JPH06283381A - Check mark for detecting layer deviation of layered electronic parts - Google Patents

Abstract

PURPOSE:To inspect layer deviation in all electronic parts simply by inspecting the check mark provided at four corners of a green sheet. CONSTITUTION:A conductive member 14 which becomes an electrode, a protrusion 16 in first edge part appearing at an edge part when laminating a substrate 11 at four corners and then cutting a marginal part in the direction of the edge part, a protrusion 17 in second edge part provided with a spacing in reference to the protrusion 16 in the direction of the first edge part by the width of layered electronic parts, and a protrusion 18 in the direction of side part appearing at a side part when laminating the substrate 11 and then cutting the marginal part in the direction of side part are formed on the substrate 11. Then, the substrate 11 is layered and then is pressed. Then, after the marginal part is cut, total number of lamination electronic parts need not be inspected by inspecting the alignment of the protrusions 16 and 17 in the direction of edge part appearing at the edge part and the side part and a protrusion 18 in the direction of side part.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated electronic component obtained by laminating substrates on which conductive members are formed, for example, a check mark for detecting a lamination deviation of a capacitor, an inductor, a non-linear resistor or the like. Is. In addition, in the present specification, for example, an "end" of a capacitor
Means a short side and “side” means a side in the longitudinal direction.

[0002]

2. Description of the Related Art FIG. 8A is a side sectional view of a conventional multilayer capacitor, and FIG. 8B is an end sectional view of the same. In FIG. 8, the multilayer capacitor 81 has, for example, laminated ceramic substrates 82, internal electrodes 83 and 84 formed on the respective ceramic substrates 82, and alternate lead-outs at the end portions of the laminated ceramic substrates 82. End electrode 8 connected to internal electrodes 83, 84
5, 86. Then, the end electrode 8
Internal electrode 83 and internal electrode 84 connected to 5, 86
Form a multilayer capacitor 81 facing each other. Further, the multilayer capacitor 81 is formed by stacking a plurality of sheets after forming the internal electrodes 83 and 84 on the green sheet.
Then, the stacked green sheets are thermocompression bonded to obtain a laminated body. Next, after being divided into one monolithic capacitor, firing is performed to obtain a monolithic capacitor 81 made of ceramic.

FIG. 9 is a diagram for explaining the distortion inside the green sheet. FIG. 10A is a side sectional view of a conventional multilayer capacitor, and FIG. 10B is an end sectional view of the same. FIG. 11 is a diagram for explaining the internal electrodes that appear at the ends and the sides when the green sheets having the internal electrodes are stacked. In recent years, miniaturization of multilayer capacitors has been significantly advanced. For example, the width of the end and the length of the side of the multilayer capacitor appear to be 0.5 × 1.0 mm. In the method of detecting the stacking deviation in the multilayer capacitor as described above, a check mark having an arbitrary shape is printed at the same time as the internal electrodes, and the check mark exposed on the end surface and the side surface of the multilayer capacitor is inspected. . The check marks are inspected for misalignment in the length direction and the width direction by inspecting the alignment of the check marks exposed on the end faces and side faces of the multilayer capacitor.

[0004]

Due to the miniaturization of the multilayer capacitor, even a small stacking deviation has a great influence on its electrical characteristics, so that the inspection accuracy of the stacking deviation is required to be very high. . Further, in the conventional method for inspecting the stacking deviation, it is necessary to inspect each of the multilayer capacitors from two directions, that is, the end portion and the side portion. The inspection of the detection check mark in each capacitor is performed by recognizing the magnified image with a microscope. However, the inspection from the two directions in the individual multilayer capacitors as described above has a problem that the image recognition process is complicated. When the green sheets are laminated and thermocompression bonded to each other, as shown in FIG. 9, there is no distortion in the vicinity of the central portion 92 of the green sheet 91 and the intermediate portion 9 is formed.
There is a little distortion in 3. And the green sheet 91
In the peripheral portion 94 of, the distortion is large.

Particularly, when the peripheral portion of the green sheet 91 is directly used as a multilayer capacitor, for example, FIG.
As shown in (a) and (b), the end margins 106 and 107 in the lateral direction may have different lengths. Similarly, in the multilayer capacitor in the peripheral portion of the green sheet 91, the lengths of the side margins 110 and 111 in the end direction may differ. Further, as shown in FIG.
In order to eliminate the distortion of the peripheral portion of the green sheet 91, an opening 113 is formed at a predetermined position.
Positioning is performed by passing the pin 114 through the pin 3. However, even if such a stacking method is adopted, distortion is generated in the peripheral portion of the green sheet 91 during thermocompression bonding, and the internal electrodes 116, 118, 120, 122 are displaced. Then, the internal electrodes 115, 117, 119, 121 located at the center or the middle portion 93 of the green sheet 91.
Has almost no distortion.

The present invention is intended to solve the above problems, and it is possible to inspect the stacking deviation in all capacitors by simply inspecting the check marks provided at the four corners of the green sheet. It is intended to provide a check mark for detecting a deviation.

[0007]

(First Invention) In order to achieve the above object, a check mark for detecting a stacking error of a multilayer electronic component according to the present invention is a conductive member (14 in FIG. 1).
Substrates (11 in FIG. 1) on which are formed are alternately staggered by the width of one laminated electronic component, stacked, laminated and adhered, and then cut into a predetermined shape along an imaginary line to be cut, whereby An electronic component is provided in a laminated electronic component that can be obtained, and appears at an end when the substrate (11) is laminated at four corners on the substrate (11) and a marginal portion in the end direction is cut. A first end direction projection (16 in FIG. 1),
A second end-direction protrusion (1 in FIG. 1) provided with a gap between the first end-direction protrusion (16) and the width of the laminated electronic component.
7) and the substrate (11) are laminated and the marginal portion in the lateral direction thereof is cut, the lateral direction protrusion (FIG.
18) and.

(Second Invention) The check mark for detecting the stacking deviation of the multilayer electronic component according to the present invention is obtained by stacking and adhering the substrates on which the conductive members are formed by shifting the width of one stacked electronic component, and then cutting them. It is provided in a laminated electronic component in which a single electronic component can be obtained by cutting the substrate (11) along a predetermined virtual line, and the substrate (11) is laminated at four corners of the substrate (11). When the marginal portion in the end direction is cut, the end-direction protrusion (5 in FIG.
2) and the substrate (11) are stacked, and a lateral direction protrusion (FIG.
53) and.

[0009]

[Operation] According to the present invention, if the deviations of the predetermined stacking deviation detection check marks provided at the four corners of the boards exposed at the end portions and the side portions of the stacked boards are within a predetermined range, It is noted that stacking deviations in other stacked electronic components are also allowed. (First Invention) A conductive member is formed in a predetermined pattern on a substrate. Then, when the conductive member is formed on the substrate, check marks for stacking error detection are formed at the four corners of the substrate. The check mark for stacking error detection is a shape that contrasts with the vertical and horizontal centerlines of the board.When the blank area of the board is cut along the virtual line to cut, it is exposed in the end and side directions. It has a part to do. Further, the check mark for stacking deviation detection includes a first end-direction protrusion that appears at an end when the boards are stacked by shifting the width of the electronic part, and the first end-direction projection and the one-stack electronic component. And a second end-direction protrusion provided at intervals of the width. Further, the stacking deviation detection check mark is provided with a lateral direction projection that appears on a side part when the substrates are stacked and a marginal part in a lateral direction thereof is cut along a virtual line to cut.

The check mark for detecting the stacking error having the above-described shape is obtained by stacking two substrates by shifting the width of one electronic component and stacking them alternately, and then cutting the end and side margins along the virtual cutting line. , The stacking misalignment detection check marks provided at the four corners of the substrate are exposed at the ends in a state where the first end-direction protrusion and the second end-direction protrusion overlap each other, and the side-direction protrusions are also exposed to the side. Exposed to the area. Therefore, when inspecting the end-direction protrusion exposed on the end and the side-direction protrusion exposed on the side, if the deviation of these protrusions is within the allowable range, the electronic component is Electrical characteristics can be obtained. That is, according to the present invention, it is not necessary to inspect each electronic component one by one by only inspecting the stacking deviation detection check marks provided at the four corners of the substrate.

(Second Invention) Substrates on which patterns of two different kinds of conductive members are formed are alternately laminated.
Then, the stacking deviation detection check marks provided at the four corners of the substrate are the end-direction protrusions that appear at the end when the blank part in the end direction of the substrate is cut along the virtual line to cut, and It is composed of a lateral direction protrusion that appears on the side part when the marginal part in the lateral direction of the substrate is cut along the virtual cutting line. Substrates on which such a check mark for stacking deviation detection is formed are stacked and thermocompression-bonded, and then the margins at the ends and sides are cut along the planned cut line. Check marks for detecting the stacking deviation of the respective boards are exposed at the ends and the side parts of the four corners of the cut board. Therefore, like the first invention, the present invention does not inspect individual electronic components, but only inspects the stacking deviation detection check marks provided at the four corners, and determines whether the stacking deviation is within the allowable range. The inspection can be done easily.

[0012]

EXAMPLE FIG. 1 is an example of the present invention and is a schematic view for explaining internal electrodes formed on a green sheet of a multilayer capacitor and check marks for stacking deviation detection provided at four corners. In FIG. 1, the green sheet 11
Is obtained by kneading the dielectric ceramic powder with an organic binder to obtain a ceramic slurry, which is processed into a sheet.
A conductive paste for forming the internal electrodes 14 is applied onto the green sheet 11 by a screen printing method. In order to form a laminated capacitor, for example, the first laminated substrate 12 and the second laminated substrate 13 are laminated so as to face each other, and the upper portion of the first laminated substrate 12 in FIG.
Also, the end electrodes (not shown) are taken out from the lower portion of the second laminated substrate 13, respectively. That is, the green sheets 11 are stacked one on the other in the left-right width direction in FIG. 1 with a shift of one pitch, and end electrodes (not shown) are taken out alternately from the internal electrodes 14 exposed at the cut ends.

On the other hand, check marks 15 are formed at the four corners of the green sheet 11 so as to be exposed on the side surfaces in the end direction and the side direction when cutting the marginal portion of the peripheral portion of the green sheet 11 which is highly distorted. There is. The check mark 15 has a symmetrical shape with respect to the vertical and horizontal centerlines of the green sheet 11. Further, the check mark 15 is provided with a pitch of one pitch in order to shift the pitch by one pitch every other layer in the left-right width direction shown in FIG.
An end direction protrusion 16 and a second end direction protrusion 17 and a side direction protrusion 18 are formed.

FIG. 2 is an embodiment of the present invention and is a view for explaining a state in which check marks formed at four corners of the green sheet are enlarged and overlapped. In FIG. 2, the solid line indicates the check mark 1 formed on the upper green sheet 11.
In FIG. 5, the dotted line is a check mark 15 'formed on the green sheet 11 laminated therebelow. In FIG. 2, the lower green sheet 11 is displaced from the green sheet 11 of FIG. 1 by one pitch to the left side. Then, the blank portion 22 of the green sheet 11 is cut by the planned cutting lines 23 and 25. At the end of the green sheet 11, the second end-direction protrusion 17 of the check mark 15 and the first end-direction protrusion 16 'of the check mark 15' are exposed.
Further, the side direction protrusion 18 of the check mark 15 and the side direction protrusion 18 'of the check mark 15' are exposed on the side part of the green sheet 11.

FIG. 3 is a diagram showing an end surface and a side surface of the check mark shown in FIG. 2 in the case where four green sheets are laminated in one embodiment of the present invention. In FIG.
The arrow points from the top to the bottom of the stacked green sheets 11. Then, the solid line and the dotted line are assumed to be at the same positions as in FIG. The upper end surface 31 in FIG.
The end-direction protrusions 17 and the first end-direction protrusions 16 'are alternately exposed. On the right side surface 32 in FIG. 3, the lateral projections 18 and the lateral projections 18 'are alternately exposed.
On the lower end face 33 in FIG. 3, only the odd-numbered check marks 15 are exposed. Further, the left side surface 34 in FIG. 3 has only the even-numbered check marks 15 'exposed.

FIGS. 4 (a) and 4 (b) are three-dimensional views showing the end faces and side faces of the check mark laminated body, and (c) show the end faces and side faces of the laminated body serving as the laminated capacitor. It is a three-dimensional figure. In FIG. 4 (a), the check mark portion 41 cut along the virtual cutting lines 23 to 25 shown in FIG. 2 has the first or second end direction protrusion 1
7 and 16 'and lateral projections 18 and 18' are exposed. The check marks 15 and 15 '(see FIG. 2) exposed on the end faces and the side faces are neatly aligned and not biased in the left-right direction. In FIG. 4B, the check mark portion 42 is exposed with the first or second end-direction protrusions 17 and 16 'and the side-direction protrusions 18 and 18' being non-uniform. That is, it can be seen that the check mark portions 42 are displaced in the end face direction and the side face direction. Also, check mark parts 41, 4
As shown in FIG. 4C, the parts of the multilayer capacitor other than 2 have internal electrodes 4 that are alternately connected to the end electrodes on the end surfaces.
4, 45 are exposed, and the internal electrodes 44, 45 are not exposed on the side surfaces. In this way, by inspecting the end faces and side faces of the check marks 15 provided at the four corners of the green sheet 11, it is possible to easily inspect the non-defective product and defective product of the multilayer capacitor in other portions.

FIG. 5 is a view for explaining a green sheet having internal electrodes and check marks according to another embodiment of the present invention. FIG. 6 is a diagram for explaining a green sheet on which internal electrodes and check marks that are offset by one pitch from FIG. 5 are formed. In FIG. 5 and FIG. 6, a part of the four corners of the green sheet is shown. The internal electrode 54 shown in FIGS.
The internal electrode 64 and the internal electrode 64 are formed in a pattern shifted from each other by one pitch. Further, the check mark 51 is formed with an end direction protrusion 52 and a side direction protrusion 53.
Then, when the blank portion 55 of the green sheet is cut by the virtual lines 511 and 527 to be cut, the end-direction protrusion 52 and the side-direction protrusion 53 are exposed. The check mark 61 in FIG. 6 is formed with the end-direction protrusion 62 and the side-direction protrusion 63, similarly to the above.
And, below the check mark 61 shown in FIG. 6, one of the internal electrodes 61 'can be formed.

FIG. 7 shows a state in which the check marks shown in FIGS. 5 and 6 are enlarged and overlapped. In FIG. 7, the planned cut virtual lines 511 and 512 and the planned cut virtual line 52.
By cutting 6, 527, the blank portion of the green sheet is cut. Then, the end-direction protrusions 52 and 62 are exposed at the end portions of the stacked green sheets, and the side-direction protrusions 53 and 63 are exposed at the side portions of the green sheets, respectively. Therefore, the stacking deviation of the green sheets can be inspected only by checking the end-direction protrusions 52 and 62 and the side-direction protrusions 53 and 63 of the check marks 51 formed at the four corners of the green sheet. After inspecting the check marks at the four corners of the green sheet in this way, if there is no stacking deviation, cut along each imaginary line to be cut,
A ceramic capacitor is produced by firing these.

Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above embodiments. And
Various design changes can be made without departing from the invention as set forth in the claims. For example, it goes without saying that the check marks formed at the four corners of the green sheet can be deformed into various shapes as long as they are exposed at the end portions and the side portions. In addition, although the embodiment has been described using the multilayer capacitor,
It can be applied to other inductors, non-linear resistors, etc. Furthermore, the check mark can be applied with paint other than the conductive member.

[0020]

According to the present invention, when the margin portion of the green sheet is cut, the end portion and the side portion of the stacking deviation detection check mark are exposed, so that individual electronic parts can be formed. Laminate misalignment can be checked without inspection. Further, by forming the first end direction protrusion and the second end direction protrusion that are offset by one pitch on the check mark, it is possible to check the stacking displacement even when the electronic components are manufactured by stacking them alternately by shifting one pitch. You can easily.

[Brief description of drawings]

FIG. 1 is a schematic diagram for explaining an internal electrode formed on a green sheet of a multilayer capacitor and a stacking deviation detection check mark provided at four corners in one embodiment of the present invention.

FIG. 2 is a diagram for explaining a state in which check marks formed at four corners of a green sheet are enlarged and overlapped with each other in an embodiment of the present invention.

FIG. 3 is a diagram showing end faces and side faces of the check mark shown in FIG. 2 in the case where four green sheets are stacked, according to the embodiment of the present invention.

4A and 4B are three-dimensional views showing the end faces and side faces of the laminated body of the check mark portion, and FIG. 4C is a three-dimensional view showing the end faces and side faces of the laminated body of the portion to be the multilayer capacitor. It is a figure.

FIG. 5 is a diagram for explaining a green sheet on which internal electrodes and check marks are formed according to another embodiment of the present invention.

FIG. 6 is a diagram for explaining a green sheet on which internal electrodes and check marks that are offset by one pitch from FIG. 5 are formed.

FIG. 7 shows a state in which the check marks shown in FIGS. 5 and 6 are enlarged and overlapped.

FIG. 8A is a side sectional view of a conventional multilayer capacitor, and FIG. 8B is a sectional view of the same in the end direction.

FIG. 9 is a diagram for explaining distortion inside the green sheet.

FIG. 10A is a side sectional view of a multilayer capacitor in a conventional example, and FIG. 10B is a sectional view of the same in the end direction.

FIG. 11 is a diagram for explaining the internal electrodes that appear at the end portions and the side portions when the green sheets on which the internal electrodes are formed are stacked.

[Explanation of symbols]

 11 ... Green sheet 12 ... First laminated substrate 13 ... Second laminated substrate 14 ... Internal electrode 15 ... Check mark 16 ... First end direction projection 17 ... Second End direction protrusion 18 ... Side direction protrusion

Claims (2)

[Claims] 1. A single electron is formed by alternately stacking substrates on which conductive members are formed by shifting the width of one laminated electronic component, adhering them, and then cutting them into a predetermined shape along a virtual line to cut. In a laminated electronic component from which a component is obtained, a first end portion direction protrusion that appears at an end portion when the substrate is laminated and a blank portion in the end portion direction is cut is provided at four corners on the substrate, The first end-direction protrusions and the second end-direction protrusions spaced apart by the width of the laminated electronic component, and the second end-direction protrusions on the side when the board is laminated and the marginal part in the side direction is cut. A check mark for detecting a stacking deviation of a stacked electronic component, which is provided with a check mark consisting of a side protrusion that appears. 2. A single electronic component is manufactured by stacking and adhering substrates in which conductive members are formed by shifting the width of one laminated electronic component, adhering them, and then cutting them into a predetermined shape along a virtual line to be cut. In the laminated electronic component in which the above-mentioned substrate is laminated, at the four corners on the substrate, when the substrate is laminated and the marginal portion in the edge direction is cut, the end-direction protrusions that appear at the end and the substrate are laminated. A check mark for detecting a stacking error in a stacked electronic component, which is provided with a check mark consisting of a lateral projection that appears on the side when the marginal part in the lateral direction is cut.