JP7583180B2 - シリコーンエラストマー組成物 - Google Patents
シリコーンエラストマー組成物 Download PDFInfo
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- JP7583180B2 JP7583180B2 JP2023547436A JP2023547436A JP7583180B2 JP 7583180 B2 JP7583180 B2 JP 7583180B2 JP 2023547436 A JP2023547436 A JP 2023547436A JP 2023547436 A JP2023547436 A JP 2023547436A JP 7583180 B2 JP7583180 B2 JP 7583180B2
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- Prior art keywords
- silicone elastomer
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- substrate
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims description 172
- 229920002379 silicone rubber Polymers 0.000 title claims description 57
- 239000000758 substrate Substances 0.000 claims description 71
- 150000008064 anhydrides Chemical group 0.000 claims description 45
- 239000003054 catalyst Substances 0.000 claims description 44
- 229920001296 polysiloxane Polymers 0.000 claims description 40
- 125000003342 alkenyl group Chemical group 0.000 claims description 38
- 229920005989 resin Polymers 0.000 claims description 27
- 239000011347 resin Substances 0.000 claims description 27
- 125000000304 alkynyl group Chemical group 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 22
- 238000006459 hydrosilylation reaction Methods 0.000 claims description 21
- 239000003112 inhibitor Substances 0.000 claims description 20
- 239000012763 reinforcing filler Substances 0.000 claims description 20
- 229920001169 thermoplastic Polymers 0.000 claims description 19
- 239000004416 thermosoftening plastic Substances 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 18
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 15
- 125000003118 aryl group Chemical group 0.000 claims description 13
- 125000000217 alkyl group Chemical group 0.000 claims description 12
- 150000001875 compounds Chemical class 0.000 claims description 10
- 239000003999 initiator Substances 0.000 claims description 10
- 239000002131 composite material Substances 0.000 claims description 9
- 150000003961 organosilicon compounds Chemical class 0.000 claims description 9
- 230000008569 process Effects 0.000 claims description 9
- 239000003795 chemical substances by application Substances 0.000 claims description 8
- 125000000524 functional group Chemical group 0.000 claims description 8
- 150000001451 organic peroxides Chemical class 0.000 claims description 8
- 229920003023 plastic Polymers 0.000 claims description 8
- 239000004033 plastic Substances 0.000 claims description 8
- 239000004417 polycarbonate Substances 0.000 claims description 7
- 229920000515 polycarbonate Polymers 0.000 claims description 7
- 125000003944 tolyl group Chemical group 0.000 claims description 7
- 229910052799 carbon Inorganic materials 0.000 claims description 6
- 125000005023 xylyl group Chemical group 0.000 claims description 5
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 claims description 3
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000012528 membrane Substances 0.000 claims description 3
- 238000009423 ventilation Methods 0.000 claims description 3
- 240000007594 Oryza sativa Species 0.000 claims description 2
- 235000007164 Oryza sativa Nutrition 0.000 claims description 2
- 235000009566 rice Nutrition 0.000 claims description 2
- 238000010295 mobile communication Methods 0.000 claims 1
- -1 cyclohexynyl Chemical group 0.000 description 69
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 34
- 229920000642 polymer Polymers 0.000 description 29
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 23
- 239000000654 additive Substances 0.000 description 20
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 19
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 18
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 17
- 238000001723 curing Methods 0.000 description 16
- 229920002554 vinyl polymer Polymers 0.000 description 16
- 239000002318 adhesion promoter Substances 0.000 description 15
- 125000004432 carbon atom Chemical group C* 0.000 description 14
- 239000000945 filler Substances 0.000 description 14
- 229910052751 metal Inorganic materials 0.000 description 14
- 239000002184 metal Substances 0.000 description 14
- 229910052697 platinum Inorganic materials 0.000 description 13
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- 229920001577 copolymer Polymers 0.000 description 12
- 230000000996 additive effect Effects 0.000 description 11
- 150000003254 radicals Chemical class 0.000 description 11
- 239000004971 Cross linker Substances 0.000 description 10
- 238000009472 formulation Methods 0.000 description 10
- 239000000243 solution Substances 0.000 description 10
- 239000004970 Chain extender Substances 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 9
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 9
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 8
- 239000002253 acid Substances 0.000 description 8
- 235000019400 benzoyl peroxide Nutrition 0.000 description 8
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 8
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 8
- 239000004342 Benzoyl peroxide Substances 0.000 description 7
- 150000001298 alcohols Chemical class 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 7
- 150000002430 hydrocarbons Chemical group 0.000 description 7
- 239000000377 silicon dioxide Substances 0.000 description 7
- 229920002050 silicone resin Polymers 0.000 description 7
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 6
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 6
- 229920001971 elastomer Polymers 0.000 description 6
- 239000000806 elastomer Substances 0.000 description 6
- 239000004615 ingredient Substances 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 6
- 229920001843 polymethylhydrosiloxane Polymers 0.000 description 6
- 229910052604 silicate mineral Inorganic materials 0.000 description 6
- 125000004469 siloxy group Chemical group [SiH3]O* 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 5
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 5
- 229910052739 hydrogen Inorganic materials 0.000 description 5
- 239000001257 hydrogen Substances 0.000 description 5
- 229910052909 inorganic silicate Inorganic materials 0.000 description 5
- IVSZLXZYQVIEFR-UHFFFAOYSA-N m-xylene Chemical group CC1=CC=CC(C)=C1 IVSZLXZYQVIEFR-UHFFFAOYSA-N 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 239000000454 talc Substances 0.000 description 5
- 229910052623 talc Inorganic materials 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 4
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 150000001336 alkenes Chemical class 0.000 description 4
- 239000007795 chemical reaction product Substances 0.000 description 4
- 239000011231 conductive filler Substances 0.000 description 4
- 125000004122 cyclic group Chemical group 0.000 description 4
- 239000004205 dimethyl polysiloxane Substances 0.000 description 4
- 229910052731 fluorine Inorganic materials 0.000 description 4
- 239000011737 fluorine Substances 0.000 description 4
- 239000002223 garnet Substances 0.000 description 4
- 239000011777 magnesium Substances 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 4
- 150000002978 peroxides Chemical class 0.000 description 4
- 229920001707 polybutylene terephthalate Polymers 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- 239000004912 1,5-cyclooctadiene Substances 0.000 description 3
- 238000010146 3D printing Methods 0.000 description 3
- 238000004438 BET method Methods 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 238000007259 addition reaction Methods 0.000 description 3
- AYJRCSIUFZENHW-UHFFFAOYSA-L barium carbonate Chemical class [Ba+2].[O-]C([O-])=O AYJRCSIUFZENHW-UHFFFAOYSA-L 0.000 description 3
- 230000003197 catalytic effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 229910021485 fumed silica Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 125000005843 halogen group Chemical group 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 239000002923 metal particle Substances 0.000 description 3
- 239000010445 mica Substances 0.000 description 3
- 229910052618 mica group Inorganic materials 0.000 description 3
- 125000005375 organosiloxane group Chemical group 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- 150000004760 silicates Chemical class 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000007858 starting material Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 3
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 2
- CEBKHWWANWSNTI-UHFFFAOYSA-N 2-methylbut-3-yn-2-ol Chemical compound CC(C)(O)C#C CEBKHWWANWSNTI-UHFFFAOYSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 229910004283 SiO 4 Inorganic materials 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 229910000323 aluminium silicate Inorganic materials 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 239000003849 aromatic solvent Substances 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- FSIJKGMIQTVTNP-UHFFFAOYSA-N bis(ethenyl)-methyl-trimethylsilyloxysilane Chemical compound C[Si](C)(C)O[Si](C)(C=C)C=C FSIJKGMIQTVTNP-UHFFFAOYSA-N 0.000 description 2
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 2
- 239000011575 calcium Substances 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 2
- IJOOHPMOJXWVHK-UHFFFAOYSA-N chlorotrimethylsilane Chemical compound C[Si](C)(C)Cl IJOOHPMOJXWVHK-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- HGCIXCUEYOPUTN-UHFFFAOYSA-N cyclohexene Chemical compound C1CCC=CC1 HGCIXCUEYOPUTN-UHFFFAOYSA-N 0.000 description 2
- LPIQUOYDBNQMRZ-UHFFFAOYSA-N cyclopentene Chemical compound C1CC=CC1 LPIQUOYDBNQMRZ-UHFFFAOYSA-N 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 2
- 125000005388 dimethylhydrogensiloxy group Chemical group 0.000 description 2
- 239000013536 elastomeric material Substances 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000004811 fluoropolymer Substances 0.000 description 2
- 229920002313 fluoropolymer Polymers 0.000 description 2
- 238000007306 functionalization reaction Methods 0.000 description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 description 2
- 230000002209 hydrophobic effect Effects 0.000 description 2
- 238000011065 in-situ storage Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 2
- 239000003446 ligand Substances 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 2
- 239000000347 magnesium hydroxide Substances 0.000 description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 2
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 125000004433 nitrogen atom Chemical group N* 0.000 description 2
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 2
- 239000010450 olivine Substances 0.000 description 2
- 229910052609 olivine Inorganic materials 0.000 description 2
- 125000004430 oxygen atom Chemical group O* 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 125000002255 pentenyl group Chemical group C(=CCCC)* 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920006380 polyphenylene oxide Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000003908 quality control method Methods 0.000 description 2
- 239000000376 reactant Substances 0.000 description 2
- 238000007790 scraping Methods 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- LEDMRZGFZIAGGB-UHFFFAOYSA-L strontium carbonate Chemical class [Sr+2].[O-]C([O-])=O LEDMRZGFZIAGGB-UHFFFAOYSA-L 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 125000004434 sulfur atom Chemical group 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000010456 wollastonite Substances 0.000 description 2
- 229910052882 wollastonite Inorganic materials 0.000 description 2
- WRXCBRHBHGNNQA-UHFFFAOYSA-N (2,4-dichlorobenzoyl) 2,4-dichlorobenzenecarboperoxoate Chemical compound ClC1=CC(Cl)=CC=C1C(=O)OOC(=O)C1=CC=C(Cl)C=C1Cl WRXCBRHBHGNNQA-UHFFFAOYSA-N 0.000 description 1
- DEIGXXQKDWULML-UHFFFAOYSA-N 1,2,5,6,9,10-hexabromocyclododecane Chemical compound BrC1CCC(Br)C(Br)CCC(Br)C(Br)CCC1Br DEIGXXQKDWULML-UHFFFAOYSA-N 0.000 description 1
- CCNDOQHYOIISTA-UHFFFAOYSA-N 1,2-bis(2-tert-butylperoxypropan-2-yl)benzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC=C1C(C)(C)OOC(C)(C)C CCNDOQHYOIISTA-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- VYXHVRARDIDEHS-UHFFFAOYSA-N 1,5-cyclooctadiene Chemical compound C1CC=CCCC=C1 VYXHVRARDIDEHS-UHFFFAOYSA-N 0.000 description 1
- UICXTANXZJJIBC-UHFFFAOYSA-N 1-(1-hydroperoxycyclohexyl)peroxycyclohexan-1-ol Chemical compound C1CCCCC1(O)OOC1(OO)CCCCC1 UICXTANXZJJIBC-UHFFFAOYSA-N 0.000 description 1
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical class CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 1
- LQMDOONLLAJAPZ-UHFFFAOYSA-N 1-ethynylcyclopentan-1-ol Chemical compound C#CC1(O)CCCC1 LQMDOONLLAJAPZ-UHFFFAOYSA-N 0.000 description 1
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical class CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 1
- UIGLAZDLBZDVBL-UHFFFAOYSA-N 1-phenylprop-2-yn-1-ol Chemical compound C#CC(O)C1=CC=CC=C1 UIGLAZDLBZDVBL-UHFFFAOYSA-N 0.000 description 1
- 238000005160 1H NMR spectroscopy Methods 0.000 description 1
- VMAWODUEPLAHOE-UHFFFAOYSA-N 2,4,6,8-tetrakis(ethenyl)-2,4,6,8-tetramethyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical compound C=C[Si]1(C)O[Si](C)(C=C)O[Si](C)(C=C)O[Si](C)(C=C)O1 VMAWODUEPLAHOE-UHFFFAOYSA-N 0.000 description 1
- CXRXDDBPMBXXFT-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,4-dimethylhexane Chemical compound CC(C)(C)OOC(C)C(C)CC(C)(C)OOC(C)(C)C CXRXDDBPMBXXFT-UHFFFAOYSA-N 0.000 description 1
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- MAYUMUDTQDNZBD-UHFFFAOYSA-N 2-chloroethylsilane Chemical compound [SiH3]CCCl MAYUMUDTQDNZBD-UHFFFAOYSA-N 0.000 description 1
- BIISIZOQPWZPPS-UHFFFAOYSA-N 2-tert-butylperoxypropan-2-ylbenzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC=C1 BIISIZOQPWZPPS-UHFFFAOYSA-N 0.000 description 1
- NECRQCBKTGZNMH-UHFFFAOYSA-N 3,5-dimethylhex-1-yn-3-ol Chemical compound CC(C)CC(C)(O)C#C NECRQCBKTGZNMH-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- VBATUBQIYXCZPA-UHFFFAOYSA-N 3-methylpent-1-en-4-yn-3-ol Chemical compound C=CC(O)(C)C#C VBATUBQIYXCZPA-UHFFFAOYSA-N 0.000 description 1
- 125000006043 5-hexenyl group Chemical group 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
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- 238000001721 transfer moulding Methods 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- DWAWYEUJUWLESO-UHFFFAOYSA-N trichloromethylsilane Chemical compound [SiH3]C(Cl)(Cl)Cl DWAWYEUJUWLESO-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- 125000004205 trifluoroethyl group Chemical group [H]C([H])(*)C(F)(F)F 0.000 description 1
- 125000000725 trifluoropropyl group Chemical group [H]C([H])(*)C([H])([H])C(F)(F)F 0.000 description 1
- 125000000026 trimethylsilyl group Chemical group [H]C([H])([H])[Si]([*])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- 239000010455 vermiculite Substances 0.000 description 1
- 229910052902 vermiculite Inorganic materials 0.000 description 1
- 235000019354 vermiculite Nutrition 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 238000004073 vulcanization Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
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- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
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- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
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- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
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- C08J2483/04—Polysiloxanes
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Description
プライマー法は、特に製造されているパーツ/物品に対して信頼できない生産性、品質管理の問題、及び実際の信頼性の問題をもたらす可能性があることから、厄介である。プライマーはまた、揮発性有機溶媒を含有することが多いという欠点を有する。
(A)アルケニル基及びアルキニル基から選択され、25℃で1000mPa.s~500,000mPa.sの範囲の粘度を有する、1分子当たり少なくとも2個の不飽和基を含むが、無水物官能基を含まない、1個以上のオルガノポリシロキサンと、
(B)硬化剤であって、
(B)(i)有機過酸化物ラジカル開始剤、又は
(B)(ii)ヒドロシリル化硬化触媒パッケージであって、
a.1分子当たり少なくとも2個、若しくは少なくとも3個のSi-H基を有する有機ケイ素化合物、及び
b.ヒドロシリル化触媒を含む、ヒドロシリル化硬化触媒パッケージを含む、硬化剤と、
(C)少なくとも1個の補強性充填剤及び任意選択で1個以上の非補強性充填剤と、
(D)ポリオルガノシロキサンであって、
(i)アルケニル基及びアルキニル基から選択される1分子当たり少なくとも1個の不飽和基、並びに
(ii)無水物官能基及び芳香族官能基であって、芳香族官能基の炭素が、1~3個の非芳香族炭素原子を含む炭素鎖によって無水物のカルボニル基の炭素から分離されている、無水物官能基及び芳香族官能基を有する、ポリオルガノシロキサンと、を含む、プラスチック/熱可塑性/樹脂材料基材に対して接着を達成できる硬化性シリコーンエラストマー組成物に関する。
式中、各R’は、同一でも異なっていてもよく、1~18個の炭素原子を有する炭化水素基、1~18個の炭素原子を有する置換炭化水素基、又は最大18個の炭素原子を有する炭化水素オキシ基を示し、平均して1~3、好ましくは1.8~2.2のa値を有する。
本明細書に記載の組成物は、有機過酸化物ラジカル開始剤(触媒)(B)(i)又は異なる種類の過酸化物(ラジカル開始剤/触媒)の混合物で硬化され得る。
(B)(ii)(a)1分子当たり少なくとも2個、あるいは少なくとも3個のSi-H基を有する有機ケイ素化合物、及び
(B)(ii)(b)ヒドロシリル化触媒の形態のヒドロシリル化触媒パッケージ(B)(ii)を使用して硬化され得る。
成分(B)(ii)(a)で使用されるケイ素結合有機基は、メチル、エチル、プロピル、ブテニル、ペンテニル、ヘキシル又は同様のアルキル基;フェニル、トリル、キシリル又は同様のアリール基;3-クロロプロピル、3,3,3-トリフルオロプロピル又は同様のハロゲン化アルキル基で例示され得、その中でもメチル基及びフェニル基が好ましい。
(a’)トリメチルシロキシ末端メチルハイドロジェンポリシロキサン、
(b’)トリメチルシロキシ末端ポリジメチルシロキサン-メチルハイドロジェンシロキサン、
(c’)ジメチルハイドロジェンシロキシ末端ジメチルシロキサン-メチルハイドロジェンシロキサンのコポリマー、
(d’)ジメチルシロキサン-メチルハイドロジェンシロキサンの環状コポリマー、
(e’)(CH3)2HSiO1/2単位、(CH3)3SiO1/2単位、及びSiO4/2単位からなるコポリマー及び/又はシリコーン樹脂、
(f’)(CH3)2HSiO1/2単位及びSiO4/2単位からなるコポリマー及び/又はシリコーン樹脂、
(g’)(CH3)2HSiO1/2単位、SiO4/2単位及び(C6H5)3SiO1/2単位からなるコポリマー及び/又はシリコーン樹脂、並びにメチルがフェニル基又は他のアルキル基によって置換された代替物。
あるいは、成分(B)(ii)(a)架橋剤は、充填剤、例えば、上記の1つで処理されたシリカであってもよい。
(i)米国特許第3,419,593号に記載されている、塩化白金酸のエチレン性不飽和炭化水素基を含有するオルガノシロキサンとの錯体;
(ii)六水和物形態又は無水形態のいずれかの塩化白金酸;
(iii)塩化白金酸をジビニルテトラメチルジシロキサンなどの脂肪族不飽和有機ケイ素化合物と反応させることを含む、方法によって得られる白金含有触媒;
(iv)(COD)Pt(SiMeCl2)2(式中、「COD」は1,5-シクロオクタジエンである)などの米国特許第6,605,734号に記載されているアルケン-白金-シリル錯体;及び/又は
(v)Karstedt触媒、すなわち典型的にはトルエンが使用され得るような溶媒中に、約1重量%の白金を含有する白金ジビニルテトラメチルジシロキサン錯体が挙げられる。これらは、米国特許第3,715,334号及び米国特許第3,814,730号に記載されている。
成分(C)の補強性充填剤は、好ましくは微粉化形態のヒュームドシリカ、及び/又は好ましくは微粉化形態の沈降シリカ、及び/又はコロイド状シリカ、及び/又は適切なシリコーン樹脂によって例示され得る。
(i)アルケニル基及びアルキニル基から選択される1分子当たり少なくとも1個の不飽和基、並びに
(ii)無水物官能基及び芳香族官能基であって、芳香族官能基の炭素が、1~3個の非芳香族炭素原子を含む炭素鎖によって無水物のカルボニル基の炭素から分離されている、無水物官能基及び芳香族官能基を有する、ポリオルガノシロキサンである。
成分(D)は、本出願人から国際公開第2021/0260055号として公開された国際PCT出願/米国第20/044709号(その内容は本明細書に組み込まれる)に従って記載されるように調製され得る。
成分(D)は、25℃で5~100,000MPa.s超の粘度を有することができる点を除く。
成分(A)中の不飽和基の一部は、(D)(ii)の無水物官能基によって置換され、その結果、成分(D)(i)及び(D)(ii)が存在する。
これは、以下に述べるように、ラジカルグラフト化によってポリオルガノシロキサン上に無水物官能基を導入する官能化反応を用いて達成される。
化学量論的不足量の無水物を利用する場合、得られる主反応生成物は、反応物のモル比に応じて(b)及び(c)の一部もまた存在してもよいが、以下の(a)である。
(a)単官能化ポリオルガノシロキサン:ViR4 2SiO-(R5 2SiO)m-SiR4 2A’
(b)二官能化ポリオルガノシロキサン:A’R4 2SiO-(R5 2SiO)m-SiR4 2A’;
(c)未反応ビニル官能性ポリオルガノシロキサン:ViR4 2SiO-(R5 2SiO)m-SiR4 2Vi;
そしてA’は、
であり、式中、Xは、溶媒の残部(例えば、トリル基又はキシリル基)、又は開始剤の残部(例えば、ベンゾイル基)である芳香族基である。
の一官能化ポリオルガノシロキサンを含んでもよく、ここで
各R4はアルキル基であり、各R5はアルキル基、アルケニル基、アルキニル基又はA’であり、A’は、
であり、式中、Xは芳香族基であり、各分子は少なくとも1個のアルケニル基又はアルキニル基を含む。一実施形態では、Xは、任意の適切な芳香族基であってよく、例えば、ベンゾイル基、トリル基又はキシリル基であるが、これらに限定されない。
式中、Ixは、対象となる官能基の積分面積(アルケニルについては6.3~5.6ppm、及び無水物については3.5~2.0ppm)であり、Iisは、内部標準(3.68ppm)の積分面積であり、Nisは、内部標準の核の数(この場合Nis=8)であり、Nxは、対象となる官能基についての核の数(アルケニルについては6、及び無水物については5)であり、Cxは、対象となる官能基の濃度であり、Cisは、内部標準の濃度である。
熱可塑性基材上で、有機樹脂基材上で、又は熱可塑性かつ有機樹脂基材表面上で有意な接着を達成することができる硬化性シリコーンエラストマー組成物を含み得、これは、以下の成分を含む。
成分A
組成物の総重量に基づいて10~85重量%、あるいは組成物の総重量に基づいて20~80重量%、あるいは組成物の総重量に基づいて20~75重量%、あるいは組成物の総重量に基づいて30~65重量%の量で、1分子当たり少なくとも2つのアルケニル基を含有し、25℃で1000mPa.s~500,000mPa.sの範囲の粘度を有する1個以上のオルガノポリシロキサン、
成分B
成分(B)が(B)(i)である場合、有機過酸化物は、いずれの場合も組成物の重量に基づいて0.2~3重量%、あるいは0.2~2重量%の量で存在し得る。
あるいは、成分(B)(ii)(a)である場合、全組成物の0.1~40重量%、あるいは全組成物の0.5~20重量%、あるいは全組成物の0.5~10重量%、更にあるいは全組成物の1重量%~5重量%の量で、1分子当たり少なくとも2又は3個のケイ素結合水素原子を含有するオルガノポリシロキサン、
成分(B)(ii)(b)である場合、全組成物の0.01~10重量%、あるいは全組成物の0.01重量%~5重量%、更にあるいは全組成物の0.05重量%~2重量%の量の少なくとも1個のヒドロシリル化触媒であり、
成分(C)、組成物の総重量に基づいて1~80重量%、あるいは組成物の総重量に基づいて1~50重量%、あるいは組成物の総重量に基づいて5~50重量%、更にあるいは組成物の総重量に基づいて8~30重量%の量で、少なくとも1個の補強性充填剤及び任意選択で1個以上の非補強性充填剤、
成分(D)も含まれる。
a)本明細書に記載の硬化性シリコーンエラストマー組成物の混合物を形成することと、
b)任意選択で、基材が、例えば、プラズマ、コロナ及び/又はUV-Cによって表面処理された後に、基材の表面上に混合物を適用することと、
c)混合物を80~250℃の温度で硬化させることと、を含む物品又は物品の複合パーツを調製するためのプロセスが提供される。
接着促進剤1:ViR4 2SiO-(R5 2SiO)m-SiR4 2Vi[式中、R4及びR5はメチルであり、mの平均値は177である]と、無水マレイン酸(MAH)及びAH及び過酸化ベンゾイル(BPO)との、m-キシレン中での反応生成物であって、得られた生成物は、9600のビニル当量(g/mol Vi)及び22,000の無水物当量(g/mol無水物)を有していた。
接着促進剤2 ViR4 2SiO-(R5 2SiO)m-SiR4 2Vi[式中、R4及びR5はメチルであり、mの平均値は46である]と、無水マレイン酸及び過酸化ベンゾイル(BPO)とのm-キシレン中での反応生成物であって、得られた生成物は、3700のビニル当量(g/mol Vi)及び3900の無水物当量(g/mol無水物)を有していた。
接着促進剤3 ViR4 2SiO-(R5 2SiO)m-SiR4 2Vi[式中、R4及びR5はメチルであり、mの平均値は7である]と、無水マレイン酸及び過酸化ベンゾイル(BPO)とのm-キシレン中での反応生成物であって、得られた生成物は、1000のビニル当量(g/mol Vi)及び860の無水物当量(g/mol無水物)を有していた。
接着促進剤4は、接着促進剤3について同定された出発成分を使用するが、添加剤3について使用されたよりも低減されたMAH:Vi比を使用した更なる例であり、590のビニルの当量(g/mol Vi)及び1400の無水物の当量(g/mol無水物)をもたらす。
上記において、mの平均値の推定値は、ポリスチレン標準で較正されたトルエンなどの溶媒中でのGPCによって得られたポリマーピークの数平均分子量(Mn)から、以下の式を使用することによって決定した。以下の式を用いて
式中、FWは括弧内の構造基の式量を示し、Mn及び全てのFWはg/molで報告される。例えば、構造MVi-Dn-MViのビニル末端PDMSについて、
である。
ビニルの当量(EW(Vi))は、ポリスチレン標準で較正されたトルエンなどの溶媒中でのGPCによって得られたポリマーピークの数平均分子量(Mn)から再び決定され、以下の式を使用して決定される。
無水物の当量(EW(anh))は、以下のように得られる:EW(anh)=Mn/(x+z)。
基材1(S.1)は、BASFによりUltradur(商標)B4300G4の商品名で販売されているポリブチレンテレフタレート(PBT)であった(20%ガラス繊維)。
まず2.00gの阻害剤1、続いて18.00gのポリマー2を添加することによって、歯科用カップ中で阻害剤溶液1の試料を調製する。次に、添加した成分を2000回転/分(rpm)で30秒間混合した。
まず2.00gの白金触媒1、続いて18.00gのポリマー2を添加することによって、歯科用カップ中で触媒溶液1の試料を調製する。次に、添加した成分を200回転/分(rpm)で30秒間混合した。
歯科用カップ中に、所望の量のポリマー1、ポリマー2、添加剤1又は2(適用する場合)、シラン1、シラン2、及び充填剤1を添加する。穏やかに手で混合し、1600回転/分(rpm)で30秒間、1回歯科用混合する。充填剤2を添加する。穏やかに手で混合し、1600回転/分(rpm)で30秒間、1回歯科用混合する。充填剤3を添加する。穏やかに手で混合し、1600回転/分(rpm)で30秒間、2回歯科用混合する。所望の量の阻害剤溶液1及び架橋剤1を添加する。穏やかに手で混合し、1600回転/分(rpm)で30秒間、1回歯科用混合する。所望の量の触媒溶液1を添加する。穏やかに手で混合し、1600回転/分(rpm)で30秒間、1回歯科用混合し、最終試料を得る。
Claims (11)
- 好適な材料基材に対して接着を達成できる硬化性シリコーンエラストマー組成物であって、
(A)アルケニル基及びアルキニル基から選択される不飽和基を1分子当たり少なくとも2個含むが、無水物官能基を含まず、25℃で1000mPa.s~500,000mPa.sの範囲の粘度を有する、1個以上のオルガノポリシロキサンと、
(B)硬化剤であって、
(B)(i)有機過酸化物ラジカル開始剤、又は
(B)(ii)ヒドロシリル化硬化触媒パッケージであって、
a.1分子当たり少なくとも2個、若しくは少なくとも3個のSi-H基を有する有機ケイ素化合物、及び
b.ヒドロシリル化触媒を含む、ヒドロシリル化硬化触媒パッケージを含む、硬化剤と、
(C)少なくとも1個の補強充填剤及び任意選択で1個以上の非補強充填剤と、
(D)ポリオルガノシロキサンであって、
(i)アルケニル基及びアルキニル基から選択される1分子当たり少なくとも1個の不飽和基、並びに
(ii)無水物官能基及び芳香族官能基であって、芳香族官能基の炭素が、1~3個の非芳香族炭素原子を含む炭素鎖によって無水物のカルボニル基の炭素から分離されている、無水物官能基及び芳香族官能基を有する、ポリオルガノシロキサンと、を含み、
成分(D)は、式
の一官能化ポリオルガノシロキサンを含み、ここで
mは7~177の数であり、各R4はアルキル基であり、各R5はアルキル基、アルケニル基、アルキニル基又はA’であり、A’は、
であり、式中、Xは、ベンゾイル基、トリル基又はキシリル基であり、各分子は少なくとも1個のアルケニル基又はアルキニル基を含み、
成分(D)を組成物の全量に対し0.5~5重量%の量で含有する、
硬化性シリコーンエラストマー組成物。 - 前記組成物は硬化阻害剤を含む、請求項1に記載の硬化性シリコーンエラストマー組成物。
- 使用前に少なくとも2つの別個のパーツで保管される、請求項1に記載の硬化性シリコーンエラストマー組成物。
- 物品又は物品の複合パーツを調製するためのプロセスであって、
a)請求項1に記載の硬化性シリコーンエラストマー組成物の混合物を形成することと、
b)前記混合物を基材の表面上に適用することと、
c)前記混合物を80~250℃の温度で硬化させることと、を含む、プロセス。 - 前記基材はポリカーボネートである、請求項4に記載のプロセス。
- 請求項1に記載の硬化性シリコーンエラストマー組成物から硬化された物品。
- 請求項1に記載の硬化性シリコーンエラストマー組成物から硬化されたシリコーンエラストマーがプラスチック基材に被着された物品。
- 請求項1に記載の硬化性シリコーンエラストマー組成物から硬化されたシリコーンエラストマーが熱可塑性基材、有機樹脂基材、又は熱可塑性かつ有機樹脂基材上に被着された物品。
- シリコーンシール、ガスケット、プラグ、コネクタ、センサーのコンポーネント、膜、隔壁、又は気候換気コンポーネントを有するハウジング;並びに
携帯電話カバーシール、携帯電話付属品、精密電子機器、電気スイッチ、スイッチカバー、腕時計、リストバンド、及びウェアラブル電子デバイスから選択されるパーソナル電子機器;
から選択される、請求項6又は7に記載の物品。 - 請求項1に記載の硬化性シリコーンエラストマー組成物から硬化されたシリコーンエラストマーを、プラスチック、熱可塑性、又は樹脂材料の基材上に含む、複合物。
- シリコーンシール、ガスケット、プラグ、コネクタ、センサーのコンポーネント、膜、隔壁、又は気候換気コンポーネントを有するハウジング;
携帯電話カバーシール、携帯電話付属品、精密電子機器、電気スイッチ、スイッチカバー、腕時計、リストバンド、ウェアラブル器具、及びウェアラブル電子デバイスから選択されるパーソナル電子機器;並びに
携帯電話、モバイル通信機器、ゲーム機、時計、画像受信機、DVD機器、MD機器、CD機器、電子レンジ、冷蔵庫、電気炊飯器、陰極線テレビ、液晶テレビ及びプラズマテレビの薄型ディスプレイ、複写機、プリンター、ファクシミリ機、コネクタシール、スパークプラグキャップ、又はセンサーのコンポーネントのパーツ;
から選択される、請求項10に記載の複合物。
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