CN115042086B - High-precision semiconductor wafer outer diameter grinding device - Google Patents
High-precision semiconductor wafer outer diameter grinding device Download PDFInfo
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- CN115042086B CN115042086B CN202210835806.7A CN202210835806A CN115042086B CN 115042086 B CN115042086 B CN 115042086B CN 202210835806 A CN202210835806 A CN 202210835806A CN 115042086 B CN115042086 B CN 115042086B
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- grinding
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- outer diameter
- semiconductor wafer
- clamping
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 28
- 230000000670 limiting effect Effects 0.000 claims abstract description 65
- 230000007246 mechanism Effects 0.000 claims abstract description 32
- 238000004140 cleaning Methods 0.000 claims abstract description 19
- 230000008093 supporting effect Effects 0.000 claims description 76
- 230000005540 biological transmission Effects 0.000 claims description 21
- 230000001360 synchronised effect Effects 0.000 claims description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 43
- 229910052710 silicon Inorganic materials 0.000 abstract description 43
- 239000010703 silicon Substances 0.000 abstract description 43
- 239000013078 crystal Substances 0.000 abstract description 39
- 238000000034 method Methods 0.000 abstract description 5
- 230000008569 process Effects 0.000 abstract description 5
- 230000000694 effects Effects 0.000 description 43
- 230000001276 controlling effect Effects 0.000 description 15
- 230000033001 locomotion Effects 0.000 description 15
- 239000007788 liquid Substances 0.000 description 9
- 238000005498 polishing Methods 0.000 description 8
- 230000003028 elevating effect Effects 0.000 description 7
- 230000009471 action Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 230000008602 contraction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/02—Lapping machines or devices; Accessories designed for working surfaces of revolution
- B24B37/022—Lapping machines or devices; Accessories designed for working surfaces of revolution characterised by the movement of the work between two lapping plates
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention discloses a high-precision semiconductor wafer outer diameter grinding device which comprises a grinding box, a clamping and positioning mechanism, an adjustable grinding mechanism and a cleaning mechanism, wherein the clamping and positioning mechanism is arranged in the grinding box and comprises a positioning support plate, one side of the positioning support plate, which is positioned in the grinding box, is connected with a pair of lifting support rods, limiting support columns are arranged on the outer sides of the lifting support rods, support blocks are arranged on the two sides of the positioning support plate, clamping cones are arranged on the sides, close to the support blocks, of the pair of support blocks, and a driving rotating shaft is connected between the clamping cones and the support blocks. According to the invention, the corresponding adjustable grinding mechanism is arranged on the outer diameter grinding device of the semiconductor wafer, so that the silicon crystal bar can be subjected to adjustable grinding according to actual conditions, the grinding efficiency of the outer diameter of the silicon crystal bar is remarkably improved, the situation that the silicon crystal bar is deviated in grinding process is avoided, and the accuracy of the outer diameter grinding of the silicon crystal bar is improved.
Description
Technical Field
The invention belongs to the technical field of wafer outer diameter grinding, and particularly relates to a high-precision semiconductor wafer outer diameter grinding device.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor circuit, high-purity polycrystalline silicon is dissolved and then is doped with silicon crystal seeds, then the silicon crystal seeds are slowly pulled out to form a cylindrical silicon crystal rod, and then the silicon crystal rod is subjected to outer diameter grinding, slicing, grinding, polishing, detecting and other steps for processing and production, wherein when the silicon crystal rod is subjected to outer diameter grinding, corresponding outer diameter grinding equipment is required to grind the outer diameter of the silicon crystal rod.
The conventional semiconductor wafer outer diameter grinding device mainly comprises a grinding roller, a clamping mechanism, a driving mechanism and a control system, and when the device is used, a worker places a silicon crystal rod in the outer diameter grinding device and grinds the outer diameter of the silicon crystal rod through the grinding roller.
The existing semiconductor wafer outer diameter grinding device cannot grind the silicon crystal bar in an adjustable mode according to actual conditions, the outer diameter grinding efficiency of the silicon crystal bar is low, meanwhile, the situation that grinding deviation occurs due to the fact that the grinding roller is easily affected in the grinding process of the silicon crystal bar is solved, and the outer diameter grinding precision of the silicon crystal bar is reduced.
Accordingly, in view of the above-mentioned problems, it is desirable to provide a high-precision polishing apparatus for the outer diameter of a semiconductor wafer.
Disclosure of Invention
The invention aims to provide a high-precision semiconductor wafer outer diameter grinding device, which aims to solve the problem of poor grinding precision of the semiconductor wafer outer diameter grinding device.
In order to achieve the above object, an embodiment of the present invention provides the following technical solution:
a high precision semiconductor wafer outer diameter grinding apparatus comprising: the device comprises a grinding box, a clamping and positioning mechanism, an adjustable grinding mechanism and a cleaning mechanism;
the clamping and positioning mechanism is arranged in the grinding box and comprises a positioning support plate, one side of the positioning support plate, which is positioned in the grinding box, is connected with a pair of lifting support rods, the outer sides of the lifting support rods are respectively provided with a limiting support column, the two sides of the positioning support plate are respectively provided with a support block, one side, which is close to the support blocks, of the positioning support plate is respectively provided with a clamping cone, and a driving rotating shaft is connected between the clamping cones and the support blocks;
the adjustable grinding mechanism is arranged on the outer side of the positioning support plate and comprises a pair of grinding rollers which are symmetrically distributed on two sides of the positioning support plate, and limit control rotating shafts are connected in the pair of grinding rollers;
the cleaning mechanism is arranged on one side of the grinding box and is used for assisting in cleaning the grinding roller.
Further, a pair of equal threaded connection has the lift lead screw in the lift bracing piece, is convenient for play the effect of supporting spacing and removal control to supporting the limiting plate through the lift lead screw, be connected with between lift lead screw and the grinding case and support the limiting plate, support the limiting plate and play the effect of supporting spacing to the lift lead screw, be formed with drive control chamber between support limiting plate and the grinding case, be convenient for provide the installation operation space to the lift motor through forming drive control chamber, the one end that the lift lead screw is located drive control intracavity is connected with the lift motor, and the lift motor plays the effect of providing power, is convenient for play the control action to the rotation state of lift lead screw through the operation of control lift motor to be convenient for play the effect of removing spacing to the lift bracing piece.
Further, the support piece is fixedly connected with one side of supporting shoe, and the support piece plays support fixed and mobile control's effect to the supporting shoe, one side that the supporting piece kept away from the supporting shoe is connected with the screw thread stopper, is convenient for play mobile control's effect to the supporting shoe through the removal of screw thread stopper, screw thread stopper internal connection has the centre gripping drive shaft, and the centre gripping drive shaft plays support spacing and mobile control's effect to the screw thread stopper.
Further, the opposite external threads are cut on the two sides of the clamping driving shaft, and the pair of threaded limiting blocks move in opposite directions along with the movement of the clamping driving shaft under the action of the internal and external threads through the opposite external threads, so that the clamping state of the clamping cone is controlled conveniently, a driving belt wheel is connected to one side, far away from the threaded limiting blocks, of the clamping driving shaft, and the driving belt wheel plays a role in rotating and driving the clamping driving shaft.
Further, the outside of driving pulley is connected with the hold-in range, and the hold-in range plays the effect of connecting driving pulley and band pulley for driving pulley carries out corresponding rotation along with the rotation of band pulley under the effect of hold-in range, one side that driving pulley was kept away from to the hold-in range is connected with the band pulley, and the band pulley plays the effect of transmission centre gripping motor power, be connected with the centre gripping motor on the band pulley, the centre gripping motor plays the effect of providing power, is convenient for play the control effect to the rotation state of band pulley through the operation of control centre gripping motor.
Further, one side that the drive pivot is located the supporting shoe is connected with drive gear, and drive gear plays rotary drive's effect to the drive pivot, one side meshing of drive gear has drive gear, and drive gear plays the effect of transmission rotation electric motor power, be connected with rotary motor on the drive gear, rotary motor plays the effect that provides the power, is convenient for play rotary drive's effect to the clamp cone through the running state of control rotary motor to be convenient for play rotary control's effect to the silicon crystal bar that needs to grind.
Further, the both sides of grinding case are excavated and are had with spacing control pivot assorted regulation spout, are convenient for play position control's effect to a pair of grinding roller through the mode that spacing control pivot removed along removal spout, have improved the efficiency that carries out external diameter grinding to the silicon crystal bar, a pair of spacing control pivot is located one side outside the grinding case and all is connected with spacing supporting shoe, and spacing supporting shoe plays the fixed with removal spacing effect to spacing control pivot, be connected with the removal slide rail between spacing supporting shoe and the grinding case, remove the slide rail and play the spacing effect of removal spacing to spacing supporting shoe.
Further, a pair of spacing supporting shoe is all connected with the screw thread connecting rod in one side that is close to mutually, and screw thread connecting rod plays the effect of support to spacing supporting shoe, is convenient for carry out the effect of removal control to spacing supporting shoe through the mode of removing control to screw thread connecting rod, screw thread connecting rod internal thread is connected with the regulation screw thread pivot, regulation screw thread pivot and screw thread connecting rod assorted, screw thread connecting rod play the effect of supporting spacing and removal control to regulation screw thread pivot, one side that the removal slide rail was kept away from to the regulation screw thread pivot is connected with drive bevel gear, and drive bevel gear plays rotary drive's effect to regulation screw thread pivot, drive bevel gear's one side meshing has drive bevel gear, and drive bevel gear plays the effect of transmission regulation motor power, be connected with accommodate motor on the drive bevel gear, be convenient for play rotary drive's effect to regulation screw thread pivot through the operation of control, be equipped with the gear box between accommodate motor and the drive bevel gear and play the effect of supporting spacing to the power saving motor.
Further, one side of spacing control pivot keeps away from spacing supporting shoe is connected with the grinding band pulley, and the grinding band pulley plays rotary drive's effect to spacing control pivot, the outside of grinding band pulley is connected with synchronous drive belt, and synchronous drive belt plays the effect of connecting a pair of grinding band pulley and tensioning band pulley, is convenient for make a pair of grinding band pulley carry out synchronous rotation under synchronous drive belt's effect, one side of grinding band pulley is kept away from to synchronous drive belt is connected with the tensioning band pulley, and tensioning band pulley plays tensioning control's effect to synchronous drive belt, the outside of tensioning band pulley is equipped with the transmission control case, and the transmission control case plays the effect of operation protection to synchronous drive belt, is convenient for play the effect of supporting spacing to grinding motor through the transmission control case simultaneously, the output shaft of grinding motor is connected with spacing control pivot, and grinding motor plays the effect that provides the effect of power, is convenient for play control effect to the rotation state of spacing control pivot through the operation of control grinding motor to be convenient for play control effect to the rotation state of a pair of spacing control pivot.
Further, tensioning band pulley internal connection has the spacing axle of tensioning, and the spacing axle of tensioning plays the spacing effect of support to tensioning band pulley, the outside of the spacing axle of tensioning is connected with the removal supporting shoe, and the removal supporting shoe plays fixed spacing effect to the spacing axle of tensioning, the outside sliding connection of removal supporting shoe has the spacing, and the spacing plays the spacing effect with the motion control of support to the removal supporting shoe, be connected with tensioning spring between removal supporting shoe and the spacing, tensioning spring plays the effect of connecting removal supporting shoe and spacing, is convenient for play the spacing effect of support to the removal supporting shoe through tensioning spring's shrink and reset.
Compared with the prior art, the invention has the following advantages:
according to the invention, the corresponding adjustable grinding mechanism is arranged on the outer diameter grinding device of the semiconductor wafer, so that the silicon crystal bar can be subjected to adjustable grinding according to actual conditions, the grinding efficiency of the outer diameter of the silicon crystal bar is remarkably improved, the situation that the silicon crystal bar is deviated in grinding process is avoided, and the accuracy of the outer diameter grinding of the silicon crystal bar is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present invention, and other drawings may be obtained according to the drawings without inventive effort to those skilled in the art.
FIG. 1 is a front cross-sectional view of a high-precision semiconductor wafer outer diameter polishing apparatus according to one embodiment of the present invention;
FIG. 2 is a schematic diagram of the structure of FIG. 1 at A;
FIG. 3 is a schematic view of the structure of FIG. 1 at B;
FIG. 4 is a schematic view of the structure of FIG. 1 at C;
FIG. 5 is a schematic view of the structure of FIG. 1 at D;
FIG. 6 is a schematic diagram of the structure of FIG. 1 at E;
FIG. 7 is a first side cross-sectional view of a high precision semiconductor wafer outer diameter polishing apparatus according to one embodiment of the present invention;
FIG. 8 is a schematic view of the structure F in FIG. 7;
FIG. 9 is a second side cross-sectional view of a high precision semiconductor wafer outer diameter polishing apparatus according to one embodiment of the present invention;
FIG. 10 is a schematic diagram of the structure G in FIG. 9;
FIG. 11 is a perspective view of an apparatus for polishing an outer diameter of a semiconductor wafer with high accuracy in accordance with one embodiment of the present invention.
In the figure: 1. the system comprises a grinding box, a clamping and positioning mechanism, 201, a positioning support plate, 202, a lifting support rod, 203, a limiting support column, 204, a support block, 205, a clamping cone, 206, a driving shaft, 207, a lifting screw rod, 208, a supporting limiting plate, 209, a lifting motor, 210, a support piece, 211, a threaded limiting block, 212, a clamping driving shaft, 213, a driving belt, 214, a synchronous belt, 215, a driving belt, 216, a clamping motor, 217, a driving gear, 218, a driving gear, 219, a rotating motor, 3, an adjustable grinding mechanism, 301, a grinding roller, 302, a limiting control shaft, 303, a limiting support block, 304, a moving slide rail, 305, a threaded connecting rod, 306, an adjusting screw shaft, 307, a driving bevel gear, 308, a driving bevel gear, 309, a regulating motor, 310, a gear box, 311, a grinding belt, 312, 313, a tensioning belt, 314, a driving control box, 315, a grinding motor, 316, a tensioning limiting shaft, 317, a moving support block, 318, a limiting frame, 319, a tensioning spring, 4, a cleaning mechanism, 401, a limiting frame, 402, a protecting frame, 403, a nozzle support, a nozzle guide bracket, 404, a nozzle guide bracket, and a backflow guide box.
Detailed Description
The present invention will be described in detail below with reference to the embodiments shown in the drawings. The embodiments are not intended to limit the invention, but structural, methodological or functional modifications from the embodiments are within the scope of the invention.
The invention discloses a high-precision semiconductor wafer outer diameter grinding device, which is shown by referring to figures 1-11 and comprises a grinding box 1, a clamping and positioning mechanism 2, an adjustable grinding mechanism 3 and a cleaning mechanism 4.
Referring to fig. 1-3, the clamping and positioning mechanism 2 is arranged in the grinding box 1, so that the silicon crystal bar to be ground can be clamped and limited conveniently through the clamping and positioning mechanism 2, and the accuracy of grinding the outer diameter of the silicon crystal bar is improved.
Referring to fig. 1-3, the clamping and positioning mechanism 2 comprises a positioning support plate 201, and the positioning support plate 201 can be used for supporting and limiting a silicon crystal rod to be ground, so that the accuracy of positioning the silicon crystal rod is improved.
Referring to fig. 1 to 3, a pair of lifting support rods 202 are connected to one side of the positioning support plate 201 located in the grinding box 1, and the positioning support plate 201 is supported and limited and position-adjusted by the pair of lifting support rods 202, so that the positioning support plate 201 is conveniently controlled to move by the movement of the lifting support rods 202.
Referring to fig. 1-3, a pair of lifting support rods 202 are provided with a limit support 203 on the outer sides, and the limit support 203 plays a role in limiting movement of the lifting support rods 202.
Referring to fig. 1-3, support blocks 204 are disposed on both sides of the positioning support plate 201, so that the drive shaft 206 is supported and limited by the support blocks 204.
Referring to fig. 1-3, a clamping cone 205 is disposed on a side of the pair of support blocks 204, which is close to each other, so as to facilitate the clamping and limiting effects on the silicon crystal rod through the pair of support blocks 204.
Referring to fig. 1-3, a driving shaft 206 is connected between the clamping cone 205 and the supporting block 204, and the driving shaft 206 plays roles of supporting, limiting and controlling rotation for the clamping cone 205.
Referring to fig. 1-3, a pair of lifting support rods 202 are internally and respectively connected with a lifting screw rod 207 in a threaded manner, so that the lifting screw rods 207 can conveniently perform the functions of supporting, limiting and moving control on a supporting limiting plate 208.
Referring to fig. 1 to 3, a supporting and limiting plate 208 is connected between the lifting screw 207 and the grinding box 1, and the supporting and limiting plate 208 plays a role in supporting and limiting the lifting screw 207.
Wherein, be formed with the drive control chamber between support limiting plate 208 and the grinding case 1, be convenient for provide the installation operation space to elevating motor 209 through forming the drive control chamber.
Referring to fig. 1 to 3, one end of the elevating screw 207 located in the driving control chamber is connected with an elevating motor 209, and the elevating motor 209 plays a role in providing power, so that the rotation state of the elevating screw 207 is controlled by controlling the operation of the elevating motor 209, and thus, the elevating support bar 202 is conveniently limited in movement.
Referring to fig. 1-3, a support member 210 is fixedly connected to one side of the support block 204, and the support member 210 plays a role in supporting, fixing and controlling movement of the support block 204.
Referring to fig. 1-3, a threaded limiting block 211 is connected to a side of the support 210 away from the support block 204, so that movement of the threaded limiting block 211 can conveniently control movement of the support block 204.
Referring to fig. 1 to 3, a clamping driving shaft 212 is connected to the screw limiting block 211, and the clamping driving shaft 212 plays a role in supporting, limiting and moving control of the screw limiting block 211.
Wherein, the two sides of the clamping driving shaft 212 are cut with external threads with opposite directions, and the pair of thread limiting blocks 211 move with the movement of the clamping driving shaft 212 with opposite directions under the action of the internal and external threads through the external threads with opposite directions, so that the clamping state of the clamping cone 205 is controlled conveniently.
Referring to fig. 1 to 4, a driving pulley 213 is connected to a side of the clamping driving shaft 212 away from the thread stopper 211, and the driving pulley 213 performs a rotation driving function on the clamping driving shaft 212.
Referring to fig. 1 to 4, a timing belt 214 is connected to the outer side of the driving pulley 213, and the timing belt 214 serves to connect the driving pulley 213 with the driving pulley 215, so that the driving pulley 213 rotates correspondingly with the rotation of the driving pulley 215 under the action of the timing belt 214.
Referring to fig. 1 to 4, a transmission pulley 215 is connected to a side of the timing belt 214 away from the driving pulley 213, and the transmission pulley 215 functions to transmit the power of the clamp motor 216.
Referring to fig. 1 to 4, a clamp motor 216 is connected to the pulley 215, and the clamp motor 216 functions to provide power to control the rotation state of the pulley 215 by controlling the operation of the clamp motor 216.
Referring to fig. 1 to 3, a driving gear 217 is connected to a side of the driving shaft 206 located in the supporting block 204, and the driving gear 217 performs a rotation driving function on the driving shaft 206.
Referring to fig. 1 to 3, a transmission gear 218 is engaged with one side of the driving gear 217, and the transmission gear 218 functions to transmit the power of the rotation motor 219.
Referring to fig. 1-3, a rotary motor 219 is connected to the transmission gear 218, and the rotary motor 219 plays a role in providing power to facilitate a rotary driving function on the clamping cone 205 by controlling an operation state of the rotary motor 219, thereby facilitating a rotary control function on a silicon ingot to be polished.
Referring to fig. 1-3, the adjustable grinding mechanism 3 is disposed outside the positioning support plate 201, and the adjustable grinding mechanism 3 includes a pair of grinding rollers 301, where the pair of grinding rollers 301 are symmetrically distributed on two sides of the positioning support plate 201, so as to perform an outer diameter grinding function on the silicon ingot through the pair of grinding rollers 301.
Referring to fig. 1-3, a pair of grinding rollers 301 are each connected with a limit control shaft 302, so that the grinding rollers 301 are supported, limited and controlled in rotation by the limit control shafts 302.
Wherein, the both sides of lapping case 1 are excavated and are had with spacing control pivot 302 assorted regulation spout, are convenient for through spacing control pivot 302 along the mode that removes the spout and play position control's effect to a pair of grinding roller 301, have improved the efficiency that carries out external diameter grinding to the silicon crystal bar.
Referring to fig. 9-10, a pair of limit control rotating shafts 302 are connected to limit supporting blocks 303 on one side of the grinding box 1, and the limit supporting blocks 303 play roles in supporting, fixing and moving limiting the limit control rotating shafts 302.
Referring to fig. 9 to 10, a movable slide rail 304 is connected between the limit support block 303 and the grinding box 1, and the movable slide rail 304 plays a role in moving and limiting the limit support block 303.
Referring to fig. 9-10, a pair of spacing supporting blocks 303 are connected with a threaded connecting rod 305 on the side close to each other, and the threaded connecting rod 305 plays a role in supporting the spacing supporting blocks 303, so that the spacing supporting blocks 303 can be conveniently moved and controlled in a manner of controlling the movement of the threaded connecting rod 305.
Referring to fig. 9-10, an adjusting screw shaft 306 is connected to the screw connection rod 305 by an internal screw thread, the adjusting screw shaft 306 is matched with the screw connection rod 305, and the screw connection rod 305 plays roles of supporting, limiting and moving control on the adjusting screw shaft 306.
Referring to fig. 9 to 10, a driving bevel gear 307 is connected to a side of the adjusting screw shaft 306 remote from the moving rail 304, and the driving bevel gear 307 plays a role in rotationally driving the adjusting screw shaft 306.
Referring to fig. 9 to 10, a drive bevel gear 308 is engaged with one side of the drive bevel gear 307, and the drive bevel gear 308 functions to transmit the power of the adjustment motor 309.
Referring to fig. 9 to 10, an adjustment motor 309 is coupled to the drive bevel gear 308 to facilitate a rotation driving function of the drive bevel gear 308 by controlling the operation of the adjustment motor 309, thereby facilitating a control function of adjusting the rotation state of the screw shaft 306.
Referring to fig. 9 to 10, a gear box 310 is provided between the adjustment motor 309 and the drive bevel gear 308, and the gear box 310 plays a role in supporting and limiting the adjustment motor 309.
Referring to fig. 7 to 8, a pair of limit control shafts 302 are connected to a grinding pulley 311 at a side far from the limit support block 303, and the grinding pulley 311 plays a role in rotationally driving the limit control shafts 302.
Referring to fig. 7 to 8, a timing belt 312 is connected to the outer side of the grinding pulley 311, and the timing belt 312 serves to connect the pair of grinding pulleys 311 with the tension pulley 313, so that the pair of grinding pulleys 311 can be synchronously rotated by the timing belt 312.
Referring to fig. 7 to 8, a tension pulley 313 is connected to a side of the timing belt 312 away from the grinding pulley 311, and the tension pulley 313 plays a role in tension control of the timing belt 312.
Referring to fig. 7-8, a transmission control box 314 is arranged on the outer side of the tensioning belt wheel 313, the transmission control box 314 plays a role in running protection for the synchronous transmission belt 312, and meanwhile, the transmission control box 314 is convenient for playing a role in supporting and limiting the grinding motor 315.
Referring to fig. 7-8, a grinding motor 315 is connected to the transmission control box 314, an output shaft of the grinding motor 315 is connected to the limit control shaft 302, and the grinding motor 315 functions to provide power, so that the rotation state of the limit control shaft 302 can be controlled by controlling the operation of the grinding motor 315, and the rotation grinding state of a pair of limit control shafts 302 can be controlled.
Referring to fig. 7 to 10, a tension limiting shaft 316 is connected to the tension pulley 313, and the tension limiting shaft 316 plays a role in supporting and limiting the tension pulley 313.
Referring to fig. 7 to 10, a movable supporting block 317 is connected to the outer side of the tensioning limiting shaft 316, and the movable supporting block 317 plays a role in fixing and limiting the tensioning limiting shaft 316.
Referring to fig. 7 to 10, a limiting frame 318 is slidably connected to the outer side of the movable supporting block 317, and the limiting frame 318 plays a role in supporting, limiting and controlling movement of the movable supporting block 317.
Referring to fig. 7 to 10, a tensioning spring 319 is connected between the movable supporting block 317 and the limiting frame 318, and the tensioning spring 319 plays a role in connecting the movable supporting block 317 and the limiting frame 318, so that the movable supporting block 317 is supported and limited by contraction and restoration of the tensioning spring 319.
Referring to fig. 1, a cleaning mechanism 4 is provided on one side of the grinding box 1 for assisting cleaning of the grinding roller 301.
Referring to fig. 1 to 6, the cleaning mechanism 4 includes a limit guard 401, which is convenient for protecting the grinding box 1 by the limit guard 401 and for supporting and limiting the nozzle holder 403 by the limit guard 401.
Referring to fig. 1-6, a liquid storage tank 402 is arranged on one side of the limit guard 401 away from the grinding tank 1, and the liquid storage tank 402 plays a role in storing cleaning liquid.
Referring to fig. 1 to 6, a nozzle bracket 403 is connected to a side of the limit guard 401 away from the liquid storage tank 402, and the nozzle bracket 403 plays a role in supporting and limiting the cleaning nozzle 404.
Referring to fig. 1 to 6, a plurality of cleaning nozzles 404 are uniformly distributed on the nozzle holder 403, and the cleaning nozzles 404 are matched with the grinding roller 301, so that the cleaning liquid is sprayed out through the cleaning nozzles 404.
Referring to fig. 1-6, a plurality of auxiliary nozzles 405 are uniformly distributed in the grinding box 1, and a conducting pipe 406 is communicated between the auxiliary nozzles 405 and the limiting protective frame 401, so that cleaning liquid can be conveniently conveyed into the auxiliary nozzles 405 through the conducting pipe 406.
Referring to fig. 1 to 6, a waste liquid return tank 407 is provided in the polishing tank 1, so that the cleaning liquid used in the polishing tank 1 can be collected by the waste liquid return tank 407.
When the silicon crystal rod grinding machine is specifically used, a silicon crystal rod to be ground is placed in a grinding box 1, the silicon crystal rod is supported and limited through a positioning support plate 201, then, a lifting screw rod 207 is rotationally controlled by controlling the operation of a lifting motor 209, a lifting support rod 202 moves under the action of internal and external threads, and the positioning support plate 201 moves the silicon crystal rod into the grinding box 1 through the movement of the lifting support rod 202;
subsequently, the clamping driving shaft 212 is rotationally driven by controlling the operation of the clamping motor 216, the clamping driving shaft 212 drives the pair of threaded limiting blocks 211 to move in the rotating process, the supporting block 204 is subjected to movement control by the movement of the pair of threaded limiting blocks 211, and the clamping cone 205 clamps and limits the silicon crystal rod by the movement of the supporting block 204;
when the silicon crystal rod is clamped, the limit control rotating shaft 302 is driven and controlled by controlling the operation of the grinding motor 315, the limit control rotating shaft 302 synchronously rotates under the cooperation of the grinding belt wheel 311 and the synchronous transmission belt 312, the silicon crystal rod is subjected to outer diameter grinding through the rotation of the pair of grinding rollers 301, in addition, the driving rotating shaft 206 is controlled to rotate by controlling the operation of the rotating motor 219 in the grinding process, the clamping cone 205 is controlled to rotate by controlling the rotation of the driving rotating shaft 206, then the silicon crystal rod is subjected to rotation control, the rotation direction of the silicon crystal rod is opposite to the direction of the grinding rollers 301, and the outer diameter grinding efficiency of the silicon crystal rod is improved;
meanwhile, when the position of the grinding roller 301 needs to be adjusted, the adjusting screw thread rotating shaft 306 is rotated by controlling the operation of the adjusting motor 309, and the limiting support block 303 is controlled to move by the rotation of the adjusting screw thread rotating shaft 306, so that the grinding roller 301 is convenient to adjust the position, and the accuracy of grinding the outer diameter of the silicon crystal bar is improved.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment contains only one independent technical solution, and that such description is provided for clarity only, and that the technical solutions of the embodiments may be appropriately combined to form other embodiments that will be understood by those skilled in the art.
Claims (10)
1. A high precision semiconductor wafer outer diameter grinding apparatus, comprising:
a grinding box (1);
the clamping and positioning mechanism (2) is arranged in the grinding box (1), the clamping and positioning mechanism (2) comprises a positioning support plate (201), one side of the positioning support plate (201) positioned in the grinding box (1) is connected with a pair of lifting support rods (202), the outer sides of the lifting support rods (202) are provided with limit support columns (203), the two sides of the positioning support plate (201) are provided with support blocks (204), one side, close to the support blocks (204), of the support blocks is provided with a clamping cone (205), and a driving rotating shaft (206) is connected between the clamping cone (205) and the support blocks (204);
the adjustable grinding mechanism (3) is arranged on the outer side of the positioning support plate (201), the adjustable grinding mechanism (3) comprises a pair of grinding rollers (301), the pair of grinding rollers (301) are symmetrically distributed on two sides of the positioning support plate (201), and limiting control rotating shafts (302) are connected in the pair of grinding rollers (301);
and the cleaning mechanism (4) is arranged on one side of the grinding box (1) and is used for assisting in cleaning the grinding roller (301).
2. The high-precision semiconductor wafer outer diameter grinding device according to claim 1, wherein a pair of lifting support rods (202) are internally and respectively connected with a lifting screw rod (207), a supporting limiting plate (208) is connected between the lifting screw rods (207) and the grinding box (1), a driving control cavity is formed between the supporting limiting plate (208) and the grinding box (1), and one end of the lifting screw rods (207) positioned in the driving control cavity is connected with a lifting motor (209).
3. The high-precision semiconductor wafer outer diameter grinding device according to claim 1, wherein one side of the supporting block (204) is fixedly connected with a supporting piece (210), one side of the supporting piece (210) far away from the supporting block (204) is connected with a threaded limiting block (211), and the threaded limiting block (211) is connected with a clamping driving shaft (212).
4. A high-precision semiconductor wafer outer diameter grinding device according to claim 3, wherein external threads with opposite directions are cut on two sides of the clamping driving shaft (212), and a driving belt wheel (213) is connected to one side of the clamping driving shaft (212) away from the thread limiting block (211).
5. The high-precision semiconductor wafer outer diameter grinding device according to claim 4, wherein a synchronous belt (214) is connected to the outer side of the driving belt wheel (213), a driving belt wheel (215) is connected to one side of the synchronous belt (214) away from the driving belt wheel (213), and a clamping motor (216) is connected to the driving belt wheel (215).
6. The high-precision semiconductor wafer outer diameter grinding device according to claim 1, wherein a driving gear (217) is connected to one side of the driving shaft (206) located in the supporting block (204), a transmission gear (218) is meshed to one side of the driving gear (217), and a rotary motor (219) is connected to the transmission gear (218).
7. The high-precision semiconductor wafer outer diameter grinding device according to claim 1, wherein adjusting sliding grooves matched with the limit control rotating shafts (302) are cut on two sides of the grinding box (1), one pair of limit control rotating shafts (302) are connected with limit supporting blocks (303) on one side, located outside the grinding box (1), of each limit control rotating shaft, and movable sliding rails (304) are connected between the limit supporting blocks (303) and the grinding box (1).
8. The high-precision semiconductor wafer outer diameter grinding device according to claim 7, wherein a pair of limit supporting blocks (303) are connected with a threaded connecting rod (305) on the side close to each other, an adjusting threaded rotating shaft (306) is connected with an internal thread of the threaded connecting rod (305), the adjusting threaded rotating shaft (306) is matched with the threaded connecting rod (305), a driving bevel gear (307) is connected with one side, far away from a moving slide rail (304), of the adjusting threaded rotating shaft (306), a driving bevel gear (308) is meshed with one side of the driving bevel gear (307), an adjusting motor (309) is connected on the driving bevel gear (308), and a gear box (310) is arranged between the adjusting motor (309) and the driving bevel gear (308).
9. The high-precision semiconductor wafer outer diameter grinding device according to claim 7, wherein one side of the pair of limit control rotating shafts (302) away from the limit supporting block (303) is connected with a grinding belt wheel (311), the outer side of the grinding belt wheel (311) is connected with a synchronous driving belt (312), one side of the synchronous driving belt (312) away from the grinding belt wheel (311) is connected with a tensioning belt wheel (313), the outer side of the tensioning belt wheel (313) is provided with a transmission control box (314), the transmission control box (314) is connected with a grinding motor (315), and an output shaft of the grinding motor (315) is connected with the limit control rotating shafts (302).
10. The high-precision semiconductor wafer outer diameter grinding device according to claim 9, wherein a tensioning limiting shaft (316) is connected to the tensioning pulley (313), a movable supporting block (317) is connected to the outer side of the tensioning limiting shaft (316), a limiting frame (318) is connected to the outer side of the movable supporting block (317) in a sliding manner, and a tensioning spring (319) is connected between the movable supporting block (317) and the limiting frame (318).
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| CN202210835806.7A CN115042086B (en) | 2022-07-15 | 2022-07-15 | High-precision semiconductor wafer outer diameter grinding device |
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| CN202210835806.7A CN115042086B (en) | 2022-07-15 | 2022-07-15 | High-precision semiconductor wafer outer diameter grinding device |
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| JP2000033560A (en) * | 1998-07-16 | 2000-02-02 | Fujikoshi Mach Corp | Double-side polishing machine |
| CN201136124Y (en) * | 2007-12-13 | 2008-10-22 | 中芯国际集成电路制造(上海)有限公司 | Locating ring for grinding semiconductor chip |
| JP2013052455A (en) * | 2011-09-01 | 2013-03-21 | Disco Corp | Abrasive grain embedding device, lapping device, and lapping method |
| CN112045518A (en) * | 2019-06-06 | 2020-12-08 | 东京毅力科创株式会社 | Substrate processing device |
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2022
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000033560A (en) * | 1998-07-16 | 2000-02-02 | Fujikoshi Mach Corp | Double-side polishing machine |
| CN201136124Y (en) * | 2007-12-13 | 2008-10-22 | 中芯国际集成电路制造(上海)有限公司 | Locating ring for grinding semiconductor chip |
| JP2013052455A (en) * | 2011-09-01 | 2013-03-21 | Disco Corp | Abrasive grain embedding device, lapping device, and lapping method |
| CN112045518A (en) * | 2019-06-06 | 2020-12-08 | 东京毅力科创株式会社 | Substrate processing device |
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