JPH03137463A - Heat pump device utilizing waste heat - Google Patents

Abstract

PURPOSE:To reduce a cost and a weight of a heat pump device and enable a cooling lower than an icing point and further an air cooling to be attained by a method wherein a thin film element having a thermo-electrical effect is used, a power generation is carried out in response to a temperature difference between waste heat and a cooling part, the generated electrical power is applied to get a cooling capability through its Peltier effect. CONSTITUTION:A lower corrugated fin 18 is positioned at a heating part 19, and an electrical conductor 14 contacting with the corrugated fin 18 is heated by heat received from a waste heat air. A central corrugated fin 17 is positioned at a heat radiating part 20 and then the electrical conductor 14 contacting with the corrugated fin 17 is cooled. With such an arrangement, the electrical conductor 14 alternately shows a high temperature and a low temperature so as to generate an electromotive force. The generated current is guided to an upper insulation film substrate 11 and an electrical current is flowed to semiconductors 13 and 15 and the electrical conductor 14. Then, either a heating or a thermal absorbing may occur at an interface between the semiconductors 13, 15 and the electrical conductor 14. The corrugated fin 17 alternately contacting with the electrical conductor 14 becomes a cooling part 21 so as to act as a heat pump for absorbing heat from air above the insulation film substrate 11 and discharging heat to a thermal radiation part 20.

Description

[Detailed description of the invention]

INDUSTRIAL APPLICATION FIELD The present invention relates to a heat pump that obtains cooling by using high-temperature air such as exhaust heat or high-temperature waste water.Prior art When exhaust heat is used for cooling, an absorption refrigerator is used. Absorption chiller 1 As shown in Figure 3: Absorber 1,
It consists of a generator 2, a condenser 3, an evaporator 4, a pressure pump 5, and a pressure reducing valve 6. The refrigerant vapor is heated by the condenser 3 to generate high-temperature, high-pressure refrigerant vapor.The refrigerant vapor is liquefied by discarding heat outside the system in the condenser 3.Then, it becomes low-temperature and low-pressure by the pressure reducing valve 6, and receives heat from outside the system in the evaporator 4. is vaporized.The refrigerant in a gaseous state returns to the absorber 1 and is absorbed by the solvent returned from the generator 2.As a medium for absorption refrigerators (the larger one is lithium hydrobromide, Ammonia water is used for small-sized ones.However, the problem to be solved by the invention is that in such conventional absorption refrigerators (1) the entire refrigerator is used at high or low pressure. It becomes a pressure vessel, and requires a large number of pipes for refrigerant and solvent. It is heavy and expensive. (~ Also, if the concentration of lithium bromide is lowered too much, the viscosity will become extremely high.) Air cooling is not possible (t(3) If ammonia-water is used, there may be environmental problems due to leakage. Therefore, it cannot be used for large machines.There are nine problems with the present invention. Means for Solving the Problems The thermoelectric device according to the present invention (component) consists of an N-type semiconductor conductor 1 and a P-type semiconductor conductor 2 on an insulating film substrate. Two sets of thermoelectric elements A and B each having a plurality of thermoelectric circuits in which the ends of each semiconductor/conductor are in electrical contact are installed at a distance, and the conductor 1 of the thermoelectric element A and the conductor of the thermoelectric element B are electrically conductive. A thermal conductor 1 that is in thermal contact with the body 1 and has a flow path for a fluid to be heat exchanged is installed between the thermoelectric elements A and B, and the conductor 2 of the thermoelectric element A or the conductor 2 of the thermoelectric element B is installed between the thermoelectric elements A and B. A thermal conductor 2 having two heat exchange fluid flow paths in thermal contact with one of the thermoelectric elements A is installed on the side of the film substrate that does not have the thermal conductor l;
By electrically connecting B in a closed circuit, the thermoelectric effect is used as a cooling means and a power generation means. Thermoelectric effect (Friend) When a temperature difference is applied to the interface between a metal and a semiconductor, a potential difference is generated due to the Seebeck effect, producing a power generation effect.Also, when a potential is applied to the interface, heat absorption other than Joule heat is generated due to the Peltier effect. Cooling A thin film element with such an effect is used (
＼ Electricity is generated by the Seebeck effect due to the temperature difference between the exhaust heat and the cooling part.1. X. The obtained electric power is used to obtain cooling capacity through the Peltier effect.This effect significantly reduces cost and weight, and also enables safe and cool cooling below the freezing point and air cooling. . Examples Examples according to the present invention will be described below with reference to the drawings. 1st
The figure shows the configuration of a heat pump utilizing waste heat according to an embodiment of the present invention.4 One side of two insulating film substrates 11 and 12 is
type semiconductor 13, conductor 14, P-type semiconductor 15, conductor 1
4 are formed in order. Corrugated fins 16, 17
, 18 are located on the upper or lower surface of the film substrate 11.12, and corrugated fins 16, 17 located on the opposite side,
The conductor 18 is installed so as to contact every other conductor 14 different from the conductor 14 in contact with the conductor 18 . Further, the corrugated fin 17 located in the center has a structure in which it is in contact with both of the two progressive film substrates 11 and 12 located on both sides, and is placed on the 4N type semiconductor 13, the conductor 14, and the P type semiconductor 151.
Even if the structure is such that each end overlaps and the electrical resistance and thermal resistance of the contact area does not increase, the conductor 14 may be made of copper or aluminum, which has low electrical resistance. The corrugated fins 18 located in the heating section 1
The corrugated fins 17 located in the central part are located in the heat dissipation part 20 and cool the conductors 14 in contact with the corrugated fins 17. As a result, the conductor 14 becomes high and low temperature alternately, and an electromotive force can be generated due to the Seebeck effect. The current generated here is guided to the upper insulating film substrate 11, and the semiconductor 13
, 15 and the conductor 14. As a result, the semiconductors 13 and 15 on the insulating film substrate 11 and the conductor 1
At the interface of 4, heat generation or endotherm occurs due to the Peltier effect. At this time, since the N-type semiconductors 13 and the P-type semiconductors 15 are arranged alternately, the conductors 14 alternately become heat generating parts or heat absorbing parts, and as described above, the corrugated fins 16 are in contact with every other conductor 14; Therefore, the cooling section 21 also functions as a heat pump that absorbs heat from the air above the insulating film substrate 11 and radiates the heat to the heat dissipation section 20 . This creates a structure in which the cooling part 21 is cooled by receiving heat from the heating part 19. In this embodiment, the surfaces of the corrugated fins 16, 17, and 18 are flat to improve heat transfer performance with the air. It can be said that the shape makes it easy to process slit fins and louver fins. FIG. 2 is another embodiment of the present invention, showing the configuration of a heat pump device utilizing waste heat.
Semiconductor conductor and corrugated fin 1 on 1 and 12
6 and 18 (the structure is the same as that shown in FIG. Even if the flow path 23 for the fluid to be heat exchanged is formed in the pressure vessel 22, the conductors 14 of the insulating film substrates 11 and 12 are connected to each other.
In addition, even if the corrugated fins 16 and 18 are installed so as to be in thermal contact with a conductor 14 different from the conductor 14 that they are in contact with, this allows the air in contact with the corrugated fins 16 to receive heat from the exhaust heat air. As described above, in the present invention, a heat pump is formed that radiates heat to the fluid flowing through the heat radiating section 20. In addition, it is possible to fabricate the thermoelectric element portion, fin portion, and flow path portion independently and then integrate them.A thermoelectric device that is easy to manufacture and inexpensive is provided.Advantages of the Invention Heat pump equipment (which can significantly reduce cost and weight) is safe, and
Cooling below freezing point and air cooling are possible 4.

[Brief explanation of the drawing]

Fig. 1 is a schematic diagram of a heat pump device using waste heat according to one embodiment of the present invention. Fig. 2 is a schematic diagram of a heat pump device using waste heat according to another embodiment of the present invention. Figure 3 is a conventional absorption type heat pump device using waste heat. It is a block diagram of a refrigerator. 13, 15... Semiconductor & 11.12... Insulating film substrate 14... Conductive 16.17.18... Corrugated fin, 23... Flow resistance

Claims (5)

[Claims] (1) On an insulating film substrate, an N (or P) type semiconductor, a conductor A, and a P (or N) type semiconductor conductor B are placed in this order, and the ends of each semiconductor/conductor are in electrical contact with each other. Two sets of thermoelectric elements A and B each formed with a plurality of circuits are installed at intervals, and are in thermal contact with the conductor A of the thermoelectric element A and the conductor A of the thermoelectric element B, and are connected to a fluid to be heat exchanged. A thermal conductor A having a flow path is installed between thermoelectric elements A and B, and two heat exchange fluids are in thermal contact with either conductor B of thermoelectric element A or conductor B of thermoelectric element B. A heat pump device utilizing waste heat, in which a heat conductor B having a flow path is installed on the side of the film substrate not having the heat conductor A, and thermoelectric elements A and B are electrically connected in a closed circuit. (2) The heat pump device utilizing waste heat according to claim 1, wherein the heat conductor A or B is a fin whose heat exchange fluid is gas. (3) The heat pump device utilizing waste heat according to claim 1, wherein the heat conductor A or B is a pressure vessel whose heat exchange fluid is a liquid or a fluid with a phase change. (4) The exhaust heat utilizing heat pump device according to claim 2, wherein the fins are integrated into a corrugated shape. (5) The exhaust heat utilizing heat pump device according to claim 2, wherein the fins are provided with slits or louvers.