JPH01115604A - Device of cutting wafer - Google Patents

Abstract

PURPOSE:To improve operational efficiency by enabling omission of a lapping process, by a method wherein a hone is shifted up to a hone by actuating a feed device, an end face of an ingot is ground with the hone and the ingot is cut into a state of a thin piece with an internal circumferential blade. CONSTITUTION:A hone shaft 62 is pierced through a hole 38A of a rotator 38 coaxially with the hole 38A, coupled movably in an axial direction only through a spline coupling 44 and a cup-shaped hone16 is fitted to the upper end part. When a driving motor 58 is turned, the rotator 38 is turned through a belt 56 and also the hone shaft 62 which is coupled through a spline is turned integrally. Then an ingot 34 is lowered, a motor 76 is turned after that, a feed shaft 70 is shifted upward in an axial direcion through a driving gear 78 and feed gear 74, the hone 16 is shifted up to a grinding position and suspended. When the ingot 34 is moved in the direction A, an end face of the ingot 34 is ground by a grinding part 64 of the hone 16, to begin with, and the ingot 34 is cut off by the inner circumferential blade 14 a little later than the grinding by the hone 16.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a cutting device for cutting wafers such as semiconductors, and more particularly to a cutting device for cutting wafers by cutting columnar material into thin pieces.

[Prior art]

Conventionally, columnar materials such as semiconductors (silicon ingots, etc.)
A slicing machine is used for boat fishing as a device for cutting wafers into thin pieces.

However, in this slicing machine, the cutting resistance applied to the inner peripheral blade cannot be maintained constant due to wear, clogging, etc. of the inner peripheral blade that cuts the ingot.

In such a case, as shown in FIG. 6, the inner peripheral blade 100 moves irregularly with respect to the cutting direction, and warps, saw marks (unevenness) 104, etc. are formed on the cut surface of the wafer 102.

On the other hand, there is a tendency for semiconductor materials to become larger in diameter, and as the diameter increases, large warps occur on the wafers when cutting ingots to produce wafers. Post-processing was necessary.

Therefore, Japanese Unexamined Patent Publication No. 106207/1983 discloses a method for easily removing warpage from a wafer.

This method places a cup-shaped grindstone close to the inner peripheral blade,
After cutting the wafer, the cut surface of the ingot is ground to a high degree of precision. Thereby, it is possible to easily provide a wafer without warping or the like.

[Problem that the invention seeks to solve]

However, the wafer cutting method of the above-mentioned publication does not disclose a specific configuration for arranging the inner peripheral blade and the grinding wheel in the limited space for slicing. The development of a cutting device was desired.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a wafer cutting device in which a grindstone and an inner peripheral blade are efficiently arranged.

Means for Solving Problem C] In order to achieve the above object, the present invention comprises a rotating body, an inner circumferential blade attached to the rotating body for cutting the columnar material into thin pieces, and a grindstone attached to the tip. A grinding wheel shaft that is arranged coaxially inside the rotating body and rotates integrally with the rotating body and moves in the axial direction to move the grinding wheel forward and backward relative to the inner peripheral blade, and a feeding device that moves the grinding wheel shaft in the axial direction. It is characterized by having the following.

[Effect]

According to the wafer cutting device of the present invention, at the same time as the inner peripheral blade rotates, the grindstone shaft rotates integrally with the rotating body, and the grindstone attached to the upper end of the grindstone shaft rotates. Next, the feeder is activated to move the grindstone to the grinding position. Then,
The end face of the ingot is ground with a grindstone, and the ingot is cut into thin pieces with an inner peripheral blade.

In this way, the grindstone shaft is arranged coaxially inside the rotating body so that it can move forward and backward, and the cut surface of the ingot is polished by moving the grindstone shaft back and forth, so that a compact wafer cutting device can be constructed. Can be done. Moreover, the wrapping process can be omitted, and work efficiency can be improved.

〔Example〕

Preferred embodiments of the wafer cutting apparatus according to the present invention will be described in detail below with reference to the accompanying drawings.

FIG. 1 is an overall perspective view of a wafer cutting apparatus according to the present invention.
An inner peripheral blade 14 is disposed, and a cup-shaped grindstone 6 shown in FIG. 2 is coaxially and rotatably mounted within the internal peripheral blade 14. Furthermore, an inner peripheral blade 1 is provided below this grindstone 16.
4 and a rotating mechanism 18 (
(shown in Figure 2) is attached.

Further, a wafer recovery device 22 is attached to the main body 12 and extends from the side surface of the main body 12 to approximately the center of the inner peripheral blade 14. Furthermore, facing the suction pad 22A at the tip of the wafer recovery device 22, a wafer transfer device 24 and a storage case 26 for storing the transferred wafers are attached.

Further, a cutting feed table 28 is supported on the upper surface of the main body 12 so as to be slidable in the direction of arrow AXB shown in FIG. 1, and is reciprocated by a drive source (not shown).

Further, a support 30 is provided upright at the left end of the cutting feed table 2'8. An index slider 32 is supported in front of the support column 3G so as to be movable in the longitudinal direction of the support column 30, that is, in the vertical direction. The index slider 32 is threadedly engaged with a feed screw (not shown) attached in the longitudinal direction of the support column 30, and can be moved in the vertical direction by rotating the feed screw.

Further, the index slider 32 supports an ingot 34 to which a slice base 36 is fixed. Thereby, the ingot 34 can be moved in the directions of arrows A and B (cutting direction) and in the vertical direction (ingot cutting thickness adjustment direction).

FIG. 2 is a sectional view showing the inner peripheral blade 14 and the grindstone 160 rotation mechanism 18. As shown in FIG. 2, the cylindrical rotating body 38
However, the bearing 4 is attached to the base portion 40 which is a part of the main body 12.
It is rotatably attached via 2.42. A chuck body 48 is attached to the upper end of the rotating body 38. The chuck body 48 has an inner peripheral cutter 14 on the inner peripheral surface.
A donut-shaped blade 52 forming a ring is fixed under a constant tension. Further, a pulley 54 is attached to the lower end of the rotating body 38, and a belt 56 is stretched between the pulley 54 and a pulley 60 of the motor 58.

The grindstone shaft 62 is coaxially inserted into the hole 38A of the rotating body 38, and is connected via the spline connection 44 so as to be movable only in the axial direction. A cup-shaped grindstone 16 is attached to the upper end of the grindstone shaft 62. The grinding wheel 16 has a protruding grinding portion 64 on its periphery, and the grinding portion 64 is formed on the same plane. Thereby, the grindstone 16 can rotate integrally with the inner peripheral blade 14 via the spline connection 44, and also moves when receiving a pressing force in the axial direction. Furthermore, a connecting plate 65 is attached to the lower end of the grindstone shaft 62 to receive a pressing force in the axial direction.

The connecting plate 65 is disposed within the joint casing 68 via a thrust bearing 66. On the other hand, a feed shaft 70 is attached to the lower end surface of the casing 68 coaxially with the grindstone shaft 62. The feed shaft 70 has a bearing 72
The feed gear 74 is screwed to be movable in the axial direction with the inside of the rotating feed gear 74 via the feed gear 74 . The feed gear 74 is rotated by a drive gear 78 attached to the output shaft of a motor 76.

The operation of the wafer cutting apparatus according to the present invention configured as described above will be explained.

When the drive motor 58 shown in FIG. 2 is rotated, the belt 56
The rotating body 38 rotates through the rotating body 38, and the grindstone shaft 62 spline-coupled to the rotating body 38 also rotates integrally with the rotating body 38. Next, the ingot 34 is lowered, and then the motor 76 is rotated,
The feed shaft 70 is moved axially upward via the drive gear 78 and the feed gear 74. This movement causes the casing 6
8 moves upward to move the grindstone shaft 62 upward in the axial direction. The feed shaft 70 moves the grindstone 16 to the grinding position,
Stop. Next, as shown in FIG.
When the ingot 34 is moved in six directions, the end face of the ingot 34 is first ground by the grinding portion 64 of the grindstone 16, and the inner peripheral blade 14 cuts the ingot 34 with a slight delay in the grinding of the grindstone 16. In this case, if the wafer is cut before the grinding, unreasonable stress will be applied to the wafer being cut during the grinding, and there is a risk of breakage, etc., so it is preferable to perform the grinding first.

After cutting, the table 28 is moved in the direction B and returned to its original position, while the feed shaft 70 is rotated in the reverse direction by the motor 76.
moves downward. As a result, the grindstone shaft 62 moves downward according to the feed shaft 70, the lower surface of the grindstone 16 contacts the stopper 50, and the grindstone shaft 62 stops moving. This operation described below is repeated to sequentially cut the ingot 34.

By arranging the inner circumferential blade 14 and the grindstone 16 on the same axis in this manner, it is possible to provide a compact wafer cutting device and to improve work efficiency. Moreover, the mechanism can also be simplified.

In the embodiment described above, the cutting feed table 28 on the ingot 34 side was moved to cut the ingot 34, but the present invention is not limited to this.
The ingot 34 may be cut by moving the four sides.

Further, in the above embodiment, the ingot 34 was cut at the same time as it was ground, but the invention is not limited to this. As shown in FIG. 4(a), the ingot 34 is first cut into thin pieces, and then the The cut surface may be ground as shown in FIG. 4 et al., and this may be repeated alternately.

Furthermore, in the embodiment, the grindstone 16 and the inner peripheral blade 14 are one
Although the grindstone 16 and the inner circumferential blade 14 are rotated by separate motors 58, the present invention is not limited thereto, and the grindstone 16 and the inner peripheral blade 14 may be rotated by their own motors 84 and 86, respectively, as shown in FIG.

Referring to FIG. 5 below, a case will be described in which the inner peripheral blade 14 and the grindstone 16 are driven by motors 84 and 86. Note that explanations of the same members as in the first embodiment will be omitted. A first rotating body 88 is rotatably attached to the base portion 40 via bearings 42, 42 that receive loads in the thrust and radial directions. A chuck body 48 is attached to the tip of the first rotating body 88. Further, a second rotary body 92 is rotatably attached to the first rotary body 88 via bearings 90 and 90.

In the second embodiment configured as described above, the first rotating body 88 is rotated via the belt 94 by the rotation of the first motor 84, and the second rotating body 92 is rotated by the rotation of the second motor 84. 86
Rotates via the belt 96 due to the rotation of. Further, the grindstone shaft 62 to which the grindstone 16 is attached rotates at the same time as the second rotating body 92, as in the embodiment described above. With such a configuration, the rotation speeds of the grindstone 16 and the inner peripheral blade 14 can be freely selected.

In the embodiment described above, the grinding wheel shaft 62 is spline-coupled to the rotating body 38, but the invention is not limited to this, and the rotating body 38 can be connected by a key.
May be combined with

〔Effect of the invention〕

As explained above, according to the wafer cutting apparatus according to the present invention, the grindstone shaft having the grindstone is attached to the inside of the rotating body of the inner peripheral blade so as to be movable coaxially, and the grindstone moves forward and backward with respect to the columnar material. Therefore, a compact wafer cutting device can be provided.

[BRIEF DESCRIPTION OF THE DRAWINGS] FIG. 1 is an overall perspective view of a wafer cutting device according to the present invention;
FIG. 2 is a sectional view of the wafer cutting device according to the present invention, and FIG.
The figure shows the grinding and cutting state of an ingot by the wafer cutting device according to the present invention, and (a) and (b) in Fig. 4.
FIG. 5 is a cross-sectional view of another embodiment of the wafer cutting device according to the present invention; FIG.
The figure is a front view showing how an ingot is cut by a conventional slicing machine. 10... Wafer cutting device, 14... Inner peripheral blade,
16...Cup-shaped whetstone, 34...Ingot,
62... Grinding wheel shaft, 70... Feed shaft.

Claims (4)

[Claims] (1) A rotating body, an inner peripheral blade that is attached to the rotating body and cuts the columnar material into thin pieces, and a grindstone is attached to the tip, which is placed coaxially inside the rotating body and rotates integrally with the rotating body. A wafer cutting device comprising: a grindstone shaft that moves in the axial direction to move the grindstone forward and backward with respect to the inner peripheral blade; and a feed device that moves the grindstone shaft in the axial direction. (2) The wafer cutting apparatus according to claim 1, wherein the rotating body and the grindstone are spline-coupled so that the rotating body and the grindstone rotate integrally. (3) A grindstone shaft with a grindstone attached to the tip thereof is rotatably mounted inside a rotating body, and the grindstone shaft and the rotating body are connected to a unique rotational drive source. The wafer cutting device described. (4) The wafer cutting device according to claim 1, wherein the inner peripheral blade moves to cut the columnar material.