JPH0262297A - Integrated circuit device and ic card using same - Google Patents

Abstract

PURPOSE:To enable execution of manufacture with high precision in dimensions and high efficiency by providing an adhesive resin layer on the most part of one surface of a metal thin plate except for a part of electric connection. CONSTITUTION:By using an adhesive made up of insilative resin, an adhesive resin layer 12 is formed in the most part except for a part 11c for electric connection to which a metal wire 14 is wire-bonded. The adhesive resin layer 12 is formed by a screen printing method, and the shape of a pattern is slightly smaller than that of the other surface 11b of a metal thin plate, while the part 11c for electric connection is excluded therefrom. An integrated circuit element 13 is mounted in a prescribed position of the adhesive resin layer 12 and fixed in adhesion therein by setting the adhesive resin layer 12 by heating. By this method, the adhesion between seal resin 5 and the metal thin plate 11 is improved considerably, and problems of a rise of the metal thin plate 11, exfoliation thereof, etc. due to severe environment or an external mechanical force, as well as a problem of the deterioration of the integrated circuit element 13 due to infiltration of water or the like from a interface, do not take place. Besides, the device attains high reliability as an IC card.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an integrated circuit device used, for example, in an IC card, and an IC card using the integrated circuit device.

BACKGROUND OF THE INVENTION In recent years, so-called IC cards, in which integrated circuit elements such as microcomputers and memories are mounted on plastic cards, have been put into practical use.

This IC card has a larger storage capacity and better security than the magnetic stripe cards that are already widely used, so it can be used not only for conventional magnetic stripe cards but also for a variety of other purposes such as identification cards. It is considered to be used for.

By the way, an IC card is a plastic card made of vinyl chloride resin or the like and has an integrated circuit device mounted thereon that has terminals for connecting to external devices such as a reader/writer, and this integrated circuit device can be made extremely thin. configuration is required.

There are many types of IC cards, but the standardization of IC cards with the same dimensions as conventional magnetic stripe cards is RSO (
International Organization for Standardization).

Hereinafter, a conventional IC card and an integrated circuit device used in this card will be explained with reference to the accompanying drawings.

Fig. 3 is a perspective view of the engineering C card, Fig. 4 is a cross-section of the Moom' in Fig. 3, showing the periphery of the integrated circuit device, and Fig. 6 is a cross-sectional view of the integrated circuit device using a conventional circuit board. FIG.

Conventionally, many methods have been used for manufacturing and configuring IC cards. For example, as shown in FIGS. Using a mold or Thomson mold, etc., make a hole 2 slightly larger than the size of the integrated circuit device 30, insert the integrated circuit device 30, which is slightly thinner than the plastic card 1, and glue it so that the external connection terminal 32 is exposed. Created by processing and burying.

As shown in FIG. 6, a conventional integrated circuit device has an integrated circuit mounted on a thin circuit board in which circuit conductors such as an external connection terminal pattern 32, a circuit pattern 33, and a through hole 34 are formed on a film-like insulating substrate 31. The element 36 is die-bonded, and the input/output electrodes of the integrated circuit element 36 and the circuit pattern 33 are connected to the metal wire 3 by a wire bonding method or the like.
Connect with 6. Further, a sealing frame 37 for preventing resin flow during resin sealing is provided by adhering to the circuit board, and the circuit board is sealed with a sealing material 38 such as epoxy resin.

(Unexamined Japanese Patent Publication No. 55-56647, Unexamined Japanese Patent Publication No. 68-925
In addition, as a conventional integrated circuit device that does not require a high-precision precision circuit board as described above, a lead frame made of a thin metal plate processed into a desired shape is used, and one side of the lead frame is used for external connection. The integrated circuit element is mounted on the other side as a terminal, the input/output electrodes of the integrated circuit element and the other side of the lead frame are electrically connected with metal wires, and the integrated circuit element side of the lead frame is sealed with resin. There are integrated circuit devices coated with

(Unexamined Japanese Patent Publication No. 54-69068, Unexamined Japanese Patent Publication No. 63-338
53 Publication) Problems to be Solved by the Invention Integrated circuit devices mounted on IC cards are required to have high reliability, thinness, high dimensional accuracy, and low cost. However, in the integrated circuit device using the circuit board as described above, the circuit board used is a double-sided circuit board with through holes in which wiring conductors are formed on both sides of the insulating board 31 and connected through the through holes 34. It has the following problems. ■Circuit boards are expensive. (2) Variations in the thickness of the insulating substrate 31 and variations in the plating thickness when forming through holes cause variations in the total thickness of the circuit board, making it difficult to obtain good thickness dimensional accuracy. (2) When the integrated circuit element 36 is sealed with resin, the resin flows out from the through hole 34, so a means for sealing the through hole 34 is required to prevent the resin from flowing out.

On the other hand, a lead frame made by processing a thin metal plate into a desired shape is used, one side of the lead frame is used as an external connection terminal, and the other side is equipped with an integrated circuit element, and the input/output electrodes of the integrated circuit element and the other side of the lead frame are used. Integrated circuit devices, whose surfaces are electrically connected with metal wires and whose surfaces on the integrated circuit element side of the lead frame are covered with sealing resin, do not require the high-precision precision circuit boards mentioned above, so they have high dimensions. It has the advantage of being an inexpensive integrated circuit device that can be manufactured with precision and high efficiency.

However, in the integrated circuit device using the above metal thin plate, when this integrated circuit device is mounted on a plastic card such as vinyl chloride resin and used as an IC card, the adhesion between the metal thin plate and the sealing resin is extremely poor. important,
If the adhesion is insufficient, when the IC card is used or carried, the card will be bent and subjected to mechanical external force, resulting in problems such as peeling or falling off of the thin metal plate, or problems such as damage from the interface between the thin metal plate and the sealing resin. There is a problem in that the integrated circuit element deteriorates due to the infiltration of moisture and the like, making it unsuitable for practical use as an IC card.

The present invention has been made in view of the above problems, and is a thin integrated circuit device and an IC that can be manufactured with high dimensional accuracy, high efficiency, and low cost, and that is highly reliable when mounted on a card to form an IC card. It provides a card.

Means for Solving the Problems In order to solve the above problems, the integrated circuit device of the present invention includes:
At least a portion of one surface serves as an external connection terminal, and these are mounted on a plurality of thin metal plates that are substantially on the same surface and a portion of the adhesive resin layer provided on the other side of these thin metal plates, and the input terminals are an integrated circuit element whose output electrodes are electrically connected to the other surface of these thin metal plates, and at least an integrated circuit element with mJ written on the other side of the thin metal plates, its input/output electrodes, and the other side of the thin metal plates. and a sealing resin that covers an electrically connected portion with the surface, and the adhesive resin layer is provided on most of the other surface of the thin metal plate except for the electrically connected portion.

Effect of the Invention With the above-described configuration, the present invention does not require the expensive precision circuit board used in the past, and can use a thin metal plate processed into an inexpensive and extremely common lead frame shape, making it possible to use an inexpensive integrated circuit device. In addition, it has a configuration that allows it to be manufactured with high dimensional accuracy and high efficiency as a thin integrated circuit device suitable for IC cards. In addition, when forming the sealing resin directly on the other side of the thin metal plate, a release agent such as wax added to the sealing resin is used to improve the mold release during sealing molding. Although it is difficult to obtain sufficient adhesion strength between the resin and the thin metal plate, as in the above configuration, the sealing resin can be formed in close contact with the thin metal plate through an adhesive resin layer provided on most of the other side of the thin metal plate. By doing so, the adhesion is significantly improved, and when this integrated circuit device is mounted on a plastic card and used as an IC card, even if it is subjected to external mechanical force, there will be no problems such as peeling or falling off of the thin metal plate, etc. The problem of deterioration of the integrated circuit element due to the infiltration of moisture etc. from the interface between the thin metal plate and the sealing resin is less likely to occur, resulting in an extremely reliable integrated circuit device suitable for IC cards.

Embodiment Hereinafter, an integrated circuit device according to an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a plan view of an integrated circuit device according to an embodiment of the present invention, and for the sake of explanation, only the outer shape of the sealing resin is shown. FIG. 2 is a longitudinal sectional view of an integrated circuit device according to an embodiment of the present invention, and is a longitudinal sectional view taken along line BB' in FIG. In FIGS. 1 and 2, 11 is a thin metal plate;
2 is an adhesive resin layer, 13 is an integrated circuit element, 14 is a metal wire,
16 is a sealing resin.

The configuration of the integrated circuit device of this example will be described in detail below along with its manufacturing method.

First, a strip-shaped metal material made of copper alloy with a thickness of 0.15 m was punched or photoetched.
In order to form the lead frame into the desired shape and use one side as the external connection terminal 112L (since the external connection terminal of an IC card integrated circuit device is a contact connection terminal), a nickel layer is applied to this one side. Undercoat plating and gold plating are applied, and on the other side, in order to connect metal wires by wire bonding, after the nickel undercoat plating, silver plating or gold plating is applied partially to the connection part,
A thin metal plate 11 was created. Many lead frame metal materials such as iron and iron-nickel alloys can be used as the band-shaped metal material, and the plating on the external connection terminal surface can be made of platinum or rhodium, which ensure reliability as a contact terminal. Plating of precious metals such as metals may be applied.

Next, the electrical connection part 1 for wire bonding the metal wire 14, which will be described later, on the other side 11b of the thin metal plate 11.
An adhesive resin layer 12 was formed on most of the area except for 1C using an adhesive made of an insulating resin. The adhesive resin layer 12 is formed by screen printing, and the pattern shape is as follows.
The shape is slightly smaller than that of the other thin metal plate 11b, excluding the electrical connection portion 110. The thickness of the adhesive resin layer 12 was approximately 40 μm after printing. Subsequently, the integrated circuit element 13 was mounted on the adhesive resin layer 12 at a predetermined position, and the adhesive resin layer 12 was cured by heating to be adhesively fixed. The reason why an insulating resin is used as the adhesive resin layer 12 is that the integrated circuit element is large compared to the position and dimensions of the external connection terminals on the thin metal plate, and when mounted across the external connection terminals, electrical short circuits may occur. By using an insulating resin and mounting the integrated circuit element 13 across each external connection terminal, the dimensional restrictions of the integrated circuit element 13 to be mounted and the external connection terminal 112L are avoided. Restrictions on both location and size have been significantly reduced.

Next, using a thin gold wire with a diameter of 25 μm as the metal wire 14, the input/output electrode 13a of the integrated circuit element 13 and the connection portion 11G on the other surface 11b of the thin metal plate 11 were electrically connected by wire bonding. . This electrical connection can be made by a wireless bonding method such as a flip chip method or a film carrier method other than the connection by the metal wire 14.

After making the necessary electrical connections between the input/output electrodes 13a of the integrated circuit element 13 and the metal thin plate 11, they are molded using a sealing molding material such as epoxy resin by the transfer 1 molding method, and then molded with the sealing resin 16. The integrated circuit element 13, the metal wire 14, and the other surface 11b of the thin metal plate 11 were protected. After this, unnecessary portions (not shown) of the lead frame were cut and removed.

As a result, the integrated circuit device of this example shown in FIGS. 1 and 2 was obtained.

The method for forming the sealing resin 16 described above will be explained in more detail. A thin metal plate 11 in the shape of a lead frame, on which an integrated circuit element 13 is mounted and fixed with adhesive, and the necessary electrical connections are made with metal wires 14, is externally placed in the lower mold of a transfer molding mold heated to the molding temperature. After the connection terminal surfaces are brought into close contact and the lower mold and upper mold are clamped, the sealing molding material, which is mainly composed of epoxy resin and contains a curing agent, filler, and other additives, is heated. After being injected into a mold under pressure and held for a certain period of time for curing, the resin was taken out from the transfer molding mold to form a sealing resin 15. The reason why the external connection terminal 111L is brought into close contact with the lower mold of the transfer mold is to prevent the sealing resin 15 from flowing into the surface of the external connection terminal 112L.

The dimensions of the integrated circuit device of this embodiment shown in FIGS.
The thickness was 0.85 m, and the dimensional accuracy was extremely good, and the dimensional variation was small as the thickness was ±1 μm or less. The thickness of each part is approximately that of the thin metal plate 11.
is 0.15rrrm, and the integrated circuit element 13 is 0.25mm.
, the adhesive resin layer 12 under the integrated circuit element 13 is 0.03 m long.
m, the sealing resin 16 on the integrated circuit element 13 is 0.22rr
It was an.

Further, as shown in FIG. 2, in the integrated circuit device of this embodiment, a portion of the corner of the sealing resin 16 on the opposite side to the surface that becomes the external connection terminal 11 is a curved surface with a radius of curvature of about 0.2 mm. And so. This prevents the thin wall part of the plastic card from being broken by a corner of the integrated circuit device when an IC card made by inserting and gluing an integrated circuit device into a hole in a plastic card is bent. This is to prevent this.

In addition, as shown in FIG. 2, in the integrated circuit device of this embodiment, the sealing resin 16 is exposed around the surface of the thin metal plate 11 that becomes the external connection terminal 11& and around the external connection terminal 111L. The surface is approximately the same surface. This is because when the external connection terminal surface 111L is made to protrude from the sealing resin 15, the protruding portion is susceptible to external force when carrying and using an IC card using this integrated circuit device.
This tends to cause problems such as peeling or falling off of the thin metal plate 11, and if the surface of the external connection terminal 11a is moved back from the sealing resin, the contact terminal of an external device such as an IC card reader/writer etc. Easy to cause poor contact with the piece,
This is to avoid these.

Regarding the method of forming the sealing resin, a transfer molding method using a sealing molding material containing an epoxy resin as a main component has been described, but in addition to this, a phenolic resin may be used as the sealing molding material. It can also be carried out by injection molding using a thermoplastic resin.

Regarding the integrated circuit device of this example obtained as described above, as environmental resistance tests, a pressure couture test (test conditions: 121°C, 2 atm, 100% RH, 500 hours) and a temperature cycle test (test conditions knee 50'C, 3
As a result of performing 500 cycles at 100° C. for 0 minutes for 30 minutes, there were no abnormalities such as lifting or peeling of the thin metal plate 11, which was caused by the infiltration of moisture etc. from the interface between the thin metal plate 11 and the sealing resin 15. No problem of deterioration of integrated circuit elements occurred. At the same time, as a comparative example, the adhesive resin layer was
An integrated circuit device in which the integrated circuit device was not provided on most of the other surface of 1 but only on the adhesively fixed part of the integrated circuit element was fabricated using the same method as in this example, and the same environmental resistance test was conducted. In the Kutzker test, 1 out of 10 samples had a defective integrated circuit element, and in the temperature cycle test, some samples had a gap at the boundary between the thin metal plate and the sealing resin.

Further, the integrated circuit device of this example was mounted and adhered on a plastic card provided with a hole to prepare an IC card, and a bending resistance test was conducted on this IC card. The test method and test conditions for the bending resistance test are as follows: The front and back sides of the card base are bent 250 times each, for a total of 1,000 times in each of the long and short sides of the card base. 20mm when bent
The bending process was carried out under conditions such that the bending distance in the short side direction was 10 mm.

As a result of the bending resistance test, no abnormality occurred in any of the IC cards using the integrated circuit device of this example.

As described above, the integrated circuit device of this embodiment has a thin metal plate 1
1, most of the other surface 11b of the adhesive resin layer 12, excluding the electrical connection portion, is provided on the adhesive resin layer 12, and then the integrated circuit element 13, the metal wire 1
4 and the other surface 11b of the thin metal plate 11, the adhesion between the sealing resin 15 and the thin metal plate 11 is significantly improved, and the sealing resin 15 can be protected against harsh environments or mechanical external forces. Also, a reliable integrated circuit device is obtained in which problems such as lifting and peeling of the thin metal plate 11 and deterioration of the integrated circuit element 13 due to infiltration of moisture from the interface do not occur.

Moreover, an IC card using this integrated circuit device has also become highly reliable as an IC card.

Effects of the Invention As described above, the present invention comprises a plurality of metal thin plates, each of which has at least a portion of one surface serving as an external connection terminal, and which are substantially on the same surface, and an adhesive resin layer provided on the other surface of these metal thin plates. an integrated circuit element mounted on a part of the thin metal plate and having input/output electrodes electrically connected to the other side of the thin metal plate; a sealing resin that covers an electrical connection between the output electrode and the other surface of the thin metal plate, and the adhesive resin layer is provided on most of the other surface of the thin metal plate except for the electrical connection. It is something that Therefore, there is no need for the expensive precision circuit board used in the past, and instead a thin metal plate processed into an inexpensive and extremely common lead frame shape can be used, which not only makes the integrated circuit device inexpensive but also
As a thin integrated circuit device suitable for C cards, it has a structure that can be manufactured with high dimensional accuracy and high efficiency, and unlike forming the sealing resin directly on the other surface of a thin metal sheet, Since the sealing resin is formed in close contact with the thin metal plate through the adhesive resin layer provided on the part, the adhesion is significantly improved, and this integrated circuit device can be mounted on a plastic card and used as an IC card. Even when subjected to external mechanical force, problems such as peeling or falling off of the thin metal plate, and problems of deterioration of the integrated circuit element due to infiltration of moisture etc. from the interface between the thin metal plate and the sealing resin are unlikely to occur. becomes.

[Brief explanation of the drawing]

FIG. 1 is a plan view of an integrated circuit device according to an embodiment of the present invention, FIG. 2 is a vertical cross-sectional view of an integrated circuit device according to an embodiment of the present invention, FIG. 3 is a perspective view of an IC card, and FIG. 4 is the third
FIG. 6 is a vertical cross-sectional view of a part of the IC card shown in the figure, and FIG. 6 is a vertical cross-sectional view of a conventional integrated circuit device. 11...Thin metal plate, 12...Adhesive resin layer, 13...Integrated circuit element, 14...
Metal wire, 16...Sealing resin. Name of agent: Patent attorney Shigetaka Awano and 1 other person11
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Claims (2)

[Claims] (1) At least a portion of one surface serves as an external connection terminal, and these are mounted on a plurality of thin metal plates substantially on the same surface and a portion of an adhesive resin layer provided on the other surface of these thin metal plates. , an integrated circuit element whose input/output electrodes are electrically connected to the other surface of these thin metal plates; a sealing resin that covers an electrically connected portion with the surface, and the adhesive resin layer is provided on most of the other surface of the thin metal plate except for the electrically connected portion. (2) An I in which the integrated circuit device of claim 1 is mounted on a card.
C card.