JPH022028A - Structure of thermal transfer and current supply thermal transfer printing head - Google Patents
Structure of thermal transfer and current supply thermal transfer printing headInfo
- Publication number
- JPH022028A JPH022028A JP14405588A JP14405588A JPH022028A JP H022028 A JPH022028 A JP H022028A JP 14405588 A JP14405588 A JP 14405588A JP 14405588 A JP14405588 A JP 14405588A JP H022028 A JPH022028 A JP H022028A
- Authority
- JP
- Japan
- Prior art keywords
- thermal transfer
- printer head
- electrode
- wire
- jumper wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010023 transfer printing Methods 0.000 title 1
- 239000004020 conductor Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 9
- 239000010408 film Substances 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 239000010409 thin film Substances 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- 244000126211 Hericium coralloides Species 0.000 claims description 4
- 238000009413 insulation Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000007772 electrode material Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- -1 AAzO:+) Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000006091 Macor Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野］
本発明は、熱転写及び、通電熱転写プリンタヘッドの構
造に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to thermal transfer and the structure of an energized thermal transfer printer head.
従来の熱転写プリンタヘッドの構造は、薄膜もしくは厚
膜２層構造のヘッドであった。Conventional thermal transfer printer heads have a thin-film or thick-film two-layer structure.
しかし、従来の薄膜もしくは厚膜の２層構造のヘッドは
、
電極材質と電極上下間の絶縁層材質の熱膨張係数等の違
いにより、クランクが発生したり、父上記絶縁層にポー
ラスが存在すると、絶縁抵抗が劣化する等の問題を有し
ていた。However, conventional thin-film or thick-film heads with a two-layer structure may cause cranking due to differences in thermal expansion coefficient between the electrode material and the insulation layer material between the upper and lower electrodes, or the presence of porosity in the insulation layer above the electrode. , there were problems such as deterioration of insulation resistance.
又、電極材質と、絶縁層材質とのマツチングには多大な
開発期間が必要であった。Furthermore, matching the electrode material and the insulating layer material required a long development period.
上記問題点を解決する為に、本発明は、薄膜もしくは厚
膜製法で、耐熱性絶縁基板上に、コモン電極と、出力電
極を交互に複数本、櫛歯状に形成し、コモン電極は、櫛
歯方向と垂直方向に並列に電極と同一製法により同時に
形成した導電体で接合し、出力電極は、前記導電体上空
をジャンパー線でドライバーＩＣ搭載側電極と電気的接
合をする事を特徴とする。In order to solve the above problems, the present invention forms a plurality of common electrodes and output electrodes alternately in a comb-like shape on a heat-resistant insulating substrate using a thin film or thick film manufacturing method. The output electrode is connected by a conductor formed simultaneously with the electrode by the same manufacturing method in a direction perpendicular to the comb tooth direction, and the output electrode is electrically connected to the driver IC mounting side electrode by a jumper wire above the conductor. do.
さらには、そのジャンパー線が、ＦＰＣ，Ａｕワイヤー
、 Ａｉ、ワイヤー、Ｃｕワイヤーであり、そのジャン
パー線周囲を耐湿性エポキシ樹脂で封止する事を特徴と
する。Furthermore, the jumper wire is FPC, Au wire, Al wire, or Cu wire, and the periphery of the jumper wire is sealed with a moisture-resistant epoxy resin.
以下に、本発明に於ける実施例を図面にもとづいて説明
するが、本発明はこれに限定されるものではない。Embodiments of the present invention will be described below based on the drawings, but the present invention is not limited thereto.
第１図（ａ）、 （ｂ）において、耐熱性絶縁基板１の
上面にスパッタ、メツキ等の薄膜製法、或いは、印刷等
の厚膜製法により、コモン電極２及び、出力電極３を交
互に複数本、櫛歯状に形成し、又、ドライバーＩＣ搭載
側電極６も同時に形成する。コモン電極２は櫛歯方向と
垂直方向に並列に電極と同一製法により同時に形成した
導電体４で接合する。又、出力電極３は、前記導電体４
の上空をジャンパー線５により出力電極３と同ピッチに
形成されたドライバーＩＣ搭載側電極６と接続する。In FIGS. 1(a) and 1(b), a plurality of common electrodes 2 and output electrodes 3 are alternately formed on the upper surface of a heat-resistant insulating substrate 1 by a thin film manufacturing method such as sputtering or plating, or a thick film manufacturing method such as printing. The electrode 6 on the driver IC mounting side is also formed at the same time. The common electrode 2 is connected in parallel with the comb tooth direction in a direction perpendicular to the comb tooth direction by a conductor 4 formed simultaneously with the electrode by the same manufacturing method. Further, the output electrode 3 is connected to the conductor 4
A jumper wire 5 is connected to the driver IC mounting side electrodes 6 formed at the same pitch as the output electrodes 3.
ここで、耐熱性絶縁基板１の種類としては、アルミナ（
ＡＡｚＯ：＋）等のセラミック、マコール。Here, the type of heat-resistant insulating substrate 1 is alumina (
Ceramics such as AAzO:+), Macor.
ソーダライムガラス、ポリイミド樹脂基板等が挙げられ
る。又、
ジャンパー線５の種類としては、
第２図（ａ）、 （ｂ）の様に、出力電極３のピッチと
ドライバーＩＣ搭載側電極６のピッチと同一の櫛歯状に
導電パターンを配して成るＦＰＣ７を使用するもの。或
いは、
第３図（ａ）、 （ｂ）の様に金属ワイヤー８を用いて
、１本１本接合する方法があり、ワイヤー８の種類とし
ては、Ａｕワイヤー Ａ！ワイヤー、Ｃｕワイヤー等が
挙げられる。Examples include soda lime glass and polyimide resin substrates. In addition, the jumper wire 5 has a comb-like conductive pattern arranged at the same pitch as the output electrode 3 and the pitch of the driver IC mounting side electrode 6, as shown in FIGS. 2(a) and 2(b). The one that uses FPC7 consisting of. Alternatively, as shown in FIGS. 3(a) and 3(b), there is a method of joining each wire one by one using metal wires 8. Examples of the types of wires 8 include Au wire A! Examples include wire, Cu wire, and the like.
特にワイヤーを使用する際には、ワイヤーの機械的接合
強度の上昇と、耐湿性の向上の為、ワイヤー周辺及び、
ワイヤー接合部周辺を耐湿性エポキシ樹脂９により封止
するのが有効である。In particular, when using wire, in order to increase the mechanical bonding strength of the wire and improve moisture resistance,
It is effective to seal the area around the wire joint with moisture-resistant epoxy resin 9.
又、本発明の熱転写及び通電熱転写ヘッド構造は、第４
図（ａ）、 （ｂ）に示した様に、耐熱性絶縁基板１の
上面にコモン電極２．出力電極３．導電体４゜ドライバ
ーＩＣ搭載側電極６を形成する時に、同時にドライバー
ＩＣ搭載電極を形成したＩＣ搭載基板と一体である構造
であるか、或いは、第５図（ａ）、 （ｂ）に示した様
に、ドライバーＩＣｌ０を搭載した基板１１と、本発明
の特徴を有した基・板１２とを分離し、両基板をＦＰＣ
１３もしくは、ワイヤーボンディングにより、ワイヤー
で接合すル構造である。後者の構造であると、ドライバ
ーＩＣ搭載基板１１に、ガラスエポキシ基板、祇フェノ
ール基板等が選択でき、ヘッドコストを安価なものにす
る事が可能となる。Further, the thermal transfer and energized thermal transfer head structure of the present invention has a fourth structure.
As shown in FIGS. (a) and (b), a common electrode 2. Output electrode 3. When forming the conductor 4° driver IC mounting side electrode 6, the structure is such that it is integrated with the IC mounting board on which the driver IC mounting electrode is formed at the same time, or as shown in FIGS. 5(a) and 5(b). As shown in FIG.
13 or a wire bonded structure using wire bonding. In the latter structure, a glass epoxy board, a phenol board, etc. can be selected for the driver IC mounting board 11, and the head cost can be reduced.
又、本発明は第６図（ａ）、 （ｂ）に示す様にコモン
電極２と、出力電極３の先端部に発熱抵抗体１４を設け
るか、或いは、図７に示す様に発熱抵抗層１６を、イン
クフィルム１５側に設けるかで、熱転写及び、通電熱転
写プリントヘッドとして構成される。Further, the present invention provides a heat generating resistor 14 at the tips of the common electrode 2 and the output electrode 3 as shown in FIGS. 6(a) and 6(b), or a heat generating resistor layer as shown in FIG. 16 is provided on the ink film 15 side, it can be configured as a thermal transfer print head or an electrically conductive thermal transfer print head.
〔発明の効果］
本発明は、以上説明した様に、
薄膜もしくは、厚膜製法で耐熱性絶縁基板上に、コモン
電極と出力電極を交互に複数本、櫛歯状に形成し、コモ
ン電極は櫛歯方向と垂直方向に並列に電極と同一製法に
より同時に形成した導電体で接合し、出力電極は前記導
電体上空をジャンパー線でドライバーＩＣ搭載側電極と
電気的接合し、又、ジャンパー線が金属ワイヤーの際に
は耐湿性エポキシ樹脂によりワイヤー近傍を封止する熱
転写及び通電熱転写プリンターヘッド構造により、片面
基板でローコスト化、又、クラック発生等が少なく、耐
湿性等の信頼性に優れたヘッドを構成できるという効果
を有する。[Effects of the Invention] As explained above, the present invention forms a plurality of common electrodes and output electrodes alternately in a comb-like shape on a heat-resistant insulating substrate using a thin film or thick film manufacturing method, and the common electrode is formed in a comb-like shape. The output electrode is electrically connected to the electrode on the driver IC mounting side using a jumper wire above the conductor. When working with metal wires, the thermal transfer printer head structure uses moisture-resistant epoxy resin to seal the vicinity of the wire, resulting in a low cost single-sided substrate, less cracking, and superior moisture resistance and reliability. It has the effect of being able to configure.
第１図〜第７図は、本発明の熱転写及び通電熱転写プリ
ンターヘッドの構造をそれぞれ示す図。
ｌ・・・耐熱性絶縁基板
２・・・コモン電極
３・・・出力電極
４・・・導電体
５・・・ジャンパー線
６・・・ドライバーＩＣ搭載側電極
７・・・ＦＰＣ
８・・・金属ワイヤー
９・・・耐湿性エポキシ樹脂
１０・・・ドライバーＩＣ
１１・・・ＩＣ搭載基板
１２・・・本発明の基板
１３・・・ＦＰＣ
１４・・・発熱抵抗体
１５・・・インクフィルム
１６・・・発熱抵抗層
１７・・・ベース層
１８・・・インク層
以上
出願人 セイコーエプソン株式会社
代理人弁理士 鈴木喜三部 他１名
第２図
第４−
（Ｑｌ
（ｂ）
第５図1 to 7 are diagrams showing the structures of a thermal transfer printer head and an electric thermal transfer printer head of the present invention, respectively. l...Heat-resistant insulating substrate 2...Common electrode 3...Output electrode 4...Conductor 5...Jumper wire 6...Driver IC mounting side electrode 7...FPC 8... Metal wire 9...Moisture-resistant epoxy resin 10...Driver IC 11...IC mounting board 12...Substrate of the present invention 13...FPC 14...Heating resistor 15...Ink film 16... ...Heating resistance layer 17...Base layer 18...Ink layer and above Applicant Seiko Epson Co., Ltd. Representative Patent Attorney Kizobe Suzuki and 1 other person Figure 2 Figure 4- (Ql (b) Figure 5
Claims (6)
りコモン電極と出力電極が交互に複数本、櫛歯状に配し
て通電を行う熱転写及び、通電熱転写プリンタヘッドに
於いて 複数本の１本おきのコモン電極は、櫛歯方向と垂直方向
に並列に電極と同一製法により同時に形成した導電体で
接合し、出力電極は、前記導電体上空をジャンパー線で
出力電極と同ピッチに形成されたドライバーＩＣ搭載側
電極と電気的接合をする事を特徴とした熱転写及び通電
熱転写プリンタヘッド。(1) Thermal transfer, in which a plurality of common electrodes and output electrodes are arranged alternately in a comb-teeth pattern on a heat-resistant insulating substrate using a thin film or thick film manufacturing method, and multiple electrodes are energized in a current-carrying thermal transfer printer head. Every other common electrode is connected in parallel to the comb tooth direction with a conductor formed at the same time using the same manufacturing method as the electrode, and the output electrode is formed at the same pitch as the output electrode using a jumper wire above the conductor. Thermal transfer and current-carrying thermal transfer printer heads are characterized by electrical connection with the driver IC mounting side electrodes.
歯状に導電パターンを配して成るＦＰＣである事を特徴
とする請求項１記載の熱転写及び通電熱転写プリンタヘ
ッド。(2) The thermal transfer and energizing thermal transfer printer head according to claim 1, wherein the jumper wire is an FPC having a conductive pattern arranged in a comb-like shape having the same pitch as the output electrode pitch.
により形成して成る事を特徴とする請求項１記載の熱転
写及び通電熱転写プリンタヘッド。(3) The thermal transfer and current-carrying thermal transfer printer head according to claim 1, wherein the jumper wire is formed by Au wire bonding.
により形成して成る事を特徴とする請求項１記載の熱転
写及び通電熱転写プリンタヘッド。(4) The thermal transfer and current-carrying thermal transfer printer head according to claim 1, wherein the jumper wire is formed by Al wire bonding.
により形成して成る事を特徴とする請求項１記載の熱転
写及び通電熱転写プリンタヘッド。(5) The thermal transfer and current-carrying thermal transfer printer head according to claim 1, wherein the jumper wire is formed by Cu wire bonding.
封止する事を特徴とする請求項１記載の熱転写及び通電
熱転写プリンタヘッド。(6) The thermal transfer and electrical thermal transfer printer head according to claim 1, wherein the periphery of the jumper wire is sealed with a moisture-resistant epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14405588A JPH022028A (en) | 1988-06-10 | 1988-06-10 | Structure of thermal transfer and current supply thermal transfer printing head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14405588A JPH022028A (en) | 1988-06-10 | 1988-06-10 | Structure of thermal transfer and current supply thermal transfer printing head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH022028A true JPH022028A (en) | 1990-01-08 |
Family
ID=15353264
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14405588A Pending JPH022028A (en) | 1988-06-10 | 1988-06-10 | Structure of thermal transfer and current supply thermal transfer printing head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH022028A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10022208B2 (en) | 2011-12-28 | 2018-07-17 | Colgate-Palmolive Company | Replacement head for an oral care implement, and oral care implement and method of utilizing the same |
| JP2019111751A (en) * | 2017-12-25 | 2019-07-11 | 東芝ホクト電子株式会社 | Thermal print head and thermal printer |
| JP2019111752A (en) * | 2017-12-25 | 2019-07-11 | 東芝ホクト電子株式会社 | Thermal print head and thermal printer |
-
1988
- 1988-06-10 JP JP14405588A patent/JPH022028A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10022208B2 (en) | 2011-12-28 | 2018-07-17 | Colgate-Palmolive Company | Replacement head for an oral care implement, and oral care implement and method of utilizing the same |
| US10898304B2 (en) | 2011-12-28 | 2021-01-26 | Colgate-Palmolive Company | Oral care implement body and replacement head therefor |
| US11931218B2 (en) | 2011-12-28 | 2024-03-19 | Colgate-Palmolive Company | Oral care implement body and replacement head therefor |
| JP2019111751A (en) * | 2017-12-25 | 2019-07-11 | 東芝ホクト電子株式会社 | Thermal print head and thermal printer |
| JP2019111752A (en) * | 2017-12-25 | 2019-07-11 | 東芝ホクト電子株式会社 | Thermal print head and thermal printer |
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