[go: up one dir, main page]

JPH0426563U - - Google Patents

Info

Publication number
JPH0426563U
JPH0426563U JP6685190U JP6685190U JPH0426563U JP H0426563 U JPH0426563 U JP H0426563U JP 6685190 U JP6685190 U JP 6685190U JP 6685190 U JP6685190 U JP 6685190U JP H0426563 U JPH0426563 U JP H0426563U
Authority
JP
Japan
Prior art keywords
copper foil
foil pattern
double
stopper
pattern formed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6685190U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6685190U priority Critical patent/JPH0426563U/ja
Publication of JPH0426563U publication Critical patent/JPH0426563U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図乃至第5図はこの考案に係る両面プリン
ト基板の銅箔パターンの接続構造の実施例を示し
、第1図は接続前の状態を示す断面図、第2図は
接続状態を示す断面図、第3図は接続ピンの断面
図、第4図及び第5図はこの考案の他の実施例を
示す斜視図である。 主な符号の説明、1……両面プリント基板、2
,3……銅箔パターン、4……孔、5……接続ピ
ン、5a……ストツパ、5b……半田溜り、5c
……クリーム半田、7……半田。
1 to 5 show examples of the connection structure of copper foil patterns on double-sided printed circuit boards according to this invention, FIG. 1 is a sectional view showing the state before connection, and FIG. 2 is a sectional view showing the connection state. 3 are sectional views of the connecting pin, and FIGS. 4 and 5 are perspective views showing other embodiments of this invention. Explanation of main symbols, 1...Double-sided printed circuit board, 2
, 3... Copper foil pattern, 4... Hole, 5... Connection pin, 5a... Stopper, 5b... Solder pool, 5c
...Cream solder, 7...Solder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 両面プリント基板の一方の側に形成した銅箔パ
ターンと他方の側に形成した銅箔パターンとをス
トツパ付のピンを介して接続すると共に前記スト
ツパに半田溜りを設けたことを特徴とする両面プ
リント基板の銅箔パターンの接続構造。
A double-sided print characterized in that a copper foil pattern formed on one side of a double-sided printed circuit board and a copper foil pattern formed on the other side are connected via a pin with a stopper, and a solder pool is provided in the stopper. Connection structure of copper foil pattern on board.
JP6685190U 1990-06-26 1990-06-26 Pending JPH0426563U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6685190U JPH0426563U (en) 1990-06-26 1990-06-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6685190U JPH0426563U (en) 1990-06-26 1990-06-26

Publications (1)

Publication Number Publication Date
JPH0426563U true JPH0426563U (en) 1992-03-03

Family

ID=31599916

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6685190U Pending JPH0426563U (en) 1990-06-26 1990-06-26

Country Status (1)

Country Link
JP (1) JPH0426563U (en)

Similar Documents

Publication Publication Date Title
JPH0426563U (en)
JPH0425266U (en)
JPS62112170U (en)
JPS63149565U (en)
JPH022858U (en)
JPH0195775U (en)
JPS6157557U (en)
JPH0281076U (en)
JPH0310565U (en)
JPS6371578U (en)
JPH0434766U (en)
JPS64366U (en)
JPH0468579U (en)
JPH01165673U (en)
JPH0263568U (en)
JPH0316713U (en)
JPH0173969U (en)
JPH02140874U (en)
JPS61125076U (en)
JPS61188380U (en)
JPH02137009U (en)
JPH0236070U (en)
JPS6161873U (en)
JPS61164065U (en)
JPH031474U (en)