JPS6374661A - thermal printer head - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a mounting structure of a thermal transfer type thermal printer head and an electric thermal transfer type thermal printer head on which an output driving integrated circuit is mounted.

[Conventional technology]

Conventional thermal transfer type or energized thermal transfer type thermal printer heads have an integrated circuit 6 for output and operation as shown in Figure 6.
The electrode 63 of the loading part of the driver IC 2 (hereinafter abbreviated as driver IC) and the record 66 of the driver re were formed on the substrate 71 of the same material for the purpose of miniaturizing the hegdo.

[Problem that the invention seeks to solve]

However, like the prior art described above, the dry air C loading section 6
When forming the two parts, 3 and the recording electrode wiring part 66, on the same member substrate 71, the following problems arise. dry bay C
It is possible to install the loading part, and the reliability after mounting is
If you use a substrate member and a substrate electrode member that can maintain aI. By the way, as the characteristics of the recording electrode wiring section, the following characteristics hz are required.

1) In the case of a recording electrode wiring board using an electric thermal transfer method, the substrate member ht should be easy to polish.Recording T: Hard to wear and excellent in corrosion resistance.The shape and dimensions of the recording should be good. 2) In the case of a thermal transfer type recording electrode wiring board, it is possible to form a thin or thick film, the electrode has good dimensional accuracy, and it has excellent heat resistance. Wiring section and construction O
When forming the loading section on the same substrate.

In general, a board that satisfies the characteristics of a recording electrode wiring board has a very high cost relative to its area, so there is a problem that the overall cost increases. There is a problem in that the reliability of the machine C'0 loading section after the machine C loading may be degraded.

The present invention solves the above-mentioned problems, and aims to provide a structure that satisfies the characteristics of both the recording electrode wiring board and the C loading section.

[Elaborate means to solve problems]

The thermal printer head of the present invention includes a motherboard on which a driver IC is mounted, and a recording wiring board made of a different material from the motherboard, and each terminal h; -f is characterized by being connected as follows.

〔Example〕

FIGS. 1C and 2 are diagrams showing the structure of a first embodiment of the present invention, and the entire structure constitutes a line type electrical thermal transfer type thermal printer head.

As a substrate on which a driver C2 can be mounted, a driver C26 is mounted on a motherboard 1 in which glass epoxy, which is considered to be a relatively low-cost material, is used as a substrate member. The electrodes come out from the five-electrode O output terminal of the driver air C loading section and are wired in parallel at equal pitch intervals at the tip of the motherboard 1. The driver IO is mounted using a wire bonding method, a flip chip mounting method, or the like. Furthermore, a material different from that of the motherboard 1 (for example, easily polished orsterite, mica ceramic, etc.) is used on the ratio recording electrode wiring board 5, and the recording electrodes 6 are arranged at the same pitch as the tips of the above 5. formed in parallel. This is to create an electrical connection between the two parts above.
Using a flexible wiring board 4 (hereinafter abbreviated as FPC) on which parallel patterns 7 with the same pitch as in 15.6 above are formed, an electrical connection is made between the two electrodes by thermocompression bonding or the like.

For the joint, a metal such as solder or an anisotropic conductive pattern is used.

By adopting the structure shown in this example, the driver I
C posting @lA#-j It is important that the XO bonding part has little warpage or waviness, and the surface treatment condition, and posting @ wiring part, the electrode shape, electrode hardness, discharge wear resistance, etc. are important. This makes it possible to select only the characteristics necessary for both, which greatly contributes to improvements in cost and characteristics.

In this figure 1.2, it is explained that the FPC is bonded all at once. However, depending on the cumulative tolerance of -3 and b, the FPC 4 for bonding may be divided into 5 or more parts as shown in figure 3. It may be joined by hand.

In the first embodiment, the two electrode terminals are connected by FPC, but as shown in FIG.
Electrical connections may be made using copper strands or other thin metal wires. In this figure, epoxy resin I is used as a protective agent for the thin metal wire 8.
^-Hermetic seals etc. using IFIq may be protected.

FIG. 5 shows the structure of the third embodiment of the present invention, in which ■ FP (1!10) is used in the C loading section. It plays all the roles of the C-loading board and the FPC for bonding.By adopting this structure, the number of bonding points is reduced, reducing the number of man-hours.
″--possible.

Each of the above embodiments describes the structure of a line type thermal transfer type thermal printer head, and by forming a heating element in the recording electrode wiring part, a line type thermal transfer type thermal printer head structure with zero head is realized. can be replaced. Also, if you have a line-type thermal heave,
A similar structure should be adopted for serial type thermal transfer type or electric thermal transfer type thermal printer heads.
End with t.

Furthermore, as a supplementary explanation, the characteristics of the manure are required as physical properties of each part.

(1) Although it varies depending on the IC loading section mounting method, - The IC loading section must have no warpage or undulation. 9. The surface must be treated to ensure input/output connection (metal slat treatment, etc.).

・Reliability after loading is 7 seconds (mainly thermal cycle test).

Protection of ΦIC h; Possible. etc. (2)
Recording electrode wiring part of energized thermal transfer method - Recording 1 by energizing! As the brush wears out (mainly Judentaku), the image W deteriorates, so record II! The L pole must be resistant to wear and have excellent arc resistance.

・However, the electrodes will eventually wear out and reduce the image quality, so it is necessary to cut the holes and fields in order to make the electrodes even in shape. At that time, the substrate must also be easily scraped, so it must be easy to polish.

・Since the recording capacitor reaches high temperatures, it must have excellent heat resistance.

・In order to improve the image quality, record [shape and dimensions fff
(3) Processing for forming recording electrode wiring parts and heat generating parts of thermal transfer method,
It is possible to form thin films or thick films.

・In order to improve the image quality, the dimension precision of 1 original should be improved.

In order to make the wiring resistance value uniform, the resistance value of the wiring part should be as small and uniform as possible.

-Since it generates heat, it must have excellent heat resistance.

〔Effect of the invention〕

As described above, according to the present invention, members made of different materials are used for the image portions of the driver IC mounting portion and the recording electrode wiring portion of the thermal head, and the respective terminals are electrically connected, thereby reducing the cost. Price: It has the effect of making it possible to construct a compact thermal printer head with good mechanical characteristics.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram of the main parts in the first embodiment of the present invention. FIG. 2 is a sectional view of main parts in the first embodiment of the present invention. FIG. 3 is a main schematic diagram when the FPO of the first embodiment is divided, and FIG. 4 is a sectional view of the main parts of the second embodiment. FIG. 5 is a schematic diagram of main parts in the third embodiment. FIG. 6 is a schematic diagram of the structure of a conventional thermal head. 1...Driver IC loading part board 2...
Driver IC 3... Electrode 4 of driver IC loading section...
RPC for bonding 5... Recording electrode wiring board 6... Recording 1 taku 7... Wiring for bonding FPC3K 1! Kan 8・
...Gold, aluminum, copper-plated and other thin metal wires 9 ...Epoxy resin and above Applicant: Seiko Epson Corporation 1 [Fig. 1 Fig. 2 Fig. 5 Fig. 1i6

Claims (1)

[Claims] A thermal transfer type thermal printer head and an electric thermal transfer type thermal printer head include a motherboard on which an integrated circuit for output driving is mounted, and a recording electrode wiring board using a member made of a material different from that of the motherboard. A thermal printer head characterized in that each terminal of a recording electrode wiring board is electrically connected.