JPH0278171A - male connector - Google Patents
male connectorInfo
- Publication number
- JPH0278171A JPH0278171A JP63229512A JP22951288A JPH0278171A JP H0278171 A JPH0278171 A JP H0278171A JP 63229512 A JP63229512 A JP 63229512A JP 22951288 A JP22951288 A JP 22951288A JP H0278171 A JPH0278171 A JP H0278171A
- Authority
- JP
- Japan
- Prior art keywords
- base
- contact
- male connector
- connector
- shaped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
- H01R13/035—Plated dielectric material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/10—Sockets for co-operation with pins or blades
- H01R13/11—Resilient sockets
- H01R13/112—Resilient sockets forked sockets having two legs
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔概 要〕
高密度のコネクタに係り、特にコンタクトの配列ピッチ
が小さくかつ低コストで製造が可能な表面実装用の雄側
のコネクタに関し、
絶縁基体上に導電性樹脂のコンタクト領域をダブルモー
ルド成形することにより部品点数を削減し、かつ高密度
・高精度なコンタクト配列を有する表面実装用の雄コネ
クタを提供することを目的とし、
めっき不能樹脂の成形品よりなり、プリント板に搭載さ
れる基部と、該基部から上側へ突出して相手側の雌コネ
クタに嵌入される挿入部とからなる横断面が略逆丁字形
の棒状の絶縁基体と、該絶縁基体の外周を取り巻いて複
数の帯状コンタクト領域がめつき可能樹脂のダブルモー
ルドにより所定ピッチで形成され、該コンタクト領域に
は金属がめっきにより被着された構成である。[Detailed Description of the Invention] [Summary] It relates to high-density connectors, especially surface-mount male connectors that have a small contact arrangement pitch and can be manufactured at low cost. The purpose of this connector is to reduce the number of parts by double-molding the contact area of the connector, and to provide a male connector for surface mounting that has a high-density and high-precision contact arrangement. A rod-shaped insulating base with a substantially inverted T-shaped cross section, consisting of a base mounted on a printed board and an insertion part that protrudes upward from the base and is fitted into a mating female connector; A plurality of surrounding band-shaped contact areas are formed at a predetermined pitch by double molding of a plateable resin, and metal is deposited on the contact areas by plating.
本発明は高密度のコネクタに係り、特にコンタクトの配
列ピッチが小さくかつ低コストで製造が可能な表面実装
用の雄側のコネクタに関する。The present invention relates to a high-density connector, and particularly to a surface-mount male connector that has a small contact arrangement pitch and can be manufactured at low cost.
電子装置の高密度化に伴い、プリント板に搭載するコネ
クタの端子数が増大し高密度化しつつあり、このため搭
載するプリント板に端子挿入用のスルーホールを設けず
プリント板表面の接続用バンドにコネクタの端子部を直
接半田付けする表面実装が多用されるようになった。こ
のようなコネクタを安価に提供することが要求されてい
る。With the increasing density of electronic devices, the number of terminals of connectors mounted on printed boards is increasing and the density is increasing, and for this reason, the printed boards to be mounted do not have through holes for terminal insertion, and connecting bands on the surface of the printed boards are used instead. Surface mounting, in which the terminals of the connector are directly soldered, has come to be widely used. There is a demand for providing such connectors at low cost.
従来の一般的な高密度表面実装用の雄側のコネクタを、
第4図に示す。The conventional male connector for high-density surface mounting is
It is shown in Figure 4.
図において、雄側のコネクタ(プラグコネクタ)1は、
絶縁性樹脂のモールド成形品からなる絶縁基体11と、
複数のコンタクト12からなり、プリント仮4の半田付
はパッド41にリフロー半田付けされる。In the figure, the male connector (plug connector) 1 is
an insulating base 11 made of an insulating resin molded product;
It consists of a plurality of contacts 12, and the soldering of the temporary print 4 is reflow soldered to the pad 41.
絶縁基体11には複数のコンタクト圧入穴が所定のピッ
チで形成されており、銅合金などの金属材料からプレス
加工や連続めっき加工を経て別個に製造された接触部1
2aや表面実装用の端子部12cを有するコンタク目2
が圧入植設されている。A plurality of contact press-fit holes are formed at a predetermined pitch in the insulating base 11, and the contact portions 1 are separately manufactured from a metal material such as a copper alloy through press working or continuous plating.
2a and a contact part 2 having a terminal part 12c for surface mounting.
has been press-implanted.
〔発明が解決しようとする課題〕
電子装置の高密度化により、コンタクトの配列ピッチは
従来の標準の2.54+nmから、たとえばその半分の
1゜27mm (ハーフピッチコネクタ)が標準になり
つつあるが、このようにコンタクトピッチが小さくなる
と、コンタクトを圧入固定する従来の雄コネクタでは、
絶縁体のコンタクト圧入孔間の隔壁が薄くなり、コンタ
クトの植設時に圧入割れが生じるという問題があった。[Problems to be Solved by the Invention] Due to the increasing density of electronic devices, the contact arrangement pitch is changing from the conventional standard of 2.54+nm to half that, for example, 1°27mm (half-pitch connector). As the contact pitch becomes smaller in this way, conventional male connectors in which the contacts are press-fitted,
There was a problem in that the partition walls between the contact press-fit holes in the insulator became thin, and press-fit cracks occurred when the contacts were installed.
また構成部材として、モールド成形工程により作成され
る絶縁基体と、プレス加工や連続めっき加工で作成され
る複数のコンタクトとを必要するので部品点数が多く、
コンタクトを絶縁体に植設するための組立工程を必要と
するのでコストアップになるという問題点もあった。In addition, the number of components is large because it requires an insulating base made by a molding process and a plurality of contacts made by press working or continuous plating.
There is also the problem of increased costs because an assembly process is required to implant the contacts in the insulator.
さらに、プリント板への実装の際のりフロー半田付けが
良好になされるためには複数のコンタクトの端子部が同
一面内に高精度で配列されていることが望ましいが、個
別のコンタクトを植設するので精度が悪いという欠点も
あった。Furthermore, in order to achieve good glue flow soldering when mounting on a printed circuit board, it is desirable that the terminals of multiple contacts are arranged with high precision on the same plane, but individual contacts are Therefore, it also had the disadvantage of poor accuracy.
本発明は上記問題点に鑑み創出されたもので、絶縁基体
上に導電性樹脂によるコンタクトをダブルモールド成形
することにより部品点数を削減し、かつ高密度・高精度
なコンタクト配列を有する表面実装用の雄コネクタを提
供することを目的とする。The present invention was created in view of the above problems, and it reduces the number of parts by double-molding contacts made of conductive resin on an insulating substrate, and has a high-density and high-precision contact arrangement for surface mounting. The purpose is to provide a male connector for.
上記問題点は、
めっき不能樹脂の成形品よりなり、プリント仮に搭載さ
れる基部と、該基部から上側へ突出して相手側の雌コネ
クタに嵌入される挿入部とからなる横断面が略逆丁字形
の棒状の′4tA8!基体と、該m縁基体の外周を取り
巻いて複数の帯状コンタクト領域がめつき可能樹脂のダ
ブルモールドにより所定ピッチで形成され、該コンタク
ト領域には金属がめっきにより被着されていることを特
徴とする本発明の雄コネクタにより解決される。The above problem is that the product is made of a non-platable resin molded product, and has an approximately inverted T-shaped cross section consisting of a base on which the print is temporarily mounted, and an insertion portion that protrudes upward from the base and is fitted into the mating female connector. A rod-shaped '4tA8! A base body and a plurality of band-shaped contact areas surrounding the outer periphery of the m-edge base body are formed at a predetermined pitch by double molding of a plateable resin, and the contact areas are coated with metal by plating. This is solved by the male connector of the present invention.
コンタクト領域をめっき可能樹脂により絶縁基体上にダ
ブルモールド成形により一体で形成するので、コンタク
トをプレス加工で絶縁基体と別個に製造したり、コンタ
クトを絶縁基体に植設する工程を必要とせず、しかも高
精度、高密度でコンタクトを配列することができる。こ
のためコネクタの基本構成部材がモールド成形品−個で
済み、部材費の低減や組立工数を必要とせず製造コスト
を大幅に削減できる。またコンタクトの圧入固定を必要
としないのでコンタクト配列の高密度化が達成できる。Since the contact area is integrally formed with plating resin on the insulating base by double molding, there is no need to manufacture the contacts separately from the insulating base by press processing or to implant the contacts into the insulating base. Contacts can be arranged with high precision and high density. For this reason, the basic constituent members of the connector can be molded in pieces, and manufacturing costs can be significantly reduced by reducing component costs and requiring no assembly man-hours. Further, since it is not necessary to press-fit and fix the contacts, a high-density contact arrangement can be achieved.
以下添付図により本発明の詳細な説明する。 The present invention will be described in detail below with reference to the accompanying drawings.
第1図は本発明の雄コネクタの外観斜視図、第2図はコ
ンタクト領域の断面図、第3図は製造方法を示す図であ
る。FIG. 1 is an external perspective view of a male connector of the present invention, FIG. 2 is a sectional view of a contact area, and FIG. 3 is a diagram showing a manufacturing method.
第1図において、本発明の雄コネクタ2は下側に断面が
四角の基部21と、該基部21上に突出する挿入部22
とを有する略逆丁字形断面を有する棒状のモールド一体
成形品で、基部21の下面21aまたは側面21bはプ
リント板のパッドにリフロー半田付けされる面となり、
また挿入部21は相手側の雌コネクタに嵌入されるプラ
グ部分となる。In FIG. 1, the male connector 2 of the present invention has a base portion 21 with a square cross section on the lower side, and an insertion portion 22 protruding above the base portion 21.
It is a rod-shaped molded integrally molded product having a substantially inverted T-shaped cross section, and the lower surface 21a or side surface 21b of the base 21 is a surface to be reflow soldered to a pad of a printed board,
Further, the insertion portion 21 serves as a plug portion that is inserted into a mating female connector.
そして棒状体の表面には、後述するように溝部24aに
導電性樹脂を充填し金属めっきを施した複数の帯状のコ
ンタクト領域23が、外周を取り巻いて、例えば1 、
27mmの配列ピッチで形成されている。As will be described later, on the surface of the rod-shaped body, a plurality of strip-shaped contact regions 23, in which grooves 24a are filled with conductive resin and metal-plated, surround the outer periphery.
They are formed with an arrangement pitch of 27 mm.
第2図はコンタクト領域の層構成を示すために第1図に
おけるA−A断面を相手側の雌コネクタと共に示したも
のである。FIG. 2 shows a cross section taken along line AA in FIG. 1 along with a mating female connector to show the layer structure of the contact area.
図において3は、本発明の雄コネクタ2に挿着される相
手側の雌コネクタで、U字形ばねの接点部31aを有す
る複数の雌コンタクト31が、前記雄コネクタのコンタ
クト領域の配列ピッチに対応して絶縁体32に植設(紙
面垂直方向に並設)されてなっている。In the figure, 3 is a mating female connector that is inserted into the male connector 2 of the present invention, and a plurality of female contacts 31 having U-shaped spring contact portions 31a correspond to the arrangement pitch of the contact areas of the male connector. They are embedded in the insulator 32 (in parallel in the direction perpendicular to the plane of the paper).
そして雄コネクタ2のコンタクト領域は、めっき不能樹
脂による第一成形品よりなる絶縁基体24の周囲にめっ
き可能樹脂をダブルモールドで帯状に被着形成した第二
成形部25よりなり、該第二成形部25の表面は、例え
ば、CuおよびNi/Auの3層構造の金属めっき層2
6が導電材料および接点材料として電気めっきにて所望
の厚さに被着形成されている。The contact area of the male connector 2 consists of a second molded part 25 formed by double molding a plateable resin in a strip shape around an insulating base 24 made of a first molded product made of a non-platable resin. The surface of the portion 25 is coated with a metal plating layer 2 having a three-layer structure of Cu and Ni/Au, for example.
6 is deposited to a desired thickness by electroplating as a conductive material and a contact material.
なお4は本雄コネクク2が搭載されるプリント板で、表
面の半田付はバッド41と、平面性の優れた基部21の
下面の金属めっき層26aとがりフロー半田42により
良好に半田付けされる。Reference numeral 4 denotes a printed circuit board on which the main connector 2 is mounted, and the soldering on the surface is well achieved by a pad 41 and a metal plating layer 26a on the lower surface of the base 21 having excellent flatness with a sharp flow solder 42.
そして第1図のコンタクト領域23以外の部分は絶縁物
の第一成形品が表面に露呈したままになっており、金属
めっき層が存在しない゛ので、コンタクト領域は独立し
て複数の導電部となる。1, the first insulating molded product remains exposed on the surface, and there is no metal plating layer, so the contact area is independently connected to a plurality of conductive parts. Become.
第3図は製造方法の一例を示す。まず絶縁物である非め
っきグレードのpps <ポリフェニレンサルファイド
)樹脂の射出成形により図の(a)に示す絶縁基体24
を成形する。(第一成形)絶縁基体24は嵌合する相手
側の雌コネクタに対応する厚さの挿入部22を存し、コ
ンタクト領域に対応する部分に、所定の配列ピッチで外
周を取り巻く複数の帯状の溝部24aが形成されている
。FIG. 3 shows an example of the manufacturing method. First, the insulating base 24 shown in FIG.
to form. (First molding) The insulating base 24 has an insertion portion 22 having a thickness corresponding to the mating female connector, and a plurality of strips surrounding the outer periphery at a predetermined arrangement pitch in a portion corresponding to the contact area. A groove portion 24a is formed.
次いで、第二成形用金型に絶縁基体24を装着しで、ダ
ブルモールド成形により前記複数の溝部24aに導電性
のあるめっきグレードのPPS樹脂を射出成形して、図
の(b)に示す如く、コンタクト領域に対応する部分に
、帯状に111!!!縁基体42を取り巻(複数の第二
成形部25を形成する。Next, the insulating base 24 is attached to a second molding die, and conductive plating grade PPS resin is injection molded into the plurality of grooves 24a by double molding, as shown in FIG. , 111! in a band shape in the part corresponding to the contact area. ! ! Surrounding the edge base 42 (forming a plurality of second molded parts 25).
このようにコンタクト領域はダブルモールドで形成さ、
れるので、その幅や配列ピッチはモールド金型の精度に
支配されるため、極めて高精度に配置することができる
と共に、第一成形樹脂と第二成形樹脂との境界は溶融接
合されるので接合強度が大きく一体成形品とみなすこと
ができる。In this way, the contact area is formed by double molding,
Since the width and arrangement pitch are controlled by the precision of the mold, it is possible to arrange them with extremely high precision, and the boundary between the first molding resin and the second molding resin is melted and joined, so there is no joining. It has great strength and can be considered an integrally molded product.
そして、この第二成形は、それぞれの第二成形部25に
ゲート25aが形成される多点ゲート方式の金型により
成形するので、複数のコンタクト領域はゲート25aお
よびランナ部25bによって電気的に接続された状態の
成形品が得られる。Since this second molding is performed using a multi-gate mold in which a gate 25a is formed in each second molding part 25, the plurality of contact regions are electrically connected by the gate 25a and the runner part 25b. A molded article is obtained.
次に、このランチ部2Jbをめっき電極として用いて、
導電性のめっき可能樹脂が表面に露呈している第二成形
部25のみに電気めっきを行ってコンタクト領域を形成
する。ランチ部25aにめっき電圧を印加することによ
り、複数のコンタクト領域へのめっき電流の供給が簡単
にでき、cuおよびN i / A uの電気めっきを
所定の厚さに容易にできる。Next, using this launch part 2Jb as a plating electrode,
Electroplating is performed only on the second molded part 25 where the conductive plateable resin is exposed on the surface to form a contact area. By applying a plating voltage to the launch portion 25a, plating current can be easily supplied to a plurality of contact regions, and the electroplating of cu and Ni/Au can be easily achieved to a predetermined thickness.
そしてめっき工程後εこ、ゲート2iaを切断すること
により、溝数のコンタクト領域を容易に分離することが
でき、互い絶縁された複数のコンタクトが得られる。By cutting the gate 2ia after the plating process, the contact regions corresponding to the number of grooves can be easily separated, and a plurality of mutually insulated contacts can be obtained.
以上説明した如く、本発明によれば雄コネクタの部品点
数を一点にすることが可能となり、且つコンタクトを絶
縁体に植設する組立工程が不要になるため、高密度のコ
ネクタを低コストで製造することが可能となる。As explained above, according to the present invention, the number of male connector parts can be reduced to one, and the assembly process of implanting contacts in an insulator is not required, so a high-density connector can be manufactured at low cost. It becomes possible to do so.
第1図は本発明の雄コネクタの外観斜視図、第2図はコ
ンタクト領域の断面図、
第3図は本発明の雄コネクタの製造方法を示す図、
第4図は従来の表面実装用の雄コネクタを示す図、
である。
図において、
2−・−雄コネクタ、 21・・−基部、22−
・挿入部、 23−・−コンタクト領域、2
4−絶縁基体、 24a −溝部、25−第二
成形部、 26−・−金属めっき層、である。
木タ萌刀J比コ村りn外腿′糾7屯図
あ 1 図
コン77F今員fべのm面図
第 2 図
(a)鼾A形後
(1)ン 第 二A 左シ 後
不全gF4tnJ庄コネ7りn蒐造方遮Σ示T図茅 3
図Fig. 1 is an external perspective view of the male connector of the present invention, Fig. 2 is a sectional view of the contact area, Fig. 3 is a diagram showing a method of manufacturing the male connector of the present invention, and Fig. 4 is a conventional surface mount connector. FIG. 2 is a diagram showing a male connector. In the figure, 2--male connector, 21--base, 22-
- Insertion part, 23--Contact area, 2
4-Insulating base, 24a-Groove portion, 25-Second molded portion, 26-.-Metal plating layer. Kita Moeto J Hikomurari n Outer thighs 7 ton map A 1 Diagram 77F Inmember fbe m view No. 2 Figure (a) Snoring A-shaped rear (1) N 2nd A Left side rear Insufficiency gF4tnJ Sho connection 7 ri n construction method blocking Σshow T diagram 3
figure
Claims (1)
れる基部(21)と、該基部から上側へ突出して相手側
の雌コネクタに嵌入される挿入部(21)とからなる横
断面が略逆T字形の棒状の絶縁基体(24)と、 該絶縁基体(24)の外周を取り巻いて複数の帯状コン
タクト領域(23)がめっき可能樹脂のダブルモールド
により所定ピッチで形成され、該コンタクト領域(23
)には金属がめっきにより被着されていることを特徴と
する雄コネクタ。[Claims] Consisting of a base (21) made of a non-platable resin molded product and mounted on a printed board, and an insertion part (21) that projects upward from the base and is fitted into a mating female connector. A rod-shaped insulating base (24) having a substantially inverted T-shaped cross section, and a plurality of band-shaped contact areas (23) surrounding the outer periphery of the insulating base (24) are formed at a predetermined pitch by double molding of a plateable resin. , the contact area (23
) is coated with metal by plating.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63229512A JP2629299B2 (en) | 1988-09-13 | 1988-09-13 | Male connector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63229512A JP2629299B2 (en) | 1988-09-13 | 1988-09-13 | Male connector |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0278171A true JPH0278171A (en) | 1990-03-19 |
JP2629299B2 JP2629299B2 (en) | 1997-07-09 |
Family
ID=16893338
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63229512A Expired - Fee Related JP2629299B2 (en) | 1988-09-13 | 1988-09-13 | Male connector |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2629299B2 (en) |
Cited By (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5094134A (en) * | 1990-06-08 | 1992-03-10 | Roland Dg Corporation | Cutting pen |
JPH0652941A (en) * | 1992-07-31 | 1994-02-25 | Pfu Ltd | Connector |
US5336112A (en) * | 1991-11-30 | 1994-08-09 | Murata Manufacturing Co., Ltd. | Coaxial microstrip line transducer |
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