JPH01138087A - Brazing filler metal for joining ceramics - Google Patents
Brazing filler metal for joining ceramicsInfo
- Publication number
- JPH01138087A JPH01138087A JP29837587A JP29837587A JPH01138087A JP H01138087 A JPH01138087 A JP H01138087A JP 29837587 A JP29837587 A JP 29837587A JP 29837587 A JP29837587 A JP 29837587A JP H01138087 A JPH01138087 A JP H01138087A
- Authority
- JP
- Japan
- Prior art keywords
- filler metal
- brazing filler
- brazing
- ceramics
- joining ceramics
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005219 brazing Methods 0.000 title claims abstract description 34
- 239000000919 ceramic Substances 0.000 title claims abstract description 29
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 24
- 239000002184 metal Substances 0.000 title claims abstract description 24
- 239000000945 filler Substances 0.000 title claims abstract description 23
- 238000005304 joining Methods 0.000 title claims abstract description 7
- 229910017945 Cu—Ti Inorganic materials 0.000 claims abstract description 5
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 5
- 239000000956 alloy Substances 0.000 claims abstract description 5
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 5
- 238000005336 cracking Methods 0.000 abstract description 3
- 239000011159 matrix material Substances 0.000 description 4
- 229910017693 AgCuTi Inorganic materials 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000005491 wire drawing Methods 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910010340 TiFe Inorganic materials 0.000 description 1
- 229910010380 TiNi Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 210000004556 brain Anatomy 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052575 non-oxide ceramic Inorganic materials 0.000 description 1
- 239000011225 non-oxide ceramic Substances 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- 229910052574 oxide ceramic Inorganic materials 0.000 description 1
- 238000013001 point bending Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、電子部品用のＡ／２２０３、ＭｇＯ１ＺｒＯ
７、ＢｅＯ等の酸化物系セラミックスやＳｉ３Ｎ４、Ｓ
Ｉ Ｃ、、Ｔ ｔ Ｃ％ Ｂ ａ Ｃ％ Ｗ Ｃ等の
非酸化物系セラミックスの接合に用いるろう材の改良に
関する。Detailed Description of the Invention (Industrial Application Field) The present invention is directed to A/2203, MgO1ZrO for electronic parts.
7. Oxide ceramics such as BeO, Si3N4, S
This invention relates to improvements in brazing filler metals used for joining non-oxide ceramics such as I C, T t C% B a C% W C.
（従来の技術とその問題点）
従来より上記セラミックスの接合にはＡｇ−Ｃｕ−Ｔｉ
合金より成るろう材が用いられているが、このろう材は
ＡｇＣｕＴｉマトリクスが軟らかい（Ｈｖ１５０）のに
硬い（Ｈｖ３５０） Ｃｕ Ｔ ｉ相が太きな粒状とな
って点在する為、加工時に応力が不均一にかかり、線径
の細い線材に加工した際には伸線中にＣｕＴｉ相の部分
で破断し、薄板に加工した際には圧延中にＣｕＴｉ相の
部分で凹凸が発生したり、割れたり、穴が明いたりして
甚だ加工性が悪かった。またろう付は強度が低（、ばら
つきが大きくて不安定であった。(Conventional technology and its problems) Conventionally, Ag-Cu-Ti has been used to bond the above ceramics.
A brazing filler metal made of an alloy is used, but this brazing filler metal has a soft (Hv150) but hard (Hv350) AgCuTi matrix, which is dotted with thick grains of Cu Ti phase, which causes stress during processing. When processed into a thin wire rod, the CuTi phase part breaks during drawing, and when processed into a thin sheet, unevenness occurs or cracks occur in the CuTi phase part during rolling. The machinability was extremely poor as holes appeared. In addition, the strength of brazing was low (it was unstable due to large variations).
（発明の目的）
本発明は、上記問題点を解決すべくなされたもので、加
工性を向上させ、且つセラミックスのろう付は強度を高
く安定させることのできるセラミックス接合用ろう材を
提供することを目的とするものである。(Object of the invention) The present invention was made to solve the above-mentioned problems, and it is an object of the present invention to provide a brazing material for joining ceramics that can improve workability and provide high and stable strength when brazing ceramics. The purpose is to
（問題点を解決するため手段）
上記問題点を解決するための本発明のセラミックス接合
用ろう材は、Ａｇ−Ｃｕ−Ｔｉ合金より成るセラミック
ス用ろう材に於いて、Ｆｅ、、Ｃｏ。(Means for Solving the Problems) The brazing filler metal for ceramic bonding of the present invention for solving the above-mentioned problems is a brazing filler metal for ceramics made of an Ag-Cu-Ti alloy.
Ｎｉの少なくとも１種を０．１〜２ｗｔ％添加して成る
ことを特徴とするものである。It is characterized by adding 0.1 to 2 wt% of at least one type of Ni.
本発明のセラミックス接合用ろう材に於いて、Ｆｅ、Ｃ
ｏ、Ｎｉの少なくとも１種を０．１〜２ｗｔ％添加する
理由は、ＡｇＣｕＴｉのマトリクス中のＣｕＴｉ相を均
一に微細に分散させる為で、０、Ｔｉ％未満では添加の
効果が無く、ＣｕＴｉ相の化合物結晶が大きくなり、厚
さ５０μｍ以下の板状に加工すると、ＣｕＴ ｉの結晶
が抜は落ちて穴が明き、２ｗｔ％を超えるとＴｉＦｅ、
Ｔ１Ｃｏ、Ｔ ｉ Ｎ ｉ等の化合物を作り、セラミッ
クスの接合に必要なＴｉ成分がろう付は時にセラミック
ス側へ移動せず、従って接合できないからである。In the brazing filler metal for ceramic bonding of the present invention, Fe, C
The reason for adding 0.1 to 2 wt% of at least one of Ni and Ni is to uniformly and finely disperse the CuTi phase in the AgCuTi matrix. When the compound crystals of CuTi become large and processed into a plate shape with a thickness of 50 μm or less, the CuTi crystals fall off and form holes, and when it exceeds 2 wt%, TiFe,
This is because compounds such as T1Co and TiNi are created, and the Ti component necessary for joining ceramics sometimes does not move to the ceramic side during brazing, and therefore cannot be joined.
（作用）
上記成分組成の本発明のセラミックス接合用ろう材は、
ｐ ｅ ％ Ｃｏ、Ｎｉの少なくとも１種を０．１〜２
ｗｔ％添加されて、ＣｕＴ ｉ相が均一微細に分散され
ているので、所要のろう財形状に加工した際、応力が均
一にかかり、折れたり、割れたりすることが無い。また
前述の如（Ｃｕ Ｔ ｉ相が均一微細に分散されている
ので、セラミックスとの濡れ性が向上し、ろう付は強度
が著しく高くなる。(Function) The brazing filler metal for ceramic bonding of the present invention having the above-mentioned composition is as follows:
p e % At least one of Co and Ni is 0.1 to 2
wt% is added and the CuTi phase is uniformly and finely dispersed, so when processed into the desired shape of the wax product, stress is applied uniformly and there is no possibility of bending or cracking. Further, as mentioned above (because the Cu Ti phase is uniformly and finely dispersed, the wettability with ceramics is improved, and the brazing strength is significantly increased).
（実施例）
本発明によるセラミックス接合用ろう材の実施例を従来
例と共に説明する。(Example) Examples of the brazing filler metal for ceramic bonding according to the present invention will be described together with conventional examples.
下記の表の左欄に示す成分組成の実施例及び従来例のセ
ラミックス用ろう材を、溶解−鋳造−伸線を熱処理−伸
線一切断の工程で作り、このろう材を用いて、下記の表
の中央欄に示す直径７ ｍｍ、長さ３０ｍのセラミック
スの線材同志を真空（１０−５ｍｍＨｇ）の炉中で各１
００本ろう付けし、このろう付けした線材をＪＩＳａ点
曲げ試験を行って、ろう付は強度を測定した処、下記の
表の右欄に示すような結果を得た。また使用前の加工上
がりのセラ 。The brazing filler metals for ceramics having the compositions shown in the left column of the table below are made through the steps of melting, casting, wire drawing, heat treatment, wire drawing, and cutting. Ceramic wires with a diameter of 7 mm and a length of 30 m shown in the center column of the table were placed in a vacuum (10-5 mmHg) furnace.
00 wires were brazed, and the brazed wire rods were subjected to a JIS A point bending test, and the strength of the brazing was measured, and the results shown in the right column of the table below were obtained. Also, the finished Cera before use.
ミックス接合用ろう材の断面観察によるＣ ｕ Ｔ ｉ
相のブレーンサイズの結果を下記の表の最右欄に示す。C u Ti by cross-sectional observation of brazing filler metal for mixed bonding
The results of the phase brane sizes are shown in the rightmost column of the table below.
（以下余白）
上記の表で明らかなように実施例のセラミ・７クス接合
用ろう材は、使用前の加工上がりのＣｕＴｉ相のブレー
ンサイズが、従来例のセラミックス接合用ろう材のそれ
よりも著しく小さいことが判る９そしてこのセラミック
ス接合用ろう材でろう付けしたセラミックスの線材同志
のろう付は強度は、従来例のセラミックス接合用ろう材
でろう付けしたもののろう付は強度よりも高く安定して
いることが判る。これはひとえに実施例のセラミックス
接合用ろう材が、ＣｕＴｉ相がＡｇＣｕＴｉマトリクス
に均−微細に分散してセラミックスとの濡れ性が向上し
たからに他ならない。(Leaving space below) As is clear from the table above, the brazing filler metal for ceramics and 7x bonding of the example has a larger brain size of the CuTi phase after processing before use than that of the conventional brazing filler metal for bonding ceramics. It can be seen that the brazing strength of ceramic wires brazed together with this brazing filler metal for ceramic bonding is higher and more stable than that of conventional brazing filler metal for ceramic bonding. It can be seen that This is simply because the CuTi phase of the ceramic bonding brazing material of the example was evenly and finely dispersed in the AgCuTi matrix, and the wettability with ceramics was improved.
（発明の効果）
以上の説明で判るように本発明のセラミックス接合用ろ
う材は、Ａ ｇ Ｃｕ ＴｉマトリクスにＣｕＴｉ相が
均一微細に分散されているので、加工性に優れ、従って
加工時応力が均一にかかって折れたり割れたりすること
が無く、またセラミックスとの濡れ性に優れ、従ってセ
ラミックスのろう付は強度を高く安定させることができ
る等の効果がなる。(Effects of the Invention) As can be seen from the above explanation, the brazing filler metal for ceramic bonding of the present invention has excellent workability because the CuTi phase is uniformly and finely dispersed in the A g Cu Ti matrix, and therefore the stress during processing is reduced. It applies evenly without breaking or cracking, and has excellent wettability with ceramics, so brazing ceramics has the effect of high strength and stability.
Claims (1)
う材に於いて、Ｆｅ、Ｃｏ、Ｎｉの少なくとも１種を０
．１〜２ｗｔ％添加して成ることを特徴とするセラミッ
クス接合用ろう材。In a brazing filler metal for ceramic bonding made of an Ag-Cu-Ti alloy, at least one of Fe, Co, and Ni is free.
．． A brazing filler metal for joining ceramics characterized by adding 1 to 2 wt%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62298375A JP2575756B2 (en) | 1987-11-26 | 1987-11-26 | Brazing filler metal for ceramics |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62298375A JP2575756B2 (en) | 1987-11-26 | 1987-11-26 | Brazing filler metal for ceramics |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01138087A true JPH01138087A (en) | 1989-05-30 |
| JP2575756B2 JP2575756B2 (en) | 1997-01-29 |
Family
ID=17858874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62298375A Expired - Fee Related JP2575756B2 (en) | 1987-11-26 | 1987-11-26 | Brazing filler metal for ceramics |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2575756B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008004552A1 (en) * | 2006-07-04 | 2008-01-10 | Kabushiki Kaisha Toshiba | Ceramic-metal bonded body, method for manufacturing the bonded body and semiconductor device using the bonded body |
| JP2013154361A (en) * | 2012-01-27 | 2013-08-15 | Kyocera Corp | Brazing filler metal, and joined body which is joined by using the same |
| CN110806617A (en) * | 2019-10-21 | 2020-02-18 | 中航光电科技股份有限公司 | Brazing type ceramic contact pin assembling structure |
| CN115786762A (en) * | 2022-11-24 | 2023-03-14 | 南京理工大学 | A high-strength active solder |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5538225A (en) * | 1978-08-28 | 1980-03-17 | Ishikawajima Harima Heavy Ind | Underground storage tank |
-
1987
- 1987-11-26 JP JP62298375A patent/JP2575756B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5538225A (en) * | 1978-08-28 | 1980-03-17 | Ishikawajima Harima Heavy Ind | Underground storage tank |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008004552A1 (en) * | 2006-07-04 | 2008-01-10 | Kabushiki Kaisha Toshiba | Ceramic-metal bonded body, method for manufacturing the bonded body and semiconductor device using the bonded body |
| JP5226511B2 (en) * | 2006-07-04 | 2013-07-03 | 株式会社東芝 | Ceramic-metal bonded body, manufacturing method thereof, and semiconductor device using the same |
| US8518554B2 (en) | 2006-07-04 | 2013-08-27 | Kabushiki Kaisha Toshiba | Ceramic metal composite and semiconductor device using the same |
| JP2013154361A (en) * | 2012-01-27 | 2013-08-15 | Kyocera Corp | Brazing filler metal, and joined body which is joined by using the same |
| CN110806617A (en) * | 2019-10-21 | 2020-02-18 | 中航光电科技股份有限公司 | Brazing type ceramic contact pin assembling structure |
| CN115786762A (en) * | 2022-11-24 | 2023-03-14 | 南京理工大学 | A high-strength active solder |
| CN115786762B (en) * | 2022-11-24 | 2024-05-07 | 南京理工大学 | A high-strength active brazing filler metal |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2575756B2 (en) | 1997-01-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |