JP6964003B2 - 電極用保護層 - Google Patents
電極用保護層 Download PDFInfo
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- JP6964003B2 JP6964003B2 JP2017560242A JP2017560242A JP6964003B2 JP 6964003 B2 JP6964003 B2 JP 6964003B2 JP 2017560242 A JP2017560242 A JP 2017560242A JP 2017560242 A JP2017560242 A JP 2017560242A JP 6964003 B2 JP6964003 B2 JP 6964003B2
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Images
Classifications
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- H01M10/4235—Safety or regulating additives or arrangements in electrodes, separators or electrolyte
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- B32B5/16—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer formed of particles, e.g. chips, powder or granules
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- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
- B05D1/12—Applying particulate materials
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- B32B15/00—Layered products comprising a layer of metal
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- H01M10/05—Accumulators with non-aqueous electrolyte
- H01M10/052—Li-accumulators
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- H—ELECTRICITY
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Description
この実施例には、基材上にエアロゾル沈着法によって複数の粒子を付着させ、融着させることによるイオン伝導性層の形成を示した。
LiSiPSのアニオン伝導性固体粒子を、約10μmの平均を有する粒子分布を有するように作製した。Li2S、SiS2およびP2S5を混合し、約700℃に上記成分を加熱することによって、粒子を作製した。冷却後、所望の粒径分布を達成するために、上記材料を粉砕し、(例えば、乾燥アルカンなどのドライヘキサン/水を含まない非反応性有機溶媒中で)部分的に湿式粉砕した。いくつかの場合、上記分布からより大きな粒子(例えば、25μmよりも大きい直径を有する粒子)を除去するために、篩い分けも行った。上記粒子を、エアロゾル沈着法(ADM)粉末供給システムに充填し、90PSIのキャリアガス圧を用いて、低真空環境(0.5mTorr)で4μm厚のPET基材上に噴霧した。基材上に所望のセラミック被覆を得るために、運動制御システムによって、基材ホルダとエアゾールノズルの両方を移動させてもよい。最終コーティングのSEM画像を図3A〜図3Bに示す。上記画像から分かるように、得られたコーティングは、緻密であり、厚さが約27μm〜約34μmであった。上記コーティングの一部(図3Bにおける27μm以上の断面)を処理中に破断し、そのようなものとして、コーティングの測定部分の厚さは、図3Aに示されるものよりも小さい。
図3C〜図3DはPET基材上に付着したLiSiPS材料の上面図である。融着領域が、表面上の小さな粒子を含む図3Dの拡大図中で見ることができる。
この実施例には、基材上にエアロゾル沈着法によって複数の粒子を付着させ、融着させることによる他のイオン伝導性層の形成を示す。
エアロゾル沈着法によって4μm厚さのPET基材上に付着させたザクロ石粒子のSEM断面画像を図4A〜図4Bに示す。100PSIのキャリアガス圧力および1Torrの圧力を用いた以外は、実施例1と同様の付着方法に従った。図4Aには、約3.8μmの厚さを有する融着された結晶性部分210を示している。頂部220には、いくつかの融着粒子が含まれたが、この部分は、融着の少ない上記部分210であった。上記層の全体の厚さは4.9μmであった(図4B)。
この実施例には、複数の粒子の部分的な融着を有する、実施例2におけるイオン伝導性層の形成を示す。
実施例2に記載されるように、エアロゾル沈着法によって4μm厚さのPET基材上に付着させたザクロ石粒子のSEM断面画像を図4Cに示す。図4Cには、融着された結晶性部分250および部分的に融着した部分260を示す。80PSIのキャリアガス圧力および1Torrの圧力を用いた以外は、実施例1と同様の付着方法に従った。
この実施例には、基材上にエアロゾル沈着法によって複数の粒子を付着させ、融着させることによる更に別のイオン伝導性層の形成を示す。
銅箔上のリチウムの25μm厚さのコーティング上にエアロゾル沈着法によって付着させたオキシスルフィドセラミック粒子の上面図を図5A〜図5Cに示す。30PSIのキャリアガス圧力および1Torrの圧力を用いた以外は、実施例1と同様の付着方法に従った。上記セラミックコーティングは、元のリチウム表面と同様、またはそれより大きな表面粗さを採用しているように見えるが、コーティング自体は、上記層の厚さを横切って連続的である。
図5Dは、銅箔上にリチウムの25μm厚さのコーティング上にエアロゾル沈着法によって付着させた融着オキシスルフィドセラミック粒子を含むイオン伝導性層のSEM断面画像である。
この比較例では、複数の粒子の融着不良を有する、実施例3におけるイオン伝導性層の形成を示す。
オキシスルフィドセラミック粒子は、銅箔上にリチウムの25μm厚さのコーティング上にエアロゾル沈着法によって付着させた。15PSIのキャリアガス圧力および1Torrの圧力を用いた以外は、実施例1と同様の付着方法に従った。
しかしながら、上記粒子が融着しないように、または部分的に融着するように(融着不良)、オキシスルフィドセラミック粒子を付着させた。図6A〜図6Bは、未融着粒子310と部分的に融着したオキシスルフィドセラミック粒子領域320の少なくとも一部を含むイオン伝導性層のSEM断面画像である。
多くの要素または要素のリストの、1つより多いも含む少なくとも1つ、任意に、リストに挙げられていない更なる項目を含むと解釈されるべきである。明確に示されている項目のみ、例えば、「〜の内の1つのみ」または「〜の内の正確に1つ」、或いは特許請求の範囲において使用される場合の「〜から成る」は、多くの要素または要素のリストの内の正確に1つを含むことを意味する。一般的に、本明細書中で用いられる用語「または」は、「どちらか」、「〜の内の1つ」、「〜の内の1つのみ」または「〜の内の正確に1つ」などの排他性を有する用語が先行する場合、排他的選択肢(即ち、「一方、または両方でない他方」)を示すものとして解釈されるのみである。特許請求の範囲において使用される場合の「本質的に〜から成る」は、特許法の分野で使用されるようなその通常の意味を有する。
20、120 … 第1の層
30 … 第2の層
30’ … 第1の表面
40、140 … 複数の粒子
50 … 電解質層
Claims (34)
- 金属リチウムを含む第1の層;および
該第1の層上に配置した第2の層
を含み、
該第2の層が複数の粒子を含み、かつ実質的に非多孔性であり、
該複数の粒子がイオン伝導性材料を含み、
該複数の粒子の少なくとも一部が、少なくとも部分的に該第1の層内に埋め込まれており、
該複数の粒子の少なくとも一部が、互いと融着しており、
該互いと融着した複数の粒子の少なくともいくつかが、0.75μm以上の平均最大断面寸法を有し、
該第2の層が、10−6〜10−2[S/cm]のイオン伝導率を有し、
該第2の層が、0.5〜50μmの平均厚さを有する、電極用保護層を含む電極構造体。 - 前記複数の粒子が、0.75〜20μmの平均最大断面寸法を有する、請求項1に記載の電極構造体。
- 前記第2の層が、イオン伝導性材料および非イオン伝導性材料を含む、請求項1に記載の電極構造体。
- 前記イオン伝導性材料が無機材料を含む、請求項1に記載の電極構造体。
- 前記イオン伝導性材料がセラミックを含み、任意に該セラミックがザクロ石である、請求項1に記載の電極構造体。
- 前記イオン伝導性材料が、1〜99%結晶性である、請求項1に記載の電極構造体。
- 前記イオン伝導性材料が、少なくとも1GPaのヤング率を有する、請求項1に記載の電極構造体。
- 前記第2の層が、イオン伝導性材料および非イオン伝導性材料を含み、該非イオン伝導性材料が、イオン伝導性材料のヤング率の少なくとも2倍小さいヤング率を有する、請求項1に記載の電極構造体。
- 前記非イオン伝導性材料がポリマーを含む、請求項3に記載の電極構造体。
- 前記第2の層が、1.5〜6g/cm3の密度を有する、請求項1に記載の電極構造体。
- 前記第2の層が、5%未満の気孔率を有する、請求項1に記載の電極構造体。
- 前記第1の層がポリマーを含む、請求項1に記載の電極構造体。
- 前記第1の層がポリマーを含み、該ポリマーがポリマーゲルであるか、または液体電解質に暴露するとポリマーゲルを形成する、請求項1に記載の電極構造体。
- 液体電解質を含み、前記第2の層が液体電解質に対して不透過性である、請求項1に記載の電極構造体。
- 液体電解質を含む、請求項1に記載の電極構造体を含む電気化学電池。
- 金属リチウムを含む第1の層を、少なくともいくつかの粒子を融着させるのに十分な速度を有する複数の粒子に暴露する工程;
該粒子の少なくとも一部を該第1の層内に埋め込む工程;および
第2材料を含む第2の層を形成する工程
を含み、
該粒子が第2材料を含み、
該第2の層が10−6〜10−2[S/cm]のイオン伝導率を有する、
電極用保護層を含む電極構造体を形成する方法。 - 前記複数の粒子からイオン伝導性連続経路を形成する工程を含む、請求項16に記載の方法。
- 前記第1の層を前記複数の粒子に暴露する工程が、エアロゾル沈着法を用いて前記複数の粒子を前記第1の層上に噴霧する工程を含む、請求項16に記載の方法。
- 前記暴露する工程が、500℃未満の温度で行われる、請求項16に記載の方法。
- 前記第1の層を500〜2000m/秒の速度を有する前記複数の粒子に暴露する工程を含む、請求項16に記載の方法。
- 前記第2の層が、3〜25μmの平均厚さを有する、請求項16に記載の方法。
- 前記複数の粒子が、0.5〜20μmの平均最大断面寸法を有する、請求項16に記載の方法。
- 前記第2の層が、イオン伝導性材料および非イオン伝導性材料を含む、請求項16に記載の方法。
- 前記イオン伝導性材料が無機材料を含む、請求項23に記載の方法。
- 前記イオン伝導性材料がセラミックを含み、任意に該セラミックがザクロ石である、請求項23に記載の方法。
- 前記イオン伝導性材料が、1〜99%結晶性である、請求項23に記載の方法。
- 前記非イオン伝導性材料がポリマーを含む、請求項23に記載の方法。
- 前記第2の層が、5%未満の気孔率を有する、請求項16に記載の方法。
- 前記第1の層が電気活性材料を含む、請求項16に記載の方法。
- 前記暴露する工程が、0.5〜100mTorrの圧力で行われる、請求項16に記載の方法。
- 前記複数の粒子の少なくとも一部が、前記暴露する工程中に、互いと融着している、請求項16に記載の方法。
- 前記第2の層を液体電解質に暴露する工程を含む、請求項16に記載の方法。
- 粒子の元の表面が、互いと融着した前記複数の粒子中で識別することができない、請求項1に記載の電極構造体。
- 粒子の元の表面が、互いと融着した前記複数の粒子中で識別することができない、請求項31に記載の方法。
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US20170018815A1 (en) | 2017-01-19 |
US11239504B2 (en) | 2022-02-01 |
KR102585447B1 (ko) | 2023-10-06 |
JP2018518803A (ja) | 2018-07-12 |
CN107848247B (zh) | 2021-06-01 |
US10535902B2 (en) | 2020-01-14 |
US20160344067A1 (en) | 2016-11-24 |
US20200099108A1 (en) | 2020-03-26 |
US10461372B2 (en) | 2019-10-29 |
WO2016187510A1 (en) | 2016-11-24 |
CN107848247A (zh) | 2018-03-27 |
KR20180000726A (ko) | 2018-01-03 |
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