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JPH01164758U - - Google Patents

Info

Publication number
JPH01164758U
JPH01164758U JP1989051949U JP5194989U JPH01164758U JP H01164758 U JPH01164758 U JP H01164758U JP 1989051949 U JP1989051949 U JP 1989051949U JP 5194989 U JP5194989 U JP 5194989U JP H01164758 U JPH01164758 U JP H01164758U
Authority
JP
Japan
Prior art keywords
cylindrical member
cathode sputtering
sputtering device
target
length
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989051949U
Other languages
Japanese (ja)
Other versions
JPH0232684Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPH01164758U publication Critical patent/JPH01164758U/ja
Application granted granted Critical
Publication of JPH0232684Y2 publication Critical patent/JPH0232684Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Medicines Containing Plant Substances (AREA)
  • Acyclic And Carbocyclic Compounds In Medicinal Compositions (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、この考案に係るカソードスパツタリ
ング装置の一実施例の断面図、第２図は、同じく
側面図、第３図は、第１図３―３線矢視方向断面
図である。 １０……カソード装置、１１……減圧コーテイ
ング室、１２……底壁、１３……上壁、１４，１
５……側壁、１６，１７……シール、１８……真
空ポンプ、１９……ガス供給管、２０……バルブ
、２１……円筒状部材、２２……磁石装置、２３
……内側端壁、２４……外側端壁、２５……トラ
ニヨン、２６……ブラケツト、２７……ブツシユ
、２８，２９……カラー、３０……ネジ、３１…
…ターゲツトストリツプ、３２……コーテイング
材、３３……クランプバー、３３ａ……ネジ、３
４……凹部、３５……フランジ、３６……クーラ
ント供給管、３７……ハンガー部材、３８……ト
ラウニオン、３９……キヤツプ、４０……パイプ
、４１……孔、４２……放出管、４３……槽、４
４……ロツクバー、４４ａ……ロツド、４５……
永久磁石、４６……永久磁石の外側の足、４７…
…ストリツプ、４８……永久磁石の内側の足、４
９……ストリツプ、５０，５１……ネジ、５２…
…ストリツプの底面、５３……操作レバー、５４
……カラー、５５……ネジ、５６……電気接点、
ｓ……コーテイングされる基材、５９……水平軸
、５７，５８……ローラー、６０，６１……ベア
リングブロツク。 FIG. 1 is a sectional view of an embodiment of the cathode sputtering device according to this invention, FIG. 2 is a side view thereof, and FIG. 3 is a sectional view taken along the line 3-3 in FIG. . 10...Cathode device, 11...Reduced pressure coating chamber, 12...Bottom wall, 13...Top wall, 14,1
5... Side wall, 16, 17... Seal, 18... Vacuum pump, 19... Gas supply pipe, 20... Valve, 21... Cylindrical member, 22... Magnet device, 23
... Inner end wall, 24 ... Outer end wall, 25 ... Trunnion, 26 ... Bracket, 27 ... Button, 28, 29 ... Collar, 30 ... Screw, 31 ...
...Target strip, 32...Coating material, 33...Clamp bar, 33a...Screw, 3
4... recess, 35... flange, 36... coolant supply pipe, 37... hanger member, 38... trunion, 39... cap, 40... pipe, 41... hole, 42... discharge pipe, 43 ...Tank, 4
4... Lock bar, 44a... Rod, 45...
Permanent magnet, 46...Outer leg of permanent magnet, 47...
...Strip, 48...Permanent magnet inner leg, 4
9...Strip, 50, 51...Screw, 52...
... Bottom of the strip, 53 ... Operation lever, 54
...Color, 55...Screw, 56...Electric contact,
s...Base material to be coated, 59...Horizontal shaft, 57, 58...Roller, 60, 61...Bearing block.

Claims (1)

【実用新案登録請求の範囲】 (1) 円筒状部材と、この円筒状部材を回転させ
る手段とを備え、スパツタすべきコーテイング材
を保有するターゲツト手段を前記円筒状部材に着
脱自由に取り付け、 前記ターゲツト手段は、円筒状部材の周縁にそ
の長さ方向に沿つて装着されて互いに間隔をおい
て平行に配置され、前記円筒状部材に対し着脱自
由に取り付けられている複数のターゲツトストリ
ツプからなることを特徴とするカソードスパツタ
リング装置。 (2) 前記ターゲツト手段を構成するターゲツト
ストリツプは、各ターゲツトストリツプの間に配
置されたクランプ手段により前記円筒状部材に対
し着脱自由に取り付けられている実用新案登録請
求の範囲第１項記載のカソードスパツタリング装
置。 (3) 前記クランプ手段は、各ターゲツトストリ
ツプの間に配置されて、各ターゲツトストリツプ
に係合するクランプバーと、これを前記円筒状部
材に対し着脱自由に取り付ける手段とからなる実
用新案登録請求の範囲第２項記載のカソードスパ
ツタリング装置。 (4) 前記円筒状部材の内部を冷却する手段を備
えた実用新案登録請求の範囲第１項記載のカソー
ドスパツタリング装置。 (5) 前記円筒状部材の内部に磁石装置が設けて
ある実用新案登録請求の範囲第１項記載のカソー
ドスパツタリング装置。 (6) 前記円筒状部材の内部に磁石装置が、その
長さ方向に沿い設けてある実用新案登録請求の範
囲第１項記載のカソードスパツタリング装置。 (7) 前記円筒状部材の内部に永久磁石装置が、
その長さ方向に沿い設けてある実用新案登録請求
の範囲第３項記載のカソードスパツタリング装置
。[Claims for Utility Model Registration] (1) Target means comprising a cylindrical member and a means for rotating the cylindrical member, and which holds a coating material to be sputtered is detachably attached to the cylindrical member; The targeting means includes a plurality of target strips attached to the periphery of the cylindrical member along its length, spaced apart from each other and parallel to each other, and detachably attached to the cylindrical member. A cathode sputtering device characterized by: (2) The target strips constituting the target means are detachably attached to the cylindrical member by clamp means arranged between each target strip. The cathode sputtering device described in Section 1. (3) The clamp means is a practical device comprising a clamp bar disposed between each target strip and engaged with each target strip, and means for detachably attaching the clamp bar to the cylindrical member. A cathode sputtering device according to claim 2 of the patent registration claim. (4) The cathode sputtering device according to claim 1, which is provided with means for cooling the inside of the cylindrical member. (5) The cathode sputtering device according to claim 1, wherein a magnet device is provided inside the cylindrical member. (6) The cathode sputtering device according to claim 1, wherein a magnet device is provided inside the cylindrical member along its length. (7) A permanent magnet device is provided inside the cylindrical member,
The cathode sputtering device according to claim 3, which is provided along the length of the cathode sputtering device.
JP1989051949U 1983-08-17 1989-05-01 Expired JPH0232684Y2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/523,928 US4443318A (en) 1983-08-17 1983-08-17 Cathodic sputtering apparatus

Publications (2)

Publication Number Publication Date
JPH01164758U true JPH01164758U (en) 1989-11-17
JPH0232684Y2 JPH0232684Y2 (en) 1990-09-04

Family

ID=24087006

Family Applications (2)

Application Number Title Priority Date Filing Date
JP59170976A Pending JPS6059067A (en) 1983-08-17 1984-08-16 Cathode sputtering device
JP1989051949U Expired JPH0232684Y2 (en) 1983-08-17 1989-05-01

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP59170976A Pending JPS6059067A (en) 1983-08-17 1984-08-16 Cathode sputtering device

Country Status (10)

Country Link
US (1) US4443318A (en)
EP (1) EP0134559A3 (en)
JP (2) JPS6059067A (en)
AU (1) AU575056B2 (en)
BR (1) BR8404043A (en)
CA (1) CA1230079A (en)
DK (1) DK393384A (en)
HU (1) HU191712B (en)
IT (1) IT1174633B (en)
NO (1) NO842265L (en)

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Also Published As

Publication number Publication date
EP0134559A2 (en) 1985-03-20
AU575056B2 (en) 1988-07-21
IT1174633B (en) 1987-07-01
DK393384A (en) 1985-02-18
NO842265L (en) 1985-02-18
CA1230079A (en) 1987-12-08
AU2919484A (en) 1985-02-21
BR8404043A (en) 1985-07-16
JPH0232684Y2 (en) 1990-09-04
JPS6059067A (en) 1985-04-05
US4443318A (en) 1984-04-17
DK393384D0 (en) 1984-08-16
HUT35723A (en) 1985-07-29
IT8422206A0 (en) 1984-08-02
EP0134559A3 (en) 1987-01-07
HU191712B (en) 1987-03-30

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