JP7087254B2 - 電子機器 - Google Patents
電子機器 Download PDFInfo
- Publication number
- JP7087254B2 JP7087254B2 JP2016207762A JP2016207762A JP7087254B2 JP 7087254 B2 JP7087254 B2 JP 7087254B2 JP 2016207762 A JP2016207762 A JP 2016207762A JP 2016207762 A JP2016207762 A JP 2016207762A JP 7087254 B2 JP7087254 B2 JP 7087254B2
- Authority
- JP
- Japan
- Prior art keywords
- water
- cooled
- pipe
- coupler
- pipe portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000002184 metal Substances 0.000 claims description 22
- 238000003780 insertion Methods 0.000 claims description 16
- 230000037431 insertion Effects 0.000 claims description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- 238000000605 extraction Methods 0.000 claims description 3
- 239000003507 refrigerant Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 22
- 239000000758 substrate Substances 0.000 description 13
- 238000012986 modification Methods 0.000 description 10
- 230000004048 modification Effects 0.000 description 10
- 238000001816 cooling Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 5
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000012795 verification Methods 0.000 description 3
- 239000000498 cooling water Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
- H05K7/1487—Blade assemblies, e.g. blade cases or inner arrangements within a blade
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
る。
14K4は、直管部14K4の長手方向に対して直交する方向に延在する直管部14K5を通じてコールドプレート13に接続されている。
には電気コネクタ112が固定されている。また、基板111にはコールドプレート113が設けられている。コールドプレート113には、水冷配管114H,114K,114Nが接続されており、水冷配管114H,114K,114Nを流れる冷却水がコールドプレート113内を通過するようになっている。水冷配管114H,114Kは、水冷カプラ105に連結される水冷カプラ115に一端が接続され、コールドプレート113に他端が固定される。水冷配管114H,114KにはU字状の部分は無く、直管またはほぼ直管である。
宜決定される。図10の符号A~Dに示される各部の寸法が適宜決定されることにより、水冷配管14H,14Kに支持される水冷カプラ15が適当な強度と柔軟性を有することになる。
Claims (5)
- 接続口を有するスロットに挿抜される電子機器であって、
前記接続口に連結可能な被連結部と、
一端が前記被連結部を支持し、他端が前記電子機器の本体に固定される波状の金属製の配管と、を備え、
前記配管は、前記挿抜の方向沿いに延在する第1直線部と、前記第1直線部の長手方向に対して直交する方向沿いに延在する第2直線部と、を有することで、前記電子機器の本体に固定されることなく前記配管のみに支持される前記被連結部による、前記接続口と前記被連結部との間における位置ずれを吸収可能にする、
電子機器。 - 前記接続口は、冷媒の給排水口であり、
前記被連結部は、前記給排水口に連結可能なカプラを有するカプラヘッダであり、
前記配管は、一端が前記カプラヘッダに接続され、他端が前記本体の発熱部品に固定される水冷配管である、
請求項1に記載の電子機器。 - 前記接続口は、電気コネクタであり、
前記被連結部は、前記電気コネクタに連結可能な端子であり、
前記配管は、一端が前記端子を支持し、他端が前記本体の基板に固定されるケーブル内蔵用配管であり、前記端子に繋がるケーブルが内蔵されている、
請求項1に記載の電子機器。 - 前記配管は、前記第1直線部と前記第2直線部が形成するL字状の部位を有する、
請求項1から3の何れか一項に記載の電子機器。 - 前記配管は、前記第2直線部と他の直線部および曲線部とが形成するU字状の部位を有する、
請求項1から4の何れか一項に記載の電子機器。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016207762A JP7087254B2 (ja) | 2016-10-24 | 2016-10-24 | 電子機器 |
US15/724,295 US11129304B2 (en) | 2016-10-24 | 2017-10-04 | Electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016207762A JP7087254B2 (ja) | 2016-10-24 | 2016-10-24 | 電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018073861A JP2018073861A (ja) | 2018-05-10 |
JP7087254B2 true JP7087254B2 (ja) | 2022-06-21 |
Family
ID=61970232
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016207762A Active JP7087254B2 (ja) | 2016-10-24 | 2016-10-24 | 電子機器 |
Country Status (2)
Country | Link |
---|---|
US (1) | US11129304B2 (ja) |
JP (1) | JP7087254B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10952354B1 (en) * | 2019-09-20 | 2021-03-16 | Quanta Computer Inc. | Cold plate with metal tube connection and flexible metal tube |
CN113412032B (zh) * | 2021-06-22 | 2023-03-28 | 中国电子科技集团公司第九研究所 | 新型水冷式差相移式隔离器 |
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Patent Citations (5)
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JP2004246649A (ja) | 2003-02-14 | 2004-09-02 | Hitachi Ltd | ラックマウントサーバシステム、ラックキャビネット、サーバモジュール、ならびにラックマウントサーバシステムの冷却方法 |
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JP2006125718A (ja) | 2004-10-28 | 2006-05-18 | Sony Corp | 熱輸送装置及び電子機器 |
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US20160066480A1 (en) | 2014-08-29 | 2016-03-03 | International Business Machines Corporation | Blind docking apparatus to enable liquid cooling in compute nodes |
Also Published As
Publication number | Publication date |
---|---|
US20180116075A1 (en) | 2018-04-26 |
JP2018073861A (ja) | 2018-05-10 |
US11129304B2 (en) | 2021-09-21 |
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