[go: up one dir, main page]

JPS61164065U - - Google Patents

Info

Publication number
JPS61164065U
JPS61164065U JP2491985U JP2491985U JPS61164065U JP S61164065 U JPS61164065 U JP S61164065U JP 2491985 U JP2491985 U JP 2491985U JP 2491985 U JP2491985 U JP 2491985U JP S61164065 U JPS61164065 U JP S61164065U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
connection structure
connection
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2491985U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2491985U priority Critical patent/JPS61164065U/ja
Publication of JPS61164065U publication Critical patent/JPS61164065U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Combinations Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の1実施例に於ける接続構造の
断面側面図、第2図は従来一般に於ける接続構造
の断面側面図、第3図は他の従来例を示す断面図
である。 7……硬質プリント基板、8……軟質プリント
基板、9,10……銅箔パターン、11……熱硬
化性シート、12……半田。
FIG. 1 is a sectional side view of a connection structure according to an embodiment of the present invention, FIG. 2 is a sectional side view of a conventional connection structure, and FIG. 3 is a sectional view showing another conventional example. 7... Hard printed board, 8... Soft printed board, 9, 10... Copper foil pattern, 11... Thermosetting sheet, 12... Solder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 硬質プリント基板と軟質プリント基板との接続
構造に於いて、それぞれのプリント基板に接続部
を形成し、半田により電気的に接続させると共に
、熱硬化性シートを介挿させ接続を補強するよう
にしたことを特徴とするプリント基板接続構造。
In the connection structure between a hard printed circuit board and a flexible printed circuit board, a connecting part is formed on each printed circuit board, electrically connected by solder, and a thermosetting sheet is inserted to reinforce the connection. A printed circuit board connection structure characterized by:
JP2491985U 1985-02-22 1985-02-22 Pending JPS61164065U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2491985U JPS61164065U (en) 1985-02-22 1985-02-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2491985U JPS61164065U (en) 1985-02-22 1985-02-22

Publications (1)

Publication Number Publication Date
JPS61164065U true JPS61164065U (en) 1986-10-11

Family

ID=30519521

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2491985U Pending JPS61164065U (en) 1985-02-22 1985-02-22

Country Status (1)

Country Link
JP (1) JPS61164065U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5645184U (en) * 1979-09-17 1981-04-23

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5645184U (en) * 1979-09-17 1981-04-23

Similar Documents

Publication Publication Date Title
JPS61164065U (en)
JPS6188262U (en)
JPS6276555U (en)
JPS6276480U (en)
JPH0286169U (en)
JPH0336163U (en)
JPS63114070U (en)
JPS61192477U (en)
JPS63180969U (en)
JPS6315094U (en)
JPS63137975U (en)
JPH0310565U (en)
JPS62107475U (en)
JPS60101775U (en) Printed circuit board connection structure
JPS61100168U (en)
JPS61153371U (en)
JPS6359371U (en)
JPH0195775U (en)
JPS61171273U (en)
JPS61156268U (en)
JPS61161969U (en)
JPH01162289U (en)
JPH0282072U (en)
JPS6190276U (en)
JPS62193758U (en)