JPH0373453U - - Google Patents
Info
- Publication number
- JPH0373453U JPH0373453U JP13558589U JP13558589U JPH0373453U JP H0373453 U JPH0373453 U JP H0373453U JP 13558589 U JP13558589 U JP 13558589U JP 13558589 U JP13558589 U JP 13558589U JP H0373453 U JPH0373453 U JP H0373453U
- Authority
- JP
- Japan
- Prior art keywords
- plate
- shaped insulator
- grooves
- electrostatic adsorption
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012212 insulator Substances 0.000 claims description 5
- 239000001307 helium Substances 0.000 claims description 3
- 229910052734 helium Inorganic materials 0.000 claims description 3
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 3
- 238000001179 sorption measurement Methods 0.000 claims 3
- 239000007789 gas Substances 0.000 claims 2
- 238000001312 dry etching Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Drying Of Semiconductors (AREA)
- Weting (AREA)
Description
第１図は本考案の一実施例を示す断面概略図、
第２図は該実施例に於ける板状絶縁物の平面図、
第３図は第２図のＡ−Ａ矢視図、第４図は従来例
を示す断面概略図である。
１……真空容器、４……ウエーハ、８……直流
電源、１１……板状絶縁物、１５……熱授受手段
、１６，１８……溝、１７……ヘリウム供給装置
を示す。
FIG. 1 is a schematic cross-sectional view showing an embodiment of the present invention;
FIG. 2 is a plan view of the plate-shaped insulator in this embodiment,
3 is a view taken along the line A--A in FIG. 2, and FIG. 4 is a schematic cross-sectional view showing a conventional example. DESCRIPTION OF SYMBOLS 1...Vacuum container, 4...Wafer, 8...DC power source, 11...Plat-shaped insulator, 15...Heat exchange means, 16, 18...Groove, 17...Helium supply device.
Claims (1)
いられる静電吸着装置に於いて、真空容器内に配
設され、所要の熱授受手段で熱授受が行われる板
状絶縁物に静電吸着用電極を埋設し、該静電吸着
用電極に直流電源を接続し、前記板状絶縁物の被
処理基板載置面に同心状多重に溝を刻設し、該溝
を相互に連通すると共に該溝を所要の位置で板状
絶縁物外部と連通させ、該溝にヘリウムガスを供
給するヘリウムガス供給装置を連通したことを特
徴とする静電吸着装置。 In an electrostatic adsorption device used in processing equipment such as dry etching and CVD, an electrode for electrostatic adsorption is embedded in a plate-shaped insulator that is placed in a vacuum container and heat transfer is performed by the required heat transfer means. Then, a DC power source is connected to the electrostatic adsorption electrode, and multiple concentric grooves are carved on the surface of the plate-shaped insulator on which the substrate to be processed is placed, and the grooves are communicated with each other and the grooves are formed as required. 1. An electrostatic chuck device, characterized in that the groove is connected to the outside of the plate-shaped insulator, and is connected to a helium gas supply device that supplies helium gas to the groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989135585U JP2537739Y2 (en) | 1989-11-22 | 1989-11-22 | Electrostatic suction device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989135585U JP2537739Y2 (en) | 1989-11-22 | 1989-11-22 | Electrostatic suction device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0373453U true JPH0373453U (en) | 1991-07-24 |
| JP2537739Y2 JP2537739Y2 (en) | 1997-06-04 |
Family
ID=31682846
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989135585U Expired - Lifetime JP2537739Y2 (en) | 1989-11-22 | 1989-11-22 | Electrostatic suction device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2537739Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006168772A (en) * | 2004-12-15 | 2006-06-29 | Dainippon Printing Co Ltd | Envelope with gore |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55115047U (en) * | 1979-02-06 | 1980-08-13 | ||
| JPS5922340A (en) * | 1982-07-29 | 1984-02-04 | Toshiba Corp | Electrostatic chucking device |
| JPS60115226A (en) * | 1983-11-28 | 1985-06-21 | Hitachi Ltd | Substrate temperature control method |
| JPS6395644A (en) * | 1986-10-13 | 1988-04-26 | Nippon Telegr & Teleph Corp <Ntt> | Electrostatic chuck |
| JPH01200625A (en) * | 1988-02-05 | 1989-08-11 | Toshiba Corp | Semiconductor wafer processing equipment |
| JPH01135585U (en) * | 1988-03-09 | 1989-09-18 | ||
| JPH01251735A (en) * | 1988-03-31 | 1989-10-06 | Toshiba Corp | Electrostatic chuck apparatus |
| JPH0622213A (en) * | 1992-07-03 | 1994-01-28 | Nec Corp | Moving picture filter |
-
1989
- 1989-11-22 JP JP1989135585U patent/JP2537739Y2/en not_active Expired - Lifetime
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55115047U (en) * | 1979-02-06 | 1980-08-13 | ||
| JPS5922340A (en) * | 1982-07-29 | 1984-02-04 | Toshiba Corp | Electrostatic chucking device |
| JPS60115226A (en) * | 1983-11-28 | 1985-06-21 | Hitachi Ltd | Substrate temperature control method |
| JPS6395644A (en) * | 1986-10-13 | 1988-04-26 | Nippon Telegr & Teleph Corp <Ntt> | Electrostatic chuck |
| JPH01200625A (en) * | 1988-02-05 | 1989-08-11 | Toshiba Corp | Semiconductor wafer processing equipment |
| JPH01135585U (en) * | 1988-03-09 | 1989-09-18 | ||
| JPH01251735A (en) * | 1988-03-31 | 1989-10-06 | Toshiba Corp | Electrostatic chuck apparatus |
| JPH0622213A (en) * | 1992-07-03 | 1994-01-28 | Nec Corp | Moving picture filter |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006168772A (en) * | 2004-12-15 | 2006-06-29 | Dainippon Printing Co Ltd | Envelope with gore |
| JP4504174B2 (en) * | 2004-12-15 | 2010-07-14 | 大日本印刷株式会社 | Envelope with gusset |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2537739Y2 (en) | 1997-06-04 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |