JPH0239546A - Manufacture of hybrid integrated circuit - Google Patents
Manufacture of hybrid integrated circuitInfo
- Publication number
- JPH0239546A JPH0239546A JP19041988A JP19041988A JPH0239546A JP H0239546 A JPH0239546 A JP H0239546A JP 19041988 A JP19041988 A JP 19041988A JP 19041988 A JP19041988 A JP 19041988A JP H0239546 A JPH0239546 A JP H0239546A
- Authority
- JP
- Japan
- Prior art keywords
- electrolytic capacitor
- resin
- integrated circuit
- hybrid integrated
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000003990 capacitor Substances 0.000 claims abstract description 22
- 239000003960 organic solvent Substances 0.000 claims abstract description 13
- 239000003822 epoxy resin Substances 0.000 claims abstract description 10
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 10
- 239000011347 resin Substances 0.000 abstract description 10
- 229920005989 resin Polymers 0.000 abstract description 10
- 239000011248 coating agent Substances 0.000 abstract description 5
- 238000000576 coating method Methods 0.000 abstract description 5
- 239000005011 phenolic resin Substances 0.000 abstract description 5
- 239000000463 material Substances 0.000 abstract description 4
- 150000002989 phenols Chemical class 0.000 abstract description 4
- 239000000758 substrate Substances 0.000 abstract description 3
- 239000004593 Epoxy Substances 0.000 abstract 2
- 239000007788 liquid Substances 0.000 abstract 1
- 230000008961 swelling Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical class [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- 238000003618 dip coating Methods 0.000 description 2
- 229930091051 Arenine Natural products 0.000 description 1
- 206010065042 Immune reconstitution inflammatory syndrome Diseases 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は混成集積回路、特に電解コンデンサを含む混成
集積回路の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing a hybrid integrated circuit, particularly a hybrid integrated circuit including an electrolytic capacitor.
〔従来の技術と発明が解決しようとする課題〕従来、電
解コンデンサを含む混成集積回路の製造方法としては９
例えば第２図に示すように、基板４に電解コンデンサｌ
を含む各部品を実装した後、粘性の低い流動状のエポキ
シ変成フェノール樹脂等に漬け、付着した樹脂を加熱硬
化させて外装被覆３を施している。この方法は一般的に
は。[Prior art and problems to be solved by the invention] Conventionally, there are nine manufacturing methods for hybrid integrated circuits including electrolytic capacitors.
For example, as shown in FIG.
After each component including the above is mounted, the exterior coating 3 is applied by immersing it in a fluid epoxy-modified phenol resin with low viscosity, and heating and curing the adhered resin. This method is generally
デイツプコーティングと呼ばれている。It is called deep coating.
しかしながらこのような従来のデイツプコーティングに
あっては、硬化前の流動状のエポキシ変成フェノール樹
脂はその粘性を低くして混成集積回路全体への樹脂の回
り込みを良くするため、多量に（２０％乃至５０％）有
機溶剤を含ませている。そのため、混成４Ｊ積回路の構
成部品、特に電解コンデンサ１にはその有機溶剤の化学
的影響でその外装材を膨潤させて、この外側を被覆して
いる樹脂３を押し上げ、デイツプコーテイング後におい
て亀裂の発生又は剥がれ等が発生していた。However, in such conventional dip coating, a large amount (20% 50%) contains an organic solvent. Therefore, the component parts of the hybrid 4J product circuit, especially the electrolytic capacitor 1, have their exterior materials swollen due to the chemical influence of the organic solvent, pushing up the resin 3 covering the outside and causing cracks after dip coating. Occurrence or peeling occurred.
本発明では１以上のべた課題を解決するため電解コンデ
ンサを含む混成集積回路において、その電解コンデンサ
を、あらかじめ有ＩＲＩＳ剤を含まないエポキシ樹脂で
被覆、硬化させておき、そのＩ＆混成集積回路全体を低
粘性エポキシ樹脂で被覆することを特徴とする混成集積
回路の製造方法を提案するものである。In order to solve one or more of the above problems, in the present invention, in a hybrid integrated circuit including an electrolytic capacitor, the electrolytic capacitor is coated and cured in advance with an epoxy resin that does not contain an IRIS agent, and the entire I&hybrid integrated circuit is coated and cured. This invention proposes a method for manufacturing a hybrid integrated circuit characterized by coating it with a low-viscosity epoxy resin.
第１図は本発明による混成集積回路の構造図である０図
において基板４に電解コンデンサ１を含む各部品を実装
した後、電解コンデンサ１を予め局部的に有機溶剤を含
まないエポキシ樹脂２で被覆、硬化させる。その後混成
集積回路全体を粘性の低い流動状のエポキシ変成フェノ
ール樹脂等に漬け、付着した樹脂を加熱硬化させて外装
被覆３を形成する。FIG. 1 is a structural diagram of a hybrid integrated circuit according to the present invention. In FIG. Coat and cure. Thereafter, the entire hybrid integrated circuit is immersed in a fluid epoxy-modified phenol resin with low viscosity, and the adhered resin is heated and cured to form the outer covering 3.
このような製造方法にあっては、硬化前の流動状エポキ
シ変成フェノール樹脂はその粘性を低くするため、多量
に有機溶剤を含ませているにもかかわらず、混成集積回
路の構成部品の中の電解コンデンサ１は予め局部的にエ
ポキシ樹脂２で被覆保護されているので、その後の工程
でのエポキシ変成フェノール樹脂に含まれる有機溶剤は
直接電解コンデンサには接触しないと同時に、その粘性
は低く、混成集積回路全体への樹脂の回り込みは良好で
ある。従って混成４Ｊｇ４回路の外装被覆の仕上がりは
良好に保たれつつ、電解コンデンサ１は有機溶剤の化学
的影響でその外装材を膨潤されることはなくなる。In this manufacturing method, the fluid epoxy-modified phenolic resin before curing contains a large amount of organic solvent in order to lower its viscosity, but even though it contains a large amount of organic solvent, Since the electrolytic capacitor 1 is locally covered and protected with the epoxy resin 2 in advance, the organic solvent contained in the epoxy-modified phenol resin in the subsequent process does not come into direct contact with the electrolytic capacitor, and at the same time, its viscosity is low and the mixture is The resin spreads well into the entire integrated circuit. Therefore, the finish of the exterior covering of the hybrid 4Jg4 circuit is maintained well, and the exterior material of the electrolytic capacitor 1 is not swollen due to the chemical influence of the organic solvent.
本発明は以上述べたように、混成集積回路上の電解コン
デンサは予め、有機溶剤を含まない樹脂で被覆保護され
ているので、その外側を包囲しているエポキシ変成フェ
ノール樹脂に含まれる有機溶剤は直接電解コンデンサに
は接触しない。また電解コンデンサは混成集積回路の構
成部品の中では大きい部品であるが、基板に予め樹脂で
固定されるため、基板との境界部は樹脂により強固に固
定される。従って混成集積回路の外装被覆の仕上がりは
良好に保たれつつ、電解コンデンサ１は有機溶剤の化学
的影響でその外装材をｌ１１潤されることはなくなる。As described above, in the present invention, since the electrolytic capacitor on the hybrid integrated circuit is coated and protected in advance with a resin that does not contain organic solvents, the organic solvent contained in the epoxy-modified phenolic resin surrounding the outside of the electrolytic capacitor is protected. Do not touch electrolytic capacitors directly. Further, although the electrolytic capacitor is a large component among the components of a hybrid integrated circuit, since it is fixed to the substrate in advance with resin, the boundary portion with the substrate is firmly fixed with the resin. Therefore, the finish of the exterior covering of the hybrid integrated circuit is maintained well, and the exterior material of the electrolytic capacitor 1 is not wetted by the chemical influence of the organic solvent.
第１図は本発明による混成集積回路の構造図を示し、第
２図は従来の混成集積回路の構造図を示す。
１・・・電解コンデンサ
２・・・エポキシ樹脂、３・・・外装被覆４・・・基板
、５・・・リード端子FIG. 1 shows a structural diagram of a hybrid integrated circuit according to the present invention, and FIG. 2 shows a structural diagram of a conventional hybrid integrated circuit. 1... Electrolytic capacitor 2... Epoxy resin, 3... Exterior coating 4... Board, 5... Lead terminal
Claims (1)
コンデンサを、あらかじめ有機溶剤を含まないエポキシ
樹脂で被覆、硬化させておき、その後該混成集積回路全
体を低粘性エポキシ樹脂で被覆することを特徴とする混
成集積回路の製造方法。A hybrid integrated circuit including an electrolytic capacitor, characterized in that the electrolytic capacitor is coated and cured in advance with an epoxy resin that does not contain an organic solvent, and then the entire hybrid integrated circuit is coated with a low-viscosity epoxy resin. A method of manufacturing integrated circuits.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19041988A JPH0239546A (en) | 1988-07-29 | 1988-07-29 | Manufacture of hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19041988A JPH0239546A (en) | 1988-07-29 | 1988-07-29 | Manufacture of hybrid integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0239546A true JPH0239546A (en) | 1990-02-08 |
Family
ID=16257823
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19041988A Pending JPH0239546A (en) | 1988-07-29 | 1988-07-29 | Manufacture of hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0239546A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5175345A (en) * | 1991-03-27 | 1992-12-29 | Idemitsu Kosan Company Limited | Process for producing 2-fluoroisobutyric acid ester |
| EP1695964A1 (en) | 2000-11-15 | 2006-08-30 | Novexel | Quinoline derivatives for use as intermediates in the synthesis of heterocyclylalcoyl piperidines |
-
1988
- 1988-07-29 JP JP19041988A patent/JPH0239546A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5175345A (en) * | 1991-03-27 | 1992-12-29 | Idemitsu Kosan Company Limited | Process for producing 2-fluoroisobutyric acid ester |
| EP1695964A1 (en) | 2000-11-15 | 2006-08-30 | Novexel | Quinoline derivatives for use as intermediates in the synthesis of heterocyclylalcoyl piperidines |
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