JPH01176928U - - Google Patents
Info
- Publication number
- JPH01176928U JPH01176928U JP7467388U JP7467388U JPH01176928U JP H01176928 U JPH01176928 U JP H01176928U JP 7467388 U JP7467388 U JP 7467388U JP 7467388 U JP7467388 U JP 7467388U JP H01176928 U JPH01176928 U JP H01176928U
- Authority
- JP
- Japan
- Prior art keywords
- cavities
- resin
- heater
- temperature sensor
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は、本考案の半導体・集積回路素子を樹
脂封止する際に使用する金型の１チエイスの断面
図で、第２図は、その平面図である。第１図、第
２図とも上金型と下金型の１チエイスの図である
。一方、第３図は、従来の樹脂封止する際に使用
する金型の１チエイスの断面図で、第４図は、そ
の平面図である。第３図、第４図とも上金型と下
金型の１チエイスの図である。又、第５図、第６
図は、第１図、第２図の応用を示した、上金型と
下金型の１チエイスの図である。
１……チエイス、２……キヤビテイ、３……ヒ
ーター、４……温度センサー。
FIG. 1 is a cross-sectional view of one die used for resin-sealing the semiconductor/integrated circuit element of the present invention, and FIG. 2 is a plan view thereof. Both FIG. 1 and FIG. 2 are views of the upper mold and the lower mold. On the other hand, FIG. 3 is a cross-sectional view of one die used for conventional resin sealing, and FIG. 4 is a plan view thereof. Both FIGS. 3 and 4 are views of the upper mold and the lower mold. Also, Figures 5 and 6
The figure is a one-shot diagram of an upper mold and a lower mold, showing an application of FIGS. 1 and 2. 1... Chase, 2... Cavity, 3... Heater, 4... Temperature sensor.
Claims (1)
る金型の、１チエイスに複数のキヤビテイが設け
られ、この複数のキヤビテイの各々毎にヒーター
と温度センサーが付いていることを特徴とする樹
脂封止装置。 A mold used for resin-sealing semiconductor/integrated circuit elements, wherein a plurality of cavities are provided in one die, and each of the plurality of cavities is equipped with a heater and a temperature sensor. Stop device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7467388U JPH01176928U (en) | 1988-06-03 | 1988-06-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7467388U JPH01176928U (en) | 1988-06-03 | 1988-06-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01176928U true JPH01176928U (en) | 1989-12-18 |
Family
ID=31299773
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7467388U Pending JPH01176928U (en) | 1988-06-03 | 1988-06-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01176928U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020129728A1 (en) * | 2018-12-21 | 2020-06-25 | 第一精工株式会社 | Resin molding mold and resin molding method |
| JP2020100140A (en) * | 2018-12-21 | 2020-07-02 | 第一精工株式会社 | Resin molding mold and resin molding method |
-
1988
- 1988-06-03 JP JP7467388U patent/JPH01176928U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020129728A1 (en) * | 2018-12-21 | 2020-06-25 | 第一精工株式会社 | Resin molding mold and resin molding method |
| JP2020100140A (en) * | 2018-12-21 | 2020-07-02 | 第一精工株式会社 | Resin molding mold and resin molding method |