JPH04356996A - FPC terminal processing method - Google Patents
FPC terminal processing methodInfo
- Publication number
- JPH04356996A JPH04356996A JP15744591A JP15744591A JPH04356996A JP H04356996 A JPH04356996 A JP H04356996A JP 15744591 A JP15744591 A JP 15744591A JP 15744591 A JP15744591 A JP 15744591A JP H04356996 A JPH04356996 A JP H04356996A
- Authority
- JP
- Japan
- Prior art keywords
- base film
- double
- sided fpc
- fpc
- sided
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003672 processing method Methods 0.000 title claims description 9
- 239000004020 conductor Substances 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 13
- 238000012545 processing Methods 0.000 claims description 8
- 239000010408 film Substances 0.000 description 31
- 239000000758 substrate Substances 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 239000011889 copper foil Substances 0.000 description 8
- 238000005530 etching Methods 0.000 description 7
- 238000003754 machining Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 230000003014 reinforcing effect Effects 0.000 description 4
- 238000004080 punching Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 1
- 238000012993 chemical processing Methods 0.000 description 1
- 239000012787 coverlay film Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【０００１】0001
【産業上の利用分野】本発明は両面フレキシブル・プリ
ンティッド・サーキット（以下「ＦＰＣ」という）に端
子を形成するための加工方法、さらに詳しくは電気機器
などに使用される高密度両面ＦＰＣをプリント回路基板
などの基板に接続させるために用いる端子の加工方法に
関する。[Industrial Application Field] The present invention relates to a processing method for forming terminals on double-sided flexible printed circuits (hereinafter referred to as "FPC"), and more specifically, to printing high-density double-sided FPCs used in electrical equipment, etc. The present invention relates to a method of processing a terminal used for connection to a substrate such as a circuit board.
【０００２】0002
【従来の技術】従来のＦＰＣは、図１２および図１３に
示すように、絶縁性のベースフィルム１を有している。
ベースフィルム１の表裏面には、それぞれに銅箔等の導
電性の表側パターン３及び裏面パターン４とが形成され
ている。これらの表裏パターン３，４とベースフィルム
１とによって両面ＦＰＣ６を構成し、ベースフィルム１
の表裏面の間で表裏パターン３，４が互いに接続されて
いる。すなわち、ベースフィルム１の所定位置には表裏
面を貫通したスルーホール５が形成されている。表側パ
ターン３は裏側パターン４に接続するためにスルーホー
ル５へとのびている。スルーホール５には導電性のラン
ド７が形成されている。ランド７は裏側パターン４と表
側パターン３とを接続している。また、表側パターン３
はプリント回路基板のような基板８に接続されている。
つまり、基板８には表側パターン３に対向している一面
に回路パターン１０が形成されている。これらの回路パ
ターン１０に表側パターン３が対向して接続されている
。2. Description of the Related Art A conventional FPC has an insulating base film 1, as shown in FIGS. 12 and 13. A conductive front pattern 3 and a back pattern 4 made of copper foil or the like are formed on the front and back surfaces of the base film 1, respectively. These front and back patterns 3 and 4 and the base film 1 constitute a double-sided FPC 6, and the base film 1
The front and back patterns 3 and 4 are connected to each other between the front and back surfaces. That is, a through hole 5 penetrating the front and back surfaces is formed at a predetermined position of the base film 1. The front pattern 3 extends into a through hole 5 for connection to the back pattern 4. A conductive land 7 is formed in the through hole 5. The land 7 connects the back pattern 4 and the front pattern 3. Also, the front pattern 3
is connected to a substrate 8, such as a printed circuit board. That is, the circuit pattern 10 is formed on one surface of the substrate 8 facing the front pattern 3. The front side pattern 3 is connected to these circuit patterns 10 facing each other.
【０００３】また、他の従来例としては、、図１２及び
図１３に示した両面ＦＰＣ６の表裏面に銅箔などの導電
パターン（図示せず）を設け、ベースフィルム１をエッ
チング加工などの化学的な処理により溶かしてスルーホ
ール５を形成し表裏の導電パターンを接続している。As another conventional example, conductive patterns (not shown) such as copper foil are provided on the front and back surfaces of the double-sided FPC 6 shown in FIGS. 12 and 13, and the base film 1 is subjected to chemical processing such as etching. The through hole 5 is formed by melting through a process similar to that described above, and the conductive patterns on the front and back sides are connected.
【０００４】0004
【発明が解決しようとする課題】図１２及び図１３に示
すスルーホール５を穿設するには、ドリルなどの機械加
工によって行なっていた。しかし、ＦＰＣ６は柔軟性が
あり、穿設加工が困難であるばかりでなく、スルーホー
ル５の穴径がφ０．４ｍｍ程度と比較的大きいために、
高密度化には適していなかった。The through holes 5 shown in FIGS. 12 and 13 have been formed by machining using a drill or the like. However, the FPC 6 is flexible and not only difficult to drill, but also because the diameter of the through hole 5 is relatively large at about φ0.4 mm.
It was not suitable for high density.
【０００５】また、エッチングによりベースフィルム１
にスルーホールを形成する方法は導電パターンを高密度
化できるが、化学的な処理のためにどうしても加工に時
間が係り過ぎるという問題がある。さらに、ベースフィ
ルムが有機物であるためにアルカリ系の薬剤を使用する
ことになるが、かかる薬剤は有害なものが多く、薬害を
防止するための設備や廃液処理のための設備がどうして
も必要となる。このため、加工設備が大規模なものとな
らざるを得ず製品のコストアップになっていた。[0005] Furthermore, the base film 1 can be etched.
Although the method of forming through holes in the conductive pattern can increase the density of the conductive pattern, there is a problem in that the processing takes too much time due to the chemical treatment. Furthermore, since the base film is an organic substance, alkaline chemicals are used, but many of these chemicals are harmful, and equipment to prevent chemical damage and equipment for waste liquid treatment are absolutely necessary. . For this reason, the processing equipment had to be large-scale, which increased the cost of the product.
【０００６】本発明の課題は、高密度化に適し、かつ加
工時間・加工コストの改善できるＦＰＣの端子加工方法
を提供するこにある。An object of the present invention is to provide an FPC terminal processing method that is suitable for high-density processing and that can improve processing time and processing cost.
【０００７】[0007]
【課題を解決するための手段】本発明によれば、絶縁性
のベースフィルムの一面に第１の導体を設けた片面ＦＰ
Ｃを有し、上記ベースフィルムを貫通するように機械加
工により穴を開け、この後、第２の導体を該ベースフィ
ルムの上記一面とは反対側の他面に設けて両面ＦＰＣと
し、該両面ＦＰＣに上記第１及び第２の導体により導電
パターンをそれぞれ形成するようにエッチング加工を施
して上記第１及び第２の導電パターンをそれぞれ形成し
、次に上記穴部分で上記穴部分に橋渡しされている上記
第２の導電パターンを切断することにより上記第２の導
電パターンににより端子部を形成することを特徴とする
両面ＦＰＣの端子加工方法が得られる。また、本発明に
よれば、絶縁性のベースフィルムの一面に第１の導体を
設けた片面ＦＰＣを有し、上記ベースフィルムを貫通す
るように機械加工により穴を開け、この後、第２の導体
を該ベースフィルムの上記一面とは反対側の他面に設け
て両面ＦＰＣとし、該両面ＦＰＣに上記第１及び第２の
導体により第１及び第２の導電パターンをそれぞれ形成
するようにエッチング加工を施して上記第１及び第２の
導電パターンを形成し、次に、上記穴部分に橋渡しされ
ている上記第２の導電パターンと上記第２の導電パター
ンを設けた上記ベースフィルムの領域とを残した状態で
上記ベースフィルムを切断することを特徴とする両面Ｆ
ＰＣの端子加工方法が得られる。[Means for Solving the Problems] According to the present invention, a single-sided FP in which a first conductor is provided on one side of an insulating base film is provided.
A hole is made by machining so as to penetrate through the base film, and then a second conductor is provided on the other surface of the base film opposite to the one surface to form a double-sided FPC. Etching is performed on the FPC to form conductive patterns using the first and second conductors, respectively, to form the first and second conductive patterns, and then the holes are bridged by the hole portions. There is obtained a terminal processing method for a double-sided FPC, characterized in that a terminal portion is formed by the second conductive pattern by cutting the second conductive pattern. Further, according to the present invention, there is provided a single-sided FPC in which a first conductor is provided on one side of an insulating base film, a hole is made by machining so as to penetrate the base film, and then a second conductor is provided on one side of an insulating base film. A conductor is provided on the other surface of the base film opposite to the one surface to form a double-sided FPC, and the double-sided FPC is etched to form first and second conductive patterns using the first and second conductors, respectively. Processing is performed to form the first and second conductive patterns, and then the second conductive pattern bridges the hole portion and the area of the base film provided with the second conductive pattern. Double-sided F, characterized in that the base film is cut with the .
A PC terminal processing method is obtained.
【０００８】[0008]
【作用】この発明の方法に用いられるＦＰＣは片面ＦＰ
Ｃであり、ベースフィルムの一面には接着剤により導電
パターンが張り付けられている。この片面ＦＰＣのベー
スフィルム側に離型紙付きの接着剤を張り付ける。この
後、パンチング等の機械加工により穴を開ける。次に、
ベースフィルム上の離型紙を剥がし、ベースフィルムの
接着剤の付着した面に導体を張り付けて両面ＦＰＣとす
る。次に、所定部位にレジストを行ないエッチング加工
によりパターンを形成する。次に端子の先端となる部分
で切断する。上記のような工程を経て製造された端子付
きの両面ＦＰＣは基板に接続される。[Operation] The FPC used in the method of this invention is a single-sided FP.
C, and a conductive pattern is pasted on one side of the base film with an adhesive. Adhesive with release paper is applied to the base film side of this single-sided FPC. After that, holes are made by machining such as punching. next,
The release paper on the base film is peeled off, and a conductor is pasted on the adhesive-adhered side of the base film to form a double-sided FPC. Next, a resist is applied to a predetermined portion and a pattern is formed by etching. Next, cut off the tip of the terminal. The double-sided FPC with terminals manufactured through the above steps is connected to a substrate.
【０００９】[0009]
【実施例】図１乃至図８は本発明の図１は、ＦＰＣの端
子加工方法の一実施例を示している。この実施例におい
て、図１２及び図１３と同じ部分には同じ符号を付して
説明をする。DESCRIPTION OF THE PREFERRED EMBODIMENTS FIGS. 1 to 8 show an embodiment of the FPC terminal processing method of the present invention. In this embodiment, the same parts as in FIGS. 12 and 13 will be described with the same reference numerals.
【００１０】この発明の方法に用いられるＦＰＣは、片
面ＦＰＣ２１を用いている。片面ＦＰＣ２１はベースフ
ィルム１の一面に接着剤２４により銅箔のような薄い第
１の導体２銅箔５が張り付けられている。この片面ＦＰ
Ｃ２１のベースフィルム１の他面に、図２に示すように
、離型紙２６付きの接着剤２７を張り付ける。この後、
図３に示すように、パンチング等の機械加工により長穴
２８を開ける。[0010] The FPC used in the method of the present invention is a single-sided FPC 21. In the single-sided FPC 21, a thin first conductor 2 such as a copper foil 2 and a copper foil 5 are pasted on one side of the base film 1 with an adhesive 24. This single-sided FP
As shown in FIG. 2, an adhesive 27 with a release paper 26 is applied to the other surface of the base film 1 of C21. After this,
As shown in FIG. 3, a long hole 28 is made by machining such as punching.
【００１１】次に、図４及び図５に示すように、ベース
フィルム１上の離型紙２６を剥がし、ベースフィルム１
の接着剤２７の付着した面に銅箔のような薄い第２の導
体２９を張り付けて両面ＦＰＣ３０とする。この後、図
６に示すように、所定部位にレジスト３１を行ないエッ
チング加工により第１の導電パターン２５ａと第２の導
電パターン２９ａを形成する。ここで、図９はエッチン
グ加工後の両面ＦＰＣ３０の平面図を示すもので、第１
及び第２の導電パターン２５ａ，２９ａは所定の間隔を
おいて並置された状態となっている。また、第２の導電
パターン２９ａの先端部分は長穴２８に橋渡しされてい
る状態にある。Next, as shown in FIGS. 4 and 5, the release paper 26 on the base film 1 is peeled off and the base film 1 is removed.
A thin second conductor 29 such as copper foil is attached to the surface to which the adhesive 27 is attached to form a double-sided FPC 30. Thereafter, as shown in FIG. 6, a resist 31 is applied to a predetermined portion, and a first conductive pattern 25a and a second conductive pattern 29a are formed by etching. Here, FIG. 9 shows a plan view of the double-sided FPC 30 after etching.
The second conductive patterns 25a and 29a are arranged side by side at a predetermined interval. Further, the tip portion of the second conductive pattern 29a is in a state where it is bridged by the elongated hole 28.
【００１２】次に、図７に示すように、長穴２８をその
長手方向に切断するとともに、長穴２８の長手方向に直
交する向きに両面ＦＰＣ３０を切断して両面ＦＰＣ３０
から突出した端子部３３を形成する。つまり、端子部３
３は第２の導電パターン２９ａの先端部分となる。これ
らの切断部分は、図９において点線Ａ，Ｂで示した部分
となる。このような工程を経て製造された端子部３３を
有する両面ＦＰＣ３０は、図８及び図１０に示すように
、プリント回路基板のような基板８の表面に接続される
。図１０において、１０ａ，１０ｂは基板８の表面にそ
れぞれ形成した回路パターンである。すなわち、回路パ
ターン１０ａには第１の導電パターン２５ａが接続され
、回路パターン１０ｂには第２の導電パターン２９ａの
先端部分である端子部３３が接続される。Next, as shown in FIG. 7, the elongated hole 28 is cut in its longitudinal direction, and the double-sided FPC 30 is cut in a direction perpendicular to the longitudinal direction of the elongated hole 28.
A terminal portion 33 protruding from the terminal portion 33 is formed. In other words, the terminal part 3
3 is the tip of the second conductive pattern 29a. These cut portions are indicated by dotted lines A and B in FIG. The double-sided FPC 30 having the terminal portion 33 manufactured through such a process is connected to the surface of a substrate 8 such as a printed circuit board, as shown in FIGS. 8 and 10. In FIG. 10, 10a and 10b are circuit patterns formed on the surface of the substrate 8, respectively. That is, the first conductive pattern 25a is connected to the circuit pattern 10a, and the terminal portion 33, which is the tip of the second conductive pattern 29a, is connected to the circuit pattern 10b.
【００１３】なお、図１１に示すように、必要に応じて
端子部３３の先端に補強用の補強フィルム部３５を残す
ことも可能である。すなわち、補強フィルム部３５は両
面ＦＰＣ３０を、図９に示すように、上述の点線Ｂ及び
点線Ｃの部分で切断することによって窓状の長穴２８を
残した状態で形成することもできる。図１１に示す両面
ＦＰＣ３０は、高密度化により第２の導電パターン２９
ａも必然的に細くなる。この結果、端子部３３が分離し
ている状態にあると、変形する恐れもあるため、端子部
３３が折れてしまったり、ロケーションエラーを起こし
易くなるので、基板８の回路パターン１０ｂ（図８参照
）に両面ＦＰＣ３０の端子部３３を半田付けする工程時
までは、補強フィルム部３５を一体化させているもので
ある。この際、長穴２８に橋渡しされている端子部３３
を回路パターン１０ｂに半田付け等により接続し、第１
の導電パターン２５ａを回路パターン１０ａに絶縁性の
ソルダーレジストもしくはカバーレイフィルムを張り付
けて接続するものである。その後に、端子部３３を切断
して補強フィルム部３５を切り離しても良い。As shown in FIG. 11, it is also possible to leave a reinforcing film portion 35 at the tip of the terminal portion 33 if necessary. That is, the reinforcing film portion 35 can also be formed by cutting the double-sided FPC 30 along the above-mentioned dotted line B and dotted line C, leaving the window-shaped elongated hole 28, as shown in FIG. The double-sided FPC 30 shown in FIG. 11 has a second conductive pattern 29 due to high density.
a also inevitably becomes thinner. As a result, if the terminal portion 33 is separated, it may be deformed, which may cause the terminal portion 33 to break or cause location errors. ) until the step of soldering the terminal portion 33 of the double-sided FPC 30, the reinforcing film portion 35 is integrated. At this time, the terminal portion 33 bridged over the elongated hole 28
is connected to the circuit pattern 10b by soldering etc., and the first
The conductive pattern 25a is connected to the circuit pattern 10a by pasting an insulating solder resist or coverlay film. Thereafter, the reinforcing film portion 35 may be separated by cutting the terminal portion 33.
【００１４】[0014]
【発明の効果】上記したように、本発明の両面ＦＰＣの
端子加工方法によれば、個々の導電パターン毎にスルー
ホールを設ける必要がないので、高密度に端子部を形成
することができる。As described above, according to the terminal processing method for double-sided FPC of the present invention, there is no need to provide through holes for each conductive pattern, so terminal portions can be formed with high density.
【００１５】しかも、本発明の方法によれば、有機物の
エッチング工程を経ることなしに行なうことができ、通
常の機械加工と金属のエッチング（酸系薬剤使用による
）のみで行なうことができるので、廃液処理などのため
の大規模な設備を要しなくて済み、安価なコストで両面
ＦＰＣに端子部を形成することができる。Moreover, according to the method of the present invention, it can be carried out without going through an organic material etching process, and can be carried out only by ordinary machining and metal etching (using acidic chemicals). There is no need for large-scale equipment for waste liquid treatment, etc., and terminal portions can be formed on double-sided FPCs at low cost.
【図１】本発明の両面ＦＰＣの端子加工方法の一実施例
を示し、ベースフィルムの片側に銅箔を形成し片面ＦＰ
Ｃとした状態の断面図である。FIG. 1 shows an example of the terminal processing method for double-sided FPC of the present invention, in which a copper foil is formed on one side of the base film to form a single-sided FP.
It is a sectional view of the state set to C.
【図２】図１の片面ＦＰＣの他面に離型紙付き接着剤を
設けた状態の工程を示す断面図である。2 is a sectional view showing a process in which an adhesive with release paper is provided on the other side of the single-sided FPC shown in FIG. 1; FIG.
【図３】図２の片面ＦＰＣにパンチング加工により穴を
形成した状態の工程を示す断面図である。3 is a sectional view showing a process in which holes are formed by punching in the single-sided FPC of FIG. 2; FIG.
【図４】図３の片面ＦＰＣの他面に銅箔を設け両面ＦＰ
Ｃた状態の工程を示す断面図である。[Figure 4] Double-sided FP with copper foil on the other side of the single-sided FPC in Figure 3
FIG.
【図５】図４の第２の導体を設けた状態を示す斜視図で
ある。FIG. 5 is a perspective view showing a state in which the second conductor of FIG. 4 is provided.
【図６】図４の両面ＦＰＣにレジストを施した状態の工
程を示す断面図である。6 is a sectional view showing a process in which a resist is applied to the double-sided FPC shown in FIG. 4; FIG.
【図７】図６の両面ＦＰＣを切断して端子部を形成した
状態の工程を示す断面図である。7 is a cross-sectional view showing a process in which the double-sided FPC of FIG. 6 is cut to form a terminal portion; FIG.
【図８】図７の両面ＦＰＣを基板に接続した状態を示す
断面図である。8 is a sectional view showing a state in which the double-sided FPC shown in FIG. 7 is connected to a substrate.
【図９】図７の両面ＦＰＣの切断部分を示す平面図であ
る。9 is a plan view showing a cut portion of the double-sided FPC of FIG. 7. FIG.
【図１０】図８の両面ＦＰＣを基板に接続する状態を示
す斜視図である。10 is a perspective view showing a state in which the double-sided FPC of FIG. 8 is connected to a board; FIG.
【図１１】図７の両面ＦＰＣの他の実施例を示す斜視図
である。11 is a perspective view showing another embodiment of the double-sided FPC shown in FIG. 7. FIG.
【図１２】従来の両面ＦＰＣにおけてスルーホールによ
り表裏の導通をした例を示す平面図である。FIG. 12 is a plan view showing an example of a conventional double-sided FPC in which the front and back sides are electrically connected by through holes.
【図１３】図１２のスルーホールにより表裏の導通をし
基板に接続した状態を示す平面図である。13 is a plan view showing a state in which the front and back sides are electrically connected and connected to a substrate through the through holes in FIG. 12; FIG.
１ ベースフィルム ３ 導電パターン ５ スルーホール ６ 両面ＦＰＣ ８ 基板 １０ 回路パターン ２１ 片面ＦＰＣ ２４ 接着剤 ２５ 銅箔 ２６ 離型紙 ２７ 接着剤 ２８ 長穴 ２９ａ 導電パターン ３０ 両面ＦＰＣ ３３ 端子部 1 Base film 3 Conductive pattern 5 Through hole 6 Double-sided FPC 8 Substrate 10 Circuit pattern 21 Single-sided FPC 24 Adhesive 25 Copper foil 26 Release paper 27 Adhesive 28 Long hole 29a Conductive pattern 30 Double-sided FPC 33 Terminal section
Claims (2)
の導体を設けた片面ＦＰＣを有し、上記ベースフィルム
を貫通するように機械加工により穴を開け、この後、第
２の導体を該ベースフィルムの上記一面とは反対側の他
面に設けて両面ＦＰＣとし、該両面ＦＰＣに上記第１及
び第２の導体により導電パターンをそれぞれ形成するよ
うにエッチング加工を施して上記第１及び第２の導電パ
ターンをそれぞれ形成し、次に上記穴部分に橋渡しされ
ている上記第２の導電パターンを切断することにより上
記第２の導電パターンににより端子部を形成することを
特徴とする両面ＦＰＣの端子加工方法。[Claim 1] A first layer on one side of an insulating base film.
A single-sided FPC is provided with a conductor, a hole is machined through the base film, and a second conductor is then provided on the other surface of the base film opposite to the one surface. A double-sided FPC is formed, and the double-sided FPC is etched to form conductive patterns using the first and second conductors, respectively, to form the first and second conductive patterns, and then the holes are filled with the first and second conductive patterns. A terminal processing method for a double-sided FPC, characterized in that a terminal portion is formed by the second conductive pattern by cutting the bridging second conductive pattern.
の導体を設けた片面ＦＰＣを有し、上記ベースフィルム
を貫通するように機械加工により穴を開け、この後、第
２の導体を該ベースフィルムの上記一面とは反対側の他
面に設けて両面ＦＰＣとし、該両面ＦＰＣに上記第１及
び第２の導体により導電パターンをそれぞれ形成するよ
うにエッチング加工を施して上記第１及び第２の導電パ
ターンをそれぞれ形成し、次に、上記穴部分に橋渡しさ
れている上記第２の導電パターンと上記第２の導電パタ
ーンを設けた上記ベースフィルムの領域とを残した状態
で上記ベースフィルムを切断することを特徴とする両面
ＦＰＣの端子加工方法。[Claim 2] A first layer on one side of the insulating base film.
A single-sided FPC is provided with a conductor, a hole is machined through the base film, and a second conductor is then provided on the other surface of the base film opposite to the one surface. A double-sided FPC is formed, and the double-sided FPC is etched to form conductive patterns using the first and second conductors, respectively, to form the first and second conductive patterns, and then the hole portion is etched to form the first and second conductive patterns. A method for processing a terminal for a double-sided FPC, comprising cutting the base film while leaving the second conductive pattern bridging the base film and the region of the base film provided with the second conductive pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3157445A JPH0750830B2 (en) | 1991-06-03 | 1991-06-03 | FPC terminal processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3157445A JPH0750830B2 (en) | 1991-06-03 | 1991-06-03 | FPC terminal processing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04356996A true JPH04356996A (en) | 1992-12-10 |
| JPH0750830B2 JPH0750830B2 (en) | 1995-05-31 |
Family
ID=15649815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3157445A Expired - Fee Related JPH0750830B2 (en) | 1991-06-03 | 1991-06-03 | FPC terminal processing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0750830B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7772501B2 (en) | 2006-04-25 | 2010-08-10 | Molex Incorporated | Flexible printed circuit board |
-
1991
- 1991-06-03 JP JP3157445A patent/JPH0750830B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7772501B2 (en) | 2006-04-25 | 2010-08-10 | Molex Incorporated | Flexible printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0750830B2 (en) | 1995-05-31 |
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|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
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