JP6952052B2 - 統合パッケージング技術に基づいたカメラモジュールおよびアレイカメラモジュール - Google Patents
統合パッケージング技術に基づいたカメラモジュールおよびアレイカメラモジュール Download PDFInfo
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- 238000012536 packaging technology Methods 0.000 title description 13
- 230000003287 optical effect Effects 0.000 claims description 850
- 230000002093 peripheral effect Effects 0.000 claims description 41
- 230000004907 flux Effects 0.000 claims description 12
- 230000000712 assembly Effects 0.000 claims description 4
- 238000000429 assembly Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 description 119
- 238000000034 method Methods 0.000 description 51
- 230000008569 process Effects 0.000 description 37
- 238000004806 packaging method and process Methods 0.000 description 35
- 238000012858 packaging process Methods 0.000 description 32
- 230000008901 benefit Effects 0.000 description 23
- 239000000853 adhesive Substances 0.000 description 20
- 230000001070 adhesive effect Effects 0.000 description 20
- 238000000465 moulding Methods 0.000 description 16
- 238000010586 diagram Methods 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 12
- 230000015572 biosynthetic process Effects 0.000 description 11
- 239000000428 dust Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 7
- 238000001746 injection moulding Methods 0.000 description 6
- 230000002411 adverse Effects 0.000 description 5
- 230000009977 dual effect Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000001914 filtration Methods 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 230000014759 maintenance of location Effects 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 241001148659 Panicum dichotomiflorum Species 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 241000473391 Archosargus rhomboidalis Species 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000037237 body shape Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000004043 dyeing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/201—Filters in the form of arrays
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/006—Filter holders
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/022—Mountings, adjusting means, or light-tight connections, for optical elements for lenses lens and mount having complementary engagement means, e.g. screw/thread
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B13/00—Viewfinders; Focusing aids for cameras; Means for focusing for cameras; Autofocus systems for cameras
- G03B13/32—Means for focusing
- G03B13/34—Power focusing
- G03B13/36—Autofocus systems
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K41/00—Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
- H02K41/02—Linear motors; Sectional motors
- H02K41/035—DC motors; Unipolar motors
- H02K41/0352—Unipolar motors
- H02K41/0354—Lorentz force motors, e.g. voice coil motors
- H02K41/0356—Lorentz force motors, e.g. voice coil motors moving along a straight path
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/45—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/90—Arrangement of cameras or camera modules, e.g. multiple cameras in TV studios or sports stadiums
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
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- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
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- H10F39/80—Constructional details of image sensors
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- H10F39/80—Constructional details of image sensors
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- H10F39/80—Constructional details of image sensors
- H10F39/806—Optical elements or arrangements associated with the image sensors
- H10F39/8063—Microlenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/208—Filters for use with infrared or ultraviolet radiation, e.g. for separating visible light from infrared and/or ultraviolet radiation
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/021—Mountings, adjusting means, or light-tight connections, for optical elements for lenses for more than one lens
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
- G02B7/08—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted to co-operate with a remote control mechanism
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
- G02B7/09—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted for automatic focusing or varying magnification
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B2205/00—Adjustment of optical system relative to image or object surface other than for focusing
- G03B2205/0053—Driving means for the movement of one or more optical element
- G03B2205/0069—Driving means for the movement of one or more optical element using electromagnetic actuators, e.g. voice coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K41/00—Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
- H02K41/02—Linear motors; Sectional motors
- H02K41/035—DC motors; Unipolar motors
- H02K41/0352—Unipolar motors
- H02K41/0354—Lorentz force motors, e.g. voice coil motors
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- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
- H02N2/02—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing linear motion, e.g. actuators; Linear positioners ; Linear motors
- H02N2/026—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing linear motion, e.g. actuators; Linear positioners ; Linear motors by pressing one or more vibrators against the driven body
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K1/02—Details
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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- H05K2201/10151—Sensor
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
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- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
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- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
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- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/811—Interconnections
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Description
発明の分野
本発明は、カメラモジュールに関し、より詳細には、統合パッケージング技術に基づいてカメラモジュールおよびアレイカメラモジュールに関する。
関連分野の説明
本発明は、統合パッケージングプロセスに基づいたカメラモジュールおよびアレイカメラモジュールを提供する点において有利である。カメラモジュールは、カメラモジュールの一体型ベースと協働する光フィルタホルダを含むため、多様なコンポーネントをサポートすることができる
光フィルタホルダ本体から回路基板へ延びる。
Claims (13)
- カメラモジュールであって、
少なくとも回路基板と、
前記回路基板へ動作可能に接続された少なくとも1つの感光要素と、
前記回路基板上に一体的にパッケージされる少なくとも1つの一体型ベースと、
前記一体型ベース内に規定された光窓を形成するように前記一体型ベースと共に取り付けられた少なくとも1つの光フィルタホルダであって、前記光フィルタホルダは光通路を前記感光要素へ提供する、光フィルタホルダと、
前記光フィルタホルダによって所定位置に支持および保持されかつ前記感光要素の感光経路内にアラインされる少なくとも1つの光フィルタと、
前記光フィルタよりも被写体側に配置されかつ前記感光要素の前記感光経路中にアラインされる、少なくとも1つのレンズと、
を含み、
前記一体型ベースは、前記回路基板上に一体的にパッケージされるように成型された一体型ベース本体を含み、前記一体型ベース本体は少なくとも1つの開口部を有し、前記光フィルタホルダは少なくとも1つの伸長脚部及び光フィルタホルダ本体を含み、前記少なくとも1つの伸長脚部は、前記光フィルタホルダ本体から下方かつ一体的に前記回路基板へ延びて、前記一体型ベースの前記開口部中へ密閉的に挿入されかつ前記一体型ベースの前記開口部を被覆して、前記一体型ベースおよび光フィルタホルダによって規定される前記光窓を密閉的に封入する、カメラモジュール。 - 前記光フィルタホルダ本体は、内部に規定された受容開口部と、前記光フィルタホルダ本体の前記受容開口部を包囲および規定する内側の少なくとも一部から横方向に延びて前記光フィルタの取付のための支持溝部を内部に形成する1つ以上の内方伸長アームとを有する、請求項1に記載のカメラモジュール。
- 前記光フィルタホルダ本体は、内部に規定された受容開口部、1つ以上の下方伸長アームおよび1つ以上の内方伸長アームを有し、前記下方伸長アームは、内側周囲の少なくとも一部から下方に延びかつ前記光フィルタホルダ本体の前記受容開口部を規定して、前記一体型ベースと係合する係合溝部を形成し、前記内方伸長アームは、前記下方伸長アームから横方向に延びて、前記光フィルタを支持する支持溝部を形成する、請求項1に記載のカメラモジュール。
- 前記光フィルタホルダ本体の前記内方伸長アームのうち2つの間に少なくとも角開口部が形成され、前記角開口部は、前記角開口部における光束を増加させるように前記光窓から外方に延びる、請求項3に記載のカメラモジュール。
- 前記カメラモジュールの前記一体型ベースは、前記光窓と連通する少なくとも1つの取付溝部および前記光窓を外部と連通させる少なくとも1つのノッチを有し、前記光フィルタホルダの前記光フィルタホルダ本体は、前記取付溝部と係合する少なくとも1つの係合縁と、前記ノッチ中に延びかつ前記ノッチへ密閉的に嵌められる少なくとも1つの伸長縁とを含む、請求項3に記載のカメラモジュール。
- 前記カメラモジュールの前記光フィルタホルダは、前記光フィルタホルダ本体から上方に延びて前記レンズが内部に取り付けられる保持チャンバを形成する上方伸長周壁を含む、請求項3に記載のカメラモジュール。
- 前記カメラモジュールの前記光フィルタホルダは、前記光フィルタホルダ本体から上方に延びて前記レンズが内部に取り付けられる保持チャンバを形成する上方伸長周壁と、前記光フィルタホルダ本体から下方に延びて下ハウジングチャンバを形成する下方伸長周壁とを含み、前記下ハウジングチャンバは、少なくとも前記一体型ベースを前記光フィルタホルダと共に内部に受容する、請求項3に記載のカメラモジュール。
- 前記カメラモジュールの前記一体型ベース本体の前記開口部は、下部から上部へサイズが徐々に大きくなる逆台形形状を有し、前記伸長脚部も、前記光フィルタホルダを前記一体型ベースと共に所定位置に保持するように、前記開口部の前記逆台形形状と整合する、請求項1に記載のカメラモジュール。
- 前記一体型ベースは、前記回路基板上に一体的に成型される、請求項1に記載のカメラモジュール。
- 前記カメラモジュールの前記一体型ベースは、前記レンズが内部に取り付けられるレンズ穴を規定する鏡筒と共にさらに形成される、請求項1に記載のカメラモジュール。
- 前記カメラモジュールの前記一体型ベースは、傾き角度を規定する内面を有する、請求項1に記載のカメラモジュール。
- 前記カメラモジュールは、少なくとも2つの一体型ベースアセンブリ、少なくとも2つの前記感光要素、少なくとも2つの前記レンズ、少なくとも2つの前記光フィルタホルダおよび少なくとも2つの前記光フィルタを含み、前記一体型ベースアセンブリは、ジョイント回路基板アセンブリを形成するように前記回路基板上に一体的にパッケージされ、前記一体型ベースアセンブリはそれぞれ1つの前記一体型ベースを含み、前記一体型ベースは、ジョイント一体型ベースを形成するように一体的に形成される、請求項1に記載のカメラモジュール。
- 前記カメラモジュールの前記光フィルタホルダは、前記光フィルタホルダ本体の上部から少なくとも部分的に突出する少なくとも1つの保持突起部をさらに含む、請求項3に記載のカメラモジュール。
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CN201621124404.2 | 2016-10-14 | ||
CN201621124964.8 | 2016-10-14 | ||
CN201621124509.8 | 2016-10-14 | ||
PCT/CN2016/106402 WO2017181668A1 (zh) | 2016-04-21 | 2016-11-18 | 基于一体封装工艺的摄像模组和阵列摄像模组 |
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CN105681637B (zh) * | 2016-03-15 | 2019-12-31 | 宁波舜宇光电信息有限公司 | 阵列摄像模组及其感光组件和制造方法 |
CN206272707U (zh) * | 2016-03-15 | 2017-06-20 | 宁波舜宇光电信息有限公司 | 阵列摄像模组和双摄像模组及其线路板组件和电子设备 |
US9848109B2 (en) * | 2016-04-21 | 2017-12-19 | Ningbo Sunny Opotech Co., Ltd. | Camera module and array camera module based on integral packaging technology |
CN110708454B (zh) * | 2016-04-21 | 2021-10-08 | 宁波舜宇光电信息有限公司 | 基于模塑工艺的摄像模组 |
KR102152517B1 (ko) * | 2016-04-21 | 2020-09-07 | 닝보 써니 오포테크 코., 엘티디. | 통합 패키징 프로세스를 기반으로 한 카메라 모듈 및 어레이 카메라 모듈 |
US10462338B2 (en) * | 2016-06-29 | 2019-10-29 | Microsoft Technology Licensing, Llc | Floating camera module |
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Publication number | Publication date |
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US20220303441A1 (en) | 2022-09-22 |
KR20190009298A (ko) | 2019-01-28 |
US10110791B2 (en) | 2018-10-23 |
US10129452B2 (en) | 2018-11-13 |
US20200120249A1 (en) | 2020-04-16 |
WO2017181668A1 (zh) | 2017-10-26 |
US12035029B2 (en) | 2024-07-09 |
US11533416B2 (en) | 2022-12-20 |
KR102152517B1 (ko) | 2020-09-07 |
US20180176430A1 (en) | 2018-06-21 |
US9900487B2 (en) | 2018-02-20 |
US10477088B2 (en) | 2019-11-12 |
US20170353646A1 (en) | 2017-12-07 |
JP2019514076A (ja) | 2019-05-30 |
US20170353640A1 (en) | 2017-12-07 |
US20170353644A1 (en) | 2017-12-07 |
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