JP2860849B2 - Check mark for detecting misalignment of laminated electronic component, laminated electronic component having check mark for detecting misalignment of laminated electronic component, and method for inspecting misalignment of laminated electronic component - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated electronic component obtained by laminating substrates on which conductive members are formed, such as a capacitor, an inductor, and a non-linear resistor. Mark and stack misalignment detection
Multilayer electronic components with a check mark
The present invention also relates to a method for inspecting a laminated electronic component for misalignment.

[0002]

2. Description of the Related Art FIG. 6 is a view for explaining a ceramic body of a conventional multilayer capacitor. In FIG. 6, the ceramic body has electrode patterns 62, 64, 6
6, 68 are formed. The odd-numbered ceramic body and the even-numbered ceramic body are stacked so as to be connected to an external electrode at an end of the electrode pattern. The ceramic bodies provided with such electrode patterns are laminated and thermocompression-bonded. After that, the laminated ceramic body is cut along virtual lines 1 to 8 to be cut, and the chip-shaped multilayer capacitor body 6 is cut.
1, 63, 65 and 67. After attaching external electrodes to the laminated capacitor element bodies 61, 63, 65 and 67, firing is performed to form a laminated capacitor.

In recent years, miniaturization and large capacity of multilayer capacitors have been remarkably progressing. For this reason, the number of ceramic bodies on which electrode patterns are formed tends to increase.
As the number of ceramic bodies increases, a problem arises in the accuracy of lamination. Increasing the number of stacked ceramic elements and reducing the size of the ceramic elements increase the probability of occurrence of stacking misalignment and increase the occurrence of variations in capacitor characteristics and defects due to stacking misalignment. The conventional method for detecting the stacking deviation of the ceramic body as described above is to print a mark of an arbitrary shape at the same time when printing the electrode pattern on the ceramic body, and to form an end face of the chip-shaped multilayer capacitor. And the marks exposed on the sides were inspected. As described above, the chip-formed multilayer capacitor has been inspected for stacking deviation in the length direction and the width direction by inspecting the marks exposed on the end face and the side face.

[0004]

However, in the above-described conventional method for inspecting the stacking deviation, in order to inspect the length direction and the width direction of the stacking deviation, the displacement of the mark printed on the ceramic body must be determined by using a multilayer capacitor. Had to be inspected from two directions, the end face and the side face. Therefore, when printing the electrode pattern, the inspection mark must be provided on the ceramic body in the length direction and the width direction. The inspection of the inspection mark is performed by recognizing an image enlarged by a microscope. But,
Inspection from two directions of the multilayer capacitor as described above has a problem in that the image recognition process is complicated.

An object of the present invention is to solve the above-mentioned problems, and to provide a method for stacking a multilayer electronic component capable of simultaneously detecting a stacking deviation in a length direction, a width direction, and an oblique direction from only one direction of a multilayer capacitor. Check mark for misalignment detection and check mark for stacking misalignment are formed
It is an object of the present invention to provide a laminated electronic component and a method of inspecting a laminated electronic component for misalignment.

[0006]

Means for Solving the Problems (First invention) In order to achieve the above object, a check mark for detecting a displacement of a laminated electronic component according to the present invention is a conductive member (12 in FIG. 1).
The substrate (11) of FIG. 1 is laminated and bonded, and then cut into a predetermined shape to obtain a single electronic component, which is attached to the laminated electronic component. In addition, on a virtual line to be cut (1 to 4 in FIG. 1) for obtaining a single electronic component, it is arranged so as to be perpendicular to the virtual line to be cut (1 to 4) and parallel to the virtual line to be cut (1 to 4). A pair of check marks each having an opposite side of the same length and an inclined side opposite to the opposite side (FIG. 1)
13).

(Second and Third Inventions ) The stacking deviation detecting check mark of the present invention is formed.
The laminated electronic component includes a conductive member (12) and a pair of chips.
The substrate on which the check mark (13) is formed is laminated.
A single electron whose bonded part is cut into a predetermined shape
It is characterized by consisting of parts. In addition, the method for inspecting lamination displacement of a laminated electronic component according to the present invention, when laminating a substrate (11) on which a pair of check marks (13) are formed together with a conductive member (12), comprises: The group of the check marks (13) appearing in the cross section of the pair is enlarged and inspected, and the length and the position of the pair of check marks (13) are shifted depending on the width, length or oblique direction of the laminated substrate. wherein the benzalkonium <br/> and can detect from one shift of.

[0008]

(It is no first aspect third invention) [create a] On the substrate, with the conductive member is formed, in cut imaginary line to obtain a single electronic component, and at right angles the cutting imaginary line As a result, a pair of check marks each having a parallel opposite side having the same length and a side inclined to the opposite side to the opposite side are formed. Therefore, the pair of check marks is exposed on the side surface of the laminated substrate. When there is no misalignment, the lengths of the pair of check marks are all the same, and the check marks are arranged at equal intervals. In the case of lamination misalignment in the width direction, a long or short pair of check marks is detected. In addition, in the case of stacking misalignment in the length direction, a pair of check marks with misaligned positions are detected. Furthermore, in the case of stacking misalignment in an oblique direction, a pair of check marks having different lengths in the left-right direction and a pair of check marks having different positions are detected. Also,
In the case of lamination displacement in the oblique direction, the interval between the pair of check marks is detected to be wider than normal. As described above, in the inspection from one direction of the laminated substrate, the length direction, the width direction, and the oblique direction of the lamination shift are detected. In this specification, the shorter one of the electrode patterns shown in FIG. 1 is referred to as a width direction, and the longer one is referred to as a length direction. Similarly, the shorter one of the electrode patterns is referred to as an end face, and the longer one is referred to as a side face.

[0009]

FIG. 1 is a view for explaining a ceramic body of a multilayer capacitor according to an embodiment of the present invention. First, the dielectric ceramic powder is kneaded with an organic binder to form a slurry. The slurry is used to form a ceramic body 11 from a ceramic sheet having a thickness of, for example, 10 μm by a doctor blade or the like. On the ceramic body 11, an electrode pattern 12 serving as an internal electrode is formed by screen printing, and at the same time, a check mark 13 for inspecting lamination misalignment is formed.

The print position of the check mark 13 is, for example, such that the center of the check mark 13 is located on the virtual lines 1 to 4 to be cut. Further, the shape of the check mark 13 includes a pair of opposite sides having the same length parallel to the imaginary lines 1 to 4 to be cut in a direction perpendicular to the imaginary lines 1 to 4 and an inclined side opposite to the opposite side. For example,
The check mark 13 is formed on the cutting lines 1 to 4 with the vertical sides of the right triangle facing each other. The check mark 13 may be provided at one place, but as shown in FIG. 1, two check marks 13 are provided on the side of the ceramic body 11 and the directions are reversed.

The ceramic body 11 on which the electrode pattern 12 and the check mark 13 are formed as described above is punched into a predetermined shape and then stacked. Thereafter, the ceramic body 11 having a predetermined shape is adhered by, for example, thermocompression bonding or the like to obtain a laminated body. This laminated body is cut along virtual lines 1 to 4 to be cut by a rotary blade (not shown), and is divided into chips of a predetermined size. External electrodes (not shown) are connected to the alternate electrode patterns 12 on the end surfaces of the stacked chips to form a multilayer capacitor. On the other hand, two check marks 13 having different directions appear on one side surface of the divided chip, and two check marks 13 having the same side surface and the one side surface having different directions appear on the other side surface.

FIG. 2 is an enlarged view of one embodiment of the present invention, showing a side surface of a multilayer capacitor having no stacking deviation. Reference numeral 21 shown in FIG. 2 indicates a side surface of a stack of 12 ceramic bodies 11, and a check mark 13 appearing on the side surface 21 is inspected. Check mark 13
As described above, the center of the right triangle is formed on the virtual lines 1 to 4 to be cut as described above. Therefore, when there is no lamination displacement in the ceramic body 11, as shown in FIG.
Are cut at equal intervals and to the same length. Therefore, as shown in FIG. 2, the check marks 13 having the same length are arranged regularly at equal intervals. The check mark 13 is enlarged by, for example, a microscope (not shown) and analyzed by an image recognition device, so that a displacement on the order of several μm can be detected.

FIG. 3 is an enlarged view of a side surface of the multilayer capacitor in the case where lamination displacement in the width direction is detected, according to an embodiment of the present invention. If lamination misalignment occurs in the width direction,
The center of the right triangle, which is the check mark 13, is not cut by the cutting line. For example, in FIG.
Is a check mark in a portion where there is no misalignment, and reference numerals 31 to 34 are check marks in a portion where misalignment has occurred. Checkmarks 32 and 33
Indicates that it is longer than the length of the check mark 13 and is cut by a cutting line near the base of the right triangle. That is, the check marks 32, 3
3, and check marks 31, 34 shorter than usual,
It can be found in the third and tenth layers of the ceramic body shown in FIG. Thus, the different lengths of the pair of check marks 13 can indicate the direction in which the ceramic body has shifted.

FIG. 4 is an enlarged view of one embodiment of the present invention, showing the side surface of the multilayer capacitor when a stacking deviation in the longitudinal direction is detected. As shown in FIG. 4, the length of the check marks 41 to 44 is the same as that of the check mark 13, but when the position is shifted from the check mark 13,
The shift in the length direction can be known. FIG. 5 is an enlarged view of a side surface of a multilayer capacitor in a case where a lamination shift in an oblique direction is detected in one embodiment of the present invention. As shown in FIG. 5, the length of the right and left check marks is different, and the interval between the pair of check marks is wider than that of the normal check mark.
1 to 54 include both of the offsets shown in FIGS. That is, when the check marks 51 to 54 shown in FIG. 5 are found, it is known that the ceramic body is displaced obliquely. By simply providing a pair of check marks as in this embodiment at at least one location on the virtual line to be cut, it is possible to find lamination misalignments in the width direction, the length direction, and the oblique direction.

Although the embodiments of the present invention have been described in detail, the present invention is not limited to the embodiments. And
Various design changes can be made without departing from the invention as set forth in the appended claims. For example, in the present embodiment, the check marks appear on the side surface of the ceramic body, but the same effect can be obtained even if they appear on the end surface side. Also,
The shape of the pair of check marks is not limited to a triangle as long as it has a pair of parallel opposing sides and a side inclined on the opposite side to the opposing side, and includes shapes other than the present embodiment.

[0016]

According to the present invention, a check mark having a pair of parallel opposing sides and a side inclined on the opposite side to the opposing side is formed on a virtual line to be cut of the substrate. Inspection of one side surface can reveal lamination misalignment in the width direction, the length direction, and the oblique direction of the ceramic body. Therefore, the inspection operation and the image recognition for inspecting the lamination misalignment are simple, and the inspection efficiency can be improved.

[Brief description of the drawings]

FIG. 1 is a view for explaining a ceramic body of a multilayer capacitor according to an embodiment of the present invention.

FIG. 2 is an enlarged view showing a side surface of a multilayer capacitor having no stacking deviation in one embodiment of the present invention.

FIG. 3 is an enlarged view of a side surface of the multilayer capacitor in a case where lamination misalignment in the width direction is detected in one embodiment of the present invention.

FIG. 4 is an enlarged view of a side surface of the multilayer capacitor in a case where a stacking deviation in a length direction is detected in one embodiment of the present invention.

FIG. 5 is an enlarged view of a side surface of the multilayer capacitor in a case where lamination displacement in an oblique direction is detected in one embodiment of the present invention.

FIG. 6 is a view for explaining a ceramic body of a multilayer capacitor in a conventional example.

[Explanation of symbols]

11: Ceramic body 12: Electrode pattern 13: Check mark 21: Side face of laminated ceramic body 31 to 34: Check mark when shifted in width direction 41 to 44 ..Check marks when they are shifted in the length direction 51 to 54... Check marks when they are shifted in an oblique direction

Claims (3)

(57) [Claims] 1. A laminated electronic component in which a substrate on which a conductive member is formed is laminated and bonded, and then cut into a predetermined shape to obtain a single electronic component. An imaginary line to be cut for obtaining a part, an opposite side having the same length in parallel and arranged at a right angle to the imaginary line to be cut, and a side inclined to the opposite side of the opposite side, A check mark for detecting a stacking deviation of a multilayer electronic component, comprising a pair of check marks provided with: (2) A conductive member and the pair of checkers;
The part where the substrates with the
Consists of a single electronic component cut into a fixed shape
The lamination misalignment detection checker according to claim 1, characterized in that:
Multilayer electronic component on which the arc is formed. 3. When the substrates on which the pair of check marks are formed are stacked together with the conductive member, the pair of check marks appearing on the cross section of the laminated substrate are enlarged and inspected, and the pair of check marks are inspected. length and position the width direction of the laminated substrate by the deviation of the length direction or lamination of the multilayer electronic component according to claim 1 or claim 2, wherein Rukoto can detect oblique direction shifted from one direction, Misalignment inspection method.