JP7339926B2

JP7339926B2 - power converter

Info

Publication number: JP7339926B2
Application number: JP2020099462A
Authority: JP
Inventors: 克弘市橋; 祐一半田
Original assignee: Denso Corp
Current assignee: Denso Corp
Priority date: 2020-06-08
Filing date: 2020-06-08
Publication date: 2023-09-06
Anticipated expiration: 2040-06-08
Also published as: JP2021193860A

Description

本発明は、電力変換装置に関するものである。 The present invention relates to power converters.

従来、ＤＣ／ＤＣコンバータ等の電力変換装置は、スイッチング素子、トランス、リアクトル等により構成されている。これらのトランス、リアクトルなどのコイルは、適切に放熱をする必要がある。このため、例えば、特許文献１に記載の発明では、コイル基板の両側に放熱部材を配置し、コイル基板の両側から熱を逃がすように構成し、放熱性を向上させている。 Conventionally, power converters such as DC/DC converters are composed of switching elements, transformers, reactors, and the like. Coils such as these transformers and reactors need to properly dissipate heat. For this reason, for example, in the invention described in Patent Document 1, heat dissipation members are arranged on both sides of the coil substrate to release heat from both sides of the coil substrate, thereby improving heat dissipation.

特開２０１８－１８６５９６号公報JP 2018-186596 A

ところで、コイルの巻き数は、要求される仕様により変化する。コアに対する巻き数が多くなると、コイルの一部と、放熱部材との間の距離が長くなり、放熱しにくくなるという問題がある。 By the way, the number of turns of the coil varies depending on the required specifications. As the number of turns on the core increases, the distance between a portion of the coil and the heat dissipation member increases, resulting in a problem of difficulty in heat dissipation.

本発明は、上記課題を解決するためになされたものであり、その目的は、放熱性を向上させることができる電力変換装置を提供することにある。 The present invention has been made to solve the above problems, and an object thereof is to provide a power conversion device capable of improving heat dissipation.

上記課題を解決するための手段は、回路基板と、前記回路基板に設けられたコイルと、前記回路基板を保持するとともに前記回路基板を放熱する放熱部材と、を備える電力変換装置において、前記回路基板の少なくとも一方の面には、前記回路基板の熱伝導率に比較して熱伝導率が高い伝熱部材が当接しており、前記伝熱部材は、絶縁部材を介して前記放熱部材に熱的に接続されており、前記コイルからの熱を前記放熱部材に伝達する伝熱経路とされている。 Means for solving the above problems is a power conversion device comprising a circuit board, a coil provided on the circuit board, and a heat dissipation member that holds the circuit board and dissipates heat from the circuit board. A heat transfer member having a higher thermal conductivity than the circuit board is in contact with at least one surface of the substrate, and the heat transfer member transfers heat to the heat radiating member via an insulating member. are connected to each other and form a heat transfer path for transferring heat from the coil to the heat dissipating member.

これにより、コイルと放熱部材との間の距離が離れていても、伝熱部材によりコイルからの熱が放熱部材に伝達する。これにより、放熱部材との間の距離が離れているコイルの放熱を好適に行うことができる。 Thereby, even if the distance between the coil and the heat radiating member is long, the heat from the coil is transmitted to the heat radiating member by the heat transfer member. As a result, heat can be preferably dissipated from the coil that is distant from the heat dissipating member.

電力変換装置の回路図。The circuit diagram of a power converter. 磁気部品の斜視断面図。3 is a perspective cross-sectional view of the magnetic component; FIG. 磁気部品の縦断面図。FIG. 4 is a vertical cross-sectional view of the magnetic component; 磁気部品の拡大縦断面図。Enlarged vertical cross-sectional view of the magnetic component. （ａ）は、磁気部品の平面図、（ｂ）は、下コアの側面図。(a) is a plan view of a magnetic component, and (b) is a side view of a lower core. 磁気部品の平面図。The top view of a magnetic component. 別例の磁気部品の平面図。The top view of the magnetic component of another example. 別例の磁気部品の縦断面図。FIG. 10 is a vertical cross-sectional view of another magnetic component;

以下、「電力変換装置」を絶縁型ＤＣ－ＤＣコンバータに具体化した実施形態について、図面を参照しつつ説明する。なお、以下では、各実施形態及び別例で互いに同一又は均等である部分には同一符号を付しており、同一符号の部分についてはその説明を援用する。 An embodiment in which the "power converter" is embodied as an insulated DC-DC converter will be described below with reference to the drawings. In addition, below, the same code|symbol is attached|subjected to the part which is mutually the same or equivalent in each embodiment and another example, and the description is used about the part of the same code|symbol.

図１に、電力変換装置としての絶縁型ＤＣ－ＤＣコンバータ１０の回路構成の一部を示す。図１に示すように、絶縁型ＤＣ－ＤＣコンバータ１０は、１次側コイル２１及び２次側コイル２２ａ，２２ｂを有するトランス２０を備える。１次側コイル２１は、１次側回路１１に設けられ、１次側回路１１には、図示しない電源から直流電流を入力し、交流電流に変換して出力する１次側インバータ１２や、１次側リアクトルとしてのコイル１３等が設けられている。 FIG. 1 shows part of the circuit configuration of an insulated DC-DC converter 10 as a power converter. As shown in FIG. 1, the insulated DC-DC converter 10 includes a transformer 20 having a primary side coil 21 and secondary side coils 22a and 22b. The primary side coil 21 is provided in the primary side circuit 11. The primary side circuit 11 receives a direct current from a power supply (not shown), converts it to an alternating current, and outputs the alternating current. A coil 13 and the like are provided as a secondary reactor.

また、２次側コイル２２ａ，２２ｂは、２次側回路１４に設けられている。２次側回路１４は、交流電流を入力し、直流電流に変換して図示しない負荷に出力する２次側インバータ１５ａ，１５ｂや、２次側リアクトルとしてのコイル１６ａ，１６ｂ等が設けられている。なお、２次側回路１４では、２次側コイル２２ａ，２２ｂなどがそれぞれ１対設けられている。 Secondary coils 22 a and 22 b are provided in the secondary circuit 14 . The secondary side circuit 14 is provided with secondary side inverters 15a and 15b for inputting an alternating current, converting it to a direct current and outputting it to a load (not shown), coils 16a and 16b as secondary side reactors, and the like. . In the secondary circuit 14, a pair of secondary coils 22a and 22b are provided.

次に、図２～図５に基づいて、トランス２０の具体的構造について説明する。図２に、トランス２０等を含む磁気部品の斜視断面図を示し、図３に、磁気部品の縦断面図を示し、図４に、磁気部品の拡大断面図を示し、図５（ａ），図６に、磁気部品の平面図を示す。 Next, a specific structure of the transformer 20 will be described with reference to FIGS. 2 to 5. FIG. FIG. 2 shows a perspective cross-sectional view of a magnetic component including a transformer 20, etc., FIG. 3 shows a vertical cross-sectional view of the magnetic component, FIG. 4 shows an enlarged cross-sectional view of the magnetic component, and FIGS. FIG. 6 shows a plan view of the magnetic component.

図３に示すように、トランス２０を構成する１次側コイル２１、２次側コイル２２ａ，２２ｂは、回路基板３０に設けられている。図２に示すように、この回路基板３０は、筐体４０に保持されている。また、回路基板３０の中心には、回路基板３０を貫くようにコア５０が配置されている。 As shown in FIG. 3 , a primary coil 21 and secondary coils 22 a and 22 b that constitute a transformer 20 are provided on a circuit board 30 . As shown in FIG. 2, this circuit board 30 is held by a housing 40 . A core 50 is arranged in the center of the circuit board 30 so as to penetrate the circuit board 30 .

筐体４０は、図２に示すように、箱状に形成されている。筐体４０は、アルミ合金などの熱伝導率が優れた材料で形成されており、放熱性に優れている。筐体４０は、平板の底板４１と、底板４１の外縁において立設し、外縁を囲む側壁４２と、底板４１に対向配置される天板４３を有する。この実施形態では、筐体４０（及び筐体４０を構成する底板４１又は天板４３）が、放熱部材に相当する。 The housing 40 is formed in a box shape, as shown in FIG. The housing 40 is made of a material with excellent thermal conductivity, such as an aluminum alloy, and is excellent in heat dissipation. The housing 40 has a flat plate bottom plate 41 , side walls 42 erected on the outer edge of the bottom plate 41 to surround the outer edge, and a top plate 43 arranged to face the bottom plate 41 . In this embodiment, the housing 40 (and the bottom plate 41 or the top plate 43 constituting the housing 40) corresponds to the heat dissipation member.

筐体４０の内部には、１次側コイル２１及び２次側コイル２２ａ，２２ｂに対するコア５０が収容されている。コア５０は、フェライトで構成されており、上下に分割されている。下方（底板４１の側）に配置されるコアを、下コア５１と示し、上方（天板４３の側）に配置されるコアを、上コア５２と示す。下コア５１は、上コア５２とほぼ上下対称に構成されているため、下コア５１を中心に説明し、上コア５２の説明は省略する。なお、以降では、図２に示すように、筐体４０の上下方向をＺ軸方向と示し、筐体４０の長手方向をＸ軸方向と示し、筐体４０の短手方向をＹ軸方向と示す。 A core 50 for the primary coil 21 and the secondary coils 22a and 22b is housed inside the housing 40 . The core 50 is made of ferrite and divided into upper and lower parts. The core arranged below (on the side of the bottom plate 41 ) is indicated as a lower core 51 , and the core arranged above (on the side of the top plate 43 ) is indicated by an upper core 52 . Since the lower core 51 and the upper core 52 are substantially vertically symmetrical, the explanation will focus on the lower core 51 and the explanation of the upper core 52 will be omitted. Hereinafter, as shown in FIG. 2, the vertical direction of the housing 40 is indicated as the Z-axis direction, the longitudinal direction of the housing 40 is indicated as the X-axis direction, and the lateral direction of the housing 40 is indicated as the Y-axis direction. show.

図３に示すように、下コア５１は、基部５３と、基部５３の中央からＺ軸方向に突出する中央部５４と、を有している。基部５３は、図３、図５（ａ）に示すように、正方形の略４角柱状に形成されている。そして、基部５３の各側面の略中央には、それぞれ外側に開口する凹部５５が形成されている。この凹部５５は、断面が台形状に形成されており、Ｚ軸方向（図５（ａ）において紙面の垂直方向）に沿って基部５３の端から端まで形成されている。逆言えば、基部５３の各角部には、外側に突出する凸部が形成されているともいえる。中央部５４は、円柱状に形成されており、Ｚ軸方向に沿って基部５３から突出するように形成されている。 As shown in FIG. 3, the lower core 51 has a base portion 53 and a central portion 54 protruding from the center of the base portion 53 in the Z-axis direction. As shown in FIGS. 3 and 5(a), the base portion 53 is formed in a substantially square prism shape. A concave portion 55 that opens outward is formed approximately in the center of each side surface of the base portion 53 . The recess 55 has a trapezoidal cross section and is formed from end to end of the base 53 along the Z-axis direction (perpendicular to the paper surface in FIG. 5A). Conversely, it can be said that each corner of the base portion 53 is formed with a convex portion protruding outward. The central portion 54 is formed in a columnar shape and is formed to protrude from the base portion 53 along the Z-axis direction.

また、図５（ａ）及び図５（ｂ）に示すように、基部５３の各角部には、基部５３からＺ軸方向に突出する磁脚５３ａがそれぞれ設けられている。この磁脚５３ａは、Ｚ軸方向において、中央部５４と同じ程度の高さを有するように構成されている。なお、磁脚５３ａは、後述する回路基板３０の設置場所を避けるように設けられている。 Further, as shown in FIGS. 5A and 5B, each corner of the base 53 is provided with a magnetic leg 53a projecting from the base 53 in the Z-axis direction. The magnetic leg 53a is configured to have approximately the same height as the central portion 54 in the Z-axis direction. The magnetic legs 53a are provided so as to avoid the installation location of the circuit board 30, which will be described later.

そして、上コア５２と下コア５１は、その中央部５４及び磁脚５３ａ同士が当接するように、上コア５２と下コア５１とを重ね合わせて配置される。その際、基部５３の角や、凹部５５が対応するように上コア５２と下コア５１とが重ね合わせられる。これにより、コア５０では、コア５０の外側に開口する凹部５５がＺ軸方向に沿って設けられていることとなる。また、図３に示すように、コア５０には、中央部５４の周面と基部５３の平面とで囲まれたくびれ部５６が形成されることとなる。 The upper core 52 and the lower core 51 are arranged so that the central portion 54 and the magnetic legs 53a of the upper core 52 and the lower core 51 are in contact with each other. At that time, the upper core 52 and the lower core 51 are overlapped so that the corners of the base portion 53 and the concave portions 55 correspond to each other. As a result, the core 50 is provided with a concave portion 55 opening to the outside of the core 50 along the Z-axis direction. Further, as shown in FIG. 3 , the core 50 is formed with a constricted portion 56 surrounded by the peripheral surface of the central portion 54 and the plane of the base portion 53 .

なお、下コア５１は、放熱シート６１を介して、底板４１に密接するように配置されている。上コア５２も同様に、放熱シート６２を介して、天板４３に密接するように配置されている。なお、放熱シート６１，６２は、絶縁性を有している。また、放熱シート６１，６２は、熱伝導グリスに変更してもよい。 Note that the lower core 51 is arranged so as to be in close contact with the bottom plate 41 with the heat dissipation sheet 61 interposed therebetween. Similarly, the upper core 52 is arranged so as to be in close contact with the top plate 43 via the heat dissipation sheet 62 . In addition, the heat radiation sheets 61 and 62 have insulation. Also, the heat dissipation sheets 61 and 62 may be changed to heat conductive grease.

そして、図２に示すように、筐体４０には、底板４１からＺ軸方向に沿って天板４３の側に突出する突出部としての第１突出部４４が複数（本実施形態では４つ）形成されている。４つ第１突出部４４は、図３、図５（ａ）に示すように、コア５０の４辺を取り囲むように配置されている。 As shown in FIG. 2, the housing 40 has a plurality of first projections 44 (four in this embodiment) projecting from the bottom plate 41 toward the top plate 43 along the Z-axis direction. ) is formed. The four first protrusions 44 are arranged to surround the four sides of the core 50 as shown in FIGS. 3 and 5(a).

より詳しくは、図５（ａ）に示すように、４つの第１突出部４４は、それぞれ基部５３の凹部５５に対応するように配置されている。すなわち、第１突出部４４は、その断面形状が台形である４角柱状に形成されている。そして、第１突出部４４は、第１突出部４４の上底（短いほうの底辺）が凹部５５の底部と向かい合い、かつ、斜辺がそれぞれ凹部５５の斜辺（台形の脚）と向かい合うように、設けられている。その際、第１突出部４４が凹部５５内に配置されるようになっている。 More specifically, as shown in FIG. 5A, the four first projections 44 are arranged so as to correspond to the recesses 55 of the base 53, respectively. That is, the first projecting portion 44 is formed in a quadrangular prism shape having a trapezoidal cross-sectional shape. The first projecting portion 44 is arranged such that the upper base (shorter base) of the first projecting portion 44 faces the bottom of the recess 55, and the oblique sides of the first projecting portion 44 face the oblique sides of the recess 55 (legs of the trapezoid). is provided. At that time, the first protrusion 44 is arranged in the recess 55 .

図３に示すように、Ｚ軸方向において、第１突出部４４の高さは、下コア５１の基部５３の上面の高さとほぼ同じとなっている。つまり、第１突出部４４の高さは、基部５３と放熱シート６１とを合わせた高さとほぼ同じとなっている。 As shown in FIG. 3, the height of the first projecting portion 44 is substantially the same as the height of the upper surface of the base portion 53 of the lower core 51 in the Z-axis direction. That is, the height of the first projecting portion 44 is approximately the same as the combined height of the base portion 53 and the heat dissipation sheet 61 .

また、天板４３からＺ軸方向に沿って底板４１の側に突出する突出部としての第２突出部４５が複数（４つ）設けられている。第２突出部４５は、Ｚ軸方向における高さ寸法以外、第１突出部４４とほぼ同様に設けられている。すなわち、各第２突出部４５は、それぞれ第１突出部４４に対応するように上下対称に設けられている。 A plurality (four) of second protrusions 45 are provided as protrusions protruding from the top plate 43 toward the bottom plate 41 along the Z-axis direction. The second projecting portion 45 is provided in substantially the same manner as the first projecting portion 44 except for the height dimension in the Z-axis direction. That is, the second protrusions 45 are vertically symmetrically provided so as to correspond to the first protrusions 44 respectively.

そして、図６に示すように、第１突出部４４及び下コア５１の基部５３の上には、回路基板３０が、絶縁シート６３を介して、載置される。この回路基板３０は、その垂直方向がＺ軸方向と平行となるように、載置されている。また、回路基板３０は、中心に、貫通孔３１が設けられており、当該貫通孔３１内に下コア５１の基部５３から突出する中央部５４が挿通される。言い換えると、回路基板３０は、中央部５４を囲むように環状に形成されているともいえる。 Then, as shown in FIG. 6 , the circuit board 30 is placed on the first projecting portion 44 and the base portion 53 of the lower core 51 with an insulating sheet 63 interposed therebetween. The circuit board 30 is placed so that its vertical direction is parallel to the Z-axis direction. A through hole 31 is provided in the center of the circuit board 30 , and a central portion 54 projecting from a base portion 53 of the lower core 51 is inserted into the through hole 31 . In other words, it can be said that the circuit board 30 is formed in an annular shape so as to surround the central portion 54 .

この回路基板３０は、積層基板であり、図４に示すように、回路基板３０の内部には、１次側コイル２１と、２次側コイル２２ａ等が設けられている。より詳しくは、回路基板３０は、複数の絶縁層及び複数の配線層等から構成されている。複数の配線層のうち２層の配線層には、１次側コイル２１が形成されている。また、複数の配線層のうち２層の配線層には、２次側コイル２２ａが形成されている。なお、配線層と配線層の間には、絶縁層が形成されている。また、最外層は、絶縁層となっている。 The circuit board 30 is a laminated board, and as shown in FIG. 4, a primary side coil 21, a secondary side coil 22a and the like are provided inside the circuit board 30. As shown in FIG. More specifically, the circuit board 30 is composed of a plurality of insulating layers, a plurality of wiring layers, and the like. A primary coil 21 is formed in two wiring layers among the plurality of wiring layers. In addition, secondary coils 22a are formed in two wiring layers among the plurality of wiring layers. An insulating layer is formed between the wiring layers. Moreover, the outermost layer is an insulating layer.

１次側コイル２１は、図４に示すように、複数（本実施形態では７つ）の１次側のコイル部材２３ａ～２３ｇを有する。各コイル部材２３ａ～２３ｇは、図５（ａ）や図６において破線で示すように、それぞれ円環状に形成されている。各コイル部材２３ａ～２３ｇは、幅広の帯状に形成されている。 As shown in FIG. 4, the primary coil 21 has a plurality (seven in this embodiment) of primary coil members 23a to 23g. Each of the coil members 23a to 23g is formed in an annular shape, as indicated by broken lines in FIGS. 5(a) and 6. FIG. Each of the coil members 23a to 23g is formed in a wide strip shape.

コイル部材２３ａ～２３ｄは、同じ配線層に設けられており、コア５０の中央部５４を中心として同心円状となるように、中央部５４を囲むように配置されている。同様に、コイル部材２３ｅ～２３ｇは、同じ配線層に設けられており、コア５０の中央部５４を中心として同心円状となるように、中央部５４を囲むように配置されている。なお、コイル部材２３ａ～２３ｄが設けられる配線層と、コイル部材２３ｅ～２３ｇが設けられる配線層と、は異なっている。 The coil members 23a to 23d are provided on the same wiring layer, and are arranged to surround the central portion 54 of the core 50 so as to form concentric circles with the central portion 54 as the center. Similarly, the coil members 23e to 23g are provided on the same wiring layer, and are arranged to surround the central portion 54 of the core 50 so as to form concentric circles with the central portion 54 as the center. The wiring layer provided with the coil members 23a to 23d is different from the wiring layer provided with the coil members 23e to 23g.

また、径方向において、隣り合うコイル部材２３ａ～２３ｇは、所定距離離れて配置される。そして、径方向おいて、隣り合うコイル部材２３ａ～２３ｇの間には基板（絶縁材料）が配置されている。また、本実施形態において、１次側コイル２１の巻き数を調整するため、Ｚ軸方向において上側（天板４３の側）であって、外側に配置されるコイル部材２３ｇの幅寸法は、他のコイル部材２３ａ～２３ｆよりも広くなっている。なお、各コイル部材２３ａ～２３ｇは、スルーホールや配線などで互いに接続されて１次側コイル２１を構成している。 In the radial direction, adjacent coil members 23a to 23g are arranged with a predetermined distance therebetween. A substrate (insulating material) is arranged between the adjacent coil members 23a to 23g in the radial direction. In addition, in the present embodiment, in order to adjust the number of turns of the primary coil 21, the width dimension of the coil member 23g arranged on the upper side (the side of the top plate 43) and on the outer side in the Z-axis direction may be changed to other values. are wider than the coil members 23a to 23f. The coil members 23a to 23g are connected to each other via through holes, wiring, or the like to form the primary side coil 21. As shown in FIG.

２次側コイル２２ａも同様に、図４に示すように、複数（本実施形態では８つ）の２次側のコイル部材２４ａ～２４ｈを有する。各コイル部材２４ａ～２４ｈは、それぞれ円環状に形成されている。また、各コイル部材２４ａ～２４ｈは、幅広の帯状に形成されている。 Similarly, as shown in FIG. 4, the secondary coil 22a also has a plurality of (eight in this embodiment) secondary coil members 24a to 24h. Each of the coil members 24a-24h is formed in an annular shape. Also, each of the coil members 24a to 24h is formed in a wide strip shape.

コイル部材２４ａ～２４ｄは、同じ配線層に設けられており、コア５０の中央部５４を中心として同心円状となるように、中央部５４を囲むように配置されている。同様に、コイル部材２４ｅ～２４ｈは、同じ配線層に設けられており、コア５０の中央部５４を中心として同心円状となるように、中央部５４を囲むように配置されている。なお、コイル部材２４ａ～２４ｄが設けられる配線層と、コイル部材２４ｅ～２４ｈが設けられる配線層と、は異なっている。 The coil members 24a to 24d are provided on the same wiring layer and are arranged to surround the central portion 54 of the core 50 so as to form concentric circles with the central portion 54 as the center. Similarly, the coil members 24e to 24h are provided in the same wiring layer, and are arranged so as to surround the central portion 54 of the core 50 so as to form concentric circles with the central portion 54 as the center. The wiring layer provided with the coil members 24a to 24d is different from the wiring layer provided with the coil members 24e to 24h.

また、径方向において、隣り合うコイル部材２４ａ～２４ｈは、所定距離離れて配置される。そして、径方向おいて、隣り合うコイル部材２４ａ～２４ｈの間には基板（絶縁材料）が配置されている。なお、各コイル部材２４ａ～２４ｈは、スルーホールや配線などで互いに接続されて２次側コイル２２ａを構成している。 Also, in the radial direction, adjacent coil members 24a to 24h are arranged apart from each other by a predetermined distance. A substrate (insulating material) is arranged between the adjacent coil members 24a to 24h in the radial direction. The coil members 24a to 24h are connected to each other via through-holes or wires to form a secondary coil 22a.

そして、２次側コイル２２ａを構成する各コイル部材２４ａ～２４ｈは、それぞれ１次側コイル２１を構成する各コイル部材２３ａ～２３ｇに対してＺ軸方向において、絶縁層を挟んで対向するように、配置されている。 The coil members 24a to 24h forming the secondary coil 22a are arranged to face the coil members 23a to 23g forming the primary coil 21 in the Z-axis direction with an insulating layer interposed therebetween. , are placed.

また、回路基板３０の下面には、幅広の円環状に構成された２次側コイル２２ｂが固定されている。２次側コイル２２ｂは、中央部５４を中心として配置されている。この回路基板３０は、この２次側コイル２２ｂが下面に固定された状態で、絶縁シート６３を介して第１突出部４４及び下コア５１の基部５３の上に配置されている。 A secondary coil 22b having a wide annular shape is fixed to the lower surface of the circuit board 30 . The secondary coil 22b is arranged with the central portion 54 as the center. The circuit board 30 is arranged on the first projecting portion 44 and the base portion 53 of the lower core 51 with the insulating sheet 63 interposed therebetween, with the secondary coil 22b fixed to the bottom surface.

そして、回路基板３０の上面は、絶縁シート６４により覆われており、絶縁シート６４を介して、第２突出部４５に当接するようになっている。すなわち、回路基板３０は、絶縁シート６３，６４を介して、第１突出部４４及び第２突出部４５により、Ｚ軸方向の両側から挟み込まれるようにして固定されている。 The upper surface of the circuit board 30 is covered with an insulating sheet 64 and comes into contact with the second projecting portion 45 via the insulating sheet 64 . That is, the circuit board 30 is fixed so as to be sandwiched from both sides in the Z-axis direction by the first projecting portion 44 and the second projecting portion 45 via the insulating sheets 63 and 64 .

また、上コア５２の基部５３と、回路基板３０との間には、環状の絶縁リング６５が設けられている。絶縁リング６５のＺ軸方向における厚さ寸法は、上コア５２の基部５３と回路基板３０との間が埋まるように、設定されている。 An annular insulating ring 65 is provided between the base portion 53 of the upper core 52 and the circuit board 30 . The thickness dimension of the insulating ring 65 in the Z-axis direction is set so as to fill the space between the base portion 53 of the upper core 52 and the circuit board 30 .

ところで、１次側コイル２１及び２次側コイル２２ａは、電流が流れると、発熱するため、適切に放熱する必要がある。しかしながら、図３～図５に示すように、基本的に、１次側コイル２１を構成するコイル部材２３ａ～２３ｇは、下コア５１と上コア５２に挟まれており、放熱しにくい構造となっている。 By the way, since the primary coil 21 and the secondary coil 22a generate heat when current flows, it is necessary to appropriately dissipate the heat. However, as shown in FIGS. 3 to 5, basically, the coil members 23a to 23g that constitute the primary coil 21 are sandwiched between the lower core 51 and the upper core 52, which makes it difficult to dissipate heat. ing.

そこで、下コア５１及び上コア５２の各辺に凹部５５を設け、コア５０の間に配置されるコイル部材２３ａ～２３ｇ，２４ａ～２４ｈのうち一部が、下コア５１と上コア５２に挟まれないようにしている。より詳しく説明すると、コイル部材２３ｃ，２３ｄ，２３ｇ，２４ｃ，２４ｄ，２４ｇ，２４ｈの内径は、突出部４４，４５の上底（径方向中央側の辺）よりも外側に位置するように、大きく構成されている。これにより、凹部５５内に配置されたコイル部材２３ｃ，２３ｄ，２３ｇ，２４ｃ，２４ｄ，２４ｇ，２４ｈの一部は、コア５０が介在することなく、Ｚ軸方向において突出部４４，４５に重複し、突出部４４，４５に絶縁シート６３，６４を介して当接するように構成されている。 Therefore, a concave portion 55 is provided on each side of the lower core 51 and the upper core 52, and some of the coil members 23a to 23g and 24a to 24h arranged between the cores 50 are sandwiched between the lower core 51 and the upper core 52. I try not to More specifically, the inner diameters of the coil members 23c, 23d, 23g, 24c, 24d, 24g, and 24h are made large so as to be located outside the upper bases of the protrusions 44 and 45 (sides on the center side in the radial direction). It is configured. As a result, part of the coil members 23c, 23d, 23g, 24c, 24d, 24g, and 24h arranged in the recess 55 overlap the protruding portions 44 and 45 in the Z-axis direction without the core 50 being interposed therebetween. , projecting portions 44 and 45 via insulating sheets 63 and 64. As shown in FIG.

コイル部材２３ｃ，２３ｄ，２３ｇ，２４ｃ，２４ｄ，２４ｇ，２４ｈは、環状に構成されている。このため、一部でも突出部４４，４５に重複していれば、コイル部材２３ｃ，２３ｄ，２３ｇ，２４ｃ，２４ｄ，２４ｇ，２４ｈに沿って突出部４４，４５に適切に放熱させることが可能となる。 The coil members 23c, 23d, 23g, 24c, 24d, 24g, and 24h are annular. Therefore, if even a portion overlaps with the projections 44 and 45, it is possible to properly dissipate the heat to the projections 44 and 45 along the coil members 23c, 23d, 23g, 24c, 24d, 24g and 24h. Become.

一方、コイル部材２３ａ～２３ｇ，２４ａ～２４ｈのうち、他のコイル部材２３ａ，２３ｂ，２３ｅ，２３ｆ，２４ａ，２４ｂ，２４ｅ，２４ｆは、周方向のいずれにおいても下コア５１と上コア５２の間に挟まれている。つまり、これらのコイル部材２３ａ，２３ｂ，２３ｅ，２３ｆ，２４ａ，２４ｂ，２４ｅ，２４ｆの外径は、凹部５５よりも内側となるように設定されている。したがって、図３に示すように、これらのコイル部材２３ａ，２３ｂ，２３ｅ，２３ｆ，２４ａ，２４ｂ，２４ｅ，２４ｆは、周方向いずれにおいても、コア５０に形成されているくぼみ部５６に入り込んでいる。 On the other hand, among the coil members 23a to 23g and 24a to 24h, the other coil members 23a, 23b, 23e, 23f, 24a, 24b, 24e, and 24f are located between the lower core 51 and the upper core 52 in any circumferential direction. sandwiched between. That is, the outer diameters of these coil members 23 a , 23 b , 23 e , 23 f , 24 a , 24 b , 24 e , 24 f are set inside the recess 55 . Therefore, as shown in FIG. 3, these coil members 23a, 23b, 23e, 23f, 24a, 24b, 24e, and 24f enter the recesses 56 formed in the core 50 in any circumferential direction. .

このため、通常であれば、これらのコイル部材２３ａ，２３ｂ，２３ｅ，２３ｆ，２４ａ，２４ｂ，２４ｅ，２４ｆは、突出部４４，４５とその一部が重複するコイル部材２３ｃ，２３ｄ，２３ｇ，２４ｃ，２４ｄ，２４ｇ，２４ｈに比較して、放熱しにくいこととなる。 For this reason, normally, these coil members 23a, 23b, 23e, 23f, 24a, 24b, 24e, and 24f overlap the protrusions 44 and 45 and the coil members 23c, 23d, 23g, and 24c that partially overlap each other. , 24d, 24g, and 24h, it is difficult to radiate heat.

そこで、本実施形態では、図４に示すように、２次側コイル２２ｂを、絶縁シート６３を介して第１突出部４４に熱的に接続させる一方で、コイル２１，２２ａからの熱を突出部４４，４５に伝達する伝熱経路としている。すなわち、２次側コイル２２ｂは、回路基板３０に比較して熱伝導率が高く、また、基部５３の熱伝導率と比較して第１突出部４４の熱伝導率が高いため、２次側コイル２２ｂを熱のバイパス経路として構成している。 Therefore, in the present embodiment, as shown in FIG. 4, the secondary coil 22b is thermally connected to the first projecting portion 44 via the insulating sheet 63, while the heat from the coils 21 and 22a projects. It is a heat transfer path that transfers heat to the portions 44 and 45 . That is, the secondary coil 22b has a higher thermal conductivity than the circuit board 30, and the first projecting portion 44 has a higher thermal conductivity than the base portion 53. The coil 22b is configured as a heat bypass path.

より詳しくは、２次側コイル２２ｂは、Ｚ軸方向においてコア５０及びコイル２１，２２ａと重複する位置から第１突出部４４に重複する位置に達するまで回路基板３０に沿って延びるように形成されている。より具体的には、２次側コイル２２ｂは、コア５０の内側に配置されたコイル部材２３ａ，２３ｂ，２３ｅ，２３ｆ，２４ａ，２４ｂ，２４ｅ，２４ｆに重複する位置から第１突出部４４と重複する位置に達するまで回路基板３０に沿って直線状の伝熱経路が形成されるように構成されている。つまり、２次側コイル２２ｂの径方向における幅寸法は、Ｚ軸方向において、コイル部材２３ａ，２４ａ，２３ｅ，２４ｅに重複する位置から、第１突出部４４と重複する位置に達するまでの幅寸法に相当する。 More specifically, the secondary coil 22b is formed to extend along the circuit board 30 from a position overlapping the core 50 and the coils 21 and 22a in the Z-axis direction to a position overlapping the first projecting portion 44. ing. More specifically, the secondary coil 22b overlaps the first projecting portion 44 from a position overlapping the coil members 23a, 23b, 23e, 23f, 24a, 24b, 24e, and 24f arranged inside the core 50. A linear heat transfer path is formed along the circuit board 30 until it reaches a position where the heat transfer is performed. That is, the width dimension in the radial direction of the secondary coil 22b is the width dimension from the position overlapping the coil members 23a, 24a, 23e, and 24e to the position overlapping the first projecting portion 44 in the Z-axis direction. corresponds to

これにより、図４において矢印に示すように、コア５０の内側に配置されたコイル部材２３ａ，２３ｂ，２３ｅ，２３ｆ，２４ａ，２４ｂ，２４ｅ，２４ｆから生じた熱は、２次側コイル２２ｂを介して第１突出部４４まで伝達される。 As a result, as indicated by arrows in FIG. 4, heat generated from the coil members 23a, 23b, 23e, 23f, 24a, 24b, 24e, and 24f arranged inside the core 50 passes through the secondary coil 22b. and is transmitted to the first projecting portion 44 .

以上のように構成した第１実施形態は、以下に示す有利な効果を有する。 The first embodiment configured as described above has the following advantageous effects.

回路基板３０の下面には、回路基板３０の熱伝導率に比較して熱伝導率が高い伝熱部材としての２次側コイル２２ｂが当接している。そして、２次側コイル２２ｂは、絶縁シート６３を介して第１突出部４４に熱的に接続されており、コイル２１，２２ａからの熱を第１突出部４４を介して筐体４０に伝達する伝熱経路とされている。これにより、コイル２１，２２ａと筐体４０（又は突出部４４，４５）との間の距離が離れていても、２次側コイル２２ｂによりコイル２１，２２ａからの熱が速やかに筐体４０（又は突出部４４，４５）に伝達することができる。これにより、筐体４０（又は突出部４４，４５）との間の距離が離れているコイル２１，２２ａの放熱を好適に行うことができる。 The lower surface of the circuit board 30 is in contact with the secondary coil 22 b as a heat transfer member having a higher thermal conductivity than the circuit board 30 . The secondary coil 22b is thermally connected to the first projecting portion 44 via the insulating sheet 63, and the heat from the coils 21 and 22a is transmitted to the housing 40 via the first projecting portion 44. It is considered to be a heat transfer path that As a result, even if the distance between the coils 21, 22a and the housing 40 (or the protrusions 44, 45) is long, the heat from the coils 21, 22a is quickly transferred to the housing 40 (or the protrusions 44, 45) by the secondary coil 22b. Or it can be transmitted to the protrusions 44, 45). As a result, the coils 21 and 22a, which are distant from the housing 40 (or the projecting portions 44 and 45), can preferably dissipate heat.

回路基板３０には、Ｚ軸方向においてコイル２１，２２ａの少なくとも一部と重複するように、コア５０が設置されている。そして、筐体４０の底板４１（又は天板４３）は、回路基板３０に対向配置されているとともに、コア５０を避けて、Ｚ軸方向において底板４１（又は天板４３）から回路基板３０の側へ突出する突出部４４，４５を有する。そして、突出部４４，４５は回路基板３０に絶縁シート６３，６４を介して当接している。これにより、回路基板３０から突出部４４，４５を介して筐体４０に効率よく放熱させることができる。 A core 50 is installed on the circuit board 30 so as to overlap at least part of the coils 21 and 22a in the Z-axis direction. The bottom plate 41 (or top plate 43 ) of the housing 40 is arranged to face the circuit board 30 , avoiding the core 50 , and extending from the bottom plate 41 (or top plate 43 ) to the circuit board 30 in the Z-axis direction. It has protrusions 44 and 45 protruding to the side. The protrusions 44 and 45 are in contact with the circuit board 30 via the insulating sheets 63 and 64 . As a result, heat can be efficiently dissipated from the circuit board 30 to the housing 40 via the protrusions 44 and 45 .

また、Ｚ軸方向においてコア５０と重複するコイル２１，２２ａの一部は、筐体４０の底板４１（又は天板４３）から隠れてしまう。これにより、通常、Ｚ軸方向においてコア５０と重複するコイル２１，２２ａの一部は、筐体４０までの距離が遠くなり、放熱しにくい。 Also, the parts of the coils 21 and 22a overlapping the core 50 in the Z-axis direction are hidden from the bottom plate 41 (or the top plate 43) of the housing 40. FIG. As a result, a part of the coils 21 and 22a that overlap the core 50 in the Z-axis direction is usually farther from the housing 40, making it difficult to dissipate heat.

そこで、２次側コイル２２ｂを、Ｚ軸方向においてコア５０及びコイル２１，２２ａと重複する位置から突出部４４，４５に重複する位置まで回路基板３０に沿って延びるように幅広に形成した。これにより、コア５０と重複し、放熱しにくいコイル２１，２２ａの一部から効果的に放熱させることができる。 Therefore, the secondary coil 22b is formed wide so as to extend along the circuit board 30 from a position overlapping the core 50 and the coils 21 and 22a to a position overlapping the projections 44 and 45 in the Z-axis direction. As a result, heat can be effectively dissipated from the parts of the coils 21 and 22a that overlap with the core 50 and are difficult to dissipate heat.

コア５０の内側に配置されるコイル部材２３ａ，２３ｂ，２３ｅ，２３ｆ，２４ａ，２４ｂ，２４ｅ，２４ｆは、コア５０によって筐体４０の底板４１（又は天板４３）から完全に隠れてしまう。このため、通常、筐体４０までの距離が遠くなり、また、回路基板３０を介して放熱する構成上、放熱しにくいといえる。 The coil members 23 a , 23 b , 23 e , 23 f , 24 a , 24 b , 24 e and 24 f arranged inside the core 50 are completely hidden from the bottom plate 41 (or top plate 43 ) of the housing 40 by the core 50 . For this reason, the distance to the housing 40 is usually long, and it can be said that the heat is difficult to dissipate due to the structure in which heat is dissipated via the circuit board 30 .

そこで、上記実施形態では、２次側コイル２２ｂを、これらのコイル部材２３ａ，２３ｂ，２３ｅ，２３ｆ，２４ａ，２４ｂ，２４ｅ，２４ｆと重なる位置から突出部４４，４５に重なる位置に達するまで回路基板３０に沿って直線状の伝熱経路が形成されるように構成した。これにより、これらのコイル部材２３ａ，２３ｂ，２３ｅ，２３ｆ，２４ａ，２４ｂ，２４ｅ，２４ｆであっても、２次側コイル２２ｂ及び第１突出部４４を介して、効率的に放熱させることができる。 Therefore, in the above-described embodiment, the secondary coil 22b is arranged on the circuit board from a position overlapping these coil members 23a, 23b, 23e, 23f, 24a, 24b, 24e, 24f to a position overlapping the projecting portions 44, 45. It was configured to form a linear heat transfer path along 30 . As a result, even these coil members 23a, 23b, 23e, 23f, 24a, 24b, 24e, and 24f can efficiently dissipate heat through the secondary coil 22b and the first projecting portion 44. .

コア５０には、その外縁において外側に開口する凹部５５がＺ軸方向に沿って形成されている。そして、突出部４４，４５は、凹部５５を介して回路基板３０の側に突出し、絶縁シート６３，６４を介して当接している。これにより、コア５０を小さくしなくても、もしくは２次側コイル２２ｂを大きくしなくても、突出部４４，４５を２次側コイル２２ｂに当接させることができ、全体として磁気部品を小型化することができる。 The core 50 has a recessed portion 55 that opens outward along the Z-axis direction at its outer edge. The protrusions 44 and 45 protrude toward the circuit board 30 via the recess 55 and are in contact with each other via the insulating sheets 63 and 64 . As a result, the protrusions 44 and 45 can be brought into contact with the secondary coil 22b without reducing the size of the core 50 or increasing the size of the secondary coil 22b. can be

下コア５１及び上コア５２の各辺に凹部５５を設け、コア５０の間に配置されるコイル部材２３ａ～２３ｇ，２４ａ～２４ｈのうち一部が、下コア５１と上コア５２に挟まれないようにしている。より詳しく説明すると、コイル部材２３ｃ，２３ｄ，２３ｇ，２４ｃ，２４ｄ，２４ｇ，２４ｈの内径は、突出部４４，４５の上底（径方向中央側の辺）よりも大きく構成されている。これにより、凹部５５内に配置されたコイル部材２３ｃ，２３ｄ，２３ｇ，２４ｃ，２４ｄ，２４ｇ，２４ｈの一部は、コア５０が介在することなく、Ｚ軸方向において突出部４４，４５に重複し、突出部４４，４５に絶縁シート６３，６４を介して当接するように構成されている。このため、コイル部材２３ｃ，２３ｄ，２３ｇ，２４ｃ，２４ｄ，２４ｇ，２４ｈから突出部４４，４５に対して効率的に放熱させることが可能となる。 A concave portion 55 is provided on each side of the lower core 51 and the upper core 52, and some of the coil members 23a to 23g and 24a to 24h arranged between the cores 50 are not sandwiched between the lower core 51 and the upper core 52. I'm trying More specifically, the inner diameters of the coil members 23c, 23d, 23g, 24c, 24d, 24g, and 24h are configured to be larger than the upper bases of the projections 44 and 45 (sides on the center side in the radial direction). As a result, part of the coil members 23c, 23d, 23g, 24c, 24d, 24g, and 24h arranged in the recess 55 overlap the protruding portions 44 and 45 in the Z-axis direction without the core 50 being interposed therebetween. , projecting portions 44 and 45 via insulating sheets 63 and 64. As shown in FIG. Therefore, it is possible to efficiently dissipate heat from the coil members 23c, 23d, 23g, 24c, 24d, 24g, and 24h to the projecting portions 44 and 45. FIG.

Ｚ軸方向において、回路基板３０の両側に、筐体４０の底板４１及び天板４３がそれぞれ対向するように配置されている。そして、Ｚ軸方向において、底板４１から突出する第１突出部４４は、回路基板３０を挟んで、天板４３から突出する第２突出部４５と対向している。これにより、回路基板３０の両側から突出部４４，４５を当接させることができる。したがって、一方の面のみから放熱させる場合に比較して、両面から効率的に放熱させることができる。また、回路基板３０を突出部４４，４５により好適に保持することができる。 A bottom plate 41 and a top plate 43 of the housing 40 are arranged to face each other on both sides of the circuit board 30 in the Z-axis direction. In the Z-axis direction, the first projecting portion 44 projecting from the bottom plate 41 faces the second projecting portion 45 projecting from the top plate 43 with the circuit board 30 interposed therebetween. As a result, the protrusions 44 and 45 can be brought into contact with both sides of the circuit board 30 . Therefore, heat can be efficiently dissipated from both surfaces as compared with the case where heat is dissipated only from one surface. Moreover, the circuit board 30 can be preferably held by the projecting portions 44 and 45 .

コイル２１，２２ａ，２２ｂのほとんどを下コア５１と上コア５２の間に配置している。これにより、トランス２０を効率よく作動させることができる。それとともに、磁気部品を小型化することが可能となる。 Most of the coils 21 , 22 a, 22 b are arranged between the lower core 51 and the upper core 52 . Thereby, the transformer 20 can be operated efficiently. At the same time, it becomes possible to reduce the size of the magnetic component.

（他の実施形態）
上記絶縁型ＤＣ－ＤＣコンバータ１０は、以下のようにその構成を変更してもよい。 (Other embodiments)
The configuration of the isolated DC-DC converter 10 may be changed as follows.

・上記実施形態において、図７、図８に示すように、回路基板１３０には、複数のコイル２１，２２ａ，２２ｂ，１３，１６ａが配置されていてもよい。そして、突出部４４，４５は、隣り合うコイル（例えば、コイル部材２３ｇとリアクトルを構成するコイル１３，１６ａ）の間に配置され、隣り合うコイルのいずれについてもＺ軸方向において重複し、絶縁シート６３を介して当接していてもよい。これにより、隣り合う複数のコイルから突出部４４，４５を介して放熱させることができる。このため、コイルごとに突出部４４，４５を形成する場合に比較して、突出部４４，４５の数を減らすことができ、小型化できる。 - In the above embodiment, as shown in FIGS. 7 and 8, a plurality of coils 21, 22a, 22b, 13, and 16a may be arranged on the circuit board 130. FIG. The protruding portions 44 and 45 are arranged between the adjacent coils (for example, the coil member 23g and the coils 13 and 16a constituting the reactor), and overlap each other in the Z-axis direction with respect to the adjacent coils. 63 may be in contact with each other. As a result, heat can be dissipated from the adjacent coils via the protrusions 44 and 45 . Therefore, compared to the case where the protrusions 44 and 45 are formed for each coil, the number of the protrusions 44 and 45 can be reduced and the size can be reduced.

・上記実施形態では、電流が流れる電流経路となる２次側コイル２２ｂを伝熱部材として兼用したが、２次側コイル２２ｂである必要はなく、バスバーなどであってもよいし、電流が流れない部材に変更してもよい。なお、変更する部材を構成する材料は、回路基板３０よりも熱伝導率が高いことが望ましい。 In the above embodiment, the secondary coil 22b, which is the current path through which the current flows, is also used as a heat transfer member. It may be changed to a non-existent member. In addition, it is desirable that the material constituting the member to be changed has a higher thermal conductivity than the circuit board 30 .

・上記実施形態において、伝熱部材の形状は、任意に変更してもよい。例えば、直線状の板状に形成されていてもよい。 - In the above embodiment, the shape of the heat transfer member may be changed arbitrarily. For example, it may be formed in a linear plate shape.

・上記実施形態において、回路基板３０は、積層基板でなくてもよく、単なるプリント基板であってもよい。 - In the above embodiment, the circuit board 30 may not be a laminated board, and may be a simple printed board.

・上記実施形態において、２次側コイル２２ｂは、回路基板３０の表面（最外層よりも外側）に形成されていたが、回路基板３０のいずれかの層間に配置されていてもよい。 - In the above-described embodiment, the secondary coil 22b is formed on the surface of the circuit board 30 (outer than the outermost layer), but may be arranged between any layers of the circuit board 30 .

・上記実施形態において、トランス２０の代わりにリアクトルに変更してもよい。また、上記実施形態において、コイル２１，２２ａ，２２ｂの巻き方や巻き数は任意に変更してもよい。また、コイル２１，２２ａ，２２ｂの形状を変更してもよい。 - In the above embodiment, the transformer 20 may be replaced with a reactor. In the above embodiment, the winding method and the number of turns of the coils 21, 22a, 22b may be changed arbitrarily. Also, the shapes of the coils 21, 22a, 22b may be changed.

・上記実施形態において、コア５０に凹部５５を設けなくてもよい。また、コア５０に凹部５５の代わりに、又は凹部５５とともにＺ軸方向に貫通する貫通孔を設けてもよい。そして、当該貫通孔に筐体４０からの突出部を挿通し、回路基板３０に当接させてもよい。 - In the above embodiment, the recess 55 may not be provided in the core 50 . Also, instead of the recessed portion 55 or together with the recessed portion 55 , a through hole may be provided in the core 50 so as to pass through in the Z-axis direction. Then, a projecting portion from the housing 40 may be inserted through the through hole and brought into contact with the circuit board 30 .

・上記実施形態において、回路基板３０の両側に、それぞれ突出部４４，４５を当接させていたが、いずれか一方のみでもよい。 - In the above-described embodiment, the protrusions 44 and 45 are brought into contact with both sides of the circuit board 30, but only one of them may be brought into contact.

１０…絶縁型ＤＣ－ＤＣコンバータ（電力変換装置）、２１…１次側コイル、２２ａ…２次側コイル、２２ｂ…２次側コイル、４０…筐体（放熱部材）、４１…底板（放熱部材）、４３…天板（放熱部材）、６１，６２…放熱シート、６３，６４…絶縁シート。 10... Insulated DC-DC converter (power conversion device), 21... Primary side coil, 22a... Secondary side coil, 22b... Secondary side coil, 40... Case (heat dissipation member), 41... Bottom plate (heat dissipation member ), 43... Top plate (heat dissipation member), 61, 62... Heat dissipation sheet, 63, 64... Insulation sheet.

Claims

A power converter (10) comprising a circuit board (30), coils (21, 22a) provided on the circuit board, and a heat dissipation member (40) for holding the circuit board and dissipating heat from the circuit board. in
A heat transfer member (22b) having a higher thermal conductivity than the circuit board is in contact with at least one surface of the circuit board,
The heat transfer member is thermally connected to the heat dissipation member via an insulating member (63), and serves as a heat transfer path for transferring heat from the coil to the heat dissipation member ,
A core (50) of the coil is installed on the circuit board so as to overlap at least a part of the coil in the vertical direction of the circuit board,
The heat dissipation member is arranged to face the circuit board and has projections (44, 45) that project from the heat dissipation member toward the circuit board side in the vertical direction while avoiding the core,
The heat transfer member is formed to extend along the circuit board from a position overlapping with the core and the coil in the vertical direction to a position overlapping with the projecting portion. thermally connected to the protrusion,
The core is formed with a through hole penetrating along the vertical direction, or formed with a recess (55) opening outward at an outer edge along the vertical direction, or formed with the through hole and the A recess is formed,
The power conversion device, wherein the protrusion protrudes toward the circuit board through at least one of the through hole and the recess.

A power converter (10) comprising a circuit board (30), coils (21, 22a) provided on the circuit board, and a heat dissipation member (40) for holding the circuit board and dissipating heat from the circuit board. in
A heat transfer member (22b) having a higher thermal conductivity than the circuit board is in contact with at least one surface of the circuit board,
The heat transfer member is thermally connected to the heat dissipation member via an insulating member (63), and serves as a heat transfer path for transferring heat from the coil to the heat dissipation member ,
A core (50) of the coil is installed on the circuit board so as to overlap at least a part of the coil in the vertical direction of the circuit board,
The heat dissipation member is arranged to face the circuit board and has projections (44, 45) that project from the heat dissipation member toward the circuit board side in the vertical direction while avoiding the core,
The heat transfer member is formed to extend along the circuit board from a position overlapping with the core and the coil in the vertical direction to a position overlapping with the projecting portion. thermally connected to the protrusion,
The heat dissipation members are arranged on both sides of the circuit board in the vertical direction,
A power conversion device, wherein a protruding portion protruding from one of the heat dissipating members faces a protruding portion protruding from the other heat dissipating member in the vertical direction with the circuit board interposed therebetween.

A power converter (10) comprising a circuit board (30), coils (21, 22a) provided on the circuit board, and a heat dissipation member (40) for holding the circuit board and dissipating heat from the circuit board. in
A heat transfer member (22b) having a higher thermal conductivity than the circuit board is in contact with at least one surface of the circuit board,
The heat transfer member is thermally connected to the heat dissipation member via an insulating member (63), and serves as a heat transfer path for transferring heat from the coil to the heat dissipation member ,
A core (50) of the coil is installed on the circuit board so as to overlap at least a part of the coil in the vertical direction of the circuit board,
The heat dissipation member is arranged to face the circuit board and has projections (44, 45) that project from the heat dissipation member toward the circuit board side in the vertical direction while avoiding the core,
The heat transfer member is formed to extend along the circuit board from a position overlapping with the core and the coil in the vertical direction to a position overlapping with the projecting portion. thermally connected to the protrusion,
A plurality of carp are arranged on the circuit board,
The power conversion device, wherein the protruding portion is disposed between adjacent coils, overlaps with each other in the vertical direction, and is in contact with the adjacent coils via the insulating member.

The coil is composed of a plurality of coil members (23a to 23g, 24a to 24h),
Among the plurality of coil members, one or more coil members are arranged so as to overlap the core,
The heat transfer member is configured such that the heat transfer path is formed along the circuit board from a position overlapping the coil member overlapping the core in the vertical direction to a position overlapping the protrusion. The power converter according to any one of claims 1 to 3 .

The power converter according to claim 4 , wherein the heat transfer member is configured such that the linear heat transfer path is formed along the circuit board.

The power conversion device according to any one of claims 1 to 5, wherein a part of the coil overlaps the projecting portion without interposing the core in the vertical direction.

The power converter according to any one of claims 1 to 6 , wherein the heat transfer member also serves as a current path through which current flows.

The circuit board is configured by stacking a plurality of layers,
The power converter according to any one of claims 1 to 7 , wherein the heat transfer member is arranged outside the outermost layer of the circuit board or between any one of the layers of the circuit board.