JP2001221583A - Heat pipe for diffusing cold and its installing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat pipe for diffusing cold that performs the transfer of the cold from a Peltier element efficiently and that can be applied to a cooling system with a large capacity and its installing method. SOLUTION: A heat pipe for diffusing cold heat is provided with a plate type container having a hermetically sealed cavity part, a cold source that is thermally connected with a location with high efficiency of diffusing cold and working fluid sealed in the container.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat pipe for diffusing cold heat, such as a heat absorbing portion in a Peltier refrigerator, for use in diffusing cold heat, and a method of installing the same.

[0002]

2. Description of the Related Art Generally, a cooling device based on a refrigeration cycle principle such as an inverted Carnot cycle is used as a cooling device for an electronic cooling device, for example, a refrigerator. In this cooling device, since the refrigerant is circulated using a compressor, the cooling device has a sufficient cooling capacity, but the weight of the device body is increased, accompanied by noise and vibration, and a refrigerant such as Freon is used. Therefore, there is a problem in that the refrigerant easily leaks out of the system due to breakage of the connection portion and adversely affects the environment.

[0003] In order to solve the above problems, a Peltier refrigerator has been proposed. The Peltier refrigerator is a cooling device using a Peltier effect, which is a cooling device using a Peltier effect in which when two kinds of metals are connected and an electric current is applied, one of the joints absorbs heat while the other releases heat. A Peltier element is an element that can transfer heat by passing a current. Peltier elements are widely used in automotive coolers, optical communication semiconductor laser temperature control, and precision semiconductor manufacturing equipment, because Peltier elements can transfer heat without using refrigerants such as Freon. It is used for temperature control, TV cameras for broadcast stations, and the like.

[0004] The principle of the Peltier device will be briefly described. n
When a positive voltage is applied to the lower electrode of the type semiconductor and a negative voltage is applied to the lower electrode of the p-type semiconductor, electrons flow from the upper electrode to the lower electrode in the n-type semiconductor and holes flow in the p-type semiconductor. . Electrons and holes move from the upper part to the lower part, so they take energy at the upper part and release energy at the lower part. As a result, the upper part is cooled and the lower part is heated.

For example, when a DC current is applied to a Peltier element which is a thermoelectric semiconductor, heat is transferred in the direction of the current in the case of a p-type thermoelectric semiconductor, and heat is applied in the direction opposite to the current in the case of an n-type semiconductor. Is carried, and a temperature difference occurs at both ends of the thermoelectric semiconductor. The cooling system using the Peltier element uses the above-mentioned temperature difference to use the low temperature side for cooling and the high temperature side for heat radiation.

[0006] However, the Peltier refrigerator has vibration,
It has the advantage of reducing sound and not using Freon,
When the capacity is small and exceeds a predetermined capacity, it is difficult to sufficiently lower the temperature, and there is a problem that it cannot function as a home-scale refrigerator. Although attempts have been made to solve the above-mentioned problem by arranging an aluminum plate and an aluminum block as a heat sink in contact with the Peltier element, the temperature of a refrigerator having a predetermined capacity cannot be sufficiently reduced.

[0007] On the other hand, the use of heat pipes as cooling means for electronic equipment is widely known. Electronic devices incorporate high-output, highly integrated components such as microprocessors. Microprocessors emit extremely large amounts of heat because they have a very high degree of integration and perform high-speed processing and control of information. .

A heat pipe transfers heat as latent heat of vaporization of a working fluid, and has an apparent thermal conductivity of copper.
Since it is several tens to several hundred times that of a metal such as aluminum, it is used as an extremely excellent heat radiation means. The heat pipes include a round pipe-shaped heat pipe and a planar heat pipe. A flat (plate) heat pipe is preferably used because it can be easily attached to a component to be cooled and a wide contact surface can be obtained. However, an effective combination of a Peltier element and a heat pipe has not yet been proposed.

[0009]

As described above, a cooling system using a Peltier element that does not use Freon, which does not affect the environment without vibration and noise, efficiently transmits cold heat from the Peltier element. This is very important. However, there is a problem that the cooling system has a small capacity due to insufficient transmission of the cooling heat from the Peltier element, cannot provide a sufficient cooling capacity, and is not practical.

Accordingly, an object of the present invention is to provide a heat pipe for cold heat diffusion which can efficiently transmit cold heat from a Peltier element and can be applied to a cooling system having a large capacity, and a method of installing the same. .

[0011]

Means for Solving the Problems In order to solve the above-mentioned conventional problems, the inventors have made intensive studies. As a result, it has been found that when a cold heat source, that is, a Peltier element and a plate-shaped heat pipe are combined, the position where the Peltier element is provided in the plate-shaped heat pipe has a great effect on the transmission of cold from the Peltier element. That is, it is important how the low-temperature side (that is, the cold source) of the Peltier element is diffused into the heat pipe. FIG. 5 shows an example of a heat pipe for cooling and diffusing heat provided with a Peltier element. As shown in FIG. 5, the heat pipes are vertically arranged such that the longitudinal direction is located horizontally. Further, a Peltier element 12 is provided at a central portion of a surface of the heat pipe 10 opposite to the heat input surface 13 of the container 11.

When the plate-type heat pipe provided with the Peltier element 12 at the center of one surface is vertically arranged so that the longitudinal direction is located horizontally, the working fluid sealed in the plate-type heat pipe 10 is provided. Are evaporated by the heat input in the heat absorbing section, and the vapor flow moves to the heat radiating section. The vapor flow that has reached the heat radiating portion condenses and returns to the heat absorbing portion again by gravity or by capillary force of a wick structure provided in the heat pipe.

When a predetermined current flows through the Peltier device provided at the center of the heat pipe, one surface of the Peltier device becomes a heat absorbing side (that is, a cold heat source) and the other surface becomes a heat radiating side. As shown in FIG. 5, since the heat pipe 10 is used in an upright state, the lower side of the Peltier element 12 in the container 11 can diffuse cold heat, but in a portion above the Peltier element, It has been found that the working fluid hardly circulates, and when the heat pipe is used as shown in FIG. 5 with the current wick structure, the diffusion of cold heat is not effectively performed.

On the other hand, as shown in FIG. 1, a Peltier element 3 is provided at the upper end of the surface of the container 2 of the plate type heat pipe 1 having the same wick structure, opposite to the heat input surface 4. It was found that the diffusion of cold heat was effectively performed throughout the heat pipe. That is, when the plate-shaped heat pipe provided with the Peltier element at the upper end of one surface is arranged vertically so that the longitudinal direction is located vertically, the working fluid sealed in the plate-shaped heat pipe will absorb heat. The heat input in the section evaporates, and the vapor flow moves to the heat radiating section. The vapor flow that has reached the heat radiating portion condenses and returns to the heat absorbing portion again by gravity or by capillary force of a wick structure provided in the heat pipe. Furthermore,
When a predetermined current flows through the Peltier element provided at the upper end of the heat pipe, the area below the cold heat source can be made wider, so that the heat pipe uniformity is improved and more efficient cold heat It has been found that diffusion is possible.

The present invention has been made based on the above findings and the like, and a first aspect of the heat pipe for cold heat diffusion of the present invention is a heat pipe for cold heat diffusion provided with the following members. (1) a plate-shaped container having a closed cavity, (2)
(3) a working fluid sealed in the container, the cooling source being thermally connected to a portion of the container having high cooling / diffusion efficiency;

The second embodiment of the heat pipe for cold / hot diffusion according to the present invention
The aspect of the invention is a heat diffusion heat pipe in which the portion of the container having a high thermal diffusion efficiency is near the end.

The third embodiment of the heat pipe for cooling and diffusing heat of the present invention
In the aspect, the end portion is formed of a convex portion, and the cold heat source is a heat pipe for cooling and diffusing provided in the convex portion.

The fourth embodiment of the heat pipe for cooling and diffusing heat of the present invention
In the aspect, the container is an L-shaped container, and the cold heat source is a heat pipe for cold heat diffusion provided at one end of the container.

A first aspect of the method for installing a heat pipe for cold diffusion according to the present invention includes (1) a plate type container having a closed cavity, and (2) a cold heat source provided at an end of the container. And (3) a plate-shaped heat pipe provided with a working fluid sealed in the container such that the end of the container provided with the cold heat source is located on an upper side.
A method for installing a heat pipe for cooling and diffusing the heat pipe.

According to a second aspect of the method of installing a heat pipe for cold diffusion of the present invention, the end of the container is formed of a convex portion, and the cold heat source is provided on the convex portion. This is a method for installing a heat pipe for cold diffusion.

According to a third aspect of the method of installing a heat pipe for cooling and diffusing heat of the present invention, the container is an L-shaped container, and the end is a vertical end of the L-shaped container. And the cold heat source is a method for installing a heat pipe for cold heat diffusion provided at the end in the vertical direction.

According to a fourth aspect of the method of installing a heat pipe for cooling and diffusing heat of the present invention, the container is disposed so that a longitudinal direction thereof is vertical, and the end is a vertical end. The cold heat source is a method of installing a heat pipe for cold heat diffusion provided at the end in the vertical direction.

[0023]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing a heat pipe for cooling and diffusing heat according to the present invention;
The heat diffusion heat pipe of the present invention is a plate-shaped container having a closed cavity, and a part of the surface of the container, that is, a cold heat source such as a Peltier element provided in a portion having a high heat diffusion efficiency, and , A working fluid sealed in the container. Further, a wick structure provided in the container or provided on the inner wall of the container may be provided.

That is, in the heat diffusion heat pipe of the present invention, a Peltier element capable of transferring heat by passing an electric current is provided on a part of one surface forming the plate-type heat pipe. I have. As the heat pipe, a conventionally used heat pipe can be used. The Peltier element is a device in which n-type and p-type heat semiconductors are alternately arranged, and adjacent thermoelectric semiconductors are alternately connected in a π shape or an inverted π shape by upper and lower electrodes.

That is, the n-type semiconductor, the p-type semiconductor and the electrode are combined one by one and are the smallest Peltier elements. By repeating this unit, a module having a predetermined size can be formed. As a semiconductor material, it has excellent performance at room temperature.
For the tellurium-based compound semiconductor, and for the p-type, a bismuth-antimony-tellurium-based compound semiconductor is used. The Peltier element is provided on one surface of the heat pipe in such a manner that the Peltier element is tightly fixed by screwing or the like via grease having good thermal conductivity.

As the working fluid for the heat pipe, it is preferable to use pentane, carbon dioxide or the like. Since water may freeze, it is not preferable as a working fluid for the heat pipe of the present invention. As the material of the plate-type heat pipe, commonly used copper, copper alloy, aluminum, aluminum alloy and the like can be used. A wick or the like may be arranged in the container to facilitate the reflux of the working fluid. Further, a wick structure such as a groove may be formed on the inner wall of the container.

FIG. 2 is a diagram schematically showing one embodiment of the heat pipe for cold / diffusion of the present invention. In the heat pipe for cooling and diffusing heat of the present invention, the above-mentioned portion of the container having high cooling and heat diffusing efficiency, that is, the connection surface with the Peltier element is formed by an end. Further, in the heat pipe for cooling and diffusing heat of the present invention, the above-mentioned end portion is formed of a convex portion, and the Peltier element is provided on the convex portion. Further, in the heat pipe for cooling and diffusing heat of the present invention, the container is an L-shaped container, and the Peltier element is provided at one end of the container.

As shown in FIG. 1, if the Peltier element is provided at the upper end of the surface opposite to the heat input surface of the plate type heat pipe of the present invention, the diffusion of cold heat is effective over the entire heat pipe. Done in That is, the Peltier element is 1
When the plate-type heat pipe provided at the upper end of the two surfaces is vertically arranged such that the longitudinal direction is located vertically, the working fluid sealed in the plate-type heat pipe causes the heat input into the heat absorbing section to be increased. And the vapor flow moves to the heat radiating section. The vapor flow that has reached the heat radiating portion condenses and returns to the heat absorbing portion again by gravity or by capillary force of a wick structure provided in the heat pipe.

Further, when a predetermined current flows through the Peltier element provided at the upper end of the heat pipe, the area below the cold heat source can be made wider, so that the heat pipe has improved heat uniformity. More efficient cold-heat diffusion becomes possible. Note that by controlling the current flowing through the Peltier element, temperature control can be easily performed.

Next, a description will be given of an installation method of the heat pipe for cooling and diffusing heat according to the present invention, in which the efficiency of cooling and diffusing the heat pipe is increased. That is, in the method for installing a heat pipe of the present invention, a plate-shaped container having a closed cavity, a Peltier element as a cold heat source provided at a part of the end of the surface of the container, and The heat pipe is provided so that the end of the container provided with the Peltier element is located on the upper side. The heat pipe may further include a wick structure installed in the container or provided on an inner wall of the container.

When a heat pipe for cooling and diffusing heat according to the present invention is provided with a Peltier element at a part of the surface of the heat pipe and the heat pipe is arranged so that the end is located on the upper side, the area below the cold heat source is widened. Since the diffusion of cold heat is effectively performed over the entire heat pipe, the uniformity of the heat pipe is improved, and more efficient cold heat diffusion is enabled.

In particular, when the above-mentioned end portion of the container is formed of a convex portion and the Peltier element is provided in the convex portion, the area below the heat source can be further widened, Since the diffusion of cold heat is effectively performed throughout the heat pipe, the uniformity of the heat pipe is improved,
More efficient cold-heat diffusion becomes possible. As shown in FIG. 3, both sides of the upper end portion of the heat pipe for cooling and diffusing are removed to provide a protruding portion. In this case,
Except for the convex portion provided with the Peltier element as the cold heat source, all of them are located below the Peltier element, and the area below the cold heat source can be further secured.

Further, a heat pipe having a predetermined shape can be used by applying to the internal arrangement of the Peltier refrigerator. That is, in the heat pipe installation method according to the present invention, the container is an L-shaped container, and the end is a vertical end of the L-shaped container. Direction end. That is, as shown in FIG. 4, the plate-type heat pipe is bent at a substantially right angle at the center, and a Peltier element is installed at the upper end of the vertical portion. The horizontal part can be used as a heat input surface. Also in this case, the cold heat source such as the Peltier element is located at the upper end of the heat pipe, and secures a wider area below the cold heat source. Furthermore, in the heat pipe installation method of the present invention, the container is arranged so that its longitudinal direction is vertical, the end is a vertical end, and the Peltier element is provided at the vertical end. ing. That is, the container is used so that its longitudinal direction is vertical, and a cold heat source such as a Peltier element is arranged at the upper end of the container, so that a region below the cold heat source can be widely secured. A typical example of the cold heat source is a Peltier element, but other cool heat sources can also be used.

[0034]

EXAMPLE 1 According to one of the methods of the invention, 200 mm long × 100 mm wide.
An aluminum plate-type container having a size of 6 mm x 6 mm was prepared, and a mesh wick was arranged in the container. The mesh-like wick closed one end of the container disposed therein by welding, left a part of the other end of the container as an unwelded part, and closed the other part by welding. . Using the unwelded portion of the container thus prepared, pentane is injected as a working fluid and air as a non-condensable gas is degassed, and the unwelded portion that has been injected and degassed is temporarily sealed. After stopping, welding was performed, and an unwelded portion was closed to prepare a plate-type heat pipe.

Next, the plate-shaped heat pipe prepared as described above is arranged so that the longitudinal direction thereof is located in the vertical direction, and heat is applied to the upper end of one surface of the plate-shaped heat pipe as shown in FIG. The pipe was provided such that the upper end of the pipe and the upper end of the Peltier element substantially coincided with each other. Peltier element is 40m long
The size is mx 40 mm in width, and the semiconductor is composed of an n-type semiconductor and a p-type semiconductor made of ceramics.

As described above, the heat input surface of the heat pipe for cooling and diffusing heat according to the present invention, in which the Peltier element is provided at the upper end, is provided.
Heat of 10 W (40 W in total) was placed at each corner, a predetermined current was applied to the Peltier device, and the state in which the above-described heat was transported to the Peltier device as a cold heat source was examined. The evaluation was performed by measuring the temperature difference between the vicinity of the cold heat source and the upper end of the heat pipe, and the temperature difference between the vicinity of the cold heat source and the lower end of the heat pipe. As a result, the temperature difference between the vicinity of the cold heat source and the upper end of the heat pipe was 2.6 ° C., and the temperature difference between the vicinity of the cold heat source and the lower end of the heat pipe was 2.
At 4 ° C., it can be seen that cold heat is diffused over the entire surface of the heat pipe. That is, since the Peltier element is provided at the upper end of the surface opposite to the heat input surface of the plate-type heat pipe, the heat absorbing side of the Peltier element is located at the upper end of the heat pipe, and at the upper end of the heat pipe. Cold heat was efficiently transmitted to the evaporating flow of the working fluid located therein, and effective cooling was performed over the entire area of the heat pipe together with the working fluid circulating in the heat pipe.

For comparison, 200 mm long × 100 m wide
An aluminum plate-shaped container having a size of mx 6 mm was prepared, and a mesh-shaped wick was arranged in the container. The mesh-like wick closed one end of the container disposed therein by welding, left a part of the other end of the container as an unwelded portion, and closed the other portion by welding. Injecting pentane as a working fluid and degassing air that is a non-condensable gas using the unwelded portion of the container thus prepared,
Apply temporary sealing to the unwelded part that has been injected and degassed,
Welding was performed, and the unwelded portion was closed to prepare a plate-type heat pipe.

Next, the plate heat pipe prepared as described above was arranged so that its longitudinal direction was located in the vertical direction, and a Peltier element was provided at the center of one surface of the plate heat pipe. Peltier element is 40mm long x 40m wide
With a size of m, the semiconductor is composed of an n-type semiconductor and a p-type semiconductor made of ceramics.

As described above, heat of 10 W (a total of 40 W) is arranged at each of the four corners of the heat input surface of the comparative heat-diffusion heat pipe provided with the Peltier element at the center thereof, and a predetermined current is supplied to the Peltier element. To check the state in which the above-mentioned heat is transported to the Peltier element as the cold heat source. The evaluation was performed by measuring the temperature difference between the vicinity of the cold heat source and the upper end of the heat pipe, and the temperature difference between the vicinity of the cold heat source and the lower end of the heat pipe. As a result, the temperature difference between the vicinity of the cold heat source and the upper end of the heat pipe was 9.3 ° C.
The temperature difference between the vicinity of the cold heat source and the lower end of the heat pipe is 2.4 ° C., and in the comparative example in which the Peltier element as the cold heat source is provided at the center of the heat pipe, the temperature difference is up to the upper side of the heat pipe. It turns out that cold heat is not transmitted. That is, although the cooling heat from the Peltier element can be diffused below the portion where the heat absorbing side of the Peltier element is located, the diffusion of the cold heat from the Peltier element above the portion where the heat absorbing side of the Peltier element is located, It was limited to those that propagated through the material and was not effectively performed. In addition, the working fluid in the heat pipe was not sufficiently recirculated above the portion on the heat absorption side of the Peltier element, and effective cooling over the entire heat pipe was not performed.

Example 2 According to another method of the present invention, 200 mm in length × 1 in width
A container was prepared in which a central portion of one end of a 00 mm × 6 mm thick aluminum plate-shaped container protruded in a convex shape having a width of 50 mm × a height of 50 mm, and a mesh wick was arranged in the container. The mesh-like wick closed one end of the container disposed therein by welding, left a part of the other end of the container as an unwelded part, and closed the other part by welding. . Using the unwelded portion of the container thus prepared, pentane is injected as a working fluid and air as a non-condensable gas is degassed, and the unwelded portion that has been injected and degassed is temporarily sealed. After stopping, welding was performed, and an unwelded portion was closed to prepare a plate-type heat pipe.

Next, the plate-shaped heat pipe prepared as described above is arranged so that its longitudinal direction is located in the vertical direction, and one side of the protruding portion of the plate-shaped heat pipe is shown in FIG. As described above, the upper end of the heat pipe and the upper end of the Peltier element are provided so as to substantially coincide with each other. The Peltier device has a size of 40 mm in length × 40 mm in width, and the semiconductor is made of an n-type semiconductor and a p-type semiconductor made of ceramics.

With respect to the heat pipe for cooling and diffusing according to the present invention in which the Peltier element is provided in the convex portion as described above,
In the same manner as in Example 1, heat of 10 W (total of 40 W) was placed at each of the four corners of the heat input surface of the heat pipe for cold heat diffusion, a predetermined current was passed through the Peltier element, and the above-mentioned heat was used as the cold heat source. The state of being transported to the Peltier device was examined. As a result, the temperature difference between the vicinity of the cold heat source and the upper end of the heat pipe was 2.5 ° C., and the temperature difference between the vicinity of the cold heat source and the lower end of the heat pipe was 2.4 ° C. It can be seen that the heat is diffused over the entire surface. That is, since the Peltier element is provided on one surface of the protruding portion of the plate-shaped heat pipe, the heat absorbing side of the Peltier element is located at the uppermost end of the heat pipe, and the uppermost end of the heat pipe , The cold heat was efficiently transmitted to the evaporating flow of the working fluid, and more effective cooling was performed over the entire area of the heat pipe together with the working fluid circulating in the heat pipe.

Example 3 According to one of the methods of the present invention, 200 mm long × 100 wide.
An L-shaped container made of aluminum having a size of 6 mm and a thickness of 6 mm and bent at a substantially right angle in the center was prepared, and a mesh-like wick was arranged in the container. The mesh-like wick closed one end of the container disposed therein by welding, left a part of the other end of the container as an unwelded part, and closed the other part by welding. . Using the unwelded portion of the container thus prepared, pentane is injected as a working fluid and air as a non-condensable gas is degassed, and the unwelded portion that has been injected and degassed is temporarily sealed. After stopping, welding was performed, and an unwelded portion was closed to prepare a plate-type heat pipe.

Next, the plate-shaped heat pipe prepared as described above is arranged so that one part of the L-shape is located vertically and the other part is placed horizontally, and one of the vertical parts of the plate-shaped heat pipe is placed. As shown in FIG. 4, the upper end of the heat pipe and the upper end of the Peltier device were provided at the upper end of the surface of the Peltier element. Peltier element is 40mm long x 40mm wide
The semiconductor is composed of an n-type semiconductor and a p-type semiconductor made of ceramics.

As described above, the heat pipe for cooling and diffusing heat according to the present invention in which the Peltier element is provided in the protruding portion,
In the same manner as in Example 1, heat of 10 W (total of 40 W) was placed at each of the four corners of the heat input surface of the heat pipe for cold heat diffusion, a predetermined current was passed through the Peltier element, and the above-mentioned heat was used as the cold heat source. The state of being transported to the Peltier device was examined. As a result, the temperature difference between the vicinity of the cold heat source and the upper end of the heat pipe was 2.6 ° C., the temperature difference between the vicinity of the cold heat source and the lower end of the heat pipe was 2.4 ° C. It can be seen that the heat is diffused over the entire surface. That is, since the Peltier element is provided at the upper end of one surface of the vertical portion of the plate-type heat pipe, the heat absorbing side of the Peltier element is located at the upper end of the heat pipe and located at the upper end of the heat pipe. Cold heat was efficiently transmitted to the evaporating flow of the working fluid, and effective cooling was performed over the entire area of the heat pipe together with the working fluid circulating in the heat pipe. Further, by using a heat pipe having such a shape, it is possible to cope with heat absorbing portions of various shapes such as a Peltier refrigerator, and the range of application is expanded.

[0046]

According to the method of the present invention, a Peltier element is provided at a portion of the heat pipe, which is an extremely excellent heat conducting means, for efficiently transmitting the heat from the Peltier element. It is possible to provide a heat pipe for cooling and diffusing heat and a method of installing the heat pipe, which can efficiently transmit the heat and can be applied to a cooling system having a large capacity, and has high industrial utility value.

[Brief description of the drawings]

FIG. 1 is a conceptual diagram for explaining a heat pipe for cooling and diffusing heat of the present invention and a method of installing the heat pipe.

FIG. 2 is a view schematically showing one embodiment of a heat pipe for cold heat diffusion of the present invention.

FIG. 3 is a view schematically showing another embodiment of the heat pipe for cold / hot diffusion according to the present invention.

FIG. 4 is a diagram schematically showing still another embodiment of the heat pipe for cold / diffusion of the present invention.

FIG. 5 is a diagram illustrating a positional relationship between a heat pipe and a Peltier device.

[Explanation of symbols]

 1 Heat pipe for cold diffusion 2 Container 3 Peltier element 4 Heat input surface 10 Heat pipe for cold diffusion 11 Container 12 Peltier element 13 Heat input surface

Claims (8)

[Claims] 1. A heat pipe for cooling and diffusing heat provided with the following members: (1) a plate-shaped container having a closed cavity; (2)
(3) a working fluid sealed in the container, the cooling source being thermally connected to a portion of the container having high cooling / diffusion efficiency; 2. A heat diffusion heat pipe according to claim 1, wherein said portion of said container having a high heat diffusion efficiency has an end portion. 3. The heat pipe according to claim 2, wherein said end portion is formed of a convex portion, and said cold heat source is provided on said convex portion. 4. The cold-heat diffusion device according to claim 2, wherein the container is an L-shaped container, and the cold heat source is provided at one end of the container. heat pipe. 5. A (1) plate-shaped container having a closed cavity, (2) a cold heat source provided near an end of the container, and (3) a working fluid sealed in the container. A method for installing a heat pipe, wherein the heat pipe is installed such that the end of the container provided with the cold heat source is located on an upper side. 6. The installation of a heat pipe according to claim 5, wherein the end of the container is formed of a convex portion, and the cold heat source is provided on the convex portion. Method. 7. The container is an L-shaped container, the end is a vertical end of the L-shaped container, and the cold heat source is located near the vertical end. The heat pipe installation method according to claim 5, wherein the heat pipe is provided. 8. The container is arranged so that its longitudinal direction is vertical, the end is a vertical end, and the cold heat source is provided near the vertical end. The method for installing a heat pipe according to claim 5, wherein: