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JPH0438158B2 - - Google Patents

Info

Publication number
JPH0438158B2
JPH0438158B2 JP60019776A JP1977685A JPH0438158B2 JP H0438158 B2 JPH0438158 B2 JP H0438158B2 JP 60019776 A JP60019776 A JP 60019776A JP 1977685 A JP1977685 A JP 1977685A JP H0438158 B2 JPH0438158 B2 JP H0438158B2
Authority
JP
Japan
Prior art keywords
layer
conductive layer
forming
conductive
polyimide resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60019776A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61179598A (ja
Inventor
Tomohiro Nakamori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP1977685A priority Critical patent/JPS61179598A/ja
Publication of JPS61179598A publication Critical patent/JPS61179598A/ja
Publication of JPH0438158B2 publication Critical patent/JPH0438158B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP1977685A 1985-02-04 1985-02-04 多層配線形成方法 Granted JPS61179598A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1977685A JPS61179598A (ja) 1985-02-04 1985-02-04 多層配線形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977685A JPS61179598A (ja) 1985-02-04 1985-02-04 多層配線形成方法

Publications (2)

Publication Number Publication Date
JPS61179598A JPS61179598A (ja) 1986-08-12
JPH0438158B2 true JPH0438158B2 (zh) 1992-06-23

Family

ID=12008729

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977685A Granted JPS61179598A (ja) 1985-02-04 1985-02-04 多層配線形成方法

Country Status (1)

Country Link
JP (1) JPS61179598A (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63244795A (ja) * 1987-03-31 1988-10-12 松下電器産業株式会社 配線基板
JPH0638551B2 (ja) * 1989-02-20 1994-05-18 松下電工株式会社 多層配線板の製造方法
JPH0710030B2 (ja) * 1990-05-18 1995-02-01 インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン 多層配線基板の製造方法
JP5842686B2 (ja) * 2012-03-13 2016-01-13 住友金属鉱山株式会社 立体的回路基板の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4935864A (zh) * 1972-08-04 1974-04-03
JPS502059A (zh) * 1973-02-28 1975-01-10
JPS5064767A (zh) * 1973-10-12 1975-06-02

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4935864A (zh) * 1972-08-04 1974-04-03
JPS502059A (zh) * 1973-02-28 1975-01-10
JPS5064767A (zh) * 1973-10-12 1975-06-02

Also Published As

Publication number Publication date
JPS61179598A (ja) 1986-08-12

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term