JPH03104746U - - Google Patents
Info
- Publication number
- JPH03104746U JPH03104746U JP1990012912U JP1291290U JPH03104746U JP H03104746 U JPH03104746 U JP H03104746U JP 1990012912 U JP1990012912 U JP 1990012912U JP 1291290 U JP1291290 U JP 1291290U JP H03104746 U JPH03104746 U JP H03104746U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- resin
- semiconductor device
- lead terminal
- external lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Description
第１図は半導体装置の樹脂モールドする型キヤ
ビテイー内の配設した状態の断面図、第２図は樹
脂モールドされた半導体装置の側面図、第３図は
完成した半導体装置を冷却フインへ取り付けた状
態の一部断面図、第４図は従来技術による半導体
装置の断面図である。
半導体ペレツト……２、放熱板……１、外部リ
ード端子……３、突出部（ピン）……１０。
Figure 1 is a cross-sectional view of the semiconductor device placed inside the resin-molded mold cavity, Figure 2 is a side view of the resin-molded semiconductor device, and Figure 3 is the completed semiconductor device attached to the cooling fin. FIG. 4 is a sectional view of a semiconductor device according to the prior art. Semiconductor pellet...2, heat sink...1, external lead terminal...3, protrusion (pin)...10.
Claims (1)
板の一端に連続される外部リード端子と、前記半
導体ペレツト、前記放熱板および外部リード端子
に連続する前記放熱板を覆う樹脂とを有する樹脂
封止型半導体装置において、前記放熱板を覆う樹
脂面に対して立設する突出部を設けたこを特徴と
する樹脂封止型半導体装置。 A resin seal comprising a heat sink on which a semiconductor pellet is placed, an external lead terminal continuous to one end of the heat sink, and a resin covering the heat sink continuous to the semiconductor pellet, the heat sink, and the external lead terminal. 1. A resin-sealed semiconductor device, characterized in that the resin-sealed semiconductor device is provided with a protrusion that stands up from a resin surface covering the heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990012912U JPH03104746U (en) | 1990-02-13 | 1990-02-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990012912U JPH03104746U (en) | 1990-02-13 | 1990-02-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03104746U true JPH03104746U (en) | 1991-10-30 |
Family
ID=31516357
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990012912U Pending JPH03104746U (en) | 1990-02-13 | 1990-02-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03104746U (en) |
-
1990
- 1990-02-13 JP JP1990012912U patent/JPH03104746U/ja active Pending