JP7304742B2 - Substrate processing equipment - Google Patents

Description

The present disclosure relates to a substrate processing apparatus.

A spindle unit of a grinding apparatus disclosed in Patent Document 1 includes a mount on which a grinding wheel is mounted, a spindle shaft connecting the mount to the tip side, and a spindle cover with a split structure. Whenever the grinding wheel is raised or lowered, the spindle cover is also raised or lowered.

Japanese Unexamined Patent Application Publication No. 2017-222003

One aspect of the present disclosure provides a technique that facilitates maintenance work for a substrate processing apparatus.

A substrate processing apparatus according to an aspect of the present disclosure includes
a turntable on which a tool for processing the substrate is replaceably attached;
a spindle motor that rotates the turntable;
an elevating mechanism for elevating the rotating disk via the spindle motor;
a panel having an insertion opening into which the rotating disk is inserted;
with
The panel forms a processing chamber in which processing of the substrate is performed, and includes a panel upper surface portion blocking the upper side of the processing chamber and a panel side portion blocking the side of the processing chamber. have
The panel upper surface portion has an upper surface fixing portion and an upper surface movable portion that are divided along the edge of the opening of the insertion port,
The panel side portion has a side movable portion connected to the top movable portion and a side fixed portion connected to the side movable portion by a second hinge,
The side movable portion is connected to the top movable portion by a first hinge, the side movable portion opens to the outside of the processing chamber, and the side movable portion and the top movable portion are folded.

According to one aspect of the present disclosure, maintenance work for a substrate processing apparatus can be facilitated.

FIG. 1 is a plan view showing a substrate processing apparatus according to one embodiment. FIG. 2 is a cross-sectional view showing a processing unit according to one embodiment. FIG. 3 is a cross-sectional view showing an enlarged part of FIG. 2, showing an example of a standby position of the rotating disk. FIG. 4 is a cross-sectional view showing an example of the reference position of the turntable. FIG. 5 is a cross-sectional view showing an example of a maintenance position of the rotating disk. 6 is a cross-sectional view showing an example of a state in which the first cover shown in FIG. 5 is lifted with respect to the rotating disk; FIG. 7 is a cross-sectional view showing an example of a state in which the first cover shown in FIG. 6 is rotated from the raised position and lowered to the upper end of the guide section; FIG. FIG. 8 is a perspective view showing a first cover according to one embodiment. FIG. 9 is a perspective view showing a second cover, a lift section, and a guide section according to one embodiment; FIG. 10 is a perspective view of a block according to one embodiment. FIG. 11 is a side view showing the positional relationship among the first cover, detection member, and confirmation sensor according to one embodiment. FIG. 12 is a perspective view showing a state during substrate processing of the panel according to one embodiment. FIG. 13 is a perspective view showing a state during maintenance of the panel according to one embodiment.

Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In addition, in each drawing, the same reference numerals are given to the same or corresponding configurations, and explanations thereof may be omitted. In this specification, the X-axis direction, the Y-axis direction, and the Z-axis direction are directions perpendicular to each other. The X-axis direction and Y-axis direction are horizontal directions, and the Z-axis direction is vertical direction.

FIG. 1 is a plan view showing a substrate processing apparatus according to one embodiment. The substrate processing apparatus 10 thins the substrate 2 . The substrate 2 is, for example, a semiconductor substrate such as a silicon wafer. The substrate processing apparatus 10 includes a rotary table 20, four substrate chucks 30A, 30B, 30C and 30D, and three processing units 40A, 40B and 40C. Note that the number of processing units 40 may be one or more, and is not limited to three. Also, the number of substrate chucks 30 is not limited to four as long as it is greater than the number of processing units 40 .

The rotary table 20 is rotated around the rotation center line Z1. The rotation center line Z1 of the turntable 20 is arranged vertically, for example. Around the rotation center line Z1 of the rotary table 20, four substrate chucks 30A, 30B, 30C, and 30D are arranged at regular intervals. Each of the four substrate chucks 30A, 30B, 30C, and 30D rotates together with the rotary table 20, and is positioned at a loading/unloading position A0, a primary processing position A1, a secondary processing position A2, a tertiary processing position A3, and a loading/unloading position A0. It moves in this order to the exit position A0.

The loading/unloading position A0 serves both as a loading position where the substrate 2 is loaded and a loading position where the substrate 2 is loaded. The transfer robot 3 carries in the substrate 2 and carries out the substrate 2 . In this embodiment, the carry-in position and the carry-out position are the same position, but the carry-in position and the carry-out position may be different positions.

When the transport robot 3 loads the substrate 2 , the substrate chuck 30 holds the substrate 2 . A protective tape (not shown) is attached in advance to the surface of the substrate 2 facing the substrate chuck 30 (for example, the lower surface of the substrate 2). The protective tape protects the preformed devices on the bottom surface of the substrate 2 . As the protective tape, a general one is used, for example, a resin tape is used. The transport robot 3 loads and unloads the substrate 2 protected by the protective tape.

The primary processing position A1 is a position where the primary processing of the substrate 2 is performed by the processing unit 40A. The primary processing is grinding, for example.

The secondary processing position A2 is a position where secondary processing of the substrate 2 is performed by the processing unit 40B. Secondary processing is, for example, grinding. The grain size of the grindstone used in the secondary processing is smaller than the grain size of the grindstone used in the primary processing.

The tertiary processing position A3 is a position where the substrate 2 is tertiary processed by the processing unit 40C. Tertiary processing may be either grinding or polishing. The grain size of the grindstone used in the tertiary processing is smaller than the grain size of the grindstone used in the secondary processing.

The four substrate chucks 30A, 30B, 30C, and 30D are attached to the turntable 20 so as to be rotatable around their respective rotation centerlines. At the primary processing position A1, the secondary processing position A2 and the tertiary processing position A3, the substrate chucks 30A, 30B, 30C and 30D rotate about their respective rotational centerlines.

FIG. 2 is a cross-sectional view showing a processing unit according to one embodiment. The processing unit 40 includes a turntable 50 to which the tool 4 for processing the substrate 2 is replaceably attached, a spindle motor 60 that rotates the turntable 50, and an elevating mechanism 70 that moves the turntable 50 up and down via the spindle motor 60. have

The tool 4 thins the substrate 2, for example. For example, the tool 4 includes a doughnut-shaped grinding wheel 5 and a grindstone 6 fixed to the lower surface of the grinding wheel 5 . A plurality of grindstones 6 are arranged in a ring along the outer edge of the lower surface of the grinding wheel 5 .

The turntable 50 has, for example, a centering portion 51 for aligning the centerline of the turntable 50 and the centerline of the grinding wheel 5 . The grinding wheel 5 has a fitting hole 5a in its center, and the centering part 51 fits into the fitting hole 5a, so that the centerline of the rotary disk 50 and the centerline of the grinding wheel 5 are aligned. .

The turntable 50 has a ring-shaped tool mounting portion 52 projecting outward from the centering portion 51 . The tool mounting portion 52 is for mounting the tool 4 in a replaceable manner. A plurality of through holes 53 are formed in the tool attachment portion 52 at intervals in the circumferential direction thereof.

The through hole 53 penetrates the tool attachment portion 52 in the vertical direction. A bolt 54 is inserted through the through hole 53 of the tool mount 52 and screwed into a threaded hole in the top surface of the grinding wheel 5 . By loosening the bolt 54, the tool 4 can be replaced.

The tool 4 is exchanged, for example, when the wear amount of the grindstone 6 exceeds a set amount. The exchange of tools 4 may be carried out periodically.

The spindle motor 60 rotates the tool 4 by rotating the turntable 50 around a vertical rotation axis. The processing unit 40 has a holder 61 that holds the spindle motor 60 .

The holder 61 has, for example, a horizontal holder bottom wall portion 62 and a holder tubular portion 63 extending upward from the outer edge of the holder bottom wall portion 62 . A through hole is formed in the center of the holder bottom wall portion 62, and a part of the spindle motor 60 is arranged in the through hole.

The spindle motor 60 has a convex ring portion 60a on its side surface. The ring portion 60 a may be arranged inside the holder tubular portion 63 . The ring portion 60 a is used for adjusting the verticality of the rotation center line of the spindle motor 60 .

The processing unit 40 has a verticality adjusting mechanism 65 that adjusts the verticality of the rotation center line of the spindle motor 60 . The holder 61 holds the spindle motor 60 via a verticality adjusting mechanism 65 .

The verticality adjustment mechanism 65 includes, for example, a plurality of (eg, three) height adjustment portions 66 that adjust the heights of different points of the ring portion 60a. A plurality of height adjusting portions 66 are arranged at intervals in the circumferential direction of the ring portion 60a to adjust the heights of the ring portion 60a at a plurality of points so that the rotation center line of the spindle motor 60 is vertical.

The elevating mechanism 70 elevates the tool 4 by elevating the rotating disk 50 via the spindle motor 60 . For example, the lifting mechanism 70 has a vertical guide 71 , a slider 72 that moves along the guide 71 , and a motor 73 that moves the slider 72 .

A holder 61 is fixed to the slider 72 , and the holder 61 , spindle motor 60 and rotating disk 50 move up and down together with the slider 72 .

In order to process the substrate 2, first, the lifting mechanism 70 lowers the turntable 50 from the standby position (see FIGS. 2 and 3) to lower the tool 4. As shown in FIG. The tool 4 descends while rotating and contacts the top surface of the rotating substrate 2 to thin the entire top surface of the substrate 2 . During the thinning of the substrate 2 , a liquid such as water is supplied to the upper surface of the substrate 2 by a liquid supply nozzle (see FIG. 1) 80 . When the thickness of the substrate 2 reaches the set value, the lifting mechanism 70 stops lowering the turntable 50 and stops lowering the tool 4 . After that, the lifting mechanism 70 lifts the turntable 50 to separate the tool 4 from the substrate 2 . When the tool 4 leaves the substrate 2, the spindle motor 60 stops rotating the turntable 50. FIG. The lifting mechanism 70 lifts the turntable 50 to the standby position.

The substrate processing apparatus 10 has a control section 90 as shown in FIG. The control unit 90 is, for example, a computer, and includes a CPU (Central Processing Unit) 91 and a storage medium 92 such as a memory. The storage medium 92 stores programs for controlling various processes executed in the substrate processing apparatus 10 . The control unit 90 controls the operation of the substrate processing apparatus 10 by causing the CPU 91 to execute programs stored in the storage medium 92 . The control unit 90 also includes an input interface 93 and an output interface 94 . The control unit 90 receives signals from the outside via an input interface 93 and transmits signals to the outside via an output interface 94 .

The program is stored in, for example, a computer-readable storage medium, and installed from the storage medium to the storage medium 92 of the control unit 90 . Examples of computer-readable storage media include hard disks (HD), flexible disks (FD), compact disks (CD), magnet optical disks (MO), and memory cards. Note that the program may be downloaded from a server via the Internet and installed in the storage medium 92 of the control unit 90 .

As shown in FIGS. 3 to 5, the substrate processing apparatus 10 includes a substrate chuck 30, a turntable 50, a spindle motor 60, a panel 100, a first cover 110, a lift section 120, and a guide section 130. , a block 140 and a second cover 170 .

The panel 100 forms therein a processing chamber 101 in which the substrate 2 is processed. A substrate chuck 30 and the like are accommodated in the processing chamber 101 . The panel 100 suppresses scattering of the liquid supplied to the substrate 2 by the liquid supply nozzle 80 and processing waste generated by processing the substrate 2 . The panel 100 may be made of metal, for example. Since metal is harder than resin, it is excellent in durability.

The panel 100 has a panel upper surface portion 102 that covers the processing chamber 101 from above. The panel upper surface portion 102 is installed horizontally. An insertion opening 103 into which the rotating disk 50 is inserted is formed in the panel upper surface portion 102 . The diameter of the insertion port 103 is larger than the diameter of the rotating disc 50 .

The panel 100 has a ring-shaped panel standing portion 104 that rises upward from the opening edge of the insertion port 103 . The panel upright portion 104 suppresses the horizontal scattering of liquid and processing waste.

The first cover 110 is placed on the panel 100 , more specifically on the panel upper surface portion 102 , and covers at least a part of the insertion port 103 . Scattering of processing waste can be suppressed. For example, the first cover 110 stops liquid and debris rising along the panel riser 104 .

By the way, the first cover 110 is placed on the panel 100 while the rotating disk 50 moves up and down below the reference position shown in FIG. The reference position is the position where the first cover 110 starts to rise together with the rotating disk 50 . The reference position is below the maintenance position shown in FIG. 5 and above the standby position shown in FIG. A maintenance position is a position where attachment and detachment of the tool 4 are performed. The standby position is a position where the turntable 50 waits before starting processing of the substrate 2 and after finishing processing of the substrate 2 .

When the tool 4 is attached to the turntable 50, the turntable 50 is lowered from the maintenance position to the standby position and stopped at the standby position. The standby position is a position above the position where the tool 4 contacts the substrate 2 . When the turntable 20 rotates and a new substrate 2 is placed under the processing unit 30 , the turntable 50 descends from the standby position, brings the tool 4 into contact with the substrate 2 , and starts processing the substrate 2 . When the thickness of the substrate 2 reaches the set value, the turntable 50 returns to its original standby position and stops. After that, when the turntable 20 rotates again and a new substrate 2 is placed under the processing unit 30, the turntable 50 is lowered from the standby position, the substrate 2 is thinned to the set thickness by the tool 4, and then to the standby position.

Since the standby position is below the reference position, the first cover 110 continues to be placed on the panel 100 and covers at least a portion of the insertion opening 103 while the tool 4 is in contact with the substrate 2 and scrapes the substrate 2 . Therefore, it is possible to suppress scattering of liquid and processing waste from the gap between the opening edge of the insertion port 103 and the rotating disk 50 .

When maintenance of the substrate processing apparatus 10 becomes necessary, such as when the grindstone 6 wears and the grindstone 6 needs to be replaced, the turntable 50 moves up from the standby position to the maintenance position. The first cover 110 continues to be placed on the panel 100 while the turntable 50 is raised from the standby position to the reference position. When the rotary disc 50 rises above the reference position, the first cover 110 rises together with the rotary disc 50 and leaves the panel 100 . A gap is created between the panel 100 and the first cover 110 when the rotating disk 50 is at the maintenance position.

6 is a cross-sectional view showing an example of a state in which the first cover shown in FIG. 5 is lifted with respect to the rotating disk; FIG. As described above, a gap is created between the panel 100 and the first cover 110 when the turntable 50 is in the maintenance position, as shown in FIG. An operator or a work robot inserts his or her hand into the gap to lift the first cover 110 with respect to the turntable 50 as shown in FIG. Therefore, the tool 4 can be easily replaced, and the maintenance work can be facilitated.

FIG. 7 is a cross-sectional view showing an example of a state in which the first cover shown in FIG. 6 is rotated at the lifted position and lowered onto the upper end of the guide section 130, which will be described later. The first cover 110 is rotated to the lifted position and placed on the upper end of the guide part 130 . The guide portion 130 can prevent the first cover 110 from falling, and the tool mounting portion 52 of the turntable 50 can be maintained in an exposed state. Since the hands of the operator or the working robot are freed up, the tool 4 can be easily replaced, and the maintenance work can be facilitated.

When the maintenance work is finished, the first cover 110 is returned from the state shown in FIG. 7 to the state shown in FIG. 6 and then to the state shown in FIG. After that, the turntable 50 is lowered from the maintenance position to the standby position. On the way, when the turntable 50 descends from the reference position, the first cover 110 is placed on the panel 100 again.

FIG. 8 is a perspective view showing a first cover according to one embodiment. The first cover 110 has a doughnut-shaped first cover ceiling portion 111 and a first cover cylindrical portion 112 extending downward from the outer edge of the first cover ceiling portion 111 . As shown in FIG. 3 and the like, the outer diameter of the first cover ceiling portion 111 is larger than the diameter of the insertion opening 103 of the panel upper surface portion 102, and the inner diameter of the first cover ceiling portion 111 is smaller than the diameter of the rotating disk 50.

The first cover cylindrical portion 112 surrounds the panel rising portion 104 . Even if the liquid and processing debris rise along the panel upright portion 104 , they may change their direction to the horizontal direction when they hit the first cover ceiling portion 111 . Since the first cover cylindrical portion 112 surrounds the panel upright portion 104, it is possible to suppress the scattering of the liquid and the processing waste in the horizontal direction.

The first cover 110 may further have a first cover flange portion 113 projecting radially outward from the lower end of the first cover cylindrical portion 112 . The first cover flange portion 113 allows the first cover 110 to be stably placed on the panel upper surface portion 102 .

The first cover 110 may further have a ring-shaped first cover seal portion 114 that seals a gap between the first cover flange portion 113 and the panel upper surface portion 102 . The first cover seal portion 114 is attached to the lower surface of the first cover flange portion 113 and can suppress leakage of liquid and processing waste from the gap between the first cover flange portion 113 and the panel upper surface portion 102 .

The first cover seal portion 114 is softer than the first cover flange portion 113 and deforms so as to absorb variations in the size of the gap between the first cover flange portion 113 and the panel upper surface portion 102 . The first cover seal portion 114 is made of, for example, independent foam resin or independent foam rubber, and is attached to the lower surface of the first cover flange portion 113 .

At least part of the first cover 110 (eg, the first cover ceiling portion 111, the first cover cylindrical portion 112, and the first cover flange portion 113) may be made of resin. Since resin is more lightweight than metal, the load applied to the lift portion 120 can be reduced. The lift part 120 lifts the first cover 110 from the panel 100 .

Since the lift section 120 is fixed with respect to the spindle motor 60, the lift section 120 always moves up and down while the spindle motor 60 moves up and down. The lift part 120 lifts the first cover 110 from the panel 100 when the turntable 50 rises beyond the reference position. The lift part 120 can automatically lift the first cover 110 from the panel 100 .

FIG. 9 is a perspective view showing the second cover, lift portion 120, and guide portion 130 according to one embodiment. A plurality (for example, three) of the lift units 120 are arranged at intervals along the circumferential direction of the spindle motor 60 . The plurality of lift parts 120 can stably lift the first cover 110 .

The lift portion 120 has an inclined surface 121 inclined outward in the radial direction of the spindle motor 60 as it goes downward, and supports the first cover 110 on the inclined surface 121 when the first cover 110 is lifted. Furthermore, when the first cover 110 is accidentally dropped from the state shown in FIG. 6 to the state shown in FIG. This is because the load applied to the lift portion 120 is resolved into a force component in a direction perpendicular to the inclined surface 121 and a force component in a direction parallel to the inclined surface 121 . As described above, since the impact applied to the lift portion 120 can be released, damage to the lift portion 120 can be suppressed.

A first cover notch 115 is formed on the inner periphery of the first cover ceiling portion 111 to avoid interference with the lift portion 120 as shown in FIG. The first cover 110 can be attached to and detached from the spindle motor 60 at a position where the first cover notch 115 and the lift portion 120 overlap when viewed from above. When attaching the first cover 110 , first, the first cover 110 is placed below the spindle motor 60 , and then the first cover 110 is lifted and put on the spindle motor 60 . On the other hand, when removing the first cover 110 , the first cover 110 is lowered and removed from the spindle motor 60 .

As shown in FIG. 8 , a plurality of first cover notches 115 are arranged along the inner periphery of the first cover ceiling portion 111 at uneven intervals. For example, three first cover cutouts 115 are arranged at three intervals θ1, θ2, θ3. Accordingly, the three lift portions 120 are also arranged at three intervals θ1, θ2, and θ3 like the three first cover cutouts 115 . θ1, θ2 and θ3 are different values, and the total value is 360°.

As described above, the first cover 110 is attached and detached at the position where the first cover notch 115 and the lift portion 120 overlap when viewed from above. Therefore, if θ1, θ2, and θ3 are different values, it is possible to prevent the first cover 110 from being erroneously attached upside down, and it is also possible to prevent a portion of the first cover 110 in the circumferential direction (for example, detection, which will be described later). The attachment site of member 150) can be oriented as desired.

Since the first cover 110 does not have a vertically symmetrical structure and it is easy to intuitively know which part should face upward, there is little risk of erroneously attaching it upside down. Therefore, two of the three intervals θ1, θ2, θ3 (eg θ1, θ2) may have the same value and the remaining one (eg θ3) may have a different value. Also in this case, if the first cover 110 is not mistakenly attached upside down, a portion of the first cover 110 in the circumferential direction can be oriented in a desired direction.

Therefore, the number of first cover cutouts 115 should be two or more, and at least two intervals should be different. However, if the number of the first cover cutouts 115 is three or more and the intervals between the first cover notches 115 are different at least by three, it is possible to prevent the first cover 110 from being erroneously attached upside down. A portion of the circumferential direction can be oriented in a desired direction.

By the way, if the first cover notch 115 is formed in the first cover ceiling portion 111 , the lift portion 120 cannot directly contact the first cover ceiling portion 111 . Therefore, a block 140 is attached to the first cover ceiling portion 111 with bolts 141 or the like.

The block 140 is attached to the first cover ceiling portion 111 so as to block at least part of the first cover notch 115 of the first cover ceiling portion 111 . The lift part 120 can lift the first cover 110 through the block 140 . Moreover, the block 140 can suppress scattering of liquid and processing waste from the first cover notch 115 .

FIG. 10 is a perspective view of a block according to one embodiment. The block 140 has an inclined surface 142 that makes surface contact with the inclined surface 121 of the lift portion 120 . When the first cover 110 is erroneously dropped from the state shown in FIG. 6 to the state shown in FIG. 5, the inclined surface 142 of the block 140 and the inclined surface 121 of the lift portion 120 come into surface contact, thereby suppressing stress concentration. can.

Since the guide part 130 is fixed to the spindle motor 60 in the same manner as the lift part 120, the guide part 130 always moves up and down while the spindle motor 60 moves up and down. The guide portion 130 linearly extends upward from the upper end of the lift portion 120 . A plurality of pairs of the lift portion 120 and the guide portion 130 are arranged along the inner periphery of the first cover ceiling portion 111 at intervals.

The block 140 has a guide groove 143 that is guided vertically by the guide portion 130 . The guide groove 143 extends upward from the upper end of the inclined surface 142 , is formed in a U shape when viewed from above, and opens radially inward of the first cover ceiling portion 111 .

A guide groove 143 of the block 140 is fitted into the guide portion 130 . Therefore, the rotation of the first cover 110 in the circumferential direction of the spindle motor 60 can be restricted. Also, the first cover 110 can be stably moved up and down with respect to the spindle motor 60 .

As shown in FIG. 7 , the first cover ceiling portion 111 includes a placement portion 116 placed on the upper end of the guide portion 130 on its inner circumference. The mounting portion 116 is formed so as to be displaced from the first cover notch 115 in the circumferential direction. The upper end of the guide portion 130 is arranged below the second cover flange portion 172 and forms a gap with the second cover flange portion 172 .

After rotating the first cover ceiling part 111 from the state shown in FIG. 6 to the state shown in FIG. It can be placed on the upper end of the part 130 . The guide portion 130 can prevent the first cover 110 from falling, and the tool mounting portion 52 of the turntable 50 can be maintained in an exposed state. Since the hands of the operator or the working robot are freed up, the tool 4 can be easily replaced, and the maintenance work can be facilitated.

When the maintenance work is finished, the first cover 110 is returned from the state shown in FIG. 7 to the state shown in FIG. 6 to the state shown in FIG. 5, as described above. After that, the turntable 50 is lowered from the maintenance position to the standby position. On the way, when the turntable 50 descends from the reference position, the first cover 110 is placed on the panel 100 again.

The guide groove 143 of the block 140 is fitted into the guide portion 130 while the first cover 110 is returned from the state of FIG. 7 through the state of FIG. 6 to the state of FIG. Similar to the lift portion 120 , the guide portions 130 are arranged along the inner periphery of the first cover ceiling portion 111 at irregular intervals. Therefore, a part of the first cover 110 in the circumferential direction (for example, a mounting portion of the detection member 150 described below) can be oriented in a desired direction.

FIG. 11 is a side view showing the positional relationship among the first cover, detection member, and confirmation sensor according to one embodiment. As shown in FIG. 11, substrate processing apparatus 10 has detection member 150 and confirmation sensor 160 . The detection member 150 is fixed to the first cover 110 . For example, the detection member 150 is attached to a portion of the first cover cylindrical portion 112 in the circumferential direction and protrudes radially outward from the outer periphery of the first cover cylindrical portion 112 . When the first cover 110 is placed on the panel upper surface portion 102 , the detection member 150 faces the confirmation sensor 160 . The detection member 150 is, for example, plate-shaped and arranged vertically.

The confirmation sensor 160 confirms that the first cover 110 is placed on the panel 100 by detecting the presence of the detection member 150, for example. If the first cover 110 is above the panel 100 , the confirmation sensor 160 cannot detect the existence of the detection member 150 . The confirmation sensor 160 is, for example, a non-contact proximity sensor, but may be a contact limit switch. Confirmation sensor 160 transmits the confirmation result to control unit 90 .

If the first cover 110 is not placed on the panel 100 , there is a risk that a worker's or a working robot's hand may be inserted into the processing chamber 101 through the gap between the opening edge of the insertion port 103 and the spindle motor 60 . The control unit 90 prohibits the rotation of the spindle motor 60 until the confirmation sensor 160 confirms that the first cover 110 is placed on the panel 100. It is possible to prevent being caught in the rotation of 50.

As shown in FIG. 3 and the like, the second cover 170 surrounds the spindle motor 60 inside the first cover 110 . Since the second cover 170 is fixed to the spindle motor 60 , unlike the first cover 110 , it always moves up and down together with the spindle motor 60 . Therefore, it is possible to suppress adhesion of liquid and processing waste to the spindle motor 60 .

The second cover 170 has a second cover cylindrical portion 171 surrounding the spindle motor 60 inside the first cover 110 . The outer diameter of the second cover cylindrical portion 171 is smaller than the inner diameter of the first cover ceiling portion 111 and the inner diameter of the second cover cylindrical portion 171 is larger than the outer diameter of the spindle motor 60 . A plurality of pairs of the lift portion 120 and the guide portion 130 are arranged on the outer circumference of the second cover cylindrical portion 171 at intervals in the circumferential direction.

The second cover 170 has a second cover flange portion 172 projecting radially outward from the upper end of the second cover cylindrical portion 171 . The second cover flange portion 172 is fixed to the lower surface of the holder bottom wall portion 62 by bolts 173, for example. The bolts 173 are inserted through the through holes 174 of the second cover flange portion 172 and screwed into the screw holes on the lower surface of the holder bottom wall portion 62 .

A second cover notch 175 is formed on the outer edge of the second cover flange portion 172 to avoid interference with the verticality adjustment mechanism 65 . The number and positions of the second cover cutouts 175 may be the same as the number and positions of the height adjustment portions 66 of the verticality adjustment mechanism 65 . With the second cover 170 attached to the holder 61 , the operator or the work robot can operate the height adjustment section 66 through the second cover notch 175 .

The second cover 170 has a second covering portion 176 projecting radially inward from the lower end of the second cover cylindrical portion 171 as shown in FIG. The second covering portion 176 is inserted into a recess formed between the spindle motor 60 and the tool mounting portion 52 of the rotating disk 50 as shown in FIG.

At least part of the second cover 170 (entirely in this embodiment) may be made of resin from the viewpoint of lightness.

In addition, the second cover 170 may be omitted, and in that case, the lift portion 120 and the guide portion 130 may be directly provided on the outer periphery of the spindle motor 60 . The lift portion 120 and the guide portion 130 may be fixed with respect to the spindle motor 60 and should always move up and down together with the spindle motor 60 .

12 and 13, illustration of the first cover 110 is omitted. The panel 100 has a panel upper surface portion 102 that blocks the upper side of the processing chamber 101 and a panel side surface portion 105 that blocks the side of the processing chamber 101 .

The panel upper surface portion 102 includes an upper surface fixed portion 102a and an upper surface movable portion 102b that are divided along the opening edge of the insertion port 103 . Since the panel upper surface portion 102 is divided, the panel rising portion 104 is also divided. Panel upright portion 104 includes a fixed portion 104a and a movable portion 104b.

The panel side portion 105 has a side movable portion 105b connected to the top movable portion 102b by a first hinge 106, and a side fixed portion 105a connected to the side movable portion 105b by a second hinge 107. As shown in FIG. The rotation center line of the first hinge 106 and the rotation center line of the second hinge 107 are parallel and horizontal.

As shown in FIG. 12, during substrate processing, the upper movable portion 102b is arranged on the same plane as the upper fixed portion 102a, and the side movable portion 105b is arranged on the same plane as the side fixed portion 105a. This state is locked by the lock mechanism 108 . An opening window is formed in the side movable portion 105b, and the opening window is closed with a transparent member 109. As shown in FIG. The processing chamber 101 can be visually recognized through the transparent member 109 .

On the other hand, as shown in FIG. 13, during maintenance, the lock mechanism 108 is unlocked, the side movable portion 105b opens to the outside of the processing chamber 101, and the side movable portion 105b and the top movable portion 102b are folded. As a result, the inside of the processing chamber 101 is opened.

As shown in FIG. 13, the interior of the processing chamber 101 can be largely opened during maintenance, and the vicinity of the insertion port 103 can be largely opened. The insertion opening 103 is, as described above, into which the rotating disk 50 is inserted. Therefore, it is easy for an operator or a work robot to access the tool mounting portion 52 of the turntable 50, and maintenance work is easy.

Although the substrate processing apparatus according to the present disclosure has been described above, the present disclosure is not limited to the above embodiments. Various changes, modifications, substitutions, additions, deletions, and combinations are possible within the scope of the claims. These also naturally belong to the technical scope of the present disclosure.

Substrate 2 is not limited to a silicon wafer. Substrate 2 may be, for example, a silicon carbide wafer, a gallium nitride wafer, a gallium oxide wafer, or the like. Also, the substrate 2 may be a glass substrate.

2 Substrate 4 Tool 10 Substrate processing device 50 Turntable 52 Tool mounting portion 60 Spindle motor 70 Elevating mechanism 90 Control portion 100 Panel 101 Processing chamber 102 Panel upper surface portion 103 Insertion opening 104 Panel upright portion 110 First cover 111 First cover ceiling portion 112 First cover cylindrical portion 113 First cover flange portion 114 First cover seal portion 115 First cover notch 116 Mounting portion 120 Lift portion 121 Inclined surface 130 Guide portion 140 Block 160 Confirmation sensor 170 Second cover 171 Second cover Cylindrical portion 172 Second cover flange portion 175 Second cover notch 176 Second covering portion

Claims (9)

a turntable on which a tool for processing the substrate is replaceably attached;
a spindle motor that rotates the turntable;
an elevating mechanism for elevating the rotating disk via the spindle motor;
a panel having an insertion opening into which the rotating disk is inserted;
with
The panel forms a processing chamber in which processing of the substrate is performed, and includes a panel upper surface portion blocking the upper side of the processing chamber and a panel side portion blocking the side of the processing chamber. have
The panel upper surface portion has an upper surface fixing portion and an upper surface movable portion that are divided along the edge of the opening of the insertion port,
The panel side portion has a side movable portion connected to the top movable portion and a side fixed portion connected to the side movable portion by a second hinge,
The side surface movable portion is connected to the top surface movable portion by a first hinge, the side surface movable portion opens to the outside of the processing chamber, and the side surface movable portion and the top surface movable portion are folded. Device. 2. The substrate processing apparatus according to claim 1 , wherein said panel has a ring-shaped panel standing portion rising upward from the opening edge of said insertion port. 3. The substrate processing apparatus according to claim 1 , wherein an opening window is formed in said side movable portion, and said opening window is closed with a transparent member. 4. The substrate processing apparatus according to claim 1 , wherein said side movable portion is locked with respect to said side fixed portion by a locking mechanism. A first cover placed on the panel and covering at least a portion of the insertion opening,
The first cover is placed on the panel while the rotating disk moves up and down below the reference position,
5. The substrate processing apparatus according to any one of claims 1 to 4 , wherein when said rotating disk rises above said reference position, said first cover rises together with said rotating disk and separates from said panel. 6. The substrate processing apparatus according to claim 5 , further comprising a lift section fixed to said spindle motor and lifting said first cover from said panel when said rotating disk rises above said reference position. 7. The substrate processing apparatus according to claim 6 , wherein said lift section has an inclined surface inclined outward in a radial direction of said spindle motor as it extends downward, and said inclined surface supports said first cover. a second cover surrounding the spindle motor inside the first cover and fixed to the spindle motor;
8. The substrate processing apparatus according to claim 6 , wherein said lift section is provided on said second cover. a confirmation sensor for confirming that the first cover is placed on the panel;
and a control unit that prohibits rotation of the spindle motor until the confirmation sensor confirms that the first cover is placed on the panel . The substrate processing apparatus according to 1.

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