JPH09252187A - Electric device housing structure - Google Patents

Abstract

(57) Abstract: A heat pipe device having a simple structure in a case structure in which heat generated by an electric product housed in a case of an electric device is drawn to the outside of the case with a heat pipe and cooled. (EN) A case structure is obtained in which insulation between the outer case 4 and the outer box 4 is ensured, and the number of processing and assembling steps is reduced. A heat pipe device (2) in which a cooling body block (5) for attaching an electric product that generates heat is coupled to one end of a heat pipe (6), and the other end is pulled out to the outside of a housing and a cooling fin (10) is coupled to the heat pipe device (2). Frame 3 to attach
And an outer box 4 for waterproofing by enclosing the outer side of the frame 3, and the frame 3 is formed of an insulating material. Further, the frame 3 made of an insulating material has a U-shaped packing groove 9 that fits with the outer box 4 and is integrally formed with the frame 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a casing structure of an electric device such as an electric power converter, and more particularly to cooling generated heat of an electric product housed in the casing by drawing it out of the casing by a heat pipe. It relates to the structure of the housing.

[0002]

2. Description of the Related Art FIG. 5 is a side sectional view showing a housing structure of a conventional electric device, and FIG. 6 is a front view of FIG.
5 and 6 show, for example, a power conversion device mounted under the floor of a railway vehicle, in which a cooling body block 5 mounting a module-type main circuit semiconductor 1 on one end of a heat pipe 6 is shown. The heat pipe 6 is attached to the other end of the heat pipe 6 by pulling it out of the outer box 4 and the cooling fin 10 is attached to the heat pipe device 2. The cooling fins 10 are drawn out to radiate heat.

The heat pipe device 2 is attached to the front plate 3A of the frame 3 via an insulating plate 8. A packing groove 9 having a U-shaped cross section into which a waterproof packing is fitted is attached by welding around the front plate 3A of the frame 3, and a packing holder provided on the edge of the outer box 4 so as to fit into the packing groove 9 is attached. The outer box 4 has a waterproof structure by pressing 11.

In this conventional example, the heat pipe device 2 is attached to the frame 3 together with the required electrical components not shown to form an inverter unit, for example, and the inverter unit is provided together with the required electrical components not shown in the outer casing 4. The power converter is housed in, for example, a power converter. Not only when the main circuit semiconductor 1 is a non-insulating type, but also when the main circuit semiconductor 1 is an insulating type, if a breakdown voltage occurs inside the main circuit semiconductor 1 or a dielectric breakdown occurs due to some cause, the frame 3 and the outer box are not shown. There is a danger that 4 will be charged and you will get an electric shock by touching it. In order to prevent this, the cooling body block 5 and the cooling fins 1 constituting the heat pipe device 2
A mounting plate 7 is provided in the middle of 0, and the mounting plate 7 is mounted on the frame 3 via an insulating plate 8 to electrically insulate the main circuit semiconductor 1 from the frame 3 and the outer box 4.
The insulation distance is a or b + c shown in FIGS. 5 and 6.

FIG. 7 is a side sectional view showing a housing structure of another conventional electric device. The metal frame 13 is fixed to the base by means not shown, and the other end of the heat pipe 6 to which the cooling fins 10 are fixed is fixed to the cooling body 1.
6 is fixed to the frame 13 together with the main circuit semiconductor 15 and the insulating plate 14. Further, the capacitor 18 connected as shown in FIG. 8 is fixed to the frame 13 via the insulating plate 17 by the fixing tool 18A, the electric circuit is connected to the main circuit semiconductor 15 by the conductor 12, and the ends are for input / output. Becomes the conductor 19.

FIG. 8 is a front view taken along the arrow D in FIG. A capacitor 18 is fixed to the frame 13 via an insulating plate 17, and an end of a conductive portion on the back surface of the capacitor 18 is exposed above the frame 13 as an input / output conductor 19.

[0007]

In the above-mentioned example, since the insulating plate 8 is required, the material cost / processing cost of the insulating plate 8 and the man-hours for attaching the heat pipe 6 and the frame 3 are required, and the cost is accordingly increased. It was high. Further, in order to make the outer box 4 waterproof, the relational dimension between the packing groove 9 welded around the front plate 3A and the packing retainer 11 provided on the edge of the outer box 4 is high over the entire length of the packing groove 9. Since precision is required, a large number of man-hours are required for processing and assembling the frame 3, the packing groove 9 and the outer box 4, which is one of the causes of the high cost.

Similarly, in the example of FIG. 7, insulating plates 14 and 17 are used.
The material cost, the processing cost, and the number of man-hours for mounting the frame 13 are required, resulting in a high cost. An object of the present invention is to provide a heat pipe device 2 and a main circuit semiconductor 15 with a simple structure.
It is an object of the present invention to provide a housing structure that reliably insulates between the capacitor 18 and each of the frames 3 and 13 and that reduces the number of processing and assembly steps.

[0009]

SUMMARY OF THE INVENTION According to the present invention, in a structure of a housing for accommodating various electric products, and drawing out heat generated by the electric products to the outside of the housing with a heat pipe to cool the electric products and a cooling unit. The mounting frame features a structure that is an insulating material. According to a second aspect of the present invention, in a structure of a casing in which generated heat of an electrical product housed in a casing of an electric device is drawn to the outside of the casing by a heat pipe to cool the electricity, electricity generated at one end of the heat pipe is generated. A heat pipe device in which the cooling block to which the product is attached is connected, and the other end is drawn out of the housing to connect the cooling fins, a frame to which the heat pipe device is attached, and an outer part of the frame that wraps to waterproof. It is characterized by comprising a box and molding the frame with an insulating material.

According to a third aspect of the present invention, in the casing structure of the electric device according to the second aspect, the frame made of an insulating material is integrally formed with a U-shaped packing groove that fits in the outer box. It is characterized by being molded. According to a fourth aspect of the present invention, in the casing structure of the electric device according to the first aspect,
At least one type of electrical equipment is a capacitor, and the cooling part is a cooling body between a heat generating part and a heat pipe.

A fifth aspect of the present invention is characterized in that, in the casing structure of the electric device according to any one of the first to fourth aspects, the insulating material of the frame is FRP.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention has a structure in which a metal frame is molded with a rigid insulating material and a heat pipe device or a main circuit semiconductor / capacitor is directly assembled to the frame.

[0013]

【Example】

Embodiment 1 FIG. 1 is a side sectional view showing a casing structure of an electric device of the present invention, and FIG. 2 is a front view of FIG. 1 seen from AA.
1 and 2, the main circuit semiconductor 1, the heat pipe device 2, the frame 3, the outer box 4, the cooling body block 5, the heat pipe 6, the mounting plate 7, and the cooling fin 10 are the same as those described in the conventional example and their functions. The description will be omitted because they have the same purpose.

In the present invention, the frame 3 is integrally molded with an insulating material such as FRP (Fiber Reinforced Plastics), and the heat pipe device 2 is directly attached to the front plate 3A of the frame 3 by the attachment plate 7. Since the material of the frame 3 is an insulator, the heat pipe device 2 and the outer case 4 are completely insulated. Also frame 3
Since the packing groove 9 having a U-shaped cross section for fitting the waterproof packing around the front plate 3A is integrally formed with the frame 3, the processing of the packing groove 9 and the man-hours for mounting the packing groove 9 are unnecessary.

Embodiment 2 FIG. 3 is a side sectional view showing a housing structure of another electric device of the present invention, and FIG. 4 is a front view of FIG. 3 viewed from C. 3 and 4, the main circuit semiconductor 1
5, the cooling body 16, the heat pipe 6, the cooling fin 10, the capacitor 18, the input / output conductor 19, and the conductor 12 have the same functions and applications as those described in the conventional example, and therefore description thereof is omitted. Also in this invention, the main circuit semiconductor 15 and the capacitor 18 are attached by integrally molding the frame 21 with an insulating material. Due to this structure, the main circuit semiconductor 15, the cooling body 16, and the capacitor 18 are insulated from the frame 21.

[0016]

According to the present invention, the heat pipe device 2 and the outer casing 4 are reliably insulated from each other with a simple structure, and the main circuit semiconductor 15 and the capacitor 18 are reliably insulated from the frame 21. As a device, the number of processing and assembling steps can be reduced, and an inexpensive housing structure can be obtained.

[Brief description of drawings]

FIG. 1 is a side sectional view showing a casing structure of an electric device according to the present invention.

FIG. 2 is a front view of FIG. 1 seen from AA.

FIG. 3 is a side sectional view showing a casing structure of another electric device according to the present invention.

FIG. 4 is a front view of FIG. 3 viewed from C.

FIG. 5 is a side sectional view showing a housing structure of a conventional electric device.

FIG. 6 is a front view of FIG. 5 viewed from BB.

FIG. 7 is a side sectional view showing a housing structure of another conventional electric device.

FIG. 8 is a front view of FIG. 7 viewed from D.

[Explanation of symbols]

 1 Main Circuit Semiconductor 2 Heat Pipe Device 3 Frame 3A Front Plate 4 Outer Box 5 Cooler Block 6 Heat Pipe 7 Mounting Plate 9 Packing Groove 10 Cooling Fins 13 Frame 14 Insulating Plate 15 Main Circuit Semiconductor 16 Cooling Body 17 Insulating Plate 18 Capacitor 19 Input / output conductor 21 frame

Claims (5)

[Claims] 1. In a structure of a housing in which various electric products are housed and heat generated by the electric products is drawn out of the housing by a heat pipe to be cooled, a frame to which the electric products and the cooling unit are attached is made of an insulating material. A casing structure of an electric device characterized by the structure. 2. In a structure of a casing in which heat generated from an electric component housed in a casing of an electric device is drawn to the outside of the casing by a heat pipe for cooling, a heat-generating electric component is attached to one end of the heat pipe. It consists of a heat pipe device that connects the body block and pulls out the other end to the outside of the housing to connect the cooling fins, a frame to which this heat pipe device is attached, and an outer box that wraps the outside of this frame and waterproofs it. A casing structure for an electric device, wherein the frame is formed of an insulating material. 3. The housing structure for an electric device according to claim 2, wherein the frame made of an insulating material is integrally formed with a U-shaped packing groove that fits into the outer box. Enclosure structure for electrical devices. 4. The housing structure for an electric device according to claim 1, wherein at least one kind of the electrical component is a capacitor, and the cooling part is a cooling body between the heat generating part and the heat pipe. Enclosure structure for electrical devices. 5. The casing structure for an electric device according to claim 1, wherein the insulating material of the frame is FRP.