JPH03129847A - Ic inspecting jig - Google Patents

Abstract

PURPOSE:To contrive the improvement of the precision of an inspection without making an artificial mistake interpose by a method wherein an IC inspecting jig is provided with connecting pins, which are moved by leads to protrude from the outer frame body of an IC, and a substrate adhered with a conductive material which is short-circuited or opened by these pins. CONSTITUTION:An IC 3 is stepped in the direction shown by an arrow, the IC 3 is loaded on the surface, which is an insulating material, of a substrate 1 while leads of the IC 3 are inserted in insertion holes of the substrate 1, the IC 3 is pressed to the direction shown by the arrow and the points of the leads are brought into contact to connecting pins 2 at a contact pressure to correspond to the amount of a margin to shrink plungers 2b and springs 2c of the pins 2. Here, if the leads of the IC 3 all exist, the plungers 2b of all the pins 2 are isolated from the conductive material of the substrate 1 and a continuity results in not existing between first and second wirings 4 and 5. In case a lead does not exist, the plunger 2b, which exist at a place where the lead does not exist, of a pogo pin 2 is remained as it is made to ascend and a continuity exists between the wirings 4 and 5. Thereby, an artificial mistake is eliminated and the precision of an inspection can be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an IC inspection jig, and more particularly to an IC lead inspection jig for detecting the presence or absence of an IC lead.

[Conventional technology]

Conventionally, it has been necessary to visually inspect an IC by a worker to determine whether the IC leads are normally present or not. The worker turned the IC over, inspected whether the lead was in accordance with the regulations, and made a judgment as to whether the IC was good or bad.

[Problem to be solved by the invention]

With the conventional inspection method described above, operators may make mistakes,
There are disadvantages in that oversights occur due to assumptions and fatigue, rejecting products are passed on to the next process, and defective products are assembled in the subsequent process.

Our objective is to provide an IC inspection jig.

[Means to solve the problem]

The inspection jig of the present invention has a large number of insertion holes into which leads protruding from the outer body of an IC are inserted, and is arranged in correspondence with a substrate on which a conductive material is pasted on the negative side and the insertion holes. , comprising a bogo pin whose plunger protrudes or retracts, and the plunger of the bogo pin is retracted from the lead of the IC to bring the conductive material of the board into contact with the bogo pin or to separate them from each other. There is.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIGS. 1(a) and 1(b) show an embodiment of the present invention.
It is a sectional view of C inspection jig. This IC inspection jig is the first
As shown in the figure, a substrate 1 is formed with a large number of insertion holes corresponding to the leads of the IC 3, the surface facing the IC 3 is made of an insulating material, and the opposite surface is made of a conductive material. A large number of bogo pins 2 arranged at positions corresponding to the insertion holes on the conductive material side of the substrate 1, a first wiring 4 connected to the conductive material of the substrate 1, and a large number of bogo pins 2 are connected in series. It is composed of a second wiring 5. Further, the bogo pin 2 includes a plunger 2b inserted into a sleeve 2a via a spring 2c.

Next, a method for inspecting the presence or absence of leads of the IC3 using this IC inspection jig will be described. First, as shown in FIG. 1(a), advance the IC3 in the direction of arrow 6, insert the IC3 lead into the insertion hole of the board L, and insert the IC3 into the board 1.
Loaded onto a surface that is an insulating material. Next, as shown in FIG. 1(b), IC3□ is pressed in the direction of arrow 6. As a result, the tip of the lead of the IC 3 contacts the plunger 2b of the bogo pin 2 with a contact pressure equal to the contraction of the spring 2a. Here, if all the leads of IC3 are present, the plungers 2b of all the bogo pins 2 are separated from the conductive material of the board 1, so there is no conduction between the first wiring 4 and the second wiring 5. It turns out.

For example, if there is no lead indicated by the dotted line as shown in FIG. 1(a), the plunger 2b of the bogo pin 2 where there is no lead remains raised as shown in FIG. 1(b). It will come into contact with the conductive material of the substrate 1, and the first
The wiring 4 and the second wiring 5 are electrically connected.

In this way, the presence or absence of an IC lead can be determined based on the presence or absence of electrical continuity, which not only eliminates human error but also has the advantage of being applicable to automatic testing.

FIG. 2 is a sectional view of an IC inspection jig showing another embodiment of the present invention, FIG. 3 is a plan view of the first substrate in FIG. 2, and FIG. 4 is a plan view of the second substrate in FIG. 2. FIG. As shown in FIG. 2, this IC inspection jig has a second substrate
, was established. Moreover, the first substrate 1. This is different from the substrate of the previous embodiment in that, as shown in FIG. 3, a two-way conductive material is pasted along the periphery of the insertion hole.

Furthermore, the second substrate l is pasted with a line of conductive material running across the insertion hole, as shown in FIG.

In this way, by providing two substrates on which conductive material patterns are formed, for example, when the IC3 is inserted,
If IC3 does not have at least one lead, plunger 2 of bogo pin 2 at that location. remains elevated and the first substrate l.

Two series of conductive materials are connected to the bogo pin plunger 2. Short-circuited at the tip. Also, since the plunger of this bogo pin remains raised, the second board 1. The second substrate 1. is spaced apart from the conductive material of the second substrate 1. The conductive material in the example is in a disconnected state. This means that if even one lead is missing in the IC 3, the wirings 4 and 9 will be electrically connected, and the wirings 7 and 8 will be non-conductive. Moreover, the opposite indicates that the number of leads of IC3 is normal.

This embodiment has the advantage that by providing a second board and adding a determination means, a more accurate inspection jig can be obtained compared to the above-mentioned embodiments.

〔Effect of the invention〕

As explained above, the present invention provides a bogo pin that is moved by a lead protruding from the outer body of the IC, and a board on which a conductive material is attached that is short-circuited or opened by the bogo pin. Since the presence or absence of electrical conduction can be determined by the presence or absence of electrical continuity, there is an effect that a more accurate IC inspection jig can be obtained without human error.

[Brief explanation of the drawing]

FIGS. 1(a) and 1(b) show an IC showing an embodiment of the present invention.
FIG. 2 is a sectional view of an IC inspection jig showing another embodiment of the present invention, FIG. 3 is a plan view of the first substrate in FIG. 2, and FIG. FIG. 3 is a plan view of the second substrate shown in the figure. l...Substrate, 1. ...First substrate, 1
．． ...Second board, 2...Bogo pin,
2. ...Sleeve, 2. ...Plunger, 2c...Spring, 3...IC
. 4.5,7,8.9...Wiring, 6...
arrow.

Claims (1)

[Claims] A board having a large number of insertion holes into which leads protruding from the outer body of the IC are inserted, and a conductive material is pasted on one surface;
A bogo pin is arranged corresponding to the insertion hole and has a plunger that protrudes or retracts, and the plunger of the bogo pin is retracted from the lead of the IC to bring the conductive material of the board into contact with the bogo pin. An IC inspection jig that is characterized by being able to separate the parts from each other.