JP2504229B2 - Method for manufacturing laminated electronic component - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a method for manufacturing a laminated electronic component, and in particular, it is formed by stacking ceramic green sheets, and is formed between ceramic green sheets. The present invention relates to a method for manufacturing a laminated electronic component in which electrodes are formed.

[Prior Art] A typical example of a multilayer electronic component is a multilayer ceramic capacitor. A monolithic ceramic capacitor is generally manufactured as follows. That is, (1) the internal electrodes are printed on the ceramic green sheet by, for example, a screen printing method.

(2) Stacking the ceramic green sheets having a predetermined size and having the internal electrodes printed, obtained in (1) above, together with the ceramic green sheets having a predetermined size and not having the internal electrodes printed, as necessary. Then, the laminate obtained thereby is pressed and pressure-bonded.

(3) Next, the laminated body is cut into a size to be an individual laminated ceramic capacitor, and thereafter, steps of firing and forming external electrodes are carried out to obtain a desired laminated capacitor.

[Problems to be Solved by the Invention] In the above-described method for manufacturing a monolithic ceramic capacitor, the internal electrodes facing each other via the ceramic green sheet must be accurately aligned with each other. However, the conventional manufacturing method of the monolithic ceramic capacitor includes some factors that hinder such accurate alignment.

For example, when screen-printing the internal electrodes, the printed internal electrodes may be displaced from a predetermined position due to the elongation of the screen.

Also, in the process of stacking the ceramic green sheets, the alignment between the ceramic green sheets is
The end surface of each ceramic green sheet is used as a positioning reference. Therefore, the reliability of the positioning of the ceramic green sheet having no rigidity is limited. In particular, when each of the ceramic green sheets is thinned in order to obtain a large electrostatic capacity, the rigidity thereof further decreases, and it becomes more and more difficult to perform accurate alignment by the end faces of the ceramic green sheets.

In addition, it is difficult to expect uniform elongation over the entire surface of the laminated body of the ceramic green sheets when pressure bonding is performed, and in particular, a larger elongation is generated at the end portion as compared with other portions.

Therefore, when the chips to be the individual monolithic ceramic capacitors are cut out from the laminated body, the end face of the laminated body is used as a positioning reference. The deviation is reflected as it is. Therefore, in the monolithic ceramic capacitor obtained through the above-mentioned steps, defects sometimes occur due to the positional displacement of the internal electrodes. Further, the rate of occurrence of such defects increases as the monolithic ceramic capacitor to be obtained is made smaller.

The occurrence of such a defect is extremely difficult to completely prevent, and it is a property that must be prepared to some extent. From the point of view of economy, it is preferable to detect the defects as early as possible and not to carry out the subsequent steps for the defective products.
As a result, it also contributes to the reduction of the cost of the product. Also, by doing so, the product yield is improved.

Therefore, it is an object of the present invention to provide a method for manufacturing a laminated electronic component, which can detect misalignment of internal electrodes as soon as possible and prevent the execution of unnecessary steps thereafter. is there.

[Means for Solving the Problems] In the method for manufacturing a laminated electronic component according to the present invention, first, a ceramic green sheet is prepared. Then
An internal electrode is printed in a rectangular area on the ceramic green sheet, and an internal electrode is formed in a peripheral area surrounding the rectangular area, which is in contact with at least two adjacent sides of the rectangular area and which is cut later. The step of printing the alignment mark with a predetermined positional relationship with respect to the electrodes is performed. Next, a step of obtaining a laminated body in which a plurality of ceramic green sheets on which the internal electrodes and the alignment marks are printed are stacked, and the ceramic green sheets are cut along a cutting line that passes over the alignment marks to perform alignment. Exposing the mark to the end face of the ceramic green sheet. The steps of obtaining these laminates and exposing the alignment marks to the end faces of the ceramic green sheet may be performed in any order. That is, after obtaining the laminated body, even if the plurality of ceramic green sheets are cut at once and the alignment mark is exposed on the end surface of the ceramic green sheet, the plurality of ceramic green sheets are cut separately, The plurality of ceramic green sheets may be stacked after exposing the alignment mark on the end surface of the ceramic green sheet. Then, in the state of the laminated body, a step of checking the alignment state of the alignment marks exposed on the end face of the ceramic green sheet and cutting only the laminated body determined to be in proper alignment state into individual chips is performed. It

[Operation and Effect of the Invention] According to the present invention, the alignment mark is printed on the ceramic green sheet in a predetermined positional relationship with the internal electrodes. Therefore, the alignment mark can serve as a reference when chucking the position of the internal electrode. The ceramic green sheet is in a state in which the alignment mark is exposed on its end surface by being cut by a cutting line passing over the alignment mark. Therefore, by checking the alignment state of the alignment marks exposed on the end surface of the ceramic green sheet in the state of the laminated body, it is determined whether the alignment of the internal electrodes located in the laminated body is proper or not depending on the alignment state. can do.

Therefore, when it is determined that the alignment mark is not properly aligned, such a laminated body is removed from the manufacturing line, and the subsequent steps are not performed on such a laminated body. can do. This makes it possible to obviate the execution of wasteful steps such as firing and formation of external electrodes. In this respect, the economical efficiency can be improved, which in turn can contribute to the reduction of the manufacturing cost of the laminated electronic component. In addition, as a result, only products that do not reflect the drawbacks encountered in the prior art can be obtained, so that the product yield can be improved.

Further, when cutting chips that are to be individual laminated electronic components from the laminated body, for example, in the case of obtaining a laminated ceramic capacitor, such cutting may be performed with reference to the alignment mark while referring to it. it can. Therefore, the accuracy of such cutting is also improved.

[Embodiment] FIG. 1 is a plan view showing a ceramic green sheet 1 used for carrying out an embodiment of the present invention.
This ceramic green sheet 1 is used for manufacturing a laminated ceramic capacitor as an example of a laminated electronic component.

The ceramic green sheet 1 is intended to obtain a large number of monolithic ceramic capacitors by cutting after performing the subsequent stacking steps, so that a large number of internal electrodes 2 are arranged in the vertical and horizontal directions. Is formed. The internal electrode 2 is located in a rectangular area 3 on the ceramic green sheet 1.

In addition, in the peripheral area 4 surrounding the rectangular area 3 on the ceramic green sheet 1, a plurality of alignment marks 5 having a predetermined positional relationship with the internal electrode 2 are provided.
Is formed. The alignment mark 5 has, for example, a "-" shape, but may have any other shape. In the illustrated embodiment, the respective positions of the alignment marks 5 coincide with the positions of the cutting lines when cutting out the chips to be the individual laminated ceramic capacitors from the laminated body obtained by the subsequent stacking step. However, this is not mandatory. Further, the alignment mark 5 is formed in the peripheral region 4 which is in contact with all sides of the quadrangle defining the quadrangle region 3, as shown in the drawing, but at least adjacent to the quadrangle. It suffices if it is formed in a region in contact with two sides.

The alignment mark 5 as described above is provided on the internal electrode 2
At the same time, it is formed by printing. Therefore, the positional relationship between the internal electrode 2 and the alignment mark 5 is prevented from deviating from each other. For printing the internal electrodes 2 and the alignment marks 5, any printing method such as a screen printing method or a gravure printing method can be adopted.

Next, the plurality of ceramic green sheets 1 shown in FIG. 1 are stacked in a predetermined manner. As a result, the laminate 6 shown in the front view in FIG. 2 is obtained.
The laminated body 6 is pressure-bonded as in the conventional case.

Next, the periphery of the laminated body 6 is cut off. This cutting is performed along the cutting line 7 shown in FIG. The cutting line 7 is chosen to pass over the alignment mark 5, as shown in FIG.

The laminate 6 cut along the cutting line 7 as described above
Is shown in front view in FIG. As shown in FIG. 3, the alignment mark 5 is exposed on the end face of the laminated body 6, that is, the end face of the ceramic green sheet 1 (FIG. 1) included therein by the above-mentioned cutting. There is.

In such a state of the laminated body 6, the alignment mark 5
The alignment of is checked. At this time, if the alignment mark 5 is properly aligned as shown in FIG. 3, the subsequent steps for obtaining the monolithic ceramic capacitor are carried out as described below. On the other hand, when it is judged that the alignment mark 5 is not properly aligned, such a laminated body 6 is removed from the manufacturing line.

As described above, only the laminated body 6 in which the alignment marks 5 are properly aligned is cut to cut out the chips to be the individual laminated ceramic capacitors. At the time of this cutting, the positioning mark 5 exposed from the end surface of the laminated body 6 may be used as a reference for the cutting position. Then
Firing and formation of external electrodes are performed. In this way, the desired monolithic ceramic capacitor is obtained.

As a ceramic green sheet used for manufacturing a laminated electronic component such as a laminated ceramic capacitor, as shown in FIG. 4, instead of the ceramic green sheet 1 punched into a predetermined size as shown in FIG. Alternatively, a continuous ceramic green sheet 1a may be used. In FIG. 4, parts corresponding to the parts shown in FIG. 1 are given the same reference numerals.

In the ceramic green sheet 1a shown in FIG. 4, rectangular regions 3 in which the internal electrodes 2 are formed are distributed in the longitudinal direction. Such a ceramic green sheet
In order to obtain a ceramic green sheet of a predetermined size to be stacked to form a laminated body from 1a, the ceramic green sheet 1a is sequentially punched so as to include a rectangular region 3 forming the internal electrode 2. It By such punching, the ceramic green sheet 1 shown in FIG.
As described above, the ceramic green sheet having a predetermined size in which the alignment mark 5 is taken in may be first obtained, but at a stroke, the ceramic green sheet is struck along the cutting line 7 passing over the alignment mark 5. You may remove it. When the ceramic green sheets 1a are punched along the cutting lines 7, as soon as they are stacked, the laminated body 6 as shown in FIG.
Will take the form of.

Although the present invention has been described above with respect to the method for manufacturing a monolithic ceramic capacitor, the present invention can be applied to a method for manufacturing a monolithic electronic component other than the monolithic ceramic capacitor. For example, the manufacturing method according to the present invention can be applied to multilayer electronic components such as multilayer circuit boards, laminated LC filters, L chips, and C networks.

[Brief description of drawings]

FIG. 1 is a plan view showing a ceramic green sheet 1 used when carrying out an embodiment of the present invention. FIG. 2 is a front view showing a laminated body 6 obtained by laminating the ceramic green sheets 1 shown in FIG. FIG. 3 is a front view showing a state in which the periphery of the laminated body 6 shown in FIG. 2 is cut. FIG. 4 is a plan view showing a ceramic green sheet 1a used when implementing another embodiment of the present invention. In the figure, 1 and 1a are ceramic green sheets, 2 are internal electrodes, 3 is a quadrilateral region, 4 is a peripheral region, 5 is an alignment mark, 6 is a laminated body, and 7 is a cutting line.

Claims (2)

(57) [Claims] 1. A step of preparing a ceramic green sheet, wherein internal electrodes are printed in a rectangular area on the ceramic green sheet, and a peripheral area surrounding the rectangular area is adjacent to at least the rectangular area. Printing an alignment mark with a predetermined positional relationship with respect to the internal electrode in a region on a cutting line that is in contact with two sides and is cut later; and a plurality of the internal electrodes and the alignment mark printed. A step of obtaining a laminated body in which the ceramic green sheets are stacked, and the ceramic green sheets are cut by a cutting line that passes over the alignment marks, and the alignment marks are exposed on the end faces of the ceramic green sheets. The step of A method for manufacturing a laminated electronic component, comprising: checking the alignment state of the alignment marks exposed on the end surface of the sheet, and cutting only the laminate body determined to have an appropriate alignment state into individual chips. 2. A step of preparing a ceramic green sheet, wherein internal electrodes are printed in a rectangular area on the ceramic green sheet, and a peripheral area surrounding the rectangular area is adjacent to at least the rectangular area. Printing an alignment mark with a predetermined positional relationship with respect to the internal electrodes in a region on a cutting line that is in contact with the two sides and is cut later; passing the ceramic green sheet over the alignment mark Cutting by a cutting line to expose the alignment mark on the end surface of the ceramic green sheet, and stacking the plurality of cut ceramic green sheets on which the internal electrodes and the alignment mark are printed A step of obtaining a laminated body, and in the state of the laminated body, the ceramic A step of checking the alignment state of the alignment marks exposed on the end face of the Mick green sheet, and cutting only the stack body determined to have an appropriate alignment state into individual chips. Method.