JP3144096B2 - PCB repair jig - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board repair jig used for replacing electronic components on a board.

[0002]

2. Description of the Related Art In recent years, AV (audio visual)
The miniaturization of electric and electronic products such as equipment has been greatly advanced, and at the same time, high-density mounting or ultra-high-density mounting of substrates mounted in electric and electronic products has been greatly advanced.

If electronic components such as ICs and CNs (connectors) on the high-density mounting board or the ultra-high-density mounting board break down, they need to be replaced.

[0004] By the way, the replacement of the electronic parts on the substrate is conventionally performed by manual soldering using a soldering iron.
Is being done. That is, the failed electronic component is removed by a predetermined method, the solder on the land is removed with a solder wick to make the land free of solder, and then a new electronic component is mounted thereon, and the flux is removed from the land portion. , And mounted by flow soldering from above the leads using a soldering iron.

[0005] However, as the density of the mounting board or the ultra-high density increases, the interval between electronic components becomes narrower, and the interval between the leads of one electronic component becomes smaller, for example, 0.5 mm. A high level of skill is required for the flow soldering from above.

Therefore, in recent years, mounting of electronic components using a hot-air type repair jig has been performed. That is, the hot-air type repair jig has a mounting portion for mounting the substrate while supporting the end thereof,
Also, an attachment comprising two nozzles: a hot-air blowing nozzle provided opposite to the electronic component along the lead portion, and a suction nozzle provided opposite to the central portion of the electronic component to suck the electronic component. Part. And
The mounting portion is integrated with the mounting portion, and can be moved in two directions parallel to and perpendicular to the surface of the substrate mounted on the mounting portion. With such a configuration, the failed electronic component is removed by a predetermined method, and then it is poured on a land having no lead by soldering by soldering work, and furthermore, a flux is applied thereon, and then the electric power is applied.・
The substrate removed from the electronic product is mounted on the mounting portion of the jig. Then, the new electronic component is attracted to the suction nozzle of the mounting portion of the jig, and the blowout nozzle and the lead portion are opposed to each other. In this state, the mounting portion is moved so that the lead portion and the land of the board on the mounting portion are moved. And the mounting part is lowered while blowing hot air in this state. Then, the solder on the land is melted, and the lead is placed on the land while being immersed in the melted solder. When the blowing of the hot air is stopped in this state, the solder solidifies and the electronic component is mounted.

[0007]

However, in the conventional mounting using a hot-air type repair jig, since the mounting portion has a structure in which the substrate is mounted while supporting the edge thereof, the substrate is once electrically and electronically mounted. It had to be removed from the product and mounted on the mounting part. Therefore, cables and the like connected to the board must be once removed from the board. In addition, since the mounting portion has a structure in which the substrate is mounted while supporting the edge thereof, when a component that interferes with the jig, such as a connector or a directly attached flexible wiring board, is attached to the edge of the substrate, These had to be removed from the substrate and mounted on the mounting part. Also, removing parts that interfere with the jig takes a very long time, so if you do not remove them, you must make a mounting part for each board that can mount the board without interfering with those parts. did not become. For this reason, there has been a problem that the installation using the conventional hot-air repair jig is extremely complicated.

Next, mounting using a conventional hot-air type repair jig is performed by gradually lowering the electronic component sucked by the suction nozzle of the mounting portion with respect to the substrate horizontally supported by the mounting portion. This electronic component is immersed in the solder melted by hot air from the blowing nozzle of the part and placed on the land, so that the electronic component and the substrate are not in a parallel state, that is,
When the board is not mounted horizontally on the mounting portion, one side of the lead is placed on the land first, and then, when the mounting portion is lowered, the electronic component is inclined from the suction surface of the suction nozzle, that is, After disengaging from the suction nozzle, the other side of the lead is placed on the land in this state. Therefore, at this time, the other side of the lead swings and is not correctly placed on the land, so that there is a problem that the operation cannot be performed with high accuracy.

Next, as described above, the conventional hot-air-type repair jig requires the following components when the components that interfere with the jig are not removed.
A dedicated mounting unit must be manufactured for each substrate, and a mounting unit provided with a suction nozzle and a blowing nozzle must be provided. There is a problem that it is difficult to arrange the electronic product at each service station.

Accordingly, an object of the present invention is to enable mounting even if an electronic component that interferes with a jig is not necessarily removed from an electric / electronic product and even if there is an electronic component that interferes with a jig on the substrate, and that it can be manufactured at low cost. It is another object of the present invention to provide a substrate repair jig capable of performing high-precision mounting of an electronic component on a substrate using the substrate repair jig.

[0011]

In order to achieve the above object, a board repair jig according to the present invention comprises a board holder comprising two blades hinged and urged to approach each other. A sponge-like elastic member provided inside each of the two blades, and an electronic component holder provided on one of the two blades and urged toward the other of the two blades. And a backup table that is attracted to the other of the two blades by a magnet.

It is preferable that the electronic component holder extends in a direction of 45 ° with respect to the direction in which the two blade portions extend, and holds the electronic component.

Preferably, at least one of the two blades is provided with air jetting means formed of a pipe having a fine hole inside the one part.

[0014]

After removing the failed electronic component from the substrate, soldering is performed on the land, and a new electronic component is positioned and mounted on the land, and is temporarily attached. In the board repair jig of the present invention, the board is sandwiched between the two blades in a state where the electronic component holder comes into contact with the temporarily attached new electronic component. Note that a sponge-like elastic member presses the electronic component that interferes with the jig from above, thereby fixing the substrate. Then, apply hot air to the leads to melt the solder,
The lead of the electronic component is quickly sunk onto the land by the pressing force of the electronic component holder and placed. Therefore, the substrate repair jig can be mounted on the substrate without necessarily removing the substrate from the electric / electronic product, that is, while the substrate is attached to the electric / electronic product. Also, even if there is an electronic component that interferes with the jig, it is within the support. These make repair work extremely easy and short.

Next, the electronic component is temporarily attached to the substrate, and when the pressing force as a point is applied by pressing the electronic component, the solder is melted, and the leads rapidly sink into the solder and land. Since the lead portions are mounted in a shape, the correct placement of the temporary attachment allows the lead portions to be correctly placed on the lands, thereby enabling a highly accurate mounting operation.

Next, a single board repair jig can be applied to various boards, and a hot air generator for melting the solder on the land can be of any type and can not be included. Therefore, the substrate repair jig of the present invention can be manufactured at low cost.

[0017]

Embodiments of the present invention will be described below in detail with reference to the drawings.

First, a first embodiment of the present invention will be described with reference to FIGS.

In FIG. 1, a substrate repair jig 1 of the present invention is shown.
Has a board holder 2, an electronic component holder 3, and a backup table 5.

The board presser 2 has two blades 2a, 2a made of a metal plate and facing each other at an interval corresponding to the height of a sponge-like elastic member 7 to be described later and the thickness of the board normally expected. And the two blades 2a are
The front part 2f (the side that grasps the substrate) is urged by the torsion coil spring 2d so that the front parts 2f approach each other by the torsion coil spring 2d. Next, the front part 2f side of the two blade parts 2a is greatly extended forward so that the front part 2f can be applied to the electronic component in the central part of the substrate.
As shown in FIG. 1A, the blades 2a have a front part 2f.
At the tip of each, in the same position, the right-angled notch 2g
Is provided. The electronic component 6 to be mounted in the notch 2g
Is located.

Next, around the notch 2g inside each of the two blades 2a, a sponge-like elastic member 7 is provided at a total of three positions including both ends of the notch 2g and right angles of the notch 2g. Is stuck. The elastic member 7 is made of a urethane material, and can be arbitrarily deformed according to the shape of an object 8 such as an electronic component which comes into contact with the elastic member 7 (see FIG. 1B).

Next, an electronic component holder 3 is attached to one of the two blades using this as a scaffold. That is, the electronic component retainer 3 has an L-shaped metal lever 3a having a vertically lower portion 3g fixed to the mounting member 3b by the screw 3c, and the mounting member 3b is provided substantially at the center of the upper surface of the blade portion 2a. It is a structure that is rotatably attached by a hinge 3d. The torsion coil spring 3 is attached to the hinge 3d.
f, thereby providing an L-shaped metal lever 3a.
Is a structure urged in the direction of the other of the two blades.

Next, the L-shaped metal lever 3a is bent at an angle of 45 ° with respect to the extending direction of the blade portion 2a at a position perpendicular to the notch 2g, and is vertically suspended in the notch 2g. The part 3g is located. Therefore, in the case of a square electronic component 6, as shown in FIG. 1A, when the extending direction of the blade 2 a is parallel to the edge direction of the substrate 10, the metal lever 3 a , The vertically lower portion 3 g can be located at the approximate center of the electronic component 6. Accordingly, the metal lever 3a advances through a portion of the electronic component 6 where no lead is present, and as described later,
When the nozzle 11b of the hot air generator 11 is brought closer to the lead portion 6a, the L-shaped metal lever 3a does not hinder the approach of the nozzle. In addition, even when the electronic component is rectangular, the metal lever 3a can advance at the corner of the electronic component 6, and in this case, the extending direction of the blade portion 2a is also set to be oblique to the edge direction of the substrate 10. Thus, the metal lever 3a may be advanced on a diagonal line of the electronic component 6. In addition,
The torsion coil spring 2d of the hinge part 2c and the torsion coil of the hinge part 3d make the pressing load on the electronic component 6 of the vertically lower lower part 3g approximately half of the pressing load of the substrate presser 2 on the substrate 10. The strength relationship with the spring 3f is determined.

Next, as shown in FIG. 1B, a backup table 5 is provided on the other of the two blades. The backup table 5 has a structure in which a male screw 5a is screwed into one end of a mounting plate 5b, and a suction table 5c made of a permanent magnet is mounted on the other end of the mounting plate 5b.
Is thinned to a diameter of about 1 mm. The backup table 5 is attached to the substrate holder 2 by adsorbing the suction table 5c on the outer surface of the other part of the two blades. The rotation of the male screw 5a is performed by rotating the head 5f of the male screw 5a. Therefore, the distal end portion 5d of the male screw can be positioned at an arbitrary position by moving the suction table 5c and rotating the male screw 5a.

Next, the hot air generator will be described. The hot air generator is separate from the board repair jig 1 and
Anything can be used. In the hot air generator 11 of the present embodiment, the nozzle portion 11a is detachable from the main body portion, and the nozzle portions 11a of various shapes are easy. The outlet 11b of the nozzle portion 11a is provided so as to face the lead position of the electronic component, and the electronic component 6 is square as shown in FIG. 1A and the lead 6a protrudes from four directions. The outlet 11b is a square 4
The length of the lead row is provided along one side. The blowout port 11b may be formed by arranging cylindrical spot nozzles in a row, or may be a slit-shaped nozzle having a predetermined length and width. Next, since the lead is not usually arranged at the corner of the electronic component 6, the outlet 11b is not arranged at this portion, and a gap having a width of, for example, about 1 mm is formed at this portion. Therefore, electronic part presser 3
Is inserted. Next, the outlet 11b has a length equal to or greater than the height of the electronic component holder 3, for example, about 15 mm so as not to be supported when approaching the substrate. The hot air generator 11 is also used when removing a failed electronic component.

Next, in the present invention, a new electronic component 6 is
Temporarily attach to place accurately on the land. That is,
As shown in FIG. 2, first, a land 1 from which electronic components have been removed
4, soldering is performed. This soldering is performed by flow soldering, in which a soldering iron having molten solder at its tip is reciprocated several times along the rows of lands 14. As shown in FIG. 2B, solder 1 on each land
5 can be soldered with a constant height and no bumps. Then, after a flux is applied on the solder 15, at least two leads are temporarily attached as shown in FIG. For temporary attachment, the electronic component 6 is gripped with tweezers or the like, and the lead 6 a is placed on the solder 15.
This is performed by simply stopping at least two leads, for example, two leads located on a diagonal line indicated by arrows with a soldering iron 12 in a state of being accurately placed opposite to the land 14.

Next, the operation of this embodiment will be described.

First, a faulty electronic component on a board is found out without removing the board incorporated in the electric / electronic product, and the board is removed. The hot air generator 11 is used for this removal work. That is, a nozzle 11a having a predetermined shape is attached to the main body in accordance with the shape of the electronic component 6, and the hot air generator 11 is brought closer to the failed electronic component with the outlet facing the lead. Then, since the solder melts, the electronic component can be easily removed from the substrate 10 by grasping and pulling up the electronic component with tweezers or the like.

Next, as shown in FIG. 2 (a), soldering is performed on the lands by the flow soldering method. Since the failed electronic component has been removed, soldering using the soldering iron 12 can be easily performed from this portion.

Next, after applying a flux on the solder 15 on the lands, as shown in FIG.
With tweezers, etc., and solder 1
The temporary fixation can be easily performed on any two places on the joint 5 by using the soldering iron 12.

Next, the substrate repair jig 1 of the present invention is mounted on the substrate 10 which is still incorporated in the electric / electronic product. That is, while the board 1 is attached to the electric / electronic product, the board holder 2 is inserted into the board 10 from the side surface of the board 1 with the two blades 2a opened by hand, and the electronic component holder 3 With the metal lever 3 a extending the corner of the electronic component 6, the vertically lower portion 3 g is positioned substantially at the center of the electronic component 6, and the hand is released. Then, as shown in FIGS. 1A and 1B, the board holder 2 is fixed to the board 10 in a state where the interfering electronic component 8 is held down by the sponge-like elastic member 7, and the electronic component holder 3 is attached to the board 10. Using foot 2 as a foothold,
The electronic component 6 is held as a point.

Next, while maintaining the above state, the backup table 5 is moved by displacing the suction table 5c, and the front end 5d corresponds to the back side of the substrate 10 near the center position of the electronic component 6. The male screw 5a is rotated at the position where the component is not mounted, and the tip 5d is brought into contact with the substrate surface. Further, the male screw 5a is further rotated by, for example, 1/4 turn and tightened. As described above, easily and in a short time,
The mounting of the substrate repair jig 1 of the present invention on the substrate 10 is completed.

Next, the hot air generator 11 is
The outlet 11b is approached to the electronic component 6 with the outlet 11b facing the lead row 6a. At this time, since the metal lever 3a extends at the corner of the electronic component, the metal lever 3a does not hinder the approach of the outlet 11b to the lead.

Then, in this state, as shown in FIG. 4A, hot air is blown out for a certain period of time.
Keep away. The hot air melts the solder 15 on the land 14, the lead 6a sinks into the solder to form a fillet, and after natural cooling, when the solder solidifies, the soldering is completed (FIG. 4B). Since the back-up is performed from the back side by the backup table 5, dents and the like of the substrate when receiving hot air are prevented. In addition, since the electronic component 6 is pressed as a point by the electronic component retainer 3, when the solder is melted, the lead 6a rapidly sinks into the solder, and there is no displacement, a temple (foot lifting), etc.
High quality soldering is performed.

After the solder is sufficiently cooled, when the two blades 2a are opened and the board repair jig 1 is removed from the board 10, the replacement of the electronic components is completed.

Since the substrate repair jig 1 of the present invention has a simple structure, it can be manufactured at a low cost and can be sufficiently arranged at each service station or the like.

In this embodiment, various shapes of the portion of the two blades of the substrate holder that sandwich the substrate can be considered. For example, as shown in FIG. 5, the shape of the portion of the two blades 12a of the substrate holder 12 that sandwiches the substrate is such that sponge-like elastic members 17 are arranged at four corners of a rectangle surrounding the electronic component. The substrate may be sandwiched between the elastic members 17 at the corners.

Next, a second embodiment of the present invention will be described with reference to FIG.

In this embodiment, the air ejection means 18 is formed by pipes having minute holes inside each of the two blades.
Is provided.

The air jetting means 18 has a shape in which a predetermined number of minute holes 18b are provided in the front end 18a by bending the front end 18a of the pipe whose front end is closed at a right angle.
8 are mounted inside the two blades 2a, respectively, in a state where the micro holes 18b are located between the two elastic members 7 behind the notches 2g in FIG. 1A. .
Then, air is sent into the pipe 18 and this air is
Eject from 8b.

The thus configured substrate repair jig 1
Then, using the hot air generator 11, the temporarily attached new electronic component 6 is immersed in the melted solder, and after the hot air generator 11 is moved away, air is immediately sent from the minute hole 18b to cool the solder. Can be faster. As a result, the cooling time is faster, and the work of mounting the electronic component can be performed faster. The air jetting means 18 may be provided only on the upper blade 2a in FIG. 6A in order to cool the surface side of the substrate on which the land exists.

[0042]

The board repair jig of the present invention is constructed as described above, so that the work of attaching the electronic component to the board can be performed more easily and in a shorter time.

Further, since the provisionally applied electronic component is pressed from above by applying a pressing force by the electronic component presser,
High-precision mounting can be performed.

Further, since the substrate repair jig of the present invention can be manufactured at low cost, it can be arranged at each service station for repairing electric and electronic products.

[Brief description of the drawings]

FIG. 1A is a plan view of a first embodiment of a board repair jig of the present invention, and FIG. 1B is a partially cutaway side view of the same.

FIG. 2 (a) is an explanatory view of a case where solder is poured and soldering is performed, and FIG. 2 (b) is a side view of the solder piled up by the operation of FIG. 2 (a).

FIG. 3 is an explanatory diagram of an operation of temporarily fixing a new electronic component.

FIG. 4A is an explanatory view showing a state in which hot air is blown from a blowing nozzle, and FIG. 4B is a perspective view showing a state in which the solder is melted by the operation in FIG.

FIG. 5 shows a first embodiment of the board repair jig of the present invention.
It is a perspective view showing other examples of the shape of a substrate presser.

FIG. 6A is a partially broken side view of a second embodiment of the substrate repair jig of the present invention, and FIG. 6B is a plan view of a cooling pipe used in FIG. is there.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 board repair jig 2 board holder 2 a blade part 2 c hinge part 3 electronic part holder 5 backup table 7 sponge-like elastic member 18 air ejection means 18 b micro hole

Claims (3)

(57) [Claims] 1. A substrate holder comprising two blades hinged and urged to approach each other; a sponge-like elastic member provided inside each of the two blades; An electronic component retainer provided on one of the two blades and urged in the direction of the other of the two blades; and a magnet attracted to the other of the two blades by the magnet. A substrate repair jig comprising a backup table. 2. The electronic component retainer according to claim 1, wherein the electronic component retainer extends in a direction of 45 ° with respect to a direction in which the two blade portions extend, and retains the electronic component. Board repair jig. 3. The board repair jig according to claim 1 or 2, further comprising an air ejecting means comprising a pipe having a fine hole provided inside at least one of the two blades. Utensils.