JPH0356175U

JPH0356175U -

Info

Publication number: JPH0356175U
Application number: JP7359789U
Authority: JP
Priority date: 1989-06-26
Filing date: 1989-06-26
Publication date: 1991-05-30

Description

[Brief explanation of drawings]

第１図は本考案の実施例を示す表面実装部品搭
載パツドの平面図、第２図は上記基板に表面実装
部品をリフロー半田付けした状態を示す第１図の
Ｂ−Ｂ線に対応した断面図、第３図は従来の表面
実装基板の斜視図、第４図は第３図に示す従来の
表面実装基板のパツドに半田ペーストを盛り、そ
の上に対応する表面実装部品を配置したリフロー
前の状態を示す斜視図、第５図は従来の表面実装
部品が基板上に半田付け搭載された状態を示す斜
視図、第６図は第５図におけるＡ−Ａ線断面図、
第７図は従来の部品半田不濡れ状態を示す断面図
、第８図は従来の部品浮き状態を示す断面図、第
９図は本考案の第２実施例を示す表面実装部品搭
載パツドの平面図、第１０図は本考案の第３実施
例を示す表面実装部品搭載パツドの平面図である
。１１，２１，３１……基板、１２，２２，３２
……配線導体、１３，２３，３３……パツド、１
４……半田、１５……表面実装部品、１６……部
品電極、１７，２７，３７……測定端子、１８，
２８，３８……端子引き出し導体、１９，２９，
３９……スリツト、２０，３０，４０……表面実
装部品が搭載されるべき基板上の部位。 Fig. 1 is a plan view of a surface mount component mounting pad showing an embodiment of the present invention, and Fig. 2 is a cross section taken along the line B-B in Fig. 1 showing a surface mount component mounted on the above-mentioned board by reflow soldering. Figure 3 is a perspective view of a conventional surface mount board, and Figure 4 is a conventional surface mount board shown in Figure 3, with solder paste applied to the pads and the corresponding surface mount components placed on top of it before reflow. 5 is a perspective view showing a state in which a conventional surface mount component is soldered and mounted on a board; FIG. 6 is a sectional view taken along the line A-A in FIG. 5;
Fig. 7 is a cross-sectional view showing a conventional solder-free state of components, Fig. 8 is a cross-sectional view showing a conventional floating state of parts, and Fig. 9 is a plan view of a surface-mounted component mounting pad showing a second embodiment of the present invention. 10 are plan views of a surface mount component mounting pad showing a third embodiment of the present invention. 11, 21, 31...Substrate, 12, 22, 32
... Wiring conductor, 13, 23, 33 ... Pad, 1
4... Solder, 15... Surface mount component, 16... Component electrode, 17, 27, 37... Measurement terminal, 18,
28, 38...Terminal lead-out conductor, 19, 29,
39...Slit, 20, 30, 40... Portion on the board where surface mount components are to be mounted.

Claims

[Scope of Claim for Utility Model Registration] In the surface mount component mounting pad structure of a surface mount board on which surface mount components are mounted by soldering, (b) a measurement terminal formed on each of the pads via a lead conductor; (c) a part of the surface mount component electrode is provided on each of the pads; A surface mount component mounting pad structure in which the measurement terminal is placed outside a mounting area of the surface mount component.