JPH0129979Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a hybrid circuit formed by connecting an integrated circuit and a substrate on which an arbitrary circuit is constructed.

Recently, most electronic circuits have tended to be integrated circuits, but there are some circuits that include inductance, such as delay line circuits made up of a combination of coils and capacitors, which are difficult to integrate.
If such a circuit is included in the overall circuit, it will be necessary to connect it to the outside of the integrated circuit. Such an example also corresponds to the case where a buffered delay line is constructed by combining a delay line with a saturation type logic circuit using TTL elements.

Then, a delay line circuit is constructed by arranging coils and capacitors on a printed circuit board, and the board is placed on the flat package of the integrated circuit, and the delay line circuit and the integrated circuit are connected via the terminals of the flat package. A hybrid circuit in which external terminals are exposed to the outside of a dual in-line package (hereinafter referred to as DIP) is known from Japanese Utility Model Application Laid-Open No. 58-89953. However, as shown in the explanatory diagram of Fig. 1, the flat package 21 and the board 20 are stacked and the external terminals B1 and B2 are connected to both, so the position exposed outside the DIP indicated by the dotted line is on the bottom side. External terminal B1 connected to the flat package 21 of
We have no choice but to unify the position. In addition, the board 20 is miniaturized by using chip parts, etc., and circuit parts are arranged thereon. If such a tall hybrid circuit is sealed with resin and the external terminals are pulled out, it must be pulled out horizontally from a position well below the center of the DIP. During DIP molding, the molds are vertically centered around the horizontal portion 22 of the external terminal, but if the horizontal portion 22 is off center, it is difficult to separate the mold smoothly after molding. Of course, many molds are made at once using a mold, but because the molds sometimes separate or do not separate, the surface of the DIP gets scratched and external terminals often bend, resulting in poor yields. .

The present invention improves these drawbacks and provides a hybrid circuit that allows external terminals to be drawn out from approximately the center height of the DIP.

In the present invention, a board on which a circuit is constructed by arranging a plurality of circuit elements is placed on a flat package of an integrated circuit, and the connection between the integrated circuit and the circuit on the board is made by using a flat board on the side of the board. This is done through the terminals of the flat package, and in a hybrid circuit in which the board and the flat package are sandwiched and the whole is sealed with resin with external terminals exposed in two rows, the terminals of the flat package are The external terminal connected to the board extends upward from the connection part and then is bent horizontally, and the horizontal part is at the same height as the horizontal part of the external terminal connected to the board.

Taking the circuit diagram of the buffered delay line shown in FIG. 2 as an example, an explanation will be given below with reference to FIGS. 3 to 7 showing embodiments of the hybrid circuit of the present invention. Figures 3 and 4 are explanatory diagrams for explaining the connections between the delay line circuit and the integrated circuit configured on the board, and Figures 5 and 6 are partial perspective views of the hybrid circuit. , FIG. 7 is an explanatory diagram of the hybrid circuit viewed from the side in the length direction.

In Figure 2, G1 to G6 are TTL elements,
1 is an input terminal, 2 to 6 are output terminals, V _c is a power supply terminal, and E is an earth terminal. A portion surrounded by a dotted line constitutes a delay line, and elements G1 to G6 are configured within an integrated circuit.

FIG. 3 shows a substrate 10 and an integrated circuit flat package 11, each of which constitutes a delay line by arranging coils and capacitors using a known method and connecting them with conductor patterns. The white circles represent pitch positions on a plane where external terminals can exist, which are determined by the standard when formed using a lead frame. V _c A,
NA, EA, 1A to 6A are external terminals, and their positions are determined by the customer's specifications or standards at the time of design. The substrate 10 is moved in parallel to the fourth
It is placed on a flat package 11 as shown in the figure.

Coils and capacitors constituting the delay line on the surface of the substrate 10 are not shown, and only the side grooves and the conductor patterns around the main grooves are shown. An external terminal V _c A serving as the power supply terminal V _c is fixed to the groove 70 , an external terminal 1 A serving as the input terminal 1 to the groove 77 , and an external terminal EA serving as the earth terminal E fixed to the groove 78 . It is connected to the delay line circuit by a conductor pattern (not shown).
The groove 76 has an external terminal 2A serving as the output terminal 2.
is fixed, and the external terminal 2 is fixed by the conductor pattern 12.
A is electrically connected to the groove 73. An external terminal 4A serving as an output terminal 4 is fixed to the groove 75 and connected to the groove 74 through the conductor pattern 13. Groove 79
The external terminal NA fixed to is an empty terminal. The flat package 11 is made up of six TTL elements, and by assigning the same reference numerals to each element as in Figure 2 and making them correspond as shown in Figure 3, the specifications of the external terminals are satisfied. There is. 81 to 87
are the main terminals exposed horizontally on the outside of the flat package 11, and the terminals with black circles, including the terminals without symbols, are bent vertically upwards and their corresponding terminals are exposed from the bottom of the board 10. Fitted into the groove. Output side terminals 85, 86, and 87 of elements G3, G5, and G6 are bent downward at the sides of the flat package 11 and connected to external terminals 3A, 5A, and 6A, respectively. .

The output side terminal 83 of the element G2 is fitted into the groove 73 and passes through the conductor pattern 12 to the external terminal 2.
Connected to A. The terminal 81 on the input side of the element G2 and the groove 71 are connected by a jumper lead J1 formed of a flat metal piece. A delay line circuit is connected to the groove 71 by a conductor pattern (not shown). Also, the output side terminal 84 of element G4
is fitted into the groove 74 and connected to the external terminal 4A via the conductive pattern 13. The terminal 82 on the input side and the groove 72 are connected by a jumper lead J2 formed in the same manner as the jumper lead J1, and the terminal 82 is connected to a delay line circuit.

FIG. 4 shows a state in which the substrate 10 is placed on the flat package 11 in a plan view. Further, the position of the flat package 11 is indicated by a dashed line, and the jumper leads J1 and J2 are indicated by dotted lines.

FIG. 5 is a partial perspective view specifically showing the hybrid circuit in the vicinity of the external terminal V _c A to the external terminal 2A in FIG. 4. The same parts of the substrate 10 as in FIGS. 3 and 4 are shown. Figure 6 is the external terminal of Figure 4.
FIG. 3 is a partial perspective view of a nearby hybrid circuit from EA to external terminal 6A.

The tapered upper portions of the external terminal V _c A, the external terminal 2A, and the external terminal EA are fitted into the grooves of the board 10 and soldered, and become substantially horizontal in the middle and extend further downward. Jumper lead J1,
The jumper lead J2 has a tapered portion at one end soldered to a groove in the substrate 10. The end of the jumper lead J1 on the side connected to the terminal 81 is formed in a U-shape, and the horizontal part of the terminal 81 bent downward is sandwiched from below for connection. The jumper lead J1 is pulled out vertically upward at the connection position as described above, and extends horizontally in a U-shape along the bottom surface 14 of the flat package 11. jumper lead J
The same applies to 2. The external terminal 2A is soldered to the groove 76 of the substrate 10 above the terminal 81 to which the jumper lead J1 is connected. Of course terminal 8
1 and the external terminal 2A are not in contact with each other, and a so-called two-story terminal structure is formed in this part.
The hybrid circuit of this invention is a flat package 1.
An external terminal connected to the terminal 1, for example, an external terminal 6A connected to the terminal 87, has a U-shaped tip, and is connected with the terminal 87 inserted from above. It extends upward from the tip along the side surface of the flat package 11, curves approximately horizontally, and then extends downward. The height of the horizontal portion 15 is the same as that of the horizontal portion 16 of an external terminal connected to the substrate 10, for example, the external terminal EA.

In addition to the board 10 and the flat package 11, FIG. 7 shows an external terminal 6A connected to the terminal 87 of the flat package 11, and an external terminal 4 connected to the board 10.
A and the external terminal EA are shown as representative external terminals, but when the hybrid circuit is sealed with resin by DIP as shown by the dotted line, the external terminal that is connected to the terminal of the flat package 11 and the board 10 are connected. External terminals can be pulled out from the horizontal part from approximately the same height in the center of the package cage. The hybrid circuit of the present invention thus allows the horizontal portions of the external terminals connected to the terminals of the flat package 11 to coincide with the higher horizontal portions of the external terminals connected to the board. Furthermore, by making it easier to smoothly remove the mold after molding, the yield of DIP can be increased, and the product value can be improved by improving the external shape. Although the present invention has been described with reference to a hybrid circuit in which a substrate on which a delay line circuit is formed and an integrated circuit are connected, there is no particular limitation on the circuit formed on the substrate.

[Brief explanation of the drawing]

Figure 1 is an explanatory diagram of a conventional hybrid circuit, Figure 2 is a circuit diagram of a buffered delay line used in the hybrid circuit of the present invention, and Figures 3, 4, and 7 are diagrams of the hybrid circuit of the present invention. 5 and 6 are partial perspective views of the hybrid circuit of the present invention. 1: Input terminal, 2, 3, 4, 5, 6: Output terminal, 10: Board, 11: Flat package, 1
2, 13: Conductor pattern, 14: Bottom surface, 15, 1
6: Horizontal part, 1A to 6A: External terminal, G1 to G
6: TTL element, J1, J2: jumper lead.

Claims (1)

[Scope of utility model registration request] A board on which a circuit is constructed by arranging a plurality of circuit elements is placed on a flat package of an integrated circuit, and the connection between the integrated circuit and the circuit of the board is made through the terminals of the flat package on the side of the board. In a hybrid circuit that is entirely resin-sealed with the board and the flat package sandwiched between them to expose external terminals in two rows, the external terminals connected to the terminals of the flat package are A hybrid circuit characterized in that the terminal is bent horizontally after extending upward from the connection part, and the horizontal part is at the same height as the horizontal part of the external terminal connected to the board.