JPS62128636U - - Google Patents
Info
- Publication number
- JPS62128636U JPS62128636U JP1588686U JP1588686U JPS62128636U JP S62128636 U JPS62128636 U JP S62128636U JP 1588686 U JP1588686 U JP 1588686U JP 1588686 U JP1588686 U JP 1588686U JP S62128636 U JPS62128636 U JP S62128636U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- heat dissipation
- sealed
- molded
- electrode lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図ａ，ｂはこの考案の一実施例を示す半導
体装置の平面図および側面図、第２図ａ，ｂは従
来の樹脂封止形半導体装置の平面図および側面図
である。
図において、１は半導体チツプ、２は放熱フイ
ン、３は電極リード端子、５はモールド樹脂、６
は金型固定用支持部、７は金型固定用のピン穴で
ある。なお、各図中の同一符号は同一または相当
部分を示す。
1A and 1B are a plan view and a side view of a semiconductor device showing an embodiment of this invention, and FIGS. 2A and 2B are a plan view and a side view of a conventional resin-sealed semiconductor device. In the figure, 1 is a semiconductor chip, 2 is a heat radiation fin, 3 is an electrode lead terminal, 5 is a molded resin, and 6 is a heat dissipation fin.
7 is a support part for fixing the mold, and 7 is a pin hole for fixing the mold. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
ぼ全面と、電極リード端子の一部をモールド樹脂
で成形封止した樹脂絶縁形半導体装置において、
前記電極リード端子が設けられた側と反対側の前
記放熱フインの端部の中央部にモールド樹脂の封
止が行われない金型固定用支持部を設けてモール
ド成形したことを特徴とする半導体装置。 In a resin-insulated semiconductor device in which almost the entire surface of the heat dissipation fin to which the semiconductor chip is attached and a part of the electrode lead terminal are molded and sealed with mold resin,
A semiconductor characterized in that a mold fixing support portion, which is not sealed with mold resin, is provided in the center of the end of the heat dissipation fin on the side opposite to the side where the electrode lead terminal is provided, and the semiconductor is molded. Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1588686U JPS62128636U (en) | 1986-02-04 | 1986-02-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1588686U JPS62128636U (en) | 1986-02-04 | 1986-02-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62128636U true JPS62128636U (en) | 1987-08-14 |
Family
ID=30807232
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1588686U Pending JPS62128636U (en) | 1986-02-04 | 1986-02-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62128636U (en) |
-
1986
- 1986-02-04 JP JP1588686U patent/JPS62128636U/ja active Pending