JPH0450648A - Biochemical sensor - Google Patents
Biochemical sensorInfo
- Publication number
- JPH0450648A JPH0450648A JP2153758A JP15375890A JPH0450648A JP H0450648 A JPH0450648 A JP H0450648A JP 2153758 A JP2153758 A JP 2153758A JP 15375890 A JP15375890 A JP 15375890A JP H0450648 A JPH0450648 A JP H0450648A
- Authority
- JP
- Japan
- Prior art keywords
- film
- transparent substrate
- semiconductor
- light
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 239000004065 semiconductor Substances 0.000 claims description 15
- 229910052594 sapphire Inorganic materials 0.000 claims description 14
- 239000010980 sapphire Substances 0.000 claims description 14
- 239000000243 solution Substances 0.000 claims description 7
- 239000008151 electrolyte solution Substances 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 3
- 239000000969 carrier Substances 0.000 claims description 2
- 230000010287 polarization Effects 0.000 claims description 2
- 238000000605 extraction Methods 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 20
- 229910052710 silicon Inorganic materials 0.000 abstract description 19
- 239000010703 silicon Substances 0.000 abstract description 19
- 238000003754 machining Methods 0.000 abstract 2
- MUJOIMFVNIBMKC-UHFFFAOYSA-N fludioxonil Chemical compound C=12OC(F)(F)OC2=CC=CC=1C1=CNC=C1C#N MUJOIMFVNIBMKC-UHFFFAOYSA-N 0.000 abstract 1
- 238000005498 polishing Methods 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 15
- 239000012535 impurity Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 235000012239 silicon dioxide Nutrition 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910004504 HfF4 Inorganic materials 0.000 description 1
- 229910021607 Silver chloride Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000004313 potentiometry Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Landscapes
- Investigating Or Analysing Materials By The Use Of Chemical Reactions (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
- Light Receiving Elements (AREA)
Abstract
Description
【発明の詳細な説明】 本発明は生物化学センサの構造に関するものである。[Detailed description of the invention] The present invention relates to the structure of a biochemical sensor.
光アドレス電位応答センサ(L A P S ens
or−L ight−addressable p
otensiometoric 5ens。Photoaddressed potential response sensor (LAP sens)
or-Light-addressable p
otensiometric 5ens.
r)は第1図に示すように電界質溶液1/絶縁層2/シ
リコン半導体113/の構成を取るデバイスである。こ
こで、REは飽和KCL−銀−塩化銀の参照電極で、V
−8はバイアス電圧、1は電流系で、シリコン半導体基
板3の裏面より発光ダイオードLED等により光照射パ
ルスを与え、この光により絶縁層27′半導体層3の界
面に誘起されたキャリアにより生ずる光電流を電流系I
で測定する。r) is a device having the structure of electrolyte solution 1/insulating layer 2/silicon semiconductor 113/ as shown in FIG. where RE is a saturated KCL-silver-silver chloride reference electrode and V
-8 is a bias voltage, and 1 is a current system. A light irradiation pulse is applied from the back surface of the silicon semiconductor substrate 3 by a light emitting diode LED, etc., and the light is generated by carriers induced at the interface of the insulating layer 27' and the semiconductor layer 3. Current system I
Measure with.
この光電流は溶液とシリコン半導体の間に翠加される電
圧に対しある極大値を取り、この電圧は電解質溶液17
′絶縁層2の界面での表面電位に対応するので、電界質
溶液の化学変化を検出することができる。従来、光アド
レス電位応答センサはシリコン基板を用いてMetat
−1n5ulater−S ilicon(MIS)構
造でMetalを除去した構造のデバイスを形成し製作
している。This photocurrent takes a certain maximum value with respect to the voltage applied between the solution and the silicon semiconductor, and this voltage
'Since it corresponds to the surface potential at the interface of the insulating layer 2, chemical changes in the electrolyte solution can be detected. Conventionally, photo-addressable potential-responsive sensors use a silicon substrate to produce MetaT
A device with a -1n5ulator-Silicon (MIS) structure in which metal is removed is formed and manufactured.
このセンサは、片面は絶縁層2で被われているが反対面
はシリコンが剥き出しなので何らかの方法で溶液と電気
的に絶縁されなければならないし、シリコン基板3は本
来脆いものなので、このセンサの取り扱いに気を使い、
複雑にしていた。又、厚いシリコン基板の裏面から光を
入射するのに光損失を起こすので入射光のエネルギーを
上げなければならないなどの欠点があった。さらに、表
面をデバイス、裏面を先入!iF1窓としているので両
面加工が出来た方がよい。この点、シリコン基板では裏
面加工をする上で表面との位置合わせぜしにくい欠貞も
あった。One side of this sensor is covered with an insulating layer 2, but the silicon is exposed on the other side, so it must be electrically insulated from the solution in some way, and the silicon substrate 3 is inherently fragile, so handling of this sensor is difficult. be careful,
I was making it complicated. Another disadvantage is that the energy of the incident light must be increased because light is incident on the back surface of a thick silicon substrate, causing optical loss. Furthermore, the front side is a device and the back side is pre-filled! Since it is an iF1 window, it would be better to be able to process both sides. In this respect, silicon substrates have the disadvantage that it is difficult to align them with the front surface when processing the back surface.
本発明は上記欠点を解決し、このセンサが溶液と電気的
に絶縁されて安定に動作し、取り扱いが容易で、さらに
、加工が容易で口産に適し安価であるような生、物化学
センサを実現するのが目的である。The present invention solves the above-mentioned drawbacks, and provides a biochemical sensor that is electrically insulated from solutions, operates stably, is easy to handle, and is also easy to process, suitable for oral production, and inexpensive. The purpose is to realize the following.
第2図は本発明の光アドレス電位応答センサの説明図で
、シリコン・オン・サファイア(以下5O3)基板を用
いた場合である。まず、両面鏡面l1Illのサファイ
ア基板Sの一方の面上にP形シリコン膜3iを形成しS
O8基板を作る。シリコン酸
:#P面に約1μmの二酸化シリコン族Si○2を付け
る。次に受光部以外の二酸化シリコン族を除去し高濃度
不純物をドープし、^濃度ドープ領域P+を形成する。FIG. 2 is an explanatory diagram of the photo-addressable potential responsive sensor of the present invention, in which a silicon-on-sapphire (hereinafter referred to as 5O3) substrate is used. First, a P-type silicon film 3i is formed on one surface of a sapphire substrate S with a double-sided mirror surface l1Ill.
Make the O8 board. Silicon acid: Apply approximately 1 μm of silicon dioxide group Si○2 to the #P surface. Next, the silicon dioxide group other than the light-receiving portion is removed and a high concentration impurity is doped to form a heavily doped region P+.
次に島状の受光シリコン部の二酸化シリコン族を除去し
、清浄な二酸化シリコン膜化シリコン模を全て除去し8
0μmx80um口に、受光部から離れた所に位置する
高濃度不純物ドープ部に基板への電極下を形成する。上
記のような構造により、サファイア基板Sの絶縁113
ix/シリコン11面S1を溶液に接するようにし、反
対側のサファイア基板面から光パルスを照射し絶縁II
/シリコン界面に分極を発生させることができる。さら
に、基板への電極部以外は溶液と電気的に容易に絶縁す
ることができるようになる。又、第3図に、同一サファ
イア基板上に多数配置した例を示す。上記のシリコン・
オン・サファイア(SO8)基板を用意して、シリコン
表面に約1μmの二酸化シリコン族を付ける。次にW間
隔に配列された多数の80μmX8Qμm口のfIA域
の二酸化シリコン族を残し、他の二酸化シリコン族を全
て除去する。次に、この二酸化シリコン膜が除去された
シリコン面に高濃度不純物をドープする。次に上記の8
0μmX8Qμmの領域の二酸化シリコンllSi 0
2とシリコンナイトライド膜着513N4をそれぞれに
形成する。次に、等rM隔に配列された多数の80μm
X8Qμm口のtI4域を囲むようにした高濃度不純物
ドープ部の一部から外部電極Tを取り出す。上記の構造
で、多数の微小なセンサが高濃度不純物ドープ層により
独立して同一基板上に容易に111作できる。Next, remove the silicon dioxide group on the island-shaped light-receiving silicon part, and remove all the clean silicon dioxide film silicon pattern.
In a 0 μm x 80 um opening, a high concentration impurity doped portion located away from the light receiving portion is formed under the electrode to the substrate. With the above structure, the insulation 113 of the sapphire substrate S
ix/Silicon 11 surface S1 is brought into contact with the solution, and a light pulse is irradiated from the sapphire substrate surface on the opposite side to insulate II.
/Polarization can be generated at the silicon interface. Furthermore, parts other than the electrode parts to the substrate can be easily electrically insulated from the solution. Further, FIG. 3 shows an example in which a large number of devices are arranged on the same sapphire substrate. The above silicon
An on-sapphire (SO8) substrate is prepared, and about 1 μm of silicon dioxide group is attached to the silicon surface. Next, a large number of 80 μm×8 Q μm silicon dioxide groups in the fIA region arranged at intervals of W are left, and all other silicon dioxide groups are removed. Next, the silicon surface from which the silicon dioxide film has been removed is doped with impurities at a high concentration. Next, the above 8
Silicon dioxide llSi 0 in the area of 0μm×8Qμm
2 and a silicon nitride film 513N4 are formed respectively. Next, a large number of 80 μm arrayed at equal rM intervals
The external electrode T is taken out from a part of the high concentration impurity doped region surrounding the tI4 region of the X8Qμm opening. With the above structure, a large number of minute sensors can be easily fabricated independently on the same substrate using a layer doped with impurities at a high concentration.
第4図はサファイア基板の裏面に光入射窓を設けた光ア
ドレス電位応答センサの例である。サファイア基板の裏
面に光を照射する場合、レーザー光やLEDなどを光源
として、レンズか光ファイバー弗で微小領域に照射光を
絞るのには限界がある。簡便に微小領域に照射するには
、サファイア基板に裏面に微小な光入射窓を設けること
により実現される。上記の同一サファイア基板上に多数
配置したセンサに於て、裏面に銅などの反射#l1RE
を被着し、半導体ICプロセスの写真工程により微細な
窓を開ける。現実では7μmφの窓を作ることは可能で
あり、レーザー光ヤLED等の光源が多少の広がりを持
っていても、微小領域に選択的に照射できる。FIG. 4 is an example of a photo-addressable potential responsive sensor in which a light entrance window is provided on the back surface of a sapphire substrate. When irradiating light onto the back side of a sapphire substrate, there is a limit to how much light can be focused on a minute area using a lens or optical fiber when using a laser beam or LED as a light source. Irradiation to a minute area can be easily achieved by providing a minute light entrance window on the back surface of the sapphire substrate. In the above-mentioned sensors arranged in large numbers on the same sapphire substrate, reflection #l1RE of copper etc. on the back surface
is applied, and fine windows are opened using the photo process of the semiconductor IC process. In reality, it is possible to create a window of 7 μmφ, and even if a light source such as a laser beam or LED has some spread, it is possible to selectively irradiate a minute area.
光を透過する透明基板としてガラス板G、又は、石英板
を用いた他の例を第5図に示す。両面amtir研磨の
ガラス板、又は、石英板の一方の面上に5OO^インジ
ウムスズ酸化物(iTo)などの透明電極膜を形成する
。この膜上に、アモルファス乞
シリコンヤーレンなどのアモルファス半導体膜をa3i
を300 OA影形成る。次に受光部以外のアモルファ
ス半導体膜を除去し透明電極を露出ざ光
せる。ここで、受骨部は透明電橋膜上に、とびとびの島
状でも連続した面でもよい。次に清浄な二酸化シリコン
族、及び、シリコンナイトライド膜などの絶縁膜を’+
0004はど形成する。最後に受光部から離れた場所の
絶縁膜を除去し透明電極膜を露出させセンサへの電極を
形成する。上記の他に、透明な有機物数を用いて、上記
例と同様なLAPセンサを作成ぐきることは明らかであ
る。FIG. 5 shows another example in which a glass plate G or a quartz plate is used as a transparent substrate that transmits light. A transparent electrode film such as 5OO^indium tin oxide (iTo) is formed on one side of a double-sided amtir-polished glass plate or a quartz plate. On this film, an amorphous semiconductor film such as amorphous silicon yarn is applied.
300 OA shadow formation. Next, the amorphous semiconductor film other than the light receiving portion is removed to expose the transparent electrode. Here, the bridge portion may be in the form of discrete islands or a continuous surface on the transparent bridge film. Next, apply an insulating film such as a clean silicon dioxide group or silicon nitride film.
0004 is formed. Finally, the insulating film away from the light receiving section is removed to expose the transparent electrode film and form electrodes for the sensor. It is clear that in addition to the above, transparent organic materials can be used to create a LAP sensor similar to the above example.
本発明により、優れた光透過性を持ち絶縁性が高い透明
基板を使用しているのでセンサの溶液中での安定性が向
上する。特に、サファイア基板は薬品に強く、機械的強
度が強いので取り扱いが容易である。又、両面鏡面透明
基板は光を用いるセンサに向いているだけでなく、光入
射窓の加工など裏面の写真処理工程などの半導体プロセ
スに好都合であり、アモルファスシリコンやセレンなど
を透明電極とともに用いると、低温加工ができ、種々の
形状のセンサができ、−度可能で安価で高機能のセンサ
が容易に実現でき、実用上、たいへん有意義である。According to the present invention, since a transparent substrate having excellent light transmittance and high insulation properties is used, the stability of the sensor in a solution is improved. In particular, sapphire substrates are resistant to chemicals and have strong mechanical strength, making them easy to handle. In addition, double-sided mirror-finished transparent substrates are not only suitable for sensors that use light, but are also convenient for semiconductor processes such as photo processing on the back side, such as processing light entrance windows. It can be processed at low temperatures, sensors of various shapes can be made, and it is possible to easily realize low-temperature, inexpensive, and highly functional sensors, which is of great practical significance.
第1図は従来の光アドレス電位応答センサを用いたボテ
ンシオメトリーのHfF4図、第2図、第3図、第4図
及び第5図は本発明の一実施例構造図である。図におい
て、Sはサファイア基板、Sはシリコン、Sixは絶縁
膜、LEDは発光素子、■は電極である。
特許出願人 新電元工業株式会社第2図
第1図
第3図FIG. 1 is a HfF4 diagram of potentiometry using a conventional optically addressed potential responsive sensor, and FIGS. 2, 3, 4 and 5 are structural diagrams of an embodiment of the present invention. In the figure, S is a sapphire substrate, S is silicon, Six is an insulating film, LED is a light emitting element, and ■ is an electrode. Patent applicant Shindengen Kogyo Co., Ltd. Figure 2 Figure 1 Figure 3
Claims (4)
より発生する光誘起電流の変化を検出することにより電
界質溶液の化学変化を検出する光アドレス電位応答セン
サに於て、両面鏡面研磨のサファイアなどの光を透過す
る透明基板の一方の面上にP形又はN形半導体膜を形成
し、この半導体膜にオーミック性を持つ不活性領域で囲
まれた島状半導体領域を形成し、上記の膜全体に絶縁物
膜を形成し、電極の取り出し部を島状半導体領域から離
れたオーミック性を持つ不活性領域に設けたことを特徴
とする生物化学センサ。(1) In a photo-addressable potential-responsive sensor that detects chemical changes in an electrolyte solution by detecting changes in photo-induced current generated by light irradiation at the electrolyte solution/insulating layer/semiconductor layer interface, a double-sided mirror surface is used. A P-type or N-type semiconductor film is formed on one surface of a transparent substrate such as polished sapphire that transmits light, and an island-shaped semiconductor region surrounded by an inactive region having ohmic properties is formed in this semiconductor film. . A biochemical sensor, characterized in that an insulating film is formed over the entire film, and an electrode lead-out portion is provided in an inert region having ohmic properties and separated from the island-shaped semiconductor region.
物などの両面鏡面の光を透過する透明基板の一方の面上
に透明電極膜を形成し、この膜上にアモルファス半導体
膜を形成し、上記のこれらの膜上に絶縁物膜を被着し、
電極の取り出し部を透明電極膜の一部に設けたことを特
徴とする特許請求の範囲第(1)項記載の生物化学セン
サ。(2) In the above sensor, a transparent electrode film is formed on one surface of a light-transmitting transparent substrate made of a double-sided mirror surface such as sapphire, glass, or an organic substance, and an amorphous semiconductor film is formed on this film, An insulating film is deposited on these films,
The biochemical sensor according to claim 1, wherein the electrode extraction portion is provided in a part of the transparent electrode film.
るようにし、反対側の透明基板面からパルス状の光を照
射し半導体−絶縁膜界面にキャリアを発生させて分極を
起こすことを特徴とする特許請求の範囲第(1)項、第
(2)項記載の生物化学センサ。(3) Place the surface of the semiconductor film on the transparent substrate in contact with the solution, and irradiate pulsed light from the opposite transparent substrate surface to generate carriers at the semiconductor-insulating film interface and cause polarization. A biochemical sensor according to claims (1) and (2).
とを特徴とする特許請求の範囲第(1)項、第(2)項
及び第(3)項記載の生物化学センサ。(4) A biochemical sensor according to claims (1), (2), and (3), characterized in that a large number of the sensors are arranged on the same transparent substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2153758A JP3054740B2 (en) | 1990-06-12 | 1990-06-12 | Biochemical sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2153758A JP3054740B2 (en) | 1990-06-12 | 1990-06-12 | Biochemical sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0450648A true JPH0450648A (en) | 1992-02-19 |
| JP3054740B2 JP3054740B2 (en) | 2000-06-19 |
Family
ID=15569489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2153758A Expired - Fee Related JP3054740B2 (en) | 1990-06-12 | 1990-06-12 | Biochemical sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3054740B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5507936A (en) * | 1992-06-09 | 1996-04-16 | Avl Medical Instruments Ag | Member for the formation of at least one electrode and/or one sensor |
| WO2002035219A3 (en) * | 2000-10-24 | 2002-12-19 | Forschungszentrum Juelich Gmbh | Measuring device for detecting one-dimensional or multidimensional distribution of a chemical or biochemical component |
| CN102109482A (en) * | 2009-12-23 | 2011-06-29 | 中国科学院电子学研究所 | Light-addressable electropolymerization device and molecular imprinting electrochemical modification method and application thereof |
| JP2012088118A (en) * | 2010-10-18 | 2012-05-10 | Dainippon Printing Co Ltd | Transistor type sensor, and measurement method using the same |
-
1990
- 1990-06-12 JP JP2153758A patent/JP3054740B2/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5507936A (en) * | 1992-06-09 | 1996-04-16 | Avl Medical Instruments Ag | Member for the formation of at least one electrode and/or one sensor |
| WO2002035219A3 (en) * | 2000-10-24 | 2002-12-19 | Forschungszentrum Juelich Gmbh | Measuring device for detecting one-dimensional or multidimensional distribution of a chemical or biochemical component |
| CN102109482A (en) * | 2009-12-23 | 2011-06-29 | 中国科学院电子学研究所 | Light-addressable electropolymerization device and molecular imprinting electrochemical modification method and application thereof |
| JP2012088118A (en) * | 2010-10-18 | 2012-05-10 | Dainippon Printing Co Ltd | Transistor type sensor, and measurement method using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3054740B2 (en) | 2000-06-19 |
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