JP7221649B2 - ウエーハの拡張方法およびウエーハの拡張装置 - Google Patents
ウエーハの拡張方法およびウエーハの拡張装置 Download PDFInfo
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- JP7221649B2 JP7221649B2 JP2018203830A JP2018203830A JP7221649B2 JP 7221649 B2 JP7221649 B2 JP 7221649B2 JP 2018203830 A JP2018203830 A JP 2018203830A JP 2018203830 A JP2018203830 A JP 2018203830A JP 7221649 B2 JP7221649 B2 JP 7221649B2
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- wafer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/88—Separating or stopping elements, e.g. fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/79—Apparatus for Tape Automated Bonding [TAB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
- H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
2a、2a’:表面
4、4’:分割予定ライン
6、6’:デバイス
8:フレーム
8a:開口部
10:粘着テープ
10a:露出粘着テープ
12:ウエーハの拡張装置
14:フレーム固定手段
16:押圧部材
20:治具
20a:初期規制部
20b:終期規制部
Claims (2)
- 分割予定ラインによって区画され複数の長方形のデバイスが形成されたウエーハを拡張し、デバイスとデバイスとの間隔を広げるウエーハの拡張方法であって、
ウエーハを収容する開口部を備えたフレームに粘着テープを介して支持され分割予定ラインが分割された又は分割予定ラインに分割の起点が形成されたウエーハを準備するウエーハ準備工程と、
上端にフレームを載置可能なフレーム固定手段にフレームを固定するフレーム固定工程と、
ウエーハの外周に対応する外周を備えた押圧部材によって粘着テープ側からウエーハを押圧してフレームから遠ざけウエーハとフレームとの間にある露出粘着テープを拡張しデバイスとデバイスとの間隔を広げる拡張工程と、
を少なくとも含み、
該拡張工程において、該押圧部材によってウエーハをフレームから遠ざけるとデバイスの短辺が並ぶ方向の該露出粘着テープが先に貼着して該露出粘着テープの幅を規制する初期規制部と、更にウエーハをフレームから遠ざけるとデバイスの長辺が並ぶ方向の該露出粘着テープが後から徐々に貼着して該露出粘着テープの幅を規制する終期規制部とを備え、長方形のデバイスとデバイスとの間隔を均等にするための、該初期規制部から該終期規制部に渡って湾曲する治具がフレームの上部に配設され、
該終期規制部の上下方向位置は該初期規制部の上下方向位置よりも上方に位置するウエーハの拡張方法。 - 分割予定ラインによって区画され複数の長方形のデバイスが形成されたウエーハを拡張し、デバイスとデバイスとの間隔を広げるウエーハの拡張装置であって、
分割予定ラインが分割された又は分割予定ラインに分割の起点が形成されたウエーハを収容する開口部を備え粘着テープを介してウエーハを支持したフレームを固定するフレーム固定手段と、
ウエーハの外周に対応する外周を備え粘着テープ側からウエーハを押圧してフレームから遠ざけウエーハとフレームとの間にある露出粘着テープを拡張する押圧部材と、
を少なくとも備え、
該押圧部材によってウエーハをフレームから遠ざけるとデバイスの短辺が並ぶ方向の該露出粘着テープが先に貼着して該露出粘着テープの幅を規制する初期規制部と、更にウエーハをフレームから遠ざけるとデバイスの長辺が並ぶ方向の該露出粘着テープが後から徐々に貼着して該露出粘着テープの幅を規制する終期規制部とを備え、長方形のデバイスとデバイスとの間隔を均等にするための、該初期規制部から該終期規制部に渡って湾曲する治具がフレームの上部に配設され、
該終期規制部の上下方向位置は該初期規制部の上下方向位置よりも上方に位置するウエーハの拡張装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018203830A JP7221649B2 (ja) | 2018-10-30 | 2018-10-30 | ウエーハの拡張方法およびウエーハの拡張装置 |
KR1020190119562A KR102707126B1 (ko) | 2018-10-30 | 2019-09-27 | 웨이퍼의 확장 방법 및 웨이퍼의 확장 장치 |
CN201911009980.0A CN111128839B (zh) | 2018-10-30 | 2019-10-23 | 晶片的扩展方法和晶片的扩展装置 |
US16/664,310 US11018044B2 (en) | 2018-10-30 | 2019-10-25 | Wafer expanding method and wafer expanding apparatus |
TW108138588A TWI807123B (zh) | 2018-10-30 | 2019-10-25 | 晶圓擴張方法以及晶圓擴張裝置 |
DE102019216640.7A DE102019216640B4 (de) | 2018-10-30 | 2019-10-29 | Waferausdehnungsverfahren |
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JP2018203830A JP7221649B2 (ja) | 2018-10-30 | 2018-10-30 | ウエーハの拡張方法およびウエーハの拡張装置 |
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JP2020072138A JP2020072138A (ja) | 2020-05-07 |
JP7221649B2 true JP7221649B2 (ja) | 2023-02-14 |
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US (1) | US11018044B2 (ja) |
JP (1) | JP7221649B2 (ja) |
KR (1) | KR102707126B1 (ja) |
CN (1) | CN111128839B (ja) |
DE (1) | DE102019216640B4 (ja) |
TW (1) | TWI807123B (ja) |
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TWI797532B (zh) * | 2020-12-31 | 2023-04-01 | 創技工業股份有限公司 | 半導體加工的方法及裝置 |
Citations (2)
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JP2016063016A (ja) | 2014-09-17 | 2016-04-25 | 株式会社東芝 | 半導体製造装置および半導体装置の製造方法 |
WO2018079536A1 (ja) | 2016-10-28 | 2018-05-03 | 株式会社東京精密 | ワーク分割装置及びワーク分割方法 |
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JP4647830B2 (ja) | 2001-05-10 | 2011-03-09 | 株式会社ディスコ | 被加工物の分割処理方法および分割処理方法に用いるチップ間隔拡張装置 |
JP2005129607A (ja) | 2003-10-22 | 2005-05-19 | Disco Abrasive Syst Ltd | ウエーハの分割方法 |
JP2007250598A (ja) * | 2006-03-14 | 2007-09-27 | Renesas Technology Corp | 半導体装置の製造方法 |
JP5580701B2 (ja) * | 2010-09-13 | 2014-08-27 | 日東電工株式会社 | ダイシング・ダイボンドフィルム |
JP2013026544A (ja) | 2011-07-25 | 2013-02-04 | Disco Abrasive Syst Ltd | ウェーハ拡張装置 |
KR101785817B1 (ko) * | 2012-12-26 | 2017-10-16 | 히타치가세이가부시끼가이샤 | 익스팬드 방법, 반도체 장치의 제조방법, 및 반도체 장치 |
JP6189066B2 (ja) * | 2013-03-27 | 2017-08-30 | 株式会社ディスコ | ウエーハの加工方法 |
US9230862B2 (en) * | 2013-05-14 | 2016-01-05 | Texas Instruments Incorporated | Wafer die separation |
US20140339673A1 (en) * | 2013-05-14 | 2014-11-20 | Texas Instruments Incorporated | Wafer processing |
KR102535477B1 (ko) * | 2014-05-23 | 2023-05-23 | 가부시끼가이샤 레조낙 | 다이본드 다이싱 시트 |
JP6509156B2 (ja) | 2016-04-05 | 2019-05-08 | 太陽誘電株式会社 | 拡張装置及び電子部品の製造方法 |
JP6671794B2 (ja) * | 2016-05-11 | 2020-03-25 | 株式会社ディスコ | ウェーハの加工方法 |
DE102017201154B4 (de) * | 2017-01-25 | 2025-02-27 | Disco Corporation | Verfahren zum Bearbeiten eines Wafers und Waferbearbeitungssystem |
US10615075B2 (en) * | 2018-06-13 | 2020-04-07 | Texas Instruments Incorporated | Dicing a wafer |
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JP2016063016A (ja) | 2014-09-17 | 2016-04-25 | 株式会社東芝 | 半導体製造装置および半導体装置の製造方法 |
WO2018079536A1 (ja) | 2016-10-28 | 2018-05-03 | 株式会社東京精密 | ワーク分割装置及びワーク分割方法 |
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DE102019216640A1 (de) | 2020-04-30 |
CN111128839B (zh) | 2025-01-07 |
CN111128839A (zh) | 2020-05-08 |
TW202017024A (zh) | 2020-05-01 |
DE102019216640B4 (de) | 2023-01-26 |
TWI807123B (zh) | 2023-07-01 |
JP2020072138A (ja) | 2020-05-07 |
US20200135532A1 (en) | 2020-04-30 |
KR20200049513A (ko) | 2020-05-08 |
KR102707126B1 (ko) | 2024-09-13 |
US11018044B2 (en) | 2021-05-25 |
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