JP7164403B2 - WORK HOLDING FRAME AND PLATING APPARATUS USING THE SAME - Google Patents

Description

TECHNICAL FIELD The invention pertaining to the present application relates to a work holding frame for holding a rectangular plate-like work for performing electroplating on the rectangular plate-like work, and a plating apparatus using the same.

2. Description of the Related Art Conventionally, electroplating is performed using a batch-type or continuous-type plating apparatus when plating the surface of a work used for manufacturing electronic components or the like. In general, a rectangular plate-shaped workpiece to be plated is immersed in a plating solution stored in a plating bath while the upper end portion of the workpiece is held by a holding jig, and the holding jig is moved along a conveying track. Thus, electroplating is continuously performed on the surface of the workpiece to be plated.

As a configuration for holding a rectangular plate-shaped work, for example, Patent Document 1 discloses a rectangular work-holding frame arranged along the outer shape of the rectangular plate-shaped work. The workpiece holding frame comprises a pair of support bars that form one pair of opposing sides, hold the rectangular plate-shaped work and supply power to the rectangular plate-shaped work, and a pair of support bars perpendicular to the support bars. A pair of side bars arranged to form the other pair of opposing sides and holding the pair of support bars in parallel. The side bar is provided on each support bar and extends toward the opposite side of the surface to be plated of the rectangular plate-shaped workpiece, and is provided between the respective raised portions, and the side bar is provided on the rectangular plate-shaped workpiece. and a connecting portion spaced apart from the surface to be plated. A plurality of work holding frames holding rectangular plate-shaped works are attached to the transport rails and transported in the plating solution of a plating bath having an anode surface spaced apart from the surface to be plated of the rectangular plate-shaped work. Thus, each rectangular plate-like work is electroplated.

According to Patent Literature 1, the above-described workpiece holding frame can suppress the formation of a locally thick plating layer and uniformly electroplate the entire surface of the workpiece. That is, the side bar is not positioned on the side of the rectangular plate-shaped work, but is positioned opposite to the surface to be plated, and there is a certain gap between the surface to be plated and the connecting portion of the side bar. and located. If the sidebars are located on the sides of the rectangular plate-shaped works, the presence of the sidebars makes it impossible to arrange the adjacent rectangular plate-shaped works with a narrower interval. As a result, when the electroplating process is performed, the electric current concentrates at the peripheral end portion of the rectangular plate-like work near another adjacent rectangular plate-like work, and the plated layer is locally formed thick. On the other hand, in the work holding frame disclosed in Patent Document 1, since the side bars are positioned facing the plating target surface of the rectangular plate-shaped work, the adjacent rectangular plate-shaped works are arranged with a narrow interval. It is possible. As a result, when electroplating is performed, the current is not concentrated on the peripheral edge of the rectangular plate-like work, and a plating layer having a uniform thickness is formed over the entire surface of the rectangular plate-like work to be plated. be able to.

JP 2015-63717 A

However, when the electroplating process is performed, a plating layer is formed not only on the surface to be plated of the rectangular plate-like work but also on the side bars that constitute the work holding frame, which is disadvantageous in that it is wasteful.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a workpiece holding frame capable of preventing the formation of a plating layer on the side bar, and a plating apparatus using the same.

A workpiece holding frame according to the present invention is a rectangular workpiece holding frame for holding a rectangular plate-shaped workpiece to be immersed in a plating solution stored in a plating bath, and an upper support that constitutes a pair of opposing sides. A bar, a lower support bar, and a pair of side bars constituting another set of opposite sides are provided. A first upper gripping member capable of supplying power to the rectangular workpiece is provided, the lower support bar is provided with a lower gripping member that detachably holds the lower side of the rectangular plate-shaped workpiece, and the pair of side bars are: It is arranged inside the left side and the right side of the rectangular plate-shaped work held by the first upper gripping member with a gap from the plating target surface of the rectangular plate-shaped work, and is electrically insulated. It is characterized by having sex.

In the work holding frame according to the present invention, it is preferable that the side bar is arranged at a position that satisfies the following formula (1).
X≧Y×2.5 (1)
however,
X: Distance between the side bar and the surface to be plated of the rectangular plate-shaped work Y: Width of the side bar in front when the surface to be plated of the rectangular plate-shaped work is the front

In the work holding frame according to the present invention, the upper support bar has upper extensions at both ends that can extend on extension lines of the upper support bars, and each of the upper extensions includes the rectangular plate A second upper gripping member is provided for detachably holding the end of the upper side of the shaped work, and the lower support bar has lower extensions at both ends which can be extended on the extension line of the lower support bar. , by extending each said upper extension and extending each said lower extension, the spacing between each second upper gripping member is widened and the spacing between each said side bar is widened, and each said side bar is longitudinally stretchable such that stretching of each such side bar increases the spacing between said upper and lower support bars.

Moreover, in the work holding frame according to the present invention, it is preferable that the second upper gripping member is incapable of supplying power to the rectangular plate-shaped work.

Then, the plating apparatus according to the present invention transports the plurality of rectangular plate-shaped works held in the above-described work holding frame while immersing them in the plating solution stored in the plating tank, thereby forming the plurality of rectangular plate-shaped works. The electroplating process is characterized in that the work is continuously electroplated.

In the work holding frame according to the present invention, since the pair of side bars are made of an electrically insulating material, it is possible to prevent the formation of a plating layer on the side bars. Further, according to the work holding frame of the present invention, the plurality of rectangular plate-like works held by the work holding frame can be continuously electroplated.

1 is a front view of a work holding frame according to an embodiment of the present invention; FIG. FIG. 2 is a side view of the work holding frame shown in FIG. 1; FIG. 2 is a diagram showing a state in which the workpiece holding frame shown in FIG. 1 is extended; 2 is a schematic configuration diagram of a plating apparatus to which the work holding frame shown in FIG. 1 is applied; FIG.

Preferred embodiments of a "work holding frame" and a "plating apparatus" using the same according to the present invention will be described below with reference to the drawings.

<Embodiment of work holding frame according to the present invention>
First, a work holding frame as an embodiment to which the present invention is applied will be described with reference to FIGS. 1 to 3. FIG. Note that FIG. 1 shows a front view of the workpiece holding frame when the surface to be plated of the rectangular plate-shaped workpiece to be held is taken as the front.

The workpiece holding frame 1 of the present embodiment shown in FIG. 1 has rectangular plate-like workpieces W to be immersed in a plating solution stored in a plating tank 52 (see FIG. 4), which will be described later, so as to be arranged along the vertical direction. It is a rectangular frame for hanging and holding. In this embodiment, the rectangular plate-shaped workpiece W is, for example, a rectangular printed circuit board with a thickness of 0.1 mm. The plating target surface WS of the rectangular plate-like work W is a surface facing an anode surface 53a (see FIG. 4), which is described later and is arranged along the inner wall of the plating bath 52 in the longitudinal direction. Therefore, when the pair of anode surfaces 53a are arranged to face each other across the rectangular plate-shaped work W immersed in the plating solution, both surfaces of the rectangular plate-shaped work W are the surfaces WS to be plated.

As shown in FIG. 1, the work holding frame 1 includes an upper support bar 11 and a lower support bar 21 forming a pair of opposing sides, and a pair of side bars 31 forming another pair of opposing sides. , 41 and has a rectangular shape. The configuration of each bar 11, 21, 31, 41 will be described in order below.

The upper support bar 11 is a stainless steel rectangular plate disposed along the upper side W1 of the rectangular plate-like workpiece W. As shown in FIG. The upper support bar 11 is provided with four first upper gripping members 12 capable of detachably holding the upper side W1 of the rectangular plate-shaped work W and supplying power to the rectangular plate-shaped work W. As shown in FIG. In this embodiment, a clamp can be used as the first upper gripping member 12 . Also, the number of first upper gripping members 12 is arbitrary. A power cable 13 having the other end connected to the upper support bar 11 is connected to the first upper gripping member 22 . An arm 55, which will be described later, is attached to the upper support bar 11 for hanging from the transport rail 54 (see FIG. 4). Electric power is supplied to the rectangular plate-like work W through a later-described power-supplied portion 56 provided on the arm 55, the upper support bar 11, the power cable 13, and the first upper gripping member 12 (see FIG. 4).

Further, the upper support bar 11 has upper extending portions 11a, 11a that can be extended on extension lines of the upper support bar 11 at both ends. In this embodiment, as shown in FIG. 3, the upper extending portion 11a extends on the extension line of the upper support bar 11 by sliding in the left-right direction, but the configuration is arbitrary. Moreover, the extension length of the upper extension portion 11a can be arbitrarily changed, and can be fixed by a screw member or the like. Although the upper support bar 11 may be able to expand and contract at the portion where the first upper gripping member 12 is provided, the power supply from the first upper gripping member 12 may become unstable. Therefore, as in the present embodiment, the upper support bar 11 can be expanded and contracted by extending the upper extending portions 11a, 11a from both ends where the first upper gripping member 12 is not provided. Therefore, power supply from the first upper gripping member 12 can be stably performed, which is more preferable.

Each upper extending portion 11a is provided with a second upper gripping member 14 for detachably holding the end portion of the upper side W1 of the rectangular plate-like workpiece W. As shown in FIG. In this embodiment, the second upper gripping member 14 can be the same clamp as the first upper gripping member. When the upper extending portions 11a, 11a are extended, the second upper gripping members 14, 14 interlock with each other, so that the distance between the left and right second upper gripping members 15, 15 widens as shown in FIG.

The second upper gripping member 14 may be capable of supplying power to the rectangular plate-shaped work W, but is more preferably incapable of supplying power. This is because, when electric power is supplied by the second upper gripping member 14 when electroplating is performed, the current concentrates at the end of the upper side W1 of the rectangular plate-shaped work W held by the second upper gripping member 14, This is because problems such as the plated layer becoming thicker than other portions and burning may occur. Therefore, if power is not supplied by the second upper gripping member 14, such a problem can be prevented from occurring.

In addition, side bars 31 and 41 are attached to the inner side of the second upper gripping member 14 on the surface opposite to the surface on which the second upper gripping member 14 of each upper extending portion 11 is provided. A first connecting member 15 is provided.

The lower support bar 21 is a rectangular plate made of stainless steel arranged along the lower side W2 of the rectangular plate-like workpiece W. As shown in FIG. The lower support bar 21 is provided with four lower gripping members 22 that detachably hold the lower side W2 of the rectangular plate-shaped work W. As shown in FIG. The number of lower gripping members 22 is arbitrary. In this embodiment, each lower gripping member 22 cannot supply power to the rectangular plate-shaped workpiece W, but it may be capable of supplying power.

Further, the lower support bar 21 has lower extending portions 21a, 21a that can extend on extension lines of the lower support bar 21 at both ends thereof, as shown in FIG. In this embodiment, the lower extending portion 21a can extend on the extension line of the lower support bar 21 by sliding in the left-right direction, but the configuration is arbitrary. Further, the extension length of the lower extension portion 21a can be arbitrarily changed, and can be fixed by a screw member or the like.

A second connecting member 23 for attaching the side bars 31 and 41 is provided at the end of each lower extending portion 21 a opposite to the lower gripping member 22 .

Next, the configuration of the sidebars 31 and 41 will be described. The right side bar 31 is arranged along the right side W3 of the rectangular plate-shaped work W, and the left side bar 41 is arranged along the left side W4 of the rectangular plate-shaped work W. As shown in FIG. Since both the right side bar 31 and the left side bar 41 have the same configuration, the configuration of the right side bar 31 will be described, and the description of the configuration of the left side bar 41 will be omitted.

The side bar 31 includes a ratchet member 32 and a shaft-like member 33 connected to the ratchet member 32 . The ratchet member 32 is made of an electrically insulating resin material, and the shaft-like member 33 is a metal member whose surface is coated with an electrically insulating resin material. The electrically insulating resin material is, for example, Teflon (registered trademark). With such a configuration, the side bar 31 has electrical insulation.

The ratchet member 32 is inserted through an insertion member 34 provided on the first connecting member 33 . The insertion member 34 is provided with a clip 35 having a pawl portion 35 a that can be engaged with the ratchet teeth of the ratchet member 32 . The ratchet member 32 is fixed when the pawl portion 35a is engaged with the ratchet teeth, and is vertically slidable when the engagement is released.

The shaft-shaped member 33 has an upper end connected to the ratchet member 32 , a lower end bent at a substantially right angle, and a distal end connected to the second connecting member 23 . A support leg portion 36 extending substantially along an extension line of the shaft-like member 33 is attached to the second connecting member 23 .

Since each of the side bars 31 and 41 has such a configuration, when the rectangular plate-like work W is held by the work holding frame 1, the side bars 31 and 41 are shaped like a rectangular plate as shown in FIG. It is positioned with a gap from the plating target surface WS of the work W.

Here, it is more preferable that the side bars 31 and 41 are arranged at positions satisfying the following formula (1).
X≧Y×2.5 (1)
However, X is the separation distance between the side bars 31 and 41 and the plating target surface WS of the rectangular plate-shaped work W, and Y is the side bar 31 when the plating target surface WS of the rectangular plate-shaped work W is the front. , 41 in front. For example, if the cross-sectional shape of the side bars 31, 41 is rectangular, Y is the front width of the side bars 31, 41, and if the cross-sectional shape of the side bars 31, 41 is circular, It is the diameter of the side bars 31,41.

When the side bars 31 and 41 are arranged at positions satisfying the above formula (1), the electric current is applied to the regions of the plating target surface WS which are shaded by the side bars 31 and 41 during the electroplating process. can definitely flow. Therefore, it is possible to form a plating layer having a more uniform film thickness over the entire plating target surface WS of the rectangular plate-like workpiece W. On the other hand, when the side bars 31 and 41 are arranged at positions that do not satisfy the above formula (1), the current does not sufficiently flow through the regions of the plating target surface WS which are shaded by the side bars 31 and 41. This is not preferable because the film thickness of the plating layer may become thin in this region.

Next, the attachment of the rectangular plate-like work W to the work holding frame 1 will be described. First, the lengths of the bars 11, 21, 31, 41 of the workpiece holding frame 1 are adjusted according to the dimensions of the rectangular plate-like workpiece W. As shown in FIG. The upper extending portions 11a of the upper support bar 11 are slid in the lateral direction, and the lower extending portions 21a of the lower support bar 21 are slid in the lateral direction in accordance with the lateral dimension of the rectangular plate-like workpiece W. At this time, the left and right second upper gripping members 14, 14 hold the ends of the upper side W1 of the rectangular plate-shaped work W, that is, the corners, so that the left and right second upper gripping members 14, 14 hold the corners. Adjust spacing. At this time, the distance between the right side bar 31 and the left side bar 41 can be widened as shown in FIG. .

In addition, the ratchet members 32 of the side bars 31 and 41 are vertically slid in accordance with the vertical dimension of the rectangular plate-shaped work W. As shown in FIG. As a result, as shown in FIG. You can widen the gap.

Next, a rectangular plate-like work W is attached to the work holding frame 1 . The first upper gripping member 12 holds the upper side W1 of the rectangular plate-shaped work W, and the second upper holding member 14 holds the end (corner) of the upper side W1 of the rectangular plate-shaped work W. As shown in FIG. In addition, the lower side W2 of the rectangular plate-like work W is held by the lower gripping member 22 . At this time, since the lengths of the bars 11, 21, 31, and 41 are adjusted in accordance with the dimensions of the rectangular plate-shaped work W, the rectangular plate-shaped work W can be moved while a predetermined tension is applied to the rectangular plate-shaped work W. W can be held. When the rectangular plate-like work W is attached to the work holding frame 1, the side bars 31 and 41 are arranged inwardly of the right side W3 and the left side W4 of the rectangular plate-like work W as shown in FIGS. As shown in FIG. 2, it is positioned at a predetermined distance from the plating target surface WS of the rectangular plate-shaped work W. As shown in FIG.

Here, each side bar 31, 41 is electrically insulating. Therefore, when power is supplied to the rectangular plate-shaped work W through the power-supplied portion 56 provided on the arm 55, the upper support bar 11, the power cable 13, and the first upper gripping member 12, each side bar 31, 41 is not powered. Therefore, it is possible to prevent the plating layers from being formed on the side bars 31 and 41 when performing the electroplating process, thereby preventing waste.

Further, since the side bars 31 and 41 are located inside the right side W3 and the left side W3 of the rectangular plate-shaped work W, the right side W3 and the left side W4 of the rectangular plate-shaped work W are outside the side bars 31 and 41. protrude in the direction of Therefore, as will be described later, when electroplating is performed while the rectangular plate-shaped work W is held by the work holding frame 1 and transported by the transport rails 54, the adjacent rectangular plate-shaped works W are arranged close to each other. It is possible to As a result, the current is prevented from concentrating on the peripheral end portion of the rectangular plate-shaped work W near another adjacent rectangular plate-shaped work W, and the current is uniformly distributed over the entire plating target surface WS of the rectangular plate-shaped work W. A thick plating layer can be formed.

In the work holding frame 1 of this embodiment, the length of each bar 11, 21, 31, 41 can be adjusted according to the dimensions of the rectangular plate-like work W as described above. Therefore, the workpiece holding frame 1 of this embodiment can hold rectangular plate-shaped workpieces W of various sizes. On the other hand, in the conventional work holding frame disclosed in Patent Document 1, the lengths of the pair of support bars and the pair of side bars cannot be adjusted. In this case, since it is necessary to prepare work holding frames each having a size corresponding to the size of the rectangular plate-like work, there is a problem that the production cost increases. However, as described above, the workpiece holding frame 1 of the present embodiment can hold rectangular plate-shaped workpieces W of various sizes, so that an increase in production cost can be suppressed.

The configuration for adjusting the lengths of the upper support bar 11, the lower support bar 21, and the side bars 31 and 41 is not limited to the one described above.

Further, the workpiece holding frame 1 of the present embodiment holds the edge (corner) of the upper end W1 of the rectangular plate-shaped workpiece W by the second upper gripping member 14 . Therefore, even when the thickness of the rectangular plate-shaped work W is thin, the rectangular plate-shaped work W is vibrated or deformed due to the influence of the jet flow of the plating solution or the like while the work holding frame 1 is conveyed in the plating tank 52 . can be suppressed. On the other hand, when the corners of the upper end W1 of the rectangular plate-shaped work W are not held by the second upper gripping member 14, while the work holding frame 1 is conveyed in the plating bath 52, the rectangular plate-shaped work W is transported. vibrates or deforms, the adhesion of the plating layer may deteriorate, or a plating layer having a uniform thickness may not be formed. Therefore, it is more preferable to hold the end (corner) of the upper end W1 of the rectangular plate-shaped workpiece W by the second upper gripping member 14 .

Furthermore, in this embodiment, the second upper gripping member 14 cannot be powered. Since the end (corner) of the upper end W1 of the rectangular plate-shaped work W is not supplied with power, the current concentrates on the end, which may cause the plating layer to become thicker than other portions or cause burns. can be prevented.

<Plating equipment according to the present invention>
Next, a plating apparatus according to the present invention using the work holding frame 1 described above will be described with reference to FIG. Plating apparatus 51 in the present embodiment transports a plurality of rectangular plate-shaped works W held in work holding frame 1 while immersing them in a plating solution stored in plating tank 52, whereby a plurality of The rectangular plate-like works W, W are continuously electroplated.

A plating apparatus 51 as the present embodiment includes a plating tank 52 that stores a plating solution, a pair of anode electrodes 53, 53 that are immersed in the plating solution and constitute an anode surface 53a, and a rectangular plate-like electrode. A transport rail 54 is provided for holding a plurality of work holding frames 1 holding works W and for carrying and supplying power.

The plating tank 52 has an opening on the upper surface and is elongated along the direction in which the rectangular plate-like workpiece W is conveyed. A plating solution used for plating the rectangular plate-shaped work W is stored in the plating tank 52 . As the plating solution, a plating solution suitable for forming a desired plating layer on the plating target surface WS of the rectangular plate-shaped work W is appropriately selected and used.

The anode electrodes 53 , 53 are opposed to each other with a predetermined interval along the longitudinal direction of the plating bath 52 . The space between the anode electrodes 53, 53 serves as a work transfer path. Each anode electrode 53 is composed of a plate member made of an insoluble material such as stainless steel, platinum, or carbon. The insoluble material is not limited to this as long as it is commonly used as an insoluble electrode.

A transport rail 54 is arranged along the longitudinal direction of the plating tank 52 above the work transport path. The work holding frame 1 is detachably attached to the conveying rail 54 via an arm 55, and the work holding frame 1 held by the arm 55 is moved along the conveying direction. Further, a power supply rail (not shown) is attached to the transport rail 54 . A cathode (not shown) paired with the anode electrode 53 is electrically connected to the power supply rail. The arm 55 is provided with a power-supplied portion 56 that can come into contact with the power supply rail.

The configuration of the transport rails 54 for transporting the workpiece holding frame 1 in the plating tank 52 is not limited to this. That is, by moving the rectangular plate-shaped work W held by the work holding frame 1 in the plating bath 52 while being immersed in the plating solution of the plating bath 52, the surface of the rectangular plate-shaped work W to be plated is Any configuration can be adopted as long as it is a configuration that allows the WS to be plated continuously.

Furthermore, a substantially U-shaped guide groove 57 extends in the longitudinal direction at the bottom of the plating tank 52 . The support legs 36 provided on the side bars 31 and 41 of the work holding frame 1 are loosely fitted in the guide grooves 57, so that the work holding frame 1 maintains a substantially vertical upright posture during transportation. be able to.

Next, the operation of the plating processing apparatus 51 of this embodiment will be described. First, the rectangular plate-shaped work W is held by the work holding frame 1 described above, and the work holding frame 1 is attached to the arm 55 of the transport rail 54 . By operating the transport rail 54 , the rectangular plate-shaped work W held by the work holding frame 1 is transported into the plating tank 52 . Here, a treatment tank for pre-treating the surface of the rectangular plate-like work W may be provided upstream of the plating tank 52 . As the pretreatment, the surface of the rectangular plate-like workpiece W can be degreased, washed with hot water, washed with water, washed with acid, or the like.

The rectangular plate-like work W transported into the plating bath 52 by the transport rails 54 is immersed in the plating solution stored in the plating bath 52 . At this time, the liquid surface of the plating solution is at substantially the same height as the upper side W1 of the rectangular plate-like workpiece W. As shown in FIG. Therefore, the upper support bar 11 exists at a position higher than the surface of the plating solution.

Then, the arm 55 of the work holding frame 1 holding the rectangular plate-shaped work W comes into contact with the power supply rail attached to the transport rail 54 . The cathode connected to the power supply rail supplies electricity to the rectangular plate-shaped work W via the power receiving portion 56 of the arm 55, the upper support bar 11 of the work holding frame 1, and the first gripping member 21. connected As a result, electricity is supplied between the opposing anode surfaces 53a, 53a and the rectangular plate-like workpiece W acting as a cathode.

As a result, the plating solution in the plating tank 52 is electrolyzed, and a plating layer is formed on the plating target surface WS of the rectangular plate-shaped work W. As shown in FIG. Furthermore, the operation of the transport rail 54 causes the plurality of rectangular plate-shaped works W to move within the work transport path between the anode surfaces 53a, 53a, thereby continuously performing the electroplating process.

At this time, since the plating apparatus 51 of the present embodiment employs the work holding frame 1 described above as a jig for holding the rectangular plate-like work W, the side bars 31 and 41 of the work holding frame 1 It is possible to narrow the interval between the rectangular plate-shaped works W held by the work holding frame 1 and arrange the adjacent work holding frames 1 without the . As a result, the concentration of the electric current to the peripheral end portion of the rectangular plate-shaped work W near another adjacent rectangular plate-shaped work W is suppressed, and the current is uniformly distributed over the entire plating target surface WS of each rectangular plate-shaped work W. It is possible to form a plated layer with a sufficient film thickness. Therefore, in the plating apparatus 51 of the present embodiment employing the work holding frame 1 of the present invention, it is possible to plate the entire plating target surfaces WS of the plurality of rectangular plate-shaped works W with a uniform film thickness. , it is possible to form a uniform and high-quality plating film.

Further, as described above, since the side bars 31 and 41 are electrically insulating, the side bars 31 and 41 are not energized when the rectangular plate-like work W is energized through the upper support bar 11 and the like. . Therefore, formation of a plated layer on the side bars 31 and 41 can be prevented. Furthermore, since the lower support bars 21 connected to the side bars 31 and 41 are not energized, the formation of a plating layer on the lower support bars 21 can be prevented. Therefore, in the plating processing apparatus 51 of the present embodiment that employs the work holding frame 1 of the present invention, it is possible to prevent the plating layer from being wastefully formed.

The workpiece holding frame according to the present invention can be used for electroplating rectangular plate-shaped workpieces such as electronic components used for various purposes.

1 work holding frame 11 upper support bar 11a upper extension 12 first upper gripping member 14 second upper gripping member 21 lower support bar 21a lower extension 22 lower gripping member 31 right side bar 41 left side bar 51 Plating apparatus 52 Plating tank 53 Anode electrode 53a Anode surface 54 Conveying rail 55 Work conveying path 55 Arm 56 Powered part W Rectangular plate-like work W1 Upper side of rectangular plate-like work W2 Lower side of rectangular plate-like work W3 Rectangular plate-like work Right side W4 Left side of rectangular plate work WS Plating target surface

Claims (4)

A rectangular workpiece holding frame for holding a rectangular plate-shaped workpiece immersed in a plating solution stored in a plating bath,
An upper support bar and a lower support bar that form a pair of opposing sides, and a pair of side bars that form another pair of opposing sides,
The upper support bar is provided with a first upper gripping member capable of detachably holding the upper side of the rectangular plate-shaped work and supplying power to the rectangular plate-shaped work,
The lower support bar is provided with a lower gripping member that detachably holds the lower side of the rectangular plate-shaped work,
The pair of side bars are arranged inside the left side and the right side of the rectangular plate-shaped work held by the first upper gripping member and spaced apart from the surface of the rectangular plate-shaped work to be plated. and has electrical insulation ,
A workpiece holding frame, wherein the side bar is arranged at a position that satisfies the following formula (1) .
X≧Y×2.5 (1)
however,
X: Distance between the side bar and the plating target surface of the rectangular plate-shaped work
Y: Width at the front of the side bar when the surface to be plated of the rectangular plate work is the front Both ends of the upper support bar are provided with upper extensions that can extend on extension lines of the upper support bar,
Each upper extending portion is provided with a second upper gripping member that detachably holds the edge of the upper side of the rectangular plate-shaped work,
Both ends of the lower support bar are provided with lower extensions that can extend on extension lines of the lower support bar,
extending each said upper extension and extending each said lower extension to increase the spacing between each second upper gripping member and increase the spacing between each said side bar;
each said side bar is longitudinally stretchable,
2. The workpiece holding frame according to claim 1 , wherein the distance between said upper support bar and said lower support bar is widened by extending each said side bar. 3. The workpiece holding frame according to claim 2 , wherein said second upper gripping member cannot supply power to said rectangular plate-shaped workpiece. By conveying a plurality of rectangular plate-shaped works held in the work holding frame according to any one of claims 1 to 3 while being immersed in a plating solution stored in a plating tank, a plurality of the rectangular A plating apparatus for continuously electroplating a plate-like work.

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