CN208773297U - Processing unit (plant) - Google Patents
Processing unit (plant) Download PDFInfo
- Publication number
- CN208773297U CN208773297U CN201821204209.XU CN201821204209U CN208773297U CN 208773297 U CN208773297 U CN 208773297U CN 201821204209 U CN201821204209 U CN 201821204209U CN 208773297 U CN208773297 U CN 208773297U
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- Prior art keywords
- motor
- plant
- processing unit
- processing
- ring portion
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- 230000003028 elevating effect Effects 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims abstract description 7
- 241000196324 Embryophyta Species 0.000 description 33
- 230000005611 electricity Effects 0.000 description 3
- 230000008450 motivation Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 235000006508 Nelumbo nucifera Nutrition 0.000 description 1
- 240000002853 Nelumbo nucifera Species 0.000 description 1
- 235000006510 Nelumbo pentapetala Nutrition 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Landscapes
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
The utility model provides a kind of processing unit (plant) that can be accurately measured grinding load, carry out desired processing to wafer.It includes multiple chucks, is used to keep substrate；And at least one processes axis；In the processing unit (plant), the processing axis includes: processing department, is processed to the substrate；Motor rotates the processing department；Motor maintaining part keeps the motor；And elevating mechanism, go up and down the motor maintaining part；The motor maintaining part is by the ring portion for installing the motor and surrounds the cover being connected around the motor and with the lifting shaft of the elevating mechanism and is formed；The tilting equipment and at least three load transducer S of the heeling condition for adjusting the motor are provided between the motor and the ring portion.
Description
Technical field
The utility model relates to a kind of processing unit (plant), which grinds the machined objects such as substrate (such as wafer)
Mill processing.
Background technique
During making semiconductor element, using processing unit (plant) to as the substantially circular plate shape of machined object
When wafer carries out attrition process, it is difficult to measure the angle of abradant surface, accordingly, it is difficult to which the angle for being directly based upon abradant surface will
Abradant surface is adjusted to parallel with the surface of wafer.
In patent document 1, the knot of the center of the load of wafer is applied to when disclosing a kind of measuring and calculating attrition process
Structure, thus, it is possible to which wafer is formed as desired shape, also, even if in the case where asymmetrical wear has occurred in grinding pad,
Wafer can be also formed as to desired shape.
Existing technical literature
Patent document
1 Japanese Unexamined Patent Publication 2017-140658 of patent document
Utility model content
Utility model will solve the problems, such as
However, in documents 1, when measuring to the grinding load for being applied to wafer, grinding load is via grinding
Mill pad 23, main shaft 22, main shaft housing 21, flange 25, ring 24 are transmitted to sensor 41.It is inevitable due to existing between each component
Tolerance, deformation etc., therefore, measurement result is not accurate enough, thus in the presence of the case where carrying out desired processing to wafer is difficult to.
The utility model is exactly to complete in light of this situation, can accurately measure and grind its purpose is to provide one kind
Mill load, the processing unit (plant) that desired processing is carried out to wafer.
The solution to the problem
Using the processing unit (plant) of the 1st technical solution, multiple chucks are included, are used to keep substrate；And at least one
Process axis；In the processing unit (plant), the processing axis includes: processing department, is processed to the substrate；Motor,
Rotate the processing department；Motor maintaining part keeps the motor；And elevating mechanism, protect the motor
Hold portion's lifting；The motor maintaining part is by the ring portion for installing the motor and surrounds around the motor simultaneously
The cover being connected with the lifting shaft of the elevating mechanism is formed；It is provided between the motor and the ring portion for adjusting
The tilting equipment and at least three load transducer of the heeling condition of the whole motor.
Using the processing unit (plant) of the 2nd technical solution, the tilting equipment and the load transducer are disposed adjacently.
Using the processing unit (plant) of the 3rd technical solution, the tilting equipment, which has from the lower section of the ring portion, adjusts the electricity
The adjustment section of the heeling condition of motivation.
Using the processing unit (plant) of the 4th technical solution, it is equipped in the motor maintaining part for constantly acting load sensor
With the fixed part of amplifier.
Using the processing unit (plant) of the 5th technical solution, the processing unit (plant) also has machine table, keeps multiple cards
Disk moves the chuck between move-in position and grinding position, the tilting equipment include at least one fixing component with
And at least two movable link, the fixing component for movable link described at least one compared to being configured at by the machine table
Lateral center side and/or the fixing component compared to being configured at for movable link described at least one by the elevator
Structure side.
Using the processing unit (plant) of the 6th technical solution, the load transducer is equally spaced set in the circumferential direction of the ring portion
It sets.
Using the processing unit (plant) of the 7th technical solution, the processing department is grinding pad or abrasive grinding wheel.
Using the processing unit (plant) of the 8th technical solution, the load transducer is made of piezoelectric element.
The effect of utility model
It is enabled to using the processing unit (plant) of the utility model since load transducer is directly connected with engine
The result of measurement is more accurate, so as to carry out desired processing to wafer.
Detailed description of the invention
Fig. 1 is to show the perspective view of the structure of processing unit (plant) of the utility model.
Fig. 2 is to show the bottom view of the ring portion of processing unit (plant) of the utility model.
Fig. 3 is to show the sectional view of the processing axis of the processing unit (plant) of the utility model.
Fig. 4 is the signal of the fixing component for showing the processing unit (plant) of the utility model and the positional relationship of movable link
Figure.
Description of symbols
1,100. processing unit (plant)；W. wafer；11. chuck；12. processing axis；13. machine table；20. grinding pad；21. electronic
Machine；22. main shaft；23. motor maintaining part；24. elevating mechanism；25. cover portion；26. ring portion；27. center through hole；28. lifting shaft；
29. fixed part；A. load transducer amplifier；30. external thread component；31. internal thread hole；32. recess portion；33. top end part；S.
Load transducer；41. fixing component；42. movable link.
Specific embodiment
Attached drawing be in order to show the utility model and be appropriately emphasize, omit, the adjustment of ratio it is schematical
Figure, it is sometimes different from actual shape, positional relationship and ratio.Wherein, by Fig. 1,4 coordinate-system in left and right directions determine
Justice is laterally.
Embodiment 1
Next, illustrating the embodiment of the processing unit (plant) 1 of the utility model referring to attached drawing 1~3.
The processing unit (plant) 1 of present embodiment carries out attrition process to the surface to be polished of wafer W, so that surface to be polished high-precision
Ground planarization.
Wafer W is the processing object of processing unit (plant) 1.In the present embodiment, wafer W can be with silicon, sapphire, gallium etc.
For the semiconductor crystal wafer of base material.
Fig. 1 is to show the perspective view of the structure of processing unit (plant) 1 of the utility model.
As shown in Figure 1, processing unit (plant) 1 has chuck 11, it is used to keep wafer W (shown in Fig. 4 as be described hereinafter)；And 3
Process axis 12；Each processing axis 12 includes: grinding pad 20, carries out attrition process to wafer W；Motor 21 makes grinding pad 20
Rotation；Motor maintaining part 23 keeps motor 21；And elevating mechanism 24, go up and down motor maintaining part 23.In electricity
The periphery of motivation 21 is formed with cover portion 25, surrounds around motor 21, and be installed on the lifting shaft 28 of elevating mechanism 24.?
The position of the close lifting shaft 28 of cover portion 25 is equipped with fixed part 29, is used for constantly acting load sensor amplifier A.In cover portion
25 lower section is equipped with circular ring portion 26, bears the load from motor 21, motor maintaining part 23 is by cover portion 25
It is constituted with ring portion 26.
Fig. 2 is to show the bottom view of the ring portion 26 of processing unit (plant) 1 of the utility model, and Fig. 3 is that show this practical new
The sectional view of the processing axis 12 of the processing unit (plant) 1 of type.Wherein, Fig. 3 is figure obtained from the line A-A cutting along Fig. 2.
As shown in Figure 2,3, it is centrally formed with center through hole 27 in ring portion 26, the main shaft 22 and ring portion 26 of motor 21 are same
Axis it is arranged, and reaches the lower section of ring portion 26 across the center through hole 27.Grinding pad is installed in the lower end of main shaft 22
20。
In the present embodiment, tilting equipment includes external thread component 30, internal thread hole 31 and recess portion 32, is ground for adjusting
Grind the angle of pad 20.
Internal thread hole 31 is formed in ring portion 26, forms along thickness direction perforation ring portion 26 and is formed with interior spiral shell in inner peripheral surface
Line and can be screwed with external thread component 30.In addition, 3 internal thread holes 31 are on the same circumference along the circumferential direction of ring portion 26
It is equally spaced.
The lower end of motor 21 is arranged in recess portion 32, and 3 internal thread holes 31 with ring portion 26 are accordingly along upper and lower
To being formed with 3, for accommodating the top end part 33 of external thread component 30.In other words, 3 recess portions 32 are on the same circumference along electricity
The circumferential direction of motivation 21 is equally spaced.When along end on observation, the internal thread hole 31 of ring portion 26 and the recess portion 32 of motor 21
It coincides with one another.
3 load transducer S are installed using external thread component 30 between motor 21 and ring portion 26, wherein as
Load transducer S, has used piezoelectric element.Specifically, internal thread hole 31 spiral shell of the external thread component 30 from lower section and ring portion 26
Line combines, and further so that top end part 33 is extended to the recess portion 32 of motor 21 through load transducer S.Wherein, load passes
Sensor S is configured with the state clamped by motor 21 and ring portion 26.In other words, load transducer S is in motor 21 and ring portion
The state configuration being extruded in the axial direction between 26.Since external thread component 30 and internal thread hole 31 are screwed, by from ring
The lower section in portion 26 turns external thread component 30, can infinitely adjust the distance between motor 21 and ring portion 26.For example, passing through
Back-out external thread component 30, motor 21 and ring portion 26 are closer to each other；By being screwed into external thread component 30, motor 21 and ring portion
26 away from each other.Thereby, it is possible to precisely adjust the angle between grinding pad 20 and wafer W.
When processing unit (plant) 1 works, based on the value that 3 load transducer S are detected, whether the angle of monitoring grinding pad 20
Properly.When the value that load transducer S is detected is in abnormal ranges, each external thread component 30 is calculated according to scheduled algorithm
Regulated quantity is simultaneously adjusted, so that grinding pad 20 is adjusted to defined angle.
Using the processing unit (plant) 1 of embodiment 1, since grinding load is directly delivered to load via grinding pad 20, motor 21
Lotus sensor S, therefore can accurately obtain the grinding load for being applied to grinding pad 20.It therefore, can be accurately by grinding pad
20 are adjusted to desired angle, to carry out desired processing to wafer W.
Embodiment 2
The processing unit (plant) 100 of embodiment 2 is only different from embodiment 1 in tilting equipment this point, for other components, uses
Identical appended drawing reference simultaneously omits the description.
Fig. 4 is to show the fixing component 41 and movable link 42 of the tilting equipment of processing unit (plant) 100 of the utility model
The schematic diagram of positional relationship the components such as motor 21, cover portion 25 on ring portion 26 are omitted for the ease of illustration.
As shown in figure 4, processing unit (plant) 100 has machine table 13, keeps multiple for keeping the chuck 11 of wafer W, make
The chuck 11 moves between move-in position and grinding position.The tilting equipment of each processing axis 12 includes 1 fixing component
41 and 2 movable links 42, fixing component 41 and movable link 42 are as the external thread component 30 in embodiment 1 in week
It equally spaced configures upwards, tilting equipment adjusts the angle of abrasive disk using movable link 42.
It had both been configured at for compared to 2 movable links 42 of fixing component 41 by the transverse direction (left and right in Fig. 4 of machine table 13
Direction) center side, it is also configured at by 24 side of elevating mechanism.
Using the processing unit (plant) 100 of embodiment 2, since the configuration of fixing component 41 is not easy the position reached in hand, and incite somebody to action
Movable link 42 is configured in the position that hand is accessible to, and therefore, is convenient for the adjustment operation of tilting equipment.
In the above embodiments, each processing axis 12 has 3 load transducer S, but also can according to need setting 4
A above load transducer.
In addition, in the above embodiments, 3 load transducer S are equally spaced in the circumferential but it is also possible to be not
It is equally spaced.
In addition, in the above embodiments, using grinding pad 20 and being used as processing department, but also can according to need using it
His component, such as abrasive grinding wheel.
In addition, in the above embodiments, external thread component 30 passes through load transducer S, but can also be by load sensing
Device is configured in the circumferential between 2 external thread components.
In addition, disclosing by turning external thread component 30 in above-described embodiment 1 and adjusting the skewed of grinding pad 20
State, but not limited to this, as long as tilting equipment can adjust the structure of the distance between motor and ring portion.
In addition, tilting equipment includes 1 fixing component 41 and 2 movable links 42 in above-described embodiment 2, fix
Both be configured at for compared to 2 movable links 42 of component 41 by machine table 13 lateral center side and also be configured at by elevating mechanism
24 sides.But not limited to this, it can be, tilting equipment includes at least one fixing component and at least two movable link, fixed structure
Part at least one movable link compared to being configured at by the lateral center side of machine table and/or fixing component compared at least
It is configured at for 1 movable link by elevating mechanism side.
Above embodiment is only intended to illustrate the utility model, and in addition to this, also there are many different embodiments, and
These embodiments be all those skilled in the art after the technical idea of comprehension the utility model it is also envisioned that therefore, herein
It will not enumerate.
Claims (8)
1. a kind of processing unit (plant) includes multiple chucks, it is used to keep substrate；And at least one processes axis；The processing
Device is characterized in that,
The processing axis includes: processing department, is processed to the substrate；Motor rotates the processing department；It is electronic
Machine maintaining part keeps the motor；And elevating mechanism, go up and down the motor maintaining part；
The motor maintaining part by the ring portion for installing the motor and surround around the motor and with institute
The cover that the lifting shaft of elevating mechanism is connected is stated to be formed；
Be provided between the motor and the ring portion tilting equipment of the heeling condition for adjusting the motor with
And at least three load transducer.
2. processing unit (plant) according to claim 1, it is characterised in that:
The tilting equipment and the load transducer are disposed adjacently.
3. processing unit (plant) according to claim 1 or 2, it is characterised in that:
The tilting equipment has the adjustment section for the heeling condition that the motor is adjusted from the lower section of the ring portion.
4. processing unit (plant) according to claim 1 or 2, it is characterised in that:
The fixed part for constantly acting load sensor amplifier is installed in the motor maintaining part.
5. processing unit (plant) according to claim 1 or 2, it is characterised in that:
The processing unit (plant) also has machine table, keeps multiple chucks, makes the chuck in move-in position and grinding
It is moved between position,
The tilting equipment includes at least one fixing component and at least two movable link,
The fixing component compared to being configured at for movable link described at least one by the lateral center side of the machine table,
And/or the fixing component for movable link described at least one compared to being configured at by the elevating mechanism side.
6. processing unit (plant) according to claim 1 or 2, it is characterised in that:
The load transducer is equally spaced in the circumferential direction of the ring portion.
7. processing unit (plant) according to claim 1 or 2, it is characterised in that:
The processing department is grinding pad or abrasive grinding wheel.
8. processing unit (plant) according to claim 1 or 2, it is characterised in that:
The load transducer is made of piezoelectric element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821204209.XU CN208773297U (en) | 2018-07-27 | 2018-07-27 | Processing unit (plant) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821204209.XU CN208773297U (en) | 2018-07-27 | 2018-07-27 | Processing unit (plant) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208773297U true CN208773297U (en) | 2019-04-23 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821204209.XU Active CN208773297U (en) | 2018-07-27 | 2018-07-27 | Processing unit (plant) |
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| Country | Link |
|---|---|
| CN (1) | CN208773297U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111730431A (en) * | 2020-05-20 | 2020-10-02 | 清华大学 | Wafer grinding method and wafer grinding system |
| CN112045518A (en) * | 2019-06-06 | 2020-12-08 | 东京毅力科创株式会社 | Substrate processing device |
-
2018
- 2018-07-27 CN CN201821204209.XU patent/CN208773297U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112045518A (en) * | 2019-06-06 | 2020-12-08 | 东京毅力科创株式会社 | Substrate processing device |
| CN111730431A (en) * | 2020-05-20 | 2020-10-02 | 清华大学 | Wafer grinding method and wafer grinding system |
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