JPH01267816A - Thin film magnetic head element assembly - Google Patents
Thin film magnetic head element assemblyInfo
- Publication number
- JPH01267816A JPH01267816A JP9534288A JP9534288A JPH01267816A JP H01267816 A JPH01267816 A JP H01267816A JP 9534288 A JP9534288 A JP 9534288A JP 9534288 A JP9534288 A JP 9534288A JP H01267816 A JPH01267816 A JP H01267816A
- Authority
- JP
- Japan
- Prior art keywords
- magnetic head
- film magnetic
- thin film
- thin
- head element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010409 thin film Substances 0.000 title claims abstract description 97
- 239000004020 conductor Substances 0.000 claims abstract description 11
- 238000005520 cutting process Methods 0.000 abstract description 13
- 238000007667 floating Methods 0.000 abstract description 6
- 239000010408 film Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910000889 permalloy Inorganic materials 0.000 description 2
- 241000238366 Cephalopoda Species 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Landscapes
- Magnetic Heads (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、一枚のウェファ上に多数の薄l1M磁気ヘッ
ド要素を整列して担持させた薄膜61気ヘッド要素集合
体に関し、同一列に属する各薄III磁気ヘッド要素の
外部導体接続用パッド部を同一方向に導出することによ
り、スクイ5UノD IJP 、&J門圓側に設けられ
る2本のレール部の一方にのみ、薄膜磁気ヘッド要素を
担持させた浮上型薄膜磁気ヘッドを容易に得ることがで
きるようにしたものである。Detailed Description of the Invention <Industrial Application Field> The present invention relates to a thin film 61M magnetic head element assembly in which a large number of thin 1M magnetic head elements are aligned and supported on a single wafer. By leading out the external conductor connection pad portions of each thin-film magnetic head element in the same direction, the thin-film magnetic head element can be attached to only one of the two rail portions provided on the SQUID 5U, DIJP, &J gate side. This makes it possible to easily obtain a floating thin-film magnetic head that carries a.
〈従来の技術〉
第9図は特開昭61−137288号等で知られた従来
の浮上型薄膜磁気ヘッドの一般的な構造を示す斜視図で
、A1203−Tic等のセラミック構造体でなるスラ
イダ1の媒体対向面側に、間隔をおいて2木のレール部
101.102を突設し、レール部101.102の表
面を高度の平面度を有する浮上面103.104とする
と共に、レール部101.102の空気流出方向aの端
部のそれぞれに薄膜磁気ヘッド要素2A、2Bを担持さ
せである。<Prior Art> FIG. 9 is a perspective view showing the general structure of a conventional floating thin film magnetic head known from Japanese Patent Laid-Open No. 61-137288, etc., in which a slider made of a ceramic structure such as A1203-Tic is used. Two rail portions 101 and 102 are provided at intervals on the side of the medium facing surface of No. 1, and the surfaces of the rail portions 101 and 102 are made into air bearing surfaces 103 and 104 having a high degree of flatness. Thin-film magnetic head elements 2A and 2B are supported at the ends of 101 and 102 in the air outflow direction a, respectively.
磁気ディスク装置に装着して使用する場合、2本のレー
ル部101,102に担持させた2つの薄膜磁気ヘッド
要素2A、2Bが同時に使用される訳ではなく、何れか
一方だけが使用される。薄膜l1fi気ヘッド要素2A
、2Bのどちらを使用するかは、主として、磁気ディス
ク装置側の要求によって定まる。例えば磁気ディスクの
両面側で記録再生を行なう場合、表側の記録再生時には
薄膜磁気ヘッド要素2Aを使用し、裏側の記録再生には
薄膜磁気ヘッド要素2Bを使用する。そこで、薄膜磁気
ヘッド要素2A、2Bが何れが要求された場合でも対応
できるように、レール部101.102の両者に薄膜磁
気ヘッド要素2A、2Bを担持させである。When used mounted on a magnetic disk device, the two thin film magnetic head elements 2A and 2B supported by the two rail parts 101 and 102 are not used at the same time, but only one of them is used. Thin film l1fi air head element 2A
, 2B to be used is mainly determined by the request of the magnetic disk device. For example, when recording and reproducing on both sides of a magnetic disk, the thin film magnetic head element 2A is used for recording and reproducing on the front side, and the thin film magnetic head element 2B is used for recording and reproducing on the back side. Therefore, the thin film magnetic head elements 2A and 2B are supported on both of the rail portions 101 and 102 so that the thin film magnetic head elements 2A and 2B can be used regardless of the requirements.
薄膜磁気ヘッド要素2A、2BはIC製造テクノロジと
同様のプロセスにしたがって形成された薄膜素子である
。第10図は面内記録再生用の薄膜磁気ヘッド要素2の
付近の拡大断面図で、21はパーマロイ等でなる下部磁
性膜、22はAl2O3、SiC等で形成された絶縁ギ
ャップ膜、23.24は導体コイル膜、25〜27はフ
ォトレジスト等で形成された眉間絶縁膜、28はパーマ
ロイ等でなる上部磁性膜である。3は保護膜であり、薄
膜磁気ヘッド要素2A、2Bのそれぞれの導体コイル膜
23.24は保護膜3の表面に形成された外部導体接続
用のパッド部(41A、42A)、(41B、42B)
に導通接続されている。薄IJM 1iff気ヘッド要
素2人、2Bとしては、上述の面内記録再生用の他に、
垂直記録再生用のものも知られている。The thin film magnetic head elements 2A and 2B are thin film elements formed according to a process similar to IC manufacturing technology. FIG. 10 is an enlarged cross-sectional view of the vicinity of the thin film magnetic head element 2 for in-plane recording and reproducing, in which 21 is a lower magnetic film made of permalloy or the like, 22 is an insulating gap film made of Al2O3, SiC, etc., 23.24 2 is a conductive coil film, 25 to 27 are glabellar insulating films made of photoresist or the like, and 28 is an upper magnetic film made of permalloy or the like. 3 is a protective film, and the conductor coil films 23 and 24 of each of the thin film magnetic head elements 2A and 2B are formed on the surface of the protective film 3 and have pad portions (41A, 42A) and (41B, 42B) for connecting external conductors. )
Continuously connected to. Thin IJM 1iff head element 2, 2B, in addition to the above-mentioned in-plane recording and reproduction,
Types for perpendicular recording and reproduction are also known.
上述の薄膜磁気ヘッドを得るには、第11図(a)に示
すように、スライダとなるウェファ1上に薄膜磁気ヘッ
ド要素を整列して担持させ、各薄lIi磁気ヘッド要素
のパッド部(41A、42A)、(41B、42B)を
、ウェファ1上の保護膜3の表面に導出した薄lli!
ii!気ヘッド要素集合体を製造する。各薄膜磁気ヘッ
ド要素の2組のパッド部(41A、42A)、(41B
、42B)は導出方向が互いに逆方向となるように、向
き合わせて形成する。In order to obtain the above-mentioned thin film magnetic head, as shown in FIG. , 42A), (41B, 42B) were introduced onto the surface of the protective film 3 on the wafer 1.
ii! A gas head element assembly is manufactured. Two sets of pad portions (41A, 42A) and (41B) of each thin film magnetic head element
, 42B) are formed facing each other so that their derivation directions are opposite to each other.
上述のウェファ1から薄膜磁気ヘッドを取出すには、列
H8〜Hnの各々の間に設定された切断位置(X+
X+)〜(Xo+1−Xo+I)でウェファ1を切断
し、第11図(b)に示すような薄1]! 6i1気ヘ
ッド要素集合体を切出す、第11図(b)は切断位置(
X4 X4)と切断位置(Xs Xs)で切断され
た列H4の薄膜磁気ヘッド要素集合体を示している。こ
の後、切出された薄膜磁気ヘッド要素集合体に対し、ス
ライダとして必要な溝入れ加工、研磨加工等を施した後
、各薄膜磁気ヘッド要素毎に、2組のパッド部(41A
、42A)、(41B、42B)を含むように、切断位
置(y+ −y+) 〜(yn−yn)で切断する。In order to take out the thin film magnetic head from the wafer 1 described above, the cutting position (X+
The wafer 1 is cut at X+) to (Xo+1-Xo+I) to form a thin layer 1]! as shown in FIG. 11(b). The 6i1 head element assembly is cut out. FIG. 11(b) shows the cutting position (
The thin film magnetic head element assembly of row H4 is shown cut at the cutting position (Xs Xs). Thereafter, the cut out thin-film magnetic head element assembly is subjected to grooving, polishing, etc. necessary for the slider, and then two sets of pad portions (41A
, 42A) and (41B, 42B) at the cutting positions (y+ -y+) to (yn-yn).
〈発明が解決しようとする問題点〉
しかしながら、上述した従来技術には次のような問題点
があった。<Problems to be Solved by the Invention> However, the above-mentioned prior art has the following problems.
(イ)第11図(a)に示す薄膜磁気ヘッド要素集合体
は、第9図に示した如く、2つのレール部101.10
2のそれぞれに2つの薄膜磁気ヘッド要素2A、2Bを
備えた薄膜磁気ヘッドを製造するために用意されたもの
である。ところが、この薄膜磁気ヘッド要素集合体より
得られる薄膜磁気ヘッドは、磁気ディスク装置に装着し
て使用する場合、2つの薄膜磁気ヘッド要素2A、2B
の何れか一方だけが使用されるにも拘わらず、2つの薄
膜磁気ヘッド要素2A、2Bを備えているため、薄膜磁
気ヘッド要素に起因するトラブル発生確率が高くなる。(b) The thin film magnetic head element assembly shown in FIG. 11(a) has two rail parts 101 and 10 as shown in FIG.
2 is prepared for manufacturing a thin film magnetic head having two thin film magnetic head elements 2A and 2B, respectively. However, when the thin film magnetic head obtained from this thin film magnetic head element assembly is mounted on a magnetic disk device and used, two thin film magnetic head elements 2A and 2B are used.
Although only one of them is used, since two thin film magnetic head elements 2A and 2B are provided, the probability of trouble occurring due to the thin film magnetic head element is increased.
例えば、浮上面103.104の平面度を出すための研
磨工程における割れ、クラック等の発生確率は薄膜磁気
ヘッド要素の数が多い程、高くなる。これらの欠陥は歩
留りを低下させ、浮上特性及び読み書き動作に悪影響を
与える。For example, the greater the number of thin-film magnetic head elements, the higher the probability of occurrence of cracks, etc. in the polishing process for improving the flatness of the air bearing surfaces 103 and 104. These defects reduce yield and adversely affect flying characteristics and read/write operations.
(ロ)第11図(a)の薄膜磁気ヘッド要素集合体より
得られる薄膜磁気ヘッドは、1個の薄膜磁気ヘッド要素
があればよいのにも関わらず、2個の薄膜磁気ヘッド要
素2A、2Bを備え、薄膜磁気ヘッド要素2A、2B毎
にパッド部(41A。(b) Although the thin film magnetic head obtained from the thin film magnetic head element assembly shown in FIG. 11(a) only requires one thin film magnetic head element, two thin film magnetic head elements 2A, 2B, and a pad portion (41A) is provided for each thin film magnetic head element 2A, 2B.
42A)、(41B、42B)を形成していたため、パ
ッド部(41A、42A)、(41B。42A) and (41B, 42B), the pad portions (41A, 42A) and (41B) were formed.
42B)を形成するのに必要な面積以下には小型化でき
ない。このため、高密度記録対応の小型の薄膜磁気ヘッ
ドを得ることが困難になっている。42B). For this reason, it has become difficult to obtain a small thin-film magnetic head that is compatible with high-density recording.
く問題点を解決するための手段〉
上述する従来の問題点を解決するため、本発明は、一枚
のウェファ上に多数の薄膜磁気ヘッド要素を整列して担
持する薄l1M磁気ヘッド要素集合体において、同一列
に属する各薄膜磁気ヘッド要素の外部導体接続用パッド
部を、薄膜6f!気ヘツト要素の配列方向に向って同一
方向に導出したことを特徴とする。Means for Solving the Problems> In order to solve the above-mentioned problems of the conventional art, the present invention provides a thin 1M magnetic head element assembly in which a large number of thin film magnetic head elements are aligned and supported on a single wafer. , the external conductor connection pad portions of each thin film magnetic head element belonging to the same row are connected to the thin film 6f! It is characterized in that it is derived in the same direction as the direction in which the attentional elements are arranged.
く作用〉
同一列に属する各薄膜磁気ヘット要素の外部導体接続用
パッド部を、薄膜磁気ヘッド要素の配列方向に向って同
一方向に導出しであるので、各パッド部毎にウェファの
切断加工を行なうことにより、スライダに設けられた2
木のレール部の一方にのみ111M磁気ヘッド要素を担
持させた浮上型薄膜磁気ヘッドを、容易に得ることがで
きる。2木のレール部の一方にのみ薄膜磁気ヘッド要素
を担持させた浮上型薄膜磁気ヘッドは、薄膜磁気ヘッド
要素に起因するトラブル発生確率が低く、歩留りが向上
すると共に、安定した浮上特性及び磁気記録再生特性が
得られる。また、1個の薄膜磁気ヘッド要素を備えるだ
けであるので、この1個の薄IIA Iin気ヘッド要
素に必要なスペースまで小型化でき、高密度記録対応の
小型薄膜磁気ヘッドを実現できる。Since the external conductor connection pad portions of each thin-film magnetic head element belonging to the same row are led out in the same direction toward the arrangement direction of the thin-film magnetic head elements, the wafer cutting process is performed for each pad portion separately. By doing this, the 2 provided on the slider
A floating thin film magnetic head in which a 111M magnetic head element is supported only on one of the wooden rails can be easily obtained. A floating thin film magnetic head in which a thin film magnetic head element is supported only on one side of two wooden rails has a low probability of trouble occurring due to the thin film magnetic head element, improves yield, and provides stable flying characteristics and magnetic recording. Regeneration characteristics can be obtained. Furthermore, since only one thin film magnetic head element is provided, the space required for this one thin IIA Iin head element can be reduced, and a compact thin film magnetic head capable of high-density recording can be realized.
〈実施例〉
第1図は本発明に係る薄膜磁気ヘッド要素集合体の斜視
図、第2図は同じく一部拡大平面図である。図示するよ
うに、一枚のウェファ1上に多数の薄膜lin気ヘッド
要素を整列して担持する薄1lfi磁気ヘッド要素集合
体において、同一列H1〜H。<Embodiment> FIG. 1 is a perspective view of a thin film magnetic head element assembly according to the present invention, and FIG. 2 is a partially enlarged plan view. As shown in the figure, in a thin 1lfi magnetic head element assembly in which a large number of thin film magnetic head elements are aligned and supported on one wafer 1, the same rows H1 to H.
に属する各薄膜磁気ヘッド要素の外部導体接続用パッド
部(4H目〜4 H、n)〜(4H,、〜4.n)を、
薄l1Ulii1気ヘッド要素の配列方向Xに向って同
一方向に導出しである。例えば、列H1〜H1に着目し
た場合、第2図に拡大して示すように、列H1に属する
薄膜磁気ヘッド要素のパッド部4H,,〜4H14、列
H2に属する薄膜磁気ヘッド要素のパッド部(4H21
〜4H24)及び列H8に属する薄膜6n気ヘツド要素
のパッド部(4H*+〜4H34)は、各列H1〜H3
毎に同一方向に導出しである。図示は省略しであるが、
ウェファ1上には、第10図に示す構造の薄膜磁気ヘッ
ド要素が形成されており、パッド部(4H+t〜4 H
、n)〜(4HnI〜4 nn)のそれぞれは薄膜磁気
ヘッド要素のそれぞれの導体コイル膜に接続されている
。The external conductor connection pad portion (4H to 4H, n) to (4H,, to 4.n) of each thin film magnetic head element belonging to
The thin l1Ulii1 air is derived in the same direction toward the arrangement direction X of the head elements. For example, when focusing on rows H1 to H1, as shown in an enlarged view in FIG. 2, pad portions 4H, . (4H21
~4H24) and the pad portion (4H*+~4H34) of the thin film 6n air head element belonging to row H8 are
They are derived in the same direction. Although not shown,
On the wafer 1, a thin film magnetic head element having the structure shown in FIG.
, n) to (4HnI to 4nn) are connected to respective conductor coil films of the thin film magnetic head element.
パッド部(4H1〜4 H、n)〜(4H,、〜4nn
)は、隣り合う列間では、互いに逆方向に導出する。例
えば、列H1〜H3に着目した場合、第2図に拡大して
示すように、隣り合う列H1と列H2では、パッド部(
4H+t〜4 H14)とパッド部(4H21〜4 H
24)の導出方向を互いに逆にし、列H2と列H5では
パッド部(4H21〜4H24)とパッド部(4831
〜4H34)の導出方向を互いに逆にする。Pad part (4H1~4H,n)~(4H,,~4nn
) are derived in opposite directions between adjacent columns. For example, when focusing on columns H1 to H3, as shown in an enlarged view in FIG.
4H+t~4H14) and pad part (4H21~4H
24) are reversed, and in column H2 and column H5, pad portions (4H21 to 4H24) and pad portions (4831
~4H34) are derived in opposite directions.
上述の薄膜磁気ヘッド要素集合体から薄Ili iii
気ヘッドを取り出すには、第3図に示すように、各列H
1−H,の間に設定された切断位置(Xl−X+)〜(
Xn−I Xn++)でウェファ1を切断し、各列H
,−Hn毎に分離独立させる。第4図及び第5図はこう
して分離された各列毎の薄膜磁気ヘッド要素集合体を示
している。第4図は切断位置(X3 X3)と(Xn
Xn)で切断して得られた列H3の薄膜磁気ヘッ
ド要素集合体を示し、第5図は切断位置(Xn Xn
)と(x、 X5)で切断して得られた列H4の薄膜磁
気ヘッド要素集合体を示している。第4図の列H3の薄
膜磁気ヘッド要素集合体の場合、切断位置x4側がAB
S面となり、第5図の列H4の薄I1M磁気ヘッド要素
集合体では切断位置X、がABS面となる。Thin Ili iii from the above-mentioned thin film magnetic head element assembly
To remove the air head, remove each column H as shown in Figure 3.
1-H, the cutting position set between (Xl-X+) ~ (
Cut wafer 1 with Xn-I Xn++) and cut each row H
, -Hn are separated and independent. FIGS. 4 and 5 show the thus separated thin film magnetic head element assembly for each row. Figure 4 shows the cutting position (X3
FIG. 5 shows the thin film magnetic head element assembly of row H3 obtained by cutting at the cutting position (Xn
) and (x, In the case of the thin film magnetic head element assembly in row H3 in FIG. 4, the cutting position x4 side is AB.
In the case of the thin I1M magnetic head element assembly in row H4 in FIG. 5, the cutting position X becomes the ABS plane.
次に、第4図及び第5図の薄膜tin気ヘッド要素集合
体に対し、第6図に示すように、そのABS面にスライ
ダとして必要な溝入れ加工、研磨加工等を施した後、パ
ッド部(4H++〜4H+n)〜(4Hn1〜4nn)
の各個毎に、切断位置(Yl−y+)、(Y、1−Yo
)で切断する。Next, as shown in FIG. 6, the thin film tin head element assembly shown in FIGS. part (4H++~4H+n)~(4Hn1~4nn)
For each piece, the cutting position (Yl-y+), (Y, 1-Yo
) to cut.
第7図及び第8図は上述の工程を経て取り出された薄膜
1if1気ヘツドの斜視図である。図において、第9図
と同一の参照符号は同一性ある構成部分を示している。7 and 8 are perspective views of the thin film 1if1 air head taken out through the above-described process. In the figure, the same reference numerals as in FIG. 9 indicate the same components.
第7図は第5図に示す集合体から得られた薄膜磁気ヘッ
ドを示し、第8図は第4図に示す集合体から得られた薄
膜磁気ヘッドを示す。第7図の磁気ヘッドは2本のレー
ル部101.102のうち、レール部101の空気流出
端部にのみ薄膜磁気ヘッド要素2Aを備えさせ、レール
部102には薄膜磁気ヘッド要素は備えない。第8図の
磁気ヘッドはレール部102の空気流出端部にのみ、薄
膜磁気ヘッド要素2Bを備えさせ、レール部101には
薄膜磁気ヘッド要素を備えない。レール部101.10
2のどちらに薄膜磁気ヘッド要素を担持させるかは、前
述したように、磁気ディスク装置の要求によって定まる
が、本発明に係る薄膜磁気ヘッド集合体からは第7図及
び第8図の薄膜磁気ヘッドが得られるので、この要求に
充分に対応できる。FIG. 7 shows a thin film magnetic head obtained from the assembly shown in FIG. 5, and FIG. 8 shows a thin film magnetic head obtained from the assembly shown in FIG. In the magnetic head of FIG. 7, of the two rail sections 101 and 102, only the air outflow end of the rail section 101 is provided with a thin film magnetic head element 2A, and the rail section 102 is not provided with a thin film magnetic head element. The magnetic head shown in FIG. 8 is provided with a thin film magnetic head element 2B only at the air outflow end of the rail part 102, and the rail part 101 is not provided with a thin film magnetic head element. Rail part 101.10
As mentioned above, which of the thin film magnetic head elements is to be supported is determined by the requirements of the magnetic disk device, but from the thin film magnetic head assembly according to the present invention, can be obtained, so this requirement can be fully met.
〈発明の効果〉
以上述べたように、本発明に係る薄膜磁気ヘッド要素集
合体は、スライダに設けられる2本のレール部の一方に
のみ薄膜磁気ヘッド要素を担持する薄膜磁気ヘッドを容
易に得ることができる。<Effects of the Invention> As described above, the thin film magnetic head element assembly according to the present invention makes it easy to obtain a thin film magnetic head in which the thin film magnetic head element is supported only on one of the two rails provided on the slider. be able to.
こうして得られた薄膜磁気ヘッドは、薄膜tn気ヘッド
要素に起因するトラブル発生の確率が低い。従って、本
発明によれば、浮上特性及び磁気記録再生特性の良好な
薄膜磁気ヘッドを高歩留りで製造できる。また、1個の
薄膜磁気ヘッド要素を備えるだけであるので、この1個
の薄膜磁気ヘッド要素に必要なスペースまで形状を小型
化し、高密度記録対応の薄llU磁気ヘッドを提供でき
る。The thus obtained thin film magnetic head has a low probability of trouble occurring due to the thin film magnetic head element. Therefore, according to the present invention, a thin film magnetic head with good flying characteristics and magnetic recording and reproducing characteristics can be manufactured with high yield. Further, since only one thin film magnetic head element is provided, the size can be reduced to the space required for this one thin film magnetic head element, and a thin llU magnetic head capable of high density recording can be provided.
第1図は本発明に係る薄膜磁気ヘッド要素集合体の斜視
図、第2図は同じく一部拡大平面図、第3図〜第6図は
本発明に係る薄膜磁気ヘッド要素集合体から薄lIN磁
気ヘッドを取出す工程を示す図、第7図及び第8図は本
発明に係る薄膜磁気ヘッド要素集合体から得られた薄膜
磁気ヘッドの各斜視図、第9図は従来の薄llI磁気ヘ
ッドの斜視図、第10図は薄l1M磁気ヘッド要素付近
の拡大断面図、第11図(a)及び(b)は第9図及び
第10図に示した薄膜磁気ヘッドを得る工程を示す図で
ある。
1・・・ウェファ
(4H目〜4HIn)〜(4Hn+〜4 nn)・・・
薄膜磁気ヘッド要素
H1〜Hn・・・・列
第3図
第9図
第10図
第11図
+01
×n;1FIG. 1 is a perspective view of a thin film magnetic head element assembly according to the present invention, FIG. 2 is a partially enlarged plan view, and FIGS. 7 and 8 are perspective views of a thin film magnetic head obtained from a thin film magnetic head element assembly according to the present invention, and FIG. 9 is a diagram showing a process of taking out a magnetic head. A perspective view, FIG. 10 is an enlarged sectional view of the vicinity of a thin 11M magnetic head element, and FIGS. 11(a) and (b) are diagrams showing the process of obtaining the thin film magnetic head shown in FIGS. 9 and 10. . 1...Wafer (4Hth~4HIn)~(4Hn+~4nn)...
Thin-film magnetic head elements H1 to Hn...row Figure 3 Figure 9 Figure 10 Figure 11 +01 ×n;1
Claims (2)
整列して担持する薄膜磁気ヘッド要素集合体において、
同一列に属する各薄膜磁気ヘッド要素の外部導体接続用
パッド部を、薄膜磁気ヘッド要素の配列方向に向って同
一方向に導出したことを特徴とする薄膜磁気ヘッド要素
集合体。(1) In a thin film magnetic head element assembly in which a large number of thin film magnetic head elements are aligned and supported on a single wafer,
1. A thin film magnetic head element assembly characterized in that the external conductor connection pad portions of each thin film magnetic head element belonging to the same row are led out in the same direction toward the arrangement direction of the thin film magnetic head elements.
出方向が互いに逆方向に設定されていることを特徴とす
る特許請求の範囲第1項に記載の薄膜磁気ヘッド要素集
合体。(2) The thin film magnetic head element assembly according to claim 1, wherein the leading directions of the external conductor connecting pad portions are set in opposite directions between adjacent rows.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9534288A JP2642395B2 (en) | 1988-04-18 | 1988-04-18 | Thin-film magnetic head element assembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9534288A JP2642395B2 (en) | 1988-04-18 | 1988-04-18 | Thin-film magnetic head element assembly |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01267816A true JPH01267816A (en) | 1989-10-25 |
JP2642395B2 JP2642395B2 (en) | 1997-08-20 |
Family
ID=14135018
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9534288A Expired - Lifetime JP2642395B2 (en) | 1988-04-18 | 1988-04-18 | Thin-film magnetic head element assembly |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2642395B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5704112A (en) * | 1992-05-29 | 1998-01-06 | Tdk Corporation | Method of manufacturing a magnetic head |
US6125004A (en) * | 1992-05-29 | 2000-09-26 | Tdk Corporation | Magnetic head and method of manufacturing a magnetic head |
-
1988
- 1988-04-18 JP JP9534288A patent/JP2642395B2/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5704112A (en) * | 1992-05-29 | 1998-01-06 | Tdk Corporation | Method of manufacturing a magnetic head |
US6125004A (en) * | 1992-05-29 | 2000-09-26 | Tdk Corporation | Magnetic head and method of manufacturing a magnetic head |
Also Published As
Publication number | Publication date |
---|---|
JP2642395B2 (en) | 1997-08-20 |
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