JPH0526741Y2 - - Google Patents
Info
- Publication number
- JPH0526741Y2 JPH0526741Y2 JP14257088U JP14257088U JPH0526741Y2 JP H0526741 Y2 JPH0526741 Y2 JP H0526741Y2 JP 14257088 U JP14257088 U JP 14257088U JP 14257088 U JP14257088 U JP 14257088U JP H0526741 Y2 JPH0526741 Y2 JP H0526741Y2
- Authority
- JP
- Japan
- Prior art keywords
- package
- attachment
- integrated circuit
- molding
- male connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000465 moulding Methods 0.000 claims description 8
- 238000001721 transfer moulding Methods 0.000 claims description 6
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14257088U JPH0526741Y2 (ko) | 1988-10-31 | 1988-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14257088U JPH0526741Y2 (ko) | 1988-10-31 | 1988-10-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0262721U JPH0262721U (ko) | 1990-05-10 |
| JPH0526741Y2 true JPH0526741Y2 (ko) | 1993-07-07 |
Family
ID=31408644
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14257088U Expired - Lifetime JPH0526741Y2 (ko) | 1988-10-31 | 1988-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0526741Y2 (ko) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4548199B2 (ja) * | 2005-04-22 | 2010-09-22 | 株式会社デンソー | 電子回路装置の製造方法 |
| JP2009033065A (ja) * | 2007-07-30 | 2009-02-12 | Mitsubishi Electric Corp | フィン一体型半導体モジュールおよびその製造方法 |
| DE102008040676A1 (de) * | 2008-07-24 | 2010-01-28 | Robert Bosch Gmbh | Abdichtrahmen sowie Verfahren zum Abdecken eines Bauteils |
| JP2018146264A (ja) * | 2017-03-01 | 2018-09-20 | 矢崎総業株式会社 | 絶縁状態検出装置 |
-
1988
- 1988-10-31 JP JP14257088U patent/JPH0526741Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0262721U (ko) | 1990-05-10 |
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