JPH0612797B2 - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPH0612797B2 JPH0612797B2 JP19910085A JP19910085A JPH0612797B2 JP H0612797 B2 JPH0612797 B2 JP H0612797B2 JP 19910085 A JP19910085 A JP 19910085A JP 19910085 A JP19910085 A JP 19910085A JP H0612797 B2 JPH0612797 B2 JP H0612797B2
- Authority
- JP
- Japan
- Prior art keywords
- case
- pair
- side wall
- bottom wall
- integrally formed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Rectifiers (AREA)
Description
【発明の詳細な説明】 ＜発明の分野＞ この発明は放熱構造を有する固体継電器等に適用される
半導体装置に関するものである。Description: FIELD OF THE INVENTION The present invention relates to a semiconductor device applied to a solid state relay or the like having a heat dissipation structure.
＜従来技術とその問題点＞ 一般に、この種装置は、第４図に示すようにケース４１
に固定された放熱板４２の内面に電気絶縁板４３を介し
てトライアツクのような半導体素子４４を固着し、回路
構成用の部品４５を装着したプリント配線基板４６をケ
ース４１内に固定して、ケース４１にカバー４７を嵌着
し、カバー４７側に突出する端子ねじ４８に配線するよ
うになつている。<Prior Art and Problems Thereof> In general, this type of device has a case 41 as shown in FIG.
A semiconductor element 44 such as a triac is fixed to the inner surface of the heat dissipation plate 42 fixed to the inner surface of the heat dissipation plate 42, and a printed wiring board 46 on which a circuit component 45 is mounted is fixed in the case 41. The cover 47 is fitted in the case 41, and the terminal screw 48 protruding toward the cover 47 is wired.
しかるに、このものは、放熱板４２側が取付面となっつ
いるため、放熱板４２を通して外部への放熱効果が十分
発揮されない傾向にある。However, in this case, since the radiator plate 42 side is attached to the mounting surface, the heat radiation effect to the outside through the radiator plate 42 tends not to be sufficiently exerted.
一方、これとは別にケースを導電性の筒体で構成して放
熱器も兼務させたものも提案されているが、この場合、
ケース内への半導体素子等の組込構造が複雑化して製作
しにくい欠点がある。On the other hand, in addition to this, a case in which the case is made of a conductive cylindrical body and also serves as a radiator is proposed, but in this case,
There is a drawback that the structure for assembling a semiconductor element into the case is complicated and it is difficult to manufacture.
〈発明の目的〉 この発明は上記従来のものの不具合を解消するためにな
されたもので、取付状態に関係なく良好な放熱性を発揮
でき、しかも製作・組立性の良い半導体装置を提供する
ことを目的としている。<Objects of the Invention> The present invention has been made in order to solve the problems of the above-mentioned conventional ones, and it is to provide a semiconductor device that can exhibit good heat dissipation regardless of the mounting state and that is easy to manufacture and assemble. Has an aim.
＜発明の構成と効果＞ この発明の半導体装置は、導電性の底壁部に一体形成さ
れた１対の対向側壁部および放熱用フイン部をもつたケ
ースの上記底壁内面に、リード部に外部端子を一体形成
した半導体素子を電気絶縁板を介して固定し、上記対向
側壁部と上記リード部との間の絶縁隔壁を構成する立壁
をもつた１対の分割ケースを上記対向側壁部の両側方か
らそれぞれ差し込んで互に結合して、回路構成用の部品
を装着した配線基板を上記ケース内に収容し、外面側が
取付面として設定されたカバーを上記ケースに嵌着する
とともに、該カバーに形成された１対のコ字形弾性係合
片を上記１対の対向側壁部の先端の各鍔部に係脱可能に
係止したものである。<Structure and Effect of the Invention> A semiconductor device of the present invention has a case in which a pair of opposed side walls integrally formed on a conductive bottom wall and a fin for heat dissipation are provided on the inner surface of the bottom wall and the lead part. A semiconductor element integrally formed with an external terminal is fixed via an electric insulating plate, and a pair of divided cases having a standing wall that constitutes an insulating partition between the opposing side wall portion and the lead portion is provided on the opposing side wall portion. The wiring boards having the components for circuit configuration mounted therein are housed in the case by inserting from both sides and connecting to each other, and the cover having the outer surface side set as the mounting surface is fitted into the case, and the cover is also attached. The pair of U-shaped elastic engaging pieces formed in the above is releasably engaged with each of the flange portions at the tips of the pair of opposing side wall portions.
この発明によれば、ケースの底壁部に加えてフイン部や
１対の対向側壁部でも半導体素子の熱を放熱でき、放熱
性能が高られるうえ、カバー側を取り付ける構成のた
め、上記放熱作用が有効に発揮される。According to the present invention, in addition to the bottom wall of the case, the fins and the pair of opposing side walls can radiate the heat of the semiconductor element, and the heat radiation performance can be improved. Further, the cover side is attached, so that the heat radiation effect is achieved. Is effectively demonstrated.
また、ケースの一部を分割ケースで構成したため、半導
体素子や配線基板等の組み付けが簡単となり、製作の容
易化が図れることになる。Moreover, since a part of the case is configured by the divided case, the semiconductor element, the wiring board, and the like can be easily assembled, and the manufacturing can be facilitated.
さらに、分割ケースの立壁を絶縁隔壁として構成してい
るから、上記１対の対向側壁部とリード部との接触を防
止できる利点もある。Further, since the standing wall of the divided case is configured as an insulating partition, there is an advantage that contact between the pair of opposed side wall portions and the lead portion can be prevented.
＜実施例の説明＞ 以下、この発明の実施例を図面にしたがつて説明する。<Description of Embodiments> Hereinafter, embodiments of the present invention will be described with reference to the drawings.
第１図、第２図および第３図はそれぞれこの発明に係る
半導体装置の一例を示す分解斜視図，概略正面断面図お
よび概略側面断面図である。1, FIG. 2 and FIG. 3 are an exploded perspective view, a schematic front sectional view and a schematic side sectional view showing an example of a semiconductor device according to the present invention.
同図において、１はケースであり、導電性材からなる底
壁部２とこの底壁部２に一体形成された１対の対向側壁
部３，３を有し、上記底壁部２の外面には放熱用のフイ
ン部４が一体形成されている。この対向壁部３，３やフ
イン部４は引抜成形で容易に形成される。上記底壁部２
の内面には電気絶縁板５が固定され、電気絶縁板５上に
は、３相交流の各相に対応して３つの半導体素子、たと
えばトライアツク６（６１〜６３）が固着されている。
７（７１〜７３）は各トライアツク６の第１アノードの
リード部であり、それぞれ対応する外部端子８（８１〜
８３）に一体に形成されている。各トライアツク６の第
２のアノードのリード部９（９１〜９３）もそれぞれ対
応する外部端子１０（１０１〜１０３）に一体に形成さ
れている。各トライアツク６のゲート１１（１１１〜１
１３）は後述するプリント配線基板側に接続されてい
る。１２，１３は上記各外部素子８，１０に装着される
端子ねじである。In FIG. 1, reference numeral 1 denotes a case, which has a bottom wall 2 made of a conductive material and a pair of opposing side walls 3 and 3 integrally formed on the bottom wall 2, and the outer surface of the bottom wall 2 A fin portion 4 for heat dissipation is integrally formed on the. The facing wall portions 3 and 3 and the fin portion 4 are easily formed by pultrusion. The bottom wall 2
An electric insulating plate 5 is fixed to the inner surface of the, and three semiconductor elements, for example, triacs 6 (6 1 to 6 3 ) are fixed on the electric insulating plate 5 corresponding to each phase of the three-phase alternating current. .
7 (7 1 to 7 3 ) is a lead portion of the first anode of each triac 6, and the corresponding external terminals 8 (8 1 to 7 3 ).
8 3 ) is integrally formed. The lead portions 9 (9 1 to 9 3 ) of the second anode of each triac 6 are also integrally formed with the corresponding external terminals 10 (10 1 to 10 3 ). Gate 11 (11 1 to 1) of each triac 6
1 3 ) is connected to the printed wiring board side described later. Reference numerals 12 and 13 denote terminal screws attached to the external elements 8 and 10, respectively.
１４，１５は上記対向側壁部３，３に沿う方向で分割さ
れて上記ケース１の一部を構成する合成樹脂製の２分割
ケースであり、それぞれ各外部端子８，１０の嵌着部１
６，１７を有する。一方の分割ケース１４に形成された
１対の立壁１７ａ，１７ｂと他方の分割ケース１５に形
成された１対の立壁１８ａ，１８ｂとは上記対向側壁部
３，３に隙間Ｇを存在して対向する内側位置に側方から
挿入されて上記対向側壁部３，３と各リード部７，９と
の間の絶縁障壁を構成しており、各内端に形成されて互
に係合する係合部１９，２０を介して結合されている。Reference numerals 14 and 15 denote synthetic resin two-piece cases which are divided in the direction along the opposite side wall portions 3 and 3 and constitute a part of the case 1. The fitting portions 1 of the external terminals 8 and 10 are respectively formed.
6 and 17. The pair of standing walls 17a and 17b formed on one of the divided cases 14 and the pair of standing walls 18a and 18b formed on the other of the divided cases 15 face each other with a gap G in the facing side wall portions 3 and 3. It is inserted from the side to the inside position to form an insulating barrier between the opposing side wall portions 3 and 3 and the lead portions 7 and 9, and is formed at each inner end to engage with each other. It is connected via the parts 19 and 20.
２１は所定の回路部品２２を装着して上記ケース１内に
収容されたプリント配線基板であり、外部端子２３（２
３１〜２３４）や２４（２４１〜２４４）が接続されて
いる。２５，２６は端子ねじである。２７は上記ケース
１に嵌着される合成樹脂製のカバーであり、外面２７ａ
が取付面として設定されており、レール（図示せず）等
に着脱可能に装着するための係止用可動片２８が装備さ
れている。上記カバー２７の両側部には、上記クース１
の対向側壁部３，３の各先端の鍔部３ａに係脱可能に係
合するコ字形の弾性係合片部２９，２９が一体に形成さ
れている。Reference numeral 21 denotes a printed wiring board which is mounted in the case 1 with a predetermined circuit component 22 mounted thereon.
3 1 to 23 4 ) and 24 (24 1 to 24 4 ) are connected. 25 and 26 are terminal screws. Reference numeral 27 denotes a synthetic resin cover fitted in the case 1 and having an outer surface 27a.
Is set as a mounting surface, and a locking movable piece 28 for detachably mounting on a rail (not shown) or the like is provided. On both sides of the cover 27, the cous 1
U-shaped elastic engaging piece portions 29, 29 which are detachably engaged with the flange portions 3a at the respective ends of the opposing side wall portions 3, 3 are integrally formed.
上記構成において、トライアツク６１〜６３の熱は、ケ
ース１の底壁部２を放熱板として放散されるのみなら
ず、１対の対向側壁部３，３やフイン部４を通して放散
されるから、優れた放熱効果が発揮される。In the above structure, the heat of the triacs 6 1 to 6 3 is dissipated not only through the bottom wall portion 2 of the case 1 as a heat dissipation plate but also through the pair of opposing side wall portions 3 and 3 and the fin portion 4. , Excellent heat dissipation effect is exhibited.
また、カバー２７の外面２７ａがレール（図示せず）等
に取り付けた状態では、上記フイン部４等の放熱部が取
付面とは反対側に位置するため、上記放熱部を通しての
放熱作用は有効に維持される。上記ケース１の底壁部２
に導電性の対向側壁部３，３やフイン部４を一体に形成
したことにより、この部分が重くなるが、上記カバー２
７の弾性係合片部２９と対向側壁部３の鍔部３ａとを介
して上記カバー２７が上記放熱部に一体化されるため、
両者のがたつきが吸収されて適正な結合関係が保たれ
る。Further, when the outer surface 27a of the cover 27 is attached to a rail (not shown) or the like, the heat radiating portion such as the fin portion 4 is located on the side opposite to the mounting surface, so that the heat radiating action through the heat radiating portion is effective. Maintained at. Bottom wall 2 of the case 1
Since the electrically conductive opposite side wall portions 3 and 3 and the fin portion 4 are integrally formed on the above, this portion becomes heavy.
Since the cover 27 is integrated with the heat radiating portion via the elastic engaging piece portion 29 of 7 and the flange portion 3a of the opposite side wall portion 3,
The rattling of both is absorbed and an appropriate bonding relationship is maintained.
また、上記ケース１の対向側壁部３，３の両側方から１
対の分割エース１４，１５を結合させてプリント配線基
板２１等の収納空間を存在させてあるから、上記配線基
板２１等の組み込みが簡単に行なえ、製作しやすいもの
となる。In addition, from both sides of the opposite side wall portions 3 and 3 of the case 1,
Since the pair of divided aces 14 and 15 are combined to make a space for accommodating the printed wiring board 21 or the like, the wiring board 21 or the like can be easily incorporated and can be easily manufactured.
ところで、上記トライアツク６１〜６３の各リード部７
（７１〜７３），９（９１〜９３）が導電性の対向側壁
部３，３の内側に沿て配設されているため、このままで
はこれらの短絡事故のおそれがあるが、上記各分割ケー
スの立壁１７ａ，１７ｂ，１８ａ，１８ｂが絶縁隔壁と
して設定されているため、そのような事故のおそれを解
消することができる。しかも、この例では、上記一方の
対向側壁部３と各立壁１７ａ，１８ａとの間ならびに他
方の対向側壁部３と各立壁１７ｂ，１８ｂとの間にはそ
れぞれ隙間Ｇが存在して絶縁空間を形成しているため、
上記短絡事故のおそれを一層確実に解消し得る効果があ
る。By the way, the lead portions 7 of the triacs 6 1 to 6 3 described above.
Since (7 1 to 7 3 ) and 9 (9 1 to 9 3 ) are arranged along the inner side of the conductive opposite side wall portions 3 and 3, there is a risk of short-circuiting of these as they are. Since the standing walls 17a, 17b, 18a, 18b of each of the divided cases are set as insulating partition walls, it is possible to eliminate the risk of such an accident. Moreover, in this example, a gap G exists between the one opposing side wall portion 3 and each of the standing walls 17a and 18a, and between the other opposing side wall portion 3 and each of the standing walls 17b and 18b, so that an insulating space is formed. Because it is formed
There is an effect that the fear of the short circuit accident can be more surely eliminated.
第１図、第２図および第３図はそれぞれこの発明に係る
半導体装置の一例を示す分解斜視図、概正面断面図およ
び概略側面断面図、第４図は従来の半導体装置の構成を
示す正面断面図である。 １……ケース、２……底壁部、３……対向側壁部、３ａ
……鍔部、４……放熱用フイン部、５……電気絶縁板、
６（６１〜６３）……半導体素子、７（７１〜７３），
９（９１〜９３）……リード部、８（８１〜８３），１
０（１０１〜１０３）……外部端子、１４，１５……分
割ケース、１７ａ，１７ｂ，１８ａ，１８ｂ……立壁
（絶縁隔壁）、２７……カバー、２７ａ……外面（取付
面）、２９……弾性係合片部。1, 2, and 3 are an exploded perspective view, a schematic front sectional view and a schematic side sectional view, respectively, showing an example of a semiconductor device according to the present invention, and FIG. 4 is a front view showing a configuration of a conventional semiconductor device. FIG. 1 ... Case, 2 ... Bottom wall part, 3 ... Opposing side wall part, 3a
...... Collar part, 4 ...... Heat dissipation fin part, 5 ...... Electrical insulating plate,
6 (6 1 to 6 3 ) ... semiconductor element, 7 (7 1 to 7 3 ),
9 (9 1 to 9 3 ) ... Lead portion, 8 (8 1 to 8 3 ), 1
0 (10 1 to 10 3 ) ... external terminal, 14, 15 ... split case, 17a, 17b, 18a, 18b ... standing wall (insulating partition), 27 ... cover, 27a ... outer surface (mounting surface), 29 ... Elastic engaging piece.
Claims (1)
形成された１対の対向側壁部を有するケースの上記底壁
部外面に放熱用フイン部を一体形成し、リード部に外部
端子を一体形成した半導体素子を上記底壁部内面に電気
絶縁板を介して固定して、上記対向側壁部と上記リード
部との間の絶縁隔壁を構成する立壁をもつた１対の分割
ケースを上記対向側壁部の両側方からそれぞれ差し込ん
で互に結合し、回路構成用の部品を装着した配線基板を
上記ケース内に収容して、外面側が取付面として設定さ
れたカバーを上記ケースに嵌着するとともに、該カバー
に形成された１対のコ字形弾性係合片を上記１対の対向
側壁部の先端に形成された各鍔部に係脱可能に係止した
ことを特徴とする半導体装置。1. A radiating fin portion is integrally formed on an outer surface of the bottom wall portion of a case having a conductive bottom wall portion and a pair of opposing side wall portions integrally formed on the bottom wall portion, and a fin portion is externally provided. A pair of split cases having a standing wall, in which a semiconductor element integrally formed with a terminal is fixed to the inner surface of the bottom wall via an electrical insulating plate, and which constitutes an insulating partition between the opposing side wall and the lead. Are inserted from both sides of the facing side wall portion and connected to each other, the wiring board having the components for circuit configuration mounted therein is housed in the case, and the cover having the outer surface side set as the mounting surface is fitted into the case. And a pair of U-shaped elastic engaging pieces formed on the cover and releasably locked to the respective flanges formed at the tips of the pair of opposing side wall parts. apparatus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19910085A JPH0612797B2 (en) | 1985-09-09 | 1985-09-09 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19910085A JPH0612797B2 (en) | 1985-09-09 | 1985-09-09 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6258669A JPS6258669A (en) | 1987-03-14 |
| JPH0612797B2 true JPH0612797B2 (en) | 1994-02-16 |
Family
ID=16402121
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19910085A Expired - Lifetime JPH0612797B2 (en) | 1985-09-09 | 1985-09-09 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0612797B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09162713A (en) * | 1995-12-11 | 1997-06-20 | Mitsubishi Electric Corp | Semiconductor integrated circuit |
| EP3872854A1 (en) * | 2020-02-27 | 2021-09-01 | Littelfuse, Inc. | Power module housing with improved protrusion design |
-
1985
- 1985-09-09 JP JP19910085A patent/JPH0612797B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6258669A (en) | 1987-03-14 |
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