・・・18hの頭部4a上に接触させて上
面フィルム16の上方から上部のインナーコア12を通して
突出部4bを圧入すると、各接点端子は、上面フィルム16
および上部インナコア12の一部を溶融して、各突出部4b
の下端から各外部接続端子13bに接触する位置迄圧入さ
れる。このとき、上面フィルム16の各接点端子の頭部4b
に対応する部分は１旦半ゲル化状態となった上、熱圧着
治具の除去により頭部4bに固着して凝固する。これによ
り、集積回路ペレット２の外部電極パッド10は配線基板
13を介して外部接続端子部４の各接点端子18a、18b、18
c・・・18hにより外部に導かれる。この場合、各接点端
子18a、18b、18c・・・18hはそれぞれ、上面フィルム16
に埋め込まれ、その各上面は上面フィルム16の上面と略
同一面とされている。また、各接点端子18a、18b、18c
・・・18hのうち、例えば、端子18a、18bは将来必要に
なったときに使用するためののもであり、端子18cはVCC
供給用、端子18dはGND用、端子18eはリセット用、端子1
8fはVPP（プログラム）用、端子18gはクロック用、端子
18hはI/O（アドレス／データ）用のものである。なお、
上下の各フィルム16、17は軟質の塩化ビニル等の樹脂か
らなり、上面フィルム16の表面に磁気ストライプ部３が
設けられている。1 and 2 show the configuration of the IC card 1. This IC
The card 1 is an intermediate inner core that houses the wiring board 13 on the lower surface of the upper inner core 12 that houses the integrated circuit pellets 2.
The lower inner core 15 is adhered to the lower surface of the intermediate inner core 14 while the upper inner film 16 and the lower film 17 are laminated on the upper and lower surfaces thereof. In this case, each inner core 12, 14, 15
Made of hard vinyl chloride resin, the upper inner core
An accommodating portion 12a for accommodating the integrated circuit pellets 2 is formed at 12, and an accommodating portion 14a for accommodating the wiring board 13 is formed at the intermediate inner core 14 so as to correspond to the accommodating portion 12a of the upper inner core 12. There is. Storage section for this intermediate inner core 14
The wiring board 13 arranged in 14a is a film-like sheet, and is formed to be one size larger than the integrated circuit pellet 2. The upper surface thereof has internal connection terminals 13a ... And external connection terminals 13b. And are formed in an array. Each internal connection terminal 13a is connected to each external electrode pad 10 of the integrated circuit pellet 2, and each external connection terminal 13b is connected to each contact terminal 18a, 18b, 18c ... 18h of the external connection terminal portion 4, respectively. To do. That is, the semiconductor chip 2 is adhered onto the wiring board 13 via the anisotropic conductive adhesive tape 19, and the anisotropic conductive adhesive tape 19 is used to connect the internal connection terminals 13a to the external electrode pads 10 of the integrated circuit pellet 2. Are electrically connected. The anisotropic conductive adhesive tape 19 is made by mixing conductive particles such as Ni, An, and carbon into a hot melt type insulating adhesive, and the integrated circuit bellet 2 is bonded to the upper surface of the wiring board 13. Thus, only the electrode terminals that are vertically opposed to each other are electrically conducted, and the other electrode terminals adjacent to each other are not electrically conducted. Further, each contact terminal 18 of the external connection terminal 4 connected to each external connection terminal 13b of the wiring board 13
18h, 18b, 18c, ... 18h are made of conductive metal, and each of them has a pin-shaped projection 4b integrally formed at the center of the lower surface of the flat-plate-shaped head 4a. When the thermocompression-bonding jig is brought into contact with the head 4a of each contact terminal 18a, 18b, ... 18h and the protrusion 4b is press-fitted from above the upper surface film 16 through the upper inner core 12, each contact terminal becomes an upper surface film. 16
And a part of the upper inner core 12 is melted, and each protrusion 4b
It is press-fitted from the lower end to the position where it contacts each external connection terminal 13b. At this time, the head 4b of each contact terminal of the top film 16
The portion corresponding to (1) is in a gelled state for one and a half days, and is fixed to the head 4b by the removal of the thermocompression bonding jig to be solidified. As a result, the external electrode pad 10 of the integrated circuit pellet 2 becomes
Each contact terminal 18a, 18b, 18 of the external connection terminal portion 4 via
It is guided to the outside by c ... 18h. In this case, the contact terminals 18a, 18b, 18c, ...
Embedded in each of the upper surfaces of the upper surface film 16 and the upper surfaces of the upper surface films 16 are substantially flush with each other. Also, each contact terminal 18a, 18b, 18c
... Of 18h, for example, terminals 18a and 18b are for use when needed in the future, and terminal 18c is V CC.
Supply, terminal 18d for GND, terminal 18e for reset, terminal 1
8f is for V PP (program), terminal 18g is for clock, terminal
18h is for I / O (address / data). In addition,
The upper and lower films 16 and 17 are made of a soft resin such as vinyl chloride, and the magnetic stripe portion 3 is provided on the surface of the upper film 16.
しかるに、上記のように構成されたICカードによれば、
外部接続端子部４の各接点端子18a、18b、18c・・・18h
をそれぞれ、平板状の頭部4aの下面に突出部4bを設けた
構成にし、上面フィルム16の上方から熱圧着治具により
圧入し、上面フィルム16を半ゲル化して固着するように
したので、簡単な作業で各接点端子18a、18b、18c・・
・18hを能率的に取付けることができる。However, according to the IC card configured as described above,
Each contact terminal 18a, 18b, 18c ... 18h of the external connection terminal unit 4
Respectively, the protrusion 4b is provided on the lower surface of the flat plate-shaped head 4a, press-fitted from above the upper surface film 16 with a thermocompression bonding jig, and the upper surface film 16 is semi-gelled and fixed, so Each contact terminal 18a, 18b, 18c ...
・ 18h can be installed efficiently.
［第２実施例］ 次に、第６図を参照して、この発明の第２実施例を説明
する。この場合、上述した第１実施例と同一部分には同
一符号を付し、その説明は省略する。[Second Embodiment] Next, a second embodiment of the present invention will be described with reference to FIG. In this case, the same parts as those in the first embodiment described above are designated by the same reference numerals, and the description thereof will be omitted.
この第２実施例は集積回路ペレット２を収納するインナ
ーコア20の上面に直接配線パターン21を設け、この配線
パターン21に集積回路ペレット２および外部接続端子部
４の各接点端子22を接続するようにしたものである。即
ち、インナーコア20は硬質の塩化ビニル等の樹脂からな
り、その所定箇所に集積回路ペレット２の収納部20aが
形成されている。また、このインナーコア20に設けられ
る配線パターン21は収納部20aを設けたインナコア20の
一面全面に接着した銅箔をエッチングして形成されるも
ので接続用リード21a・・・は各配線パターン21が延長
されたものである。各接続用リード21aは、集積回路ペ
レット２の各外部接続パッド10に接続されており、各外
部接続端子21bは外部接続端子部４の各接点端子22に対
応している。この場合、集積回路ペレット２はその各外
部接続パッド10に配線パターン21の各接続用リード21a
が接続されると、その部分がモールド樹脂23により封止
され、インナーコア20の収納部20a内に配置される。一
方、外部接続端子部４の各接点端子22は上述した第１実
施例と同様に、平板状の頭部4aの下面に突出部4bを設け
たものであり、熱圧着治具により上面フィルム16の上方
から圧入され、上面フィルム16の一部を半ゲル化して固
着され、その下端が配線パターン21の各外部接続端子21
bに接続される。この場合、各接点端子22はその上部が
上面フィルム16の上面から若干突出した状態で上面フィ
ルム16に埋めこまれ、上面フィルムとの間の固着力によ
ってのみ保持される構造としてある。なお、インナーコ
ア20の上下面にはそれぞれ、上面フィルム16および下面
フィルム17がラミネートされている。In the second embodiment, a wiring pattern 21 is directly provided on the upper surface of the inner core 20 which houses the integrated circuit pellet 2, and the integrated circuit pellet 2 and each contact terminal 22 of the external connection terminal portion 4 are connected to this wiring pattern 21. It is the one. That is, the inner core 20 is made of a hard resin such as vinyl chloride, and the accommodating portion 20a for the integrated circuit pellet 2 is formed at a predetermined position thereof. The wiring pattern 21 provided on the inner core 20 is formed by etching a copper foil adhered to the entire surface of the inner core 20 having the storage portion 20a. The connection leads 21a ... Is an extension of. Each connection lead 21a is connected to each external connection pad 10 of the integrated circuit pellet 2, and each external connection terminal 21b corresponds to each contact terminal 22 of the external connection terminal portion 4. In this case, the integrated circuit pellet 2 is connected to the respective external connection pads 10 by the respective connection leads 21a of the wiring pattern 21.
When is connected, the portion is sealed with the mold resin 23 and placed in the storage portion 20a of the inner core 20. On the other hand, each contact terminal 22 of the external connection terminal portion 4 is, as in the above-described first embodiment, provided with the protrusion 4b on the lower surface of the flat plate-shaped head 4a, and the upper surface film 16 is formed by the thermocompression bonding jig. Is press-fitted from above, a part of the upper surface film 16 is semi-gelled and fixed, and its lower end is the external connection terminals 21 of the wiring pattern 21.
connected to b. In this case, each contact terminal 22 is embedded in the upper surface film 16 with its upper part slightly protruding from the upper surface of the upper surface film 16, and is held only by the fixing force with the upper surface film. An upper surface film 16 and a lower surface film 17 are laminated on the upper and lower surfaces of the inner core 20, respectively.
このようなICカードの外部接続用接点構造においては、
上述した第１実施例と同様の作用効果があるほか、特に
インナーコア20の構造が簡単となり、ICカードの薄型化
が可能となる。In such a contact structure for external connection of the IC card,
In addition to the same effects as the first embodiment described above, the structure of the inner core 20 is particularly simplified, and the IC card can be thinned.
［発明の効果］ 以上説明したように、この発明のICカードの製造方法に
よれば、半導体チップが接続された配線基板を樹脂性の
カード部材で覆うことでカード本体を形成し、その後、
鍔状の頭部の一面に突出部を有する金属性の外部接続接
点端子を、前記頭部に熱圧着治具を接触させて前記突出
部側からカード本体に加熱状態で圧入し、前記突出部が
配線基板の前記接続端子と接触するまで埋め込み外部接
続接点端子を形成するようにしたので、極めて簡単な作
業で且つ効率的に外部接続接点端子を設けることができ
る。そして、外部接続用接点はその突出部及び頭部がカ
ード本体に埋め込まれてカード本体に熱圧着され、特に
鍔状の頭部が大きな接触面で樹脂からなるカード本体に
固着されるので、外部接続用接点の強固な固定が可能に
なる。[Effects of the Invention] As described above, according to the method for manufacturing an IC card of the present invention, the wiring board to which the semiconductor chip is connected is covered with the resinous card member to form the card body, and thereafter,
A metallic external connection contact terminal having a protruding portion on one surface of a collar-shaped head is pressed into the card body from the protruding portion side in a heated state by contacting the head with a thermocompression bonding jig, and the protruding portion Since the embedded external connection contact terminals are formed until the contacts come into contact with the connection terminals of the wiring board, the external connection contact terminals can be efficiently provided by an extremely simple operation. The external connection contact is embedded in the card body with its protruding portion and the head being thermocompression-bonded to the card body, and in particular, the collar-shaped head is fixed to the card body made of resin with a large contact surface. Firmly fix the contact for connection.
第１図ないし第５図はこの発明の第１実施例を示し、第
１図はICカードの断面図、第２図はその分解斜視図、第
３図はICカードの外観斜視図、第４図は半導体チップ２
の外観斜視図、第５図はその断面図、第６図はこの発明
の第２実施例を示す要部断面図である。 １……ICカード、２……集積回路ペレット、４、……外
部接続端子部、4a……頭部、4b……突出部、10……内部
電極パッド、13b、21b……外部接続端子、18a、18b・・
・18h、22……接点端子。1 to 5 show a first embodiment of the present invention. FIG. 1 is a sectional view of an IC card, FIG. 2 is its exploded perspective view, and FIG. 3 is an external perspective view of the IC card. The figure shows the semiconductor chip 2
FIG. 5 is a cross-sectional view of the appearance of FIG. 5, and FIG. 1 ... IC card, 2 ... Integrated circuit pellet, 4, ... External connection terminal part, 4a ... Head part, 4b ... Projection part, 10 ... Internal electrode pad, 13b, 21b ... External connection terminal, 18a, 18b ...
・ 18h, 22 ... Contact terminal.
Claims (1)
（13、20）に半導体チップ（２）を接続し、当該半導体
チップが接続された配線基板を樹脂性のカード部材（1
2、14〜17）で覆うことでカード本体（１）を形成し、
その後、鍔状の頭部（4a）の一面に突出部（4b）を有す
る金属性の外部接続接点端子（18、22）を、前記頭部に
熱圧着治具を接触させて前記突出部側からカード本体に
加熱状態で圧入し、前記突出部が配線基板の前記接続端
子と接触するまで埋め込み外部接続接点端子を形成する
ようにしたICカードの製造方法。1. A semiconductor chip (2) is connected to a wiring board (13, 20) having connection terminals (13b, 21b), and the wiring board to which the semiconductor chip is connected is made of a resin card member (1).
2, 14 ~ 17) to form a card body (1),
Then, a metal external connection contact terminal (18, 22) having a protrusion (4b) on one surface of the collar-shaped head (4a) is brought into contact with a thermocompression bonding jig on the head, and the protrusion side is provided. A method of manufacturing an IC card in which the embedded external connection contact terminals are formed by press-fitting the card body into the card body in a heated state until the protruding portions come into contact with the connection terminals of the wiring board.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60151778A JPH07115553B2 (en) | 1985-07-10 | 1985-07-10 | IC card manufacturing method |
| US07/162,519 US4889980A (en) | 1985-07-10 | 1988-03-01 | Electronic memory card and method of manufacturing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60151778A JPH07115553B2 (en) | 1985-07-10 | 1985-07-10 | IC card manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6211695A JPS6211695A (en) | 1987-01-20 |
| JPH07115553B2 true JPH07115553B2 (en) | 1995-12-13 |
Family
ID=15526090
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60151778A Expired - Lifetime JPH07115553B2 (en) | 1985-07-10 | 1985-07-10 | IC card manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07115553B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4920383A (en) * | 1989-03-14 | 1990-04-24 | International Business Machines Corporation | Paper handling for repetitive movement of variable length media through an image transfer station |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5315337B2 (en) * | 1972-03-16 | 1978-05-24 | ||
| FR2439438A1 (en) * | 1978-10-19 | 1980-05-16 | Cii Honeywell Bull | RIBBON CARRYING ELECTRIC SIGNAL PROCESSING DEVICES, MANUFACTURING METHOD THEREOF AND APPLICATION THEREOF TO A SIGNAL PROCESSING ELEMENT |
-
1985
- 1985-07-10 JP JP60151778A patent/JPH07115553B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6211695A (en) | 1987-01-20 |
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