JPH0530063B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a semiconductor wafer transfer jig. [Technical Background of the Invention] In recent years, semiconductor wafers used in the manufacture of integrated circuits are transported by automated mechanisms. Such automated semiconductor wafer transport means include belt transport in which the semiconductor wafer is placed on a moving belt, chuck transport in which the semiconductor wafer is gripped by a chuck, or as shown in FIG. A tray conveyor on which the wafer 2 is placed is employed. These conveying means are usually used in combination. In addition, chuck transport systems tend to become less and less used because semiconductor wafers are contaminated with dust and the like when chucked. On the other hand, various diameters of semiconductor wafers to be transported are selected in order to improve productivity. [Problems with the background art] However, when the diameter of the semiconductor wafer changes, the entire transport means, especially the transport system, must be replaced.
There was a problem that significantly reduced productivity. Incidentally, in the case of belt conveyance, the belt width must be adjusted, and in the case of tray conveyance, the entire tray mechanism must be replaced. As a result, when semiconductor wafers are transported in a vacuum or reduced pressure atmosphere, the vacuum or other state must be released and then reset, resulting in a significant drop in productivity. [Object of the Invention] An object of the present invention is to provide a semiconductor wafer transport jig that can be applied to transport a plurality of types of semiconductor wafers having different diameters and achieves improved productivity. [Summary of the Invention] The present invention provides a wafer fixing peripheral portion with a diameter smaller than the inner diameter of the semiconductor wafer storage portion,
This is a semiconductor wafer transfer jig that achieves improved workability by making it possible to transfer multiple types of semiconductor wafers with different diameters. [Embodiments of the Invention] Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 2 is a perspective view of one embodiment of the invention.
In the figure, 10 is a jig main body having a substantially horseshoe shape. A semiconductor wafer 1 to be fitted is placed around the jig main body 10.
A peripheral edge portion 12 is formed with a height slightly larger than the wall thickness of 1. The diameter of the peripheral edge portion 12 is set to be slightly larger than the diameter of the large semiconductor wafer 11 of, for example, 5 inches. Furthermore, a gripping handle 13 is attached to the outer peripheral surface of the peripheral portion 12. Also,
In the center of the floor 13 of the jig main body 10 surrounded by the peripheral edge 12, a stepped portion is formed which has a wafer fixing peripheral edge 14 with an inner diameter large enough to fit, for example, a 4-inch small semiconductor wafer. ing. An opening 15 extends from the center of this step to the peripheral edge 12.
is formed. Since the semiconductor wafer 11 to be transported is normally placed on support pins or the like, the semiconductor wafer 11 supported by the opening 15 can be opened by housing the support pins or the like in the opening 15. This is for fitting into the peripheral edge part 12 or the wafer fixing peripheral edge part 14 by scooping it with the jig main body 10. Semiconductor wafer transfer jig 2 configured in this way
According to No. 0, a large semiconductor wafer 11 is placed at a peripheral portion 1.
A small semiconductor wafer can be inserted into the wafer fixing peripheral portion 14 and transported. Therefore, even if the diameter of the semiconductor wafer 11 to be transported changes, there is no need to adjust or replace the transport mechanism, and the transport work can be continued smoothly.
Therefore, even if an atmosphere such as a vacuum state is set at the destination point to be transported, the work of transporting the semiconductor wafer 11 can be continued without changing these settings in any way. As a result, workability can be significantly improved. Incidentally, when the semiconductor wafer transfer jig 20 of the embodiment was used to transfer a 5-inch semiconductor wafer to a 4-inch semiconductor wafer in a system set in a vacuum state, the adjustment required to change the diameter of the semiconductor wafer was The time was about 10 minutes. In comparison, with conventional transport jigs, it takes a long time to release and reset the vacuum state.
In the end, it was found that 4 hours of adjustment time was required. In the embodiment, a wafer fixing peripheral part 14 was provided inside the peripheral part 12 in order to fit a semiconductor wafer with a small diameter, but in addition to this, as shown in FIG. A peripheral pin 21 for fixing a wafer, which is in contact with the peripheral side of a semiconductor wafer having a small diameter, may be installed in the portion 12. Further, it goes without saying that the wafer fixing peripheral portion 14 and the wafer fixing peripheral pin 21 may be formed so as to accommodate two or more types of semiconductor wafers with different diameters. Further, the wafer fixing peripheral edge 14 may be formed integrally with the jig main body 10 as in the embodiment, or it may be formed with a substantially U-shaped holding plate that is detachable within the jig main body 10. Several types may be prepared depending on semiconductor wafers of various diameters. [Effects of the Invention] As explained above, the semiconductor wafer transfer jig according to the present invention can be applied to transfer multiple types of semiconductor wafers with different diameters, and productivity can be improved. be.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a conventional semiconductor wafer transfer jig, FIG. 2 is a perspective view of an embodiment of the present invention, and FIG.
The figure is a perspective view of another embodiment of the invention. 10...Jig body, 11...Semiconductor wafer, 1
2... Peripheral portion, 13... Gripping handle, 14... Peripheral portion for wafer fixing, 15... Opening, 20 , 22 ...
Semiconductor wafer transfer jig, 21...peripheral pin for wafer fixation.

Claims (1)

[Claims] 1. A wafer placement section on which a semiconductor wafer is placed;
a gripping handle connected to a peripheral edge of the wafer placement section, an opening provided in the center of the wafer placement section, and a gripping handle connected to a peripheral edge of the wafer placement section;
In the semiconductor wafer transfer jig, the semiconductor wafer transfer jig is provided with a notch communicating with the opening at a position different from a position where the gripping part is connected, wherein the wafer mounting part is in contact with a lower surface of the wafer to be mounted. a first annular holding surface having a predetermined width and provided for holding the first annular holding surface; a second wafer contact surface that extends vertically and downward from the inner peripheral edge of the first annular holding surface;
A second annular shape extending from the lower end of the second wafer contacting surface parallel to and inward to the first annular holding surface with a predetermined width to contact and hold the lower surface of the wafer to be placed. A semiconductor wafer transfer jig characterized by comprising a holding surface.