JPH0119395Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention particularly relates to a mounting structure for semiconductor elements used in hybrid integrated circuits.

Recently, as semiconductor elements used in hybrid integrated circuits become more integrated, the number of connection electrodes for the elements tends to increase. On the other hand, these electrodes are generally arranged along the edge of the device for connection with the outside, and as a result, as the number of electrodes increases, the dimensions of the device are determined by the number of electrodes. There is.
Therefore, it is advantageous to make the electrode dimensions as small as possible.

However, when the electrodes of the element are made smaller and the number of electrodes is increased, the following problems arise with the wiring conductor (conductor pattern) on the substrate side. That is, a partial plan view a of FIG. 1 and a sectional view b taken along X-X′ of FIG. 1 a.
As shown in FIG.
Since the wiring conductor 5 on the substrate 4 to be connected via is formed around the semiconductor element 1, it is necessary to reduce the wiring conductor 5 to the same size as the electrode 2 of the element. (corresponding to the sum of A and B in the figure) currently has a limit of 200 to 300 μm when considered on a mass production basis.

Additionally, in order to increase the number of wiring conductors, it is possible to increase the peripheral dimensions by moving the electrodes further away from the periphery of the element, but there is a limit to placing the electrodes too far away from the periphery of the element because the connections between the electrodes and the wiring conductors are thin metal wires. Yes, unfavorable in terms of reliability.

The present invention aims to eliminate the above-mentioned drawbacks, provide as many conductor patterns on the substrate as close to the periphery of the element as possible, and realize connections between element substrates that correspond to the miniaturization of the element.

According to the present invention, this purpose is to mount a semiconductor element on one main surface of a substrate, and connect the electrode of the element to a conductor pattern of the substrate by a thin metal wire, in which the conductor pattern is connected to the one main surface of the substrate. By comprising a wiring conductor formed around the upper element, and a conductive terminal having a conductive through hole located between the element and the wiring conductor and penetrating from the one main surface to the other main surface. achieved.

Fig. 2 shows an embodiment of the present invention, Fig. 2a is a plan view, Fig. 2b is a sectional view taken along Y-Y' in Fig. is attached. That is, the difference from the conventional example shown in FIG. 1 is that a conductive terminal 7 having a conductive through hole 6 is provided between the wiring conductor 5 and the semiconductor element 1.
The conductive terminal 7 and the wiring conductor 5 constitute a conductive pattern on the board. As long as the conductive terminals 7 are closer to the element 1 than the wiring conductor 5, their position and number are not particularly limited. It is preferable that the insulation region 8 be located on an extension of the insulating region 8 .

With this configuration, the electrode 9 of the element 1 is connected to the conductive terminal 7 having the through hole 6 using the thin metal wire 3, and the next connection is made by jumping over the conductive terminal 7 and connecting to the wiring conductor 5. By performing this alternately, it is possible to connect about twice as many electrodes around the element 1 on the substrate 4 as in the conventional method. As shown in FIG. 2b, the conductive terminal 7 is drawn out to the back surface of the substrate 7 through the conductive through hole 6 and connected to a circuit configured on the back surface, or is guided to an appropriate position and connected to the conductive through hole. Alternatively, it is also possible to connect to the surface of the substrate 4 again around the substrate.

As described above, according to the present invention, a large number of electrodes can be provided around the element on the substrate, so the number of electrodes on the element can be increased while making the element smaller, and the circuit can be configured on the back side of the substrate. Coupled with this, it becomes possible to downsize and integrate the device as a whole.

[Brief explanation of the drawing]

Fig. 1 shows a conventional structure, where a is a plan view, b is a sectional view taken along line is a sectional view taken along line Y-Y' in FIG. DESCRIPTION OF SYMBOLS 1... Semiconductor element, 3... Metal thin wire, 4... Substrate, 5... Wiring conductor, 6... Conductive through hole, 7... Conductive terminal, 9... Electrode.

Claims (1)

[Scope of utility model registration request] In a device in which a semiconductor element is mounted on one main surface of a substrate, and an electrode of the element is connected to a conductive pattern of the substrate by a thin metal wire, the conductive pattern is connected to a wiring formed around the element on the one main surface. a conductor;
A mounting structure for a semiconductor element, comprising a conductive terminal having a conductive through hole located between the element and the wiring conductor and penetrating from the one main surface to the other main surface.