JPH06132651A - Board repairing jig - Google Patents

Abstract

PURPOSE:To provide a jig at low cost for replacing a defective electronic part by new one easily on a board that is incorporated in an electric or electronic apparatus. CONSTITUTION:A sponge 7 is mounted on the inside of two wings 2a that are pushed near to each other with a hinge 2c. An electronic part holder 3 is fitted forcibly to one wing 2a with a spring 3f, while a back-up stage 5 is mounted on the other wing 2a by attractive force through a magnet 5c. A defective electronic part is removed in a given method while a board is still incorporated in an apparatus. After a piece of solder is put on a land, a new electronic part is temporarily put on the solder. A board repairing jig 1 put between the two wings 2a is fitted to the board 10 while the electronic part is held with an electronic part holder 3. A top part of a male screw 5a in the back-up stage 5 is fitted to a rear face of the board. Then, a hot air generator 11 is put near to melt the solder on the land, and the lead is sunk into the solder. In this way, the new electronic part is mounted by fitting the jig 1 to the board 10 that is still incorporated in the apparatus.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board repair jig used for replacing electronic parts on a board.

[0002]

2. Description of the Related Art In recent years, AV (audio visual)
The miniaturization of electric / electronic products such as devices has been greatly advanced, and along with this, high-density mounting or ultra-high-density mounting of substrates mounted in electric / electronic products has been greatly advanced.

When an electronic component such as an IC or a CN (connector) on the high-density mounting board or the ultra-high-density mounting board fails, it needs to be replaced.

By the way, the replacement of electronic components on the board is conventionally performed by manual soldering using a soldering iron.
Has been done. That is, the defective electronic component is removed by a predetermined method, the solder on the land is removed by solder wick to make the land free of solder, and then a new electronic component is mounted on this to remove the flux from the land portion. It is attached by applying it to the surface of the lead and then soldering it over the lead using a soldering iron.

However, as the mounting board becomes higher in density or ultra high in density, the distance between electronic components becomes narrower, and the distance between leads of one electronic component becomes narrower, for example, 0.5 mm. Sinking from the top requires advanced technology.

Therefore, in recent years, electronic parts have been attached using a hot air repair jig. That is, the hot-air repair jig is a mounting portion for mounting the substrate while supporting its end portion,
Also, an attachment consisting of two nozzles, a hot-air blowing nozzle provided along the lead portion of the electronic component so as to face each other, and a suction nozzle provided at the central portion of the electronic component so as to adsorb the electronic component. And a section. And
The mounting portion is integrated with the mounting portion and is movable in two directions parallel to the surface of the substrate mounted on the mounting portion and in the vertical direction. With such a structure, the defective electronic component is removed by a predetermined method, and then the solder is placed on the land without lead by soldering work, and the flux is further applied on the land.・
The board removed from the electronic product is mounted on the mounting portion of the jig. Then, a new electronic component is attracted to the suction nozzle of the attachment part of the jig, and the blowing nozzle and the lead part are opposed to each other. In this state, the attachment part is moved to move the land of the board on the lead part and the attachment part. Facing each other, and in this state, the mounting portion is lowered while blowing hot air. Then, the solder on the land is melted, and the lead is placed on the land while being immersed in the melted solder. When the blowing of hot air is stopped in this state, the solder is solidified and the electronic component is attached.

[0007]

However, in the conventional mounting using the hot-air type repair jig, the mounting portion has a structure for mounting the substrate while supporting the edge portion thereof, and therefore the substrate is temporarily mounted by the electric / electronic device. I had to remove it from the product and attach it to the attachment. Therefore, it is necessary to temporarily remove the cable and the like connected to the board from the board. Further, since the mounting portion has a structure for mounting the substrate while supporting the edge portion thereof, when a component that interferes with the jig, such as a connector or a directly mounted flexible wiring board, is attached to the substrate edge portion, These had to be removed from the substrate and mounted on the mounting part. Also, it takes a lot of time to remove the parts that interfere with the jig, so if you do not remove them, you must make a mounting part for each board that can be mounted without interfering with those parts. did not become. As a result, there is a problem that the work using the conventional hot-air repair jig is extremely complicated.

Next, in the mounting using the conventional hot-air type repair jig, the electronic components adsorbed by the suction nozzle of the mounting portion are gradually lowered with respect to the substrate horizontally supported by the mounting portion. In the solder melted by the hot air from the blowing nozzle of the part, because this electronic component is immersed and placed on the land, if the electronic component and the substrate are not in parallel, that is,
When the board is not horizontally mounted on the mounting part, one side of the lead is first mounted on the land, and then, when the mounting part is lowered, the electronic component tilts from the suction surface of the suction nozzle, that is, In this state, the other side of the lead is placed on the land while being separated from the suction nozzle. Therefore, at this time, the other side of the lead oscillates so that the lead is not properly placed on the land, and the work cannot be performed with high precision.

Next, in the conventional hot-air repair jig, as described above, if the parts that interfere with the jig are not removed,
It is very expensive because a dedicated mounting part must be manufactured for each board, and a mounting part provided with a suction nozzle and a blowing nozzle must be provided. Therefore, a camera-integrated VTR etc. There is a problem in that it is difficult to place this at each service station for electronic products.

Therefore, an object of the present invention is that it is possible to mount the substrate even if the substrate is not always removed from the electric / electronic product, or if there is an electronic component on the substrate that interferes with the jig, and the manufacturing cost is low. It is possible to provide a board repair jig capable of performing the above-mentioned work, and to perform a highly accurate electronic component mounting operation on a board using this board repair jig.

[0011]

In order to achieve the above object, the substrate repair jig of the present invention comprises a substrate retainer comprising two blade portions which are hinged and are biased toward each other. A sponge-like elastic member provided inside each of the two blade portions, and an electronic component retainer that is provided at one portion of the two blade portions and is biased toward the other portion of the two blade portions. And a backup base that is attracted by a magnet to the other of the two blades.

It is preferable that the electronic component retainer extends in a direction of 45 ° with respect to the extending direction of the two blade portions to hold the electronic component.

It is preferable that an air jetting means composed of a pipe having fine holes is provided inside at least one of the two blades.

[0014]

After the defective electronic component is removed from the substrate, solder is deposited on the land, and a new electronic component is positioned and placed on this and temporarily attached. Then, in the board repair jig of the present invention, the board is sandwiched by the two blade portions in a state where the electronic component holder is in contact with the temporarily attached new electronic component. A sponge-like elastic member is pressed against the electronic component that interferes with the jig to fix the substrate. Then, apply hot air to the leads to melt the solder,
The lead of the electronic component is rapidly sunk and placed on the land by the pressing force of the electronic component holder. Therefore, the board repair jig can be mounted on the board without necessarily removing the board from the electric / electronic product, that is, with the board still attached to the electric / electronic product. Also, even if there are electronic parts that interfere with the jig, it is within the support. These make repair work extremely easy and quick.

Next, the electronic component is temporarily mounted on the substrate, and the pressing force as a point is applied by the electronic component holder, the solder melts, the lead portion rapidly sinks into the solder, and the land Since they are mounted in a fixed shape, the lead portion can be correctly mounted on the land and the mounting work can be performed with high accuracy by properly positioning the temporary attachment.

Next, one board repair jig can be applied to various boards, and any hot air generator for melting the solder on the land can be used, and it is not necessary to include it. Therefore, the board repair jig of the present invention can be manufactured at low cost.

[0017]

Embodiments of the present invention will now be described in detail with reference to the drawings.

First, a first embodiment of the present invention will be described with reference to FIGS.

Referring to FIG. 1, a board repair jig 1 of the present invention is shown.
Has a substrate retainer 2, an electronic component retainer 3, and a backup table 5.

The substrate retainer 2 has two blade portions 2a, 2a made of a metal plate, which are opposed to each other at an interval in which the height of a sponge-like elastic member 7 described later and the thickness of the substrate which is normally expected are matched. And the two blades 2a are
It is rotatably connected by a hinge 2c at b, and is biased by a torsion coil spring 2d so that the front portion 2f side (the side for grasping the substrate) approaches each other. Next, the front portion 2f side of the two blade portions 2a is largely extended forward so that it can be applied to an electronic component in the central portion of the substrate.
As shown in FIG. 1A, the blade portion 2a is a front portion 2f.
Right-angled notch 2g at the tip of each
Is provided. Electronic component 6 to be mounted in the cutout 2g
Is located.

Next, the sponge-like elastic members 7 are provided around the notches 2g on the inner sides of the two blades 2a at a total of three positions, that is, at both ends of the notches 2g and at right angles to the notches 2g. Is stuck. A urethane material is used for the elastic member 7, and the elastic member 7 can be arbitrarily deformed according to the shape of the object 8 such as an electronic component that comes into contact therewith (see FIG. 1B).

Next, the electronic component retainer 3 is attached to one of the two blade portions using this as a scaffold. That is, in the electronic component retainer 3, an L-shaped metal lever 3a having a vertically hanging lower portion 3g is fixed to a mounting member 3b with a screw 3c, and the mounting member 3b is provided at a substantially central portion of the upper surface of the blade portion 2a. It has a structure in which it is rotatably attached by a hinge portion 3d. Further, the torsion coil spring 3 is attached to the hinge portion 3d.
f is provided, which allows the L-shaped metal lever 3a
Is a structure biased toward the other side of the two blades.

Next, the L-shaped metal lever 3a is bent at an angle of 45 ° with respect to the extending direction of the blade portion 2a at the position of the right angle portion of the cutout portion 2g, and vertically hangs in the cutout portion 2g. The part 3g is located. Therefore, in the case of the square electronic component 6, as shown in FIG. 1A, when the extending direction of the blade portion 2a is made parallel to the edge direction of the substrate 10, the metal lever 3a is on the diagonal line of the electronic component 6. The vertical hanging lower part 3g can be located in the substantially central part of the electronic component 6 by proceeding. Therefore, since the metal lever 3a advances in the corner-free portion of the electronic component 6, as will be described later,
When the nozzle 11b of the hot air generator 11 is brought close to the lead portion 6a, the L-shaped metal lever 3a does not interfere with the approach of the nozzle. Even when the electronic component has a rectangular shape, the metal lever 3a can move along the corner of the electronic component 6, and in this case, the extending direction of the blade portion 2a is set to be an oblique direction with respect to the edge direction of the substrate 10. Then, the metal lever 3a may be moved diagonally to the electronic component 6. In addition,
The torsion coil spring 2d of the hinge portion 2c and the torsion coil of the hinge portion 3d are set so that the pressing load of the vertically hanging portion 3g on the electronic component 6 becomes about 1/2 of the pressing load of the substrate pressing member 2 on the substrate 10. The strength relationship with the spring 3f is defined.

Next, as shown in FIG. 1B, a backup stand 5 is provided on the other side of the two blades. The backup table 5 has a structure in which a male screw 5a is screwed into one end of a mounting plate 5b, and an attraction table 5c made of a permanent magnet is attached to the other end of the mounting plate 5b.
Is finely cut to a diameter of about 1 mm. The backup table 5 is attached to the substrate retainer 2 by adsorbing the suction table 5c on the outer surface of the other part of the two blades. The male screw 5a is rotated by rotating the head portion 5f of the male screw 5a. Therefore, the tip portion 5d of the male screw can be positioned at an arbitrary position by moving the suction table 5c and rotating the male screw 5a.

Next, the hot air generator will be described. The hot air generator is separate from the board repair jig 1,
Any one can be used. In the hot air generator 11 of the present embodiment, the nozzle portion 11a can be attached to and detached from the main body portion, and the nozzle portion 11a having various shapes is easy. When the blowout port 11b of the nozzle portion 11a is provided so as to face the lead position of the electronic component, and the electronic component 6 is a square as shown in FIG. 1A, and the leads 6a project from four directions thereof. The outlet 11b is a square 4
The length of the lead row is provided along one side. The blowout port 11b may be one in which cylindrical spot nozzles are arranged in a row, or may be a slit nozzle having a predetermined length and width. Next, since the leads are not normally placed at the corners of the electronic component 6, the outlet 11b is not placed at this portion either, and a gap of about 1 mm width is formed at this portion. Therefore, the electronic component holder 3
Is inserted. Next, the blow-out port 11b has a length equal to or higher than the height of the electronic component retainer 3, for example, about 15 mm so as not to support it when brought close to the substrate. The hot air generator 11 is also used when removing a defective electronic component.

Next, in the present invention, the new electronic component 6 is
Temporarily attach in order to place it on the land accurately. That is,
As shown in FIG. 2, first, the land 1 from which the electronic components are removed
4. Place solder on top of 4. This soldering is performed by flow soldering, in which a soldering iron having molten solder accumulated at its tip is traced back and forth several times along the row of lands 14. As shown in FIG. 2B, solder 1 on each land
It is possible to carry out soldering with the height of 5 being constant and without causing any sticking. Then, after the flux is applied on the solder 15, at least two leads are temporarily attached as shown in FIG. For temporary attachment, grasp the electronic component 6 with tweezers or the like, and place the lead 6a on the solder 15.
This is performed by simply stopping at least two leads, for example, two leads located on a diagonal line indicated by an arrow, by using the soldering iron 12 in a state where the leads 14 are accurately placed opposite to the land 14.

Next, the operation of this embodiment will be described.

First, a defective electronic component on the substrate is found and removed while the substrate incorporated in the electric / electronic product is not removed. The hot air generator 11 is used for this removal work. That is, the nozzle portion 11a having a predetermined shape is attached to the main body portion according to the shape of the electronic component 6, and the hot air generator 11 is brought close to the defective electronic component so that the blowout port faces the lead portion. Then, since the solder melts, the electronic component can be easily removed from the substrate 10 by grasping and pulling up the electronic component with tweezers or the like.

Next, as shown in FIG. 2 (a), the solder is deposited on the land by the flow soldering method. Since the defective electronic component is removed, soldering using the soldering iron 12 can be easily performed from this portion.

Next, after the solder 15 on the land is coated with flux, as shown in FIG.
Grasp the solder with tweezers, etc.
Temporary fixing on 5 can be carried out easily by using a soldering iron 12 because any two positions can be easily fixed.

Next, the board repair jig 1 of the present invention is mounted on the board 10 which is still incorporated in an electric / electronic product. That is, with the board 1 still attached to the electric / electronic product, the board holder 2 is inserted into the board 10 from the side surface of the board 1 with the two blade portions 2a opened by hand, and the electronic component holder 3 is inserted. With the metal lever 3a extending the corner portion of the electronic component 6, the vertical hanging lower portion 3g is positioned at the substantially central portion of the electronic component 6, and the hand is released. Then, as shown in FIGS. 1A and 1B, the substrate retainer 2 is fixed to the substrate 10 while the interfering electronic component 8 is held by the sponge-like elastic member 7, and the electronic component retainer 3 is connected to the substrate. Presser 2 as a scaffold,
The electronic component 6 is held as a point.

Next, while maintaining the above state, the backup table 5 is moved by shifting the suction table 5c, and the tip portion 5d is made to correspond to the central position of the electronic component 6 on the back side of the substrate 10. Moreover, the male screw 5a is rotated to a position where the component is not mounted, and the tip portion 5d is brought into contact with the board surface. Then, further, the male screw 5a is rotated by, for example, 1/4 rotation and tightened. From the above, you can easily and quickly
The attachment of the substrate repair jig 1 of the present invention to the substrate 10 is completed.

Next, the hot air generator 11 is inserted from the notch 2g,
The blowout port 11b is brought close to the electronic component 6 in a state of facing the lead row 6a. At this time, since the metal lever 3a extends the corner portion of the electronic component, the metal lever 3a does not interfere with the approach of the blowout port 11b to the lead portion.

Then, in this state, as shown in FIG. 4A, hot air is blown for a certain period of time, and then the hot air generator 11 is used.
Keep away. The solder 15 on the land 14 is melted by the hot air, the leads 6a sink into the solder to form a fillet, and after the natural cooling, the solder is solidified, and the soldering is completed (FIG. 4B). Since the backup table 5 backs up from the back side, it is possible to prevent dents and the like on the substrate when receiving hot air. Further, since the electronic component 6 is pressed by the electronic component retainer 3 as a point, when the solder is melted, the lead 6a rapidly sinks into the solder, and there is no displacement, temperature (temporary lift), etc., high precision,
High quality soldering is done.

After the solder is sufficiently cooled, the two blade portions 2a are opened and the board repair jig 1 is removed from the board 10. Then, the electronic component replacement work is completed.

Since the substrate repair jig 1 of the present invention has a simple structure, it can be manufactured at a low cost and can be sufficiently arranged at each service station or the like.

In this embodiment, various shapes can be considered for the portions of the two blade portions of the substrate pressing member that sandwich the substrate. For example, as shown in FIG. 5, the shape of the portion of the two blade portions 12a of the substrate holder 12 that sandwich the substrate is such that sponge-like elastic members 17 are arranged at four corners of a rectangle surrounding the electronic component. The shape may be such that the substrate is sandwiched by the elastic members 17 at the corners.

Next, a second embodiment of the present invention will be described with reference to FIG.

In this embodiment, the air jetting means 18 consisting of a pipe in which fine holes are formed inside the two blades, respectively.
Is provided.

The air jetting means 18 has a shape in which a tip portion 18a of a pipe whose tip is closed is bent at a right angle and a predetermined number of minute holes 18b are provided in the tip portion 18a.
8 is attached inside each of the two blade portions 2a in a state in which the minute holes 18b are positioned between the two elastic members 7 behind the cutout portion 2g in FIG. 1A. .
Then, the air is sent into the pipe 18, and this air makes the micropores 1
Eject from 8b.

The substrate repair jig 1 having the above-mentioned structure is used.
Using the hot air generator 11, the new electronic component 6 temporarily attached is immersed in the melted solder, and the hot air generator 11 is moved away, and then air is immediately sent from the minute holes 18b to cool the solder. You can speed it up. As a result, the cooling time becomes faster, and the electronic component mounting work can be performed faster. The air jetting means 18 may be provided only on the upper blade portion 2a in FIG. 6A in order to cool the front surface side of the substrate on which the land exists.

[0042]

Since the board repair jig of the present invention is constructed as described above, the work of attaching the electronic component to the board can be performed more easily and in a shorter time.

Also, since the temporarily attached electronic component is pressed from above by the electronic component pressing member,
High precision mounting can be performed.

Since the board repair jig of the present invention can be manufactured at low cost, it can be arranged at each service station for repairing electric / electronic products.

[Brief description of drawings]

1A is a plan view of a first embodiment of a substrate repair jig of the present invention, and FIG. 1B is a partially cutaway side view thereof.

FIG. 2 (a) is an explanatory diagram in the case where a solder deposit is carried out by a soldering work, and FIG. 2 (b) is a side view of the solder deposited by the work of FIG. 2 (a).

FIG. 3 is an explanatory diagram of a work for temporarily fixing a new electronic component.

FIG. 4A is an explanatory view showing a state where hot air is being blown from a blowing nozzle, and FIG. 4B is a perspective view showing a state where the solder is melted by the work of FIG. 4A.

FIG. 5 is a plan view of the first embodiment of the board repair jig of the present invention.
It is a perspective view which shows the other example of the shape of a board | substrate presser.

6 (a) is a partially cutaway side view of a second embodiment of the substrate repair jig of the present invention, and FIG. 6 (b) is a plan view of a cooling pipe used in FIG. 6 (a). is there.

[Explanation of symbols]

 1 substrate repair jig 2 substrate holder 2a blade portion 2c hinge portion 3 electronic component holder 5 backup table 7 sponge-like elastic member 18 air jetting means 18b micro hole

Claims (3)

[Claims] 1. A substrate retainer composed of two blade portions that are hinged and urged toward each other, and a sponge-like elastic member provided inside each of the two blade portions, The electronic component retainer provided on one of the two blades and biased toward the other of the two blades, and attracted to the other of the two blades by a magnet. Substrate repair jig, which consists of a backup stand. 2. The electronic component retainer according to claim 1, wherein the electronic component retainer extends in a direction of 45 ° with respect to the extending direction of the two blade portions, and presses the electronic component. Substrate repair jig. 3. The substrate repairing method according to claim 1 or 2, further comprising an air jetting means formed of a pipe having fine holes inside at least one of the two blades. Ingredient