JPH0463679U - - Google Patents
Info
- Publication number
- JPH0463679U JPH0463679U JP10729390U JP10729390U JPH0463679U JP H0463679 U JPH0463679 U JP H0463679U JP 10729390 U JP10729390 U JP 10729390U JP 10729390 U JP10729390 U JP 10729390U JP H0463679 U JPH0463679 U JP H0463679U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- radius
- insulating
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
第１図は本考案の一実施例を示す装着状態の要
部断面図、第２図は同スルーホールの端部に電気
部品の電極脚を装着した所の要部断面図、第３図
は従来の装着状態を示す要部断面図である。
図中、１はプリント基板、２と３はパターン、
４はスルーホール、５はソルダレジスト、６は電
気部品、７は筐体、８は絶縁孔、９は電極脚、１
０は絶縁部、１１は半田付である。
Fig. 1 is a cross-sectional view of the main part of an embodiment of the present invention in the installed state, Fig. 2 is a cross-sectional view of the main part of the electrode leg of the electrical component installed at the end of the through hole, and Fig. 3 is a cross-sectional view of the main part of the installed state. FIG. 3 is a cross-sectional view of main parts showing a conventional mounting state. In the figure, 1 is a printed circuit board, 2 and 3 are patterns,
4 is a through hole, 5 is a solder resist, 6 is an electric component, 7 is a housing, 8 is an insulation hole, 9 is an electrode leg, 1
0 is an insulating part, and 11 is a soldering part.
Claims (1)
ソルダレジストを施したプリント基板に於いて、
金属製の筐体の底面に設けた絶縁孔のほぼ中央に
電極脚を突出し、同電極脚と前記絶縁孔との間に
絶縁部を備えた電気部品を設け、前記スルーホー
ルの半径をａ、前記半田付可能範囲の半径をｂ、
前記絶縁孔の半径をｃ、前記スルーホールの中心
から端部に前記電極脚を移動する量をｄとしたと
き、ａ＜ｂ＜ｃ−ｄの関係になるよう前記ソルダ
レジストを前記スルーホール上に塗布して成るこ
とを特徴とするプリント基板。 (2) ほぼ中央に貫通孔を備えた半田付用ランド
上に半田付可能範囲を除きソルダレジストを施し
たプリント基板に於いて、金属製の筐体の底面に
設けた絶縁孔のほぼ中央に電極脚を突出し、同電
極脚と前記絶縁孔との間に絶縁部を備えた電気部
品を設け、前記貫通孔の半径をａ、前記半田付可
能範囲の半径をｂ、前記絶縁孔の半径をｃ、前記
貫通孔の中心から端部に前記電極脚を移動した量
をｄとしたとき、ａ＜ｂ＜ｃ−ｄの関係になるよ
う前記ソルダレジストを前記半田付用ランドに塗
布して成ることを特徴とするプリント基板。[Claims for Utility Model Registration] (1) In a printed circuit board with solder resist applied over the through-holes except for the solderable areas,
An electrode leg is protruded from approximately the center of an insulating hole provided on the bottom of a metal casing, an electrical component having an insulating part is provided between the electrode leg and the insulating hole, and the radius of the through hole is a, The radius of the solderable range is b,
When the radius of the insulating hole is c and the amount by which the electrode leg is moved from the center of the through hole to the end is d, the solder resist is placed over the through hole so that a<b<c-d. A printed circuit board characterized by being coated with. (2) In a printed circuit board that has solder resist applied on a soldering land with a through hole approximately in the center, except for the area where soldering is possible, the insulating hole provided at the bottom of the metal casing has a through hole approximately in the center of the printed circuit board. An electric component with an insulating part is provided between the electrode leg and the insulating hole, and the radius of the through hole is a, the radius of the solderable range is b, and the radius of the insulating hole is c. The solder resist is applied to the soldering land so that the relationship a<b<c-d holds, where d is the amount by which the electrode leg is moved from the center of the through-hole to the end. A printed circuit board characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10729390U JPH0463679U (en) | 1990-10-12 | 1990-10-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10729390U JPH0463679U (en) | 1990-10-12 | 1990-10-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0463679U true JPH0463679U (en) | 1992-05-29 |
Family
ID=31853732
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10729390U Pending JPH0463679U (en) | 1990-10-12 | 1990-10-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0463679U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002246734A (en) * | 2001-02-19 | 2002-08-30 | Sony Corp | Substrate and electronic equipment having substrate |
-
1990
- 1990-10-12 JP JP10729390U patent/JPH0463679U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002246734A (en) * | 2001-02-19 | 2002-08-30 | Sony Corp | Substrate and electronic equipment having substrate |
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