JP6837897B2 - Touch sensor substrate and its manufacturing method - Google Patents

Description

The present invention relates to a touch sensor substrate for a capacitive touch panel sensor and a method for manufacturing the same.

In recent years, touch panel type input devices (hereinafter referred to as touch panel sensors) have been adopted in the operation units of various electronic devices such as mobile phones, personal digital assistants, and car navigation systems. The touch panel sensor is used by being attached as an input device for detecting the contact position of a fingertip or a pen tip on a display surface of a display panel such as a liquid crystal display device or an organic EL device. There are various types of touch panel sensors, such as a resistive film type and a capacitance type, depending on the structure and the detection method.

There are two types of capacitive touch panel sensors: surface type and projection type. Both methods detect the position by capturing the change in capacitance between the fingertip and the conductive film. Since electrostatic coupling occurs just by bringing the finger close to the sensor surface, it is possible to display a cursor before contact. What is pressed down needs to be an electrostatically conductive material equivalent to that of a finger or a finger, but the alternating current that flows in response to a change in capacitance does not depend on the impedance of the medium in contact.

In particular, the projection type capacitance method can detect multiple points at the fingertips. Generally, the projection type has a configuration in which a support substrate on which an electrode layer and a control IC are mounted is coated with a protective insulating resin. In the electrode layer, X-direction electrodes and Y-direction electrodes are arranged in a matrix on a transparent support substrate such as glass or plastic using a conductive electrode material (metal material such as copper or transparent electrode such as ITO). Has been done. When the X-direction electrode and the Y-direction electrode are formed on the same side of the transparent substrate, they are laid while maintaining insulation so as not to cause a short circuit at the intersection.

As a wiring pattern, it is preferable that the resistance is low, but since metal has a light-shielding property, it is necessary to form it sufficiently thin to increase the aperture ratio. Since the transparent electrode does not have a light-shielding property but has a problem of high resistance, a thin metal wire is often used so as to secure an aperture ratio to some extent as in Patent Document 1. The fine metal wire is formed by applying a conventional photolithography-etching method to a metal film in which a metal layer is fixed on a transparent film base material such as PET.

The touch panel sensor is grounded when an electrostatic and conductive medium such as a finger or hand is brought close to the wiring pattern when alternating current of the same voltage is applied to both ends of the thin metal wire in the same phase. It is an electronic device that utilizes the phenomenon that a capacitive coupling occurs between the considered medium and the thin metal wire (because it is also grounded) and an excessive alternating current flows through the thin metal wire.

Therefore, it is not necessary for the finger to directly touch the wiring pattern, and the wiring pattern may be touched or brought close to the wiring pattern via the dielectric. When the hand touches the wiring pattern of the sensor portion, the fine metal wire becomes dirty. Therefore, the wiring pattern of the X-direction electrode and the Y-direction electrode is usually covered with an antifouling transparent resin.

In principle, it is possible to detect which electrode material is close to which side simply by placing the electrode material appropriately on the base material, but in order to maintain the accuracy as a position sensor, as shown in FIG. The X-direction electrode and the Y-direction electrode are arranged in an XY matrix, and the position is calculated from the intersection by detecting which X-direction electrode and which Y-direction electrode are located, not where on which electrode. There is. Naturally, the electrodes in the X direction and the electrodes in the Y direction need to be insulated.

There are many reports that copper is used as a material with low electrical resistance as a thin metal wire that constitutes a wiring pattern. Wiring patterns that use pure copper as the main material have high reflectance, and the wiring that is visually glaring is very noticeable, which is not preferable. Therefore, when applying it to a touch panel, low reflection treatment is applied to suppress surface reflection of the wiring part. Is essential for practical use.

Patent Document 1 is a proposal relating to a laminated film including a blackening layer containing copper nitride (deposition by sputtering), and the surface (upper surface) is treated with low reflection (blackening) by wiring patterning of the laminated film. It is suitable for obtaining a wiring pattern.

Patent Document 2 is a proposal relating to a touch panel wiring pattern in which it is described that a copper oxide film is formed on a wiring surface (upper surface, side surface) by a chemical treatment after wiring patterning a copper layer.

Patent No. 6099875 Japanese Unexamined Patent Publication No. 2013-206315

The blackened layer made of copper oxide, copper nitride, copper oxynitride, etc. has higher electrical resistance than pure copper, and is required for external circuits (touch signal processing, transmitting device operation signals) from the touch wiring section and routing wiring. Most of the connection conductivity to be made is borne by the lower layer copper (pure copper).

If a blackening layer is formed on the terminals (pads) in the connection area between the routing wiring and the external circuit, which does not require visual low reflection treatment, it only reduces the connection reliability, but it is oxidized. Since it is not possible to leave the unstable pure copper as it is, the blackening layer is also required to play a role as a protective film.

An object of the present invention is to ensure connection reliability at the terminal (pad) portion in the connection region from the routing wiring to the external circuit while providing the blackening layer.

FPC (flexible wiring) is generally used for connection with the terminal (pad) portion in the connection region with the external circuit, and the bonding member is ACF (anisotropic conductive film) which is an adhesive film in which conductive particles are dispersed. Membrane) is often used. It is presumed that the cause of the poor connection with the blackening layer is that the conductive particles in the ACF do not sufficiently secure contact with the lower layer (pure copper) of the blackening layer.

In addition, there are many reports of poor adhesion as well as poor conduction due to the blackened layer.

In order to solve the above problems, the present invention provides a metal electrode formed by etching a metal layer provided with a metal blackening layer on the upper surface, an electrode signal extraction wiring, and an external connection terminal. It is a touch sensor board that has
The external connection terminal is formed of network wiring,
A metal layer that is not covered with the metal blackening layer is exposed on the side surface of the network wiring.
It is characterized in that the width of the thin metal wire constituting the network wiring is formed to be about the diameter of the conductive particles contained in the anisotropic conductive particle-containing material that electrically connects the external connection terminal to the electrode terminal of the flexible circuit. It is a substrate for a touch sensor.

In the present invention, according to this configuration, the conductive particles contained in the anisotropic conductive particle-containing material are connected to the metal layer exposed on the side surface of the thin metal wire of the network wiring, so that the external connection terminal is the conductive particles. It has the effect of ensuring electrical connection with the electrode terminals of the flexible circuit via.

Further, the present invention is the above-mentioned substrate for a touch sensor.
The touch sensor substrate is characterized in that the mesh pitch of the network wiring is formed to be 20 μm or more and 100 μm or less.

Further, the present invention is a method for manufacturing a substrate for a touch sensor, which comprises facing metal electrodes of X-direction electrode wiring and Y-direction electrode wiring on both sides of a transparent substrate.
A process of arranging a metal layer provided with a metal blackening layer on the surface on the side to be observed by the user on a transparent substrate, and by etching the metal layer, the metal electrode, the electrode signal extraction wiring, and an external connection are made. Has a process of collectively forming terminals for
By the etching, the external connection terminal is formed into a network wiring, and the external connection terminal is formed into a network wiring.
A metal layer that is not covered with the metal blackening layer is exposed on the side surface of the network wiring.
It is characterized in that the width of the thin metal wire constituting the network wiring is formed to be about the diameter of the conductive particles contained in the anisotropic conductive particle-containing material that electrically connects the external connection terminal to the electrode terminal of the flexible circuit. This is a method for manufacturing a substrate for a touch sensor.

Further, the present invention is the above-mentioned method for manufacturing a touch sensor substrate.
This is a method for manufacturing a substrate for a touch sensor, characterized in that the mesh pitch of the network wiring is formed to be 20 μm or more and 100 μm or less.

Further, the present invention is the above-mentioned method for manufacturing a touch sensor substrate.
The process of adhering the metal layer to the insulating resin film and
The step of forming a metal blackening layer on the surface of the metal layer and
Manufacture of a substrate for a touch sensor, which comprises a step of collectively forming the metal electrode, the electrode signal extraction wiring, and the external connection terminal by etching the metal layer and the metal blackening layer. The method.

Further, the present invention is the above-mentioned method for manufacturing a touch sensor substrate.
The process of adhering the metal layer on which the metal blackening layer is formed to the insulating resin film,
Manufacture of a substrate for a touch sensor, which comprises a step of collectively forming the metal electrode, the electrode signal extraction wiring, and the external connection terminal by etching the metal layer and the metal blackening layer. The method.

Further, the present invention is the above-mentioned method for manufacturing a touch sensor substrate.
It is a method for manufacturing a substrate for a touch sensor, which comprises a step of adhering a metal layer having a blackened metal layer on both sides to an insulating resin film.

The present invention has a metal electrode, an electrode signal extraction wiring, and an external connection terminal formed by etching a metal layer provided with a metal blackening layer, and the external connection terminal has a network shape. This is a touch sensor substrate formed of wiring and having a metal layer exposed on its side surface which is not covered with a metal blackening layer.

Since the external connection terminal is mesh-shaped, the joint with the ACF is intricately entangled, and even at the opening of the mesh, there are many places where the conductor layer under the blackening layer is exposed on the side of the conductor, and the conductive particles in the ACF The probability of contact with the particles is increased, the anchoring effect is improved, and both electrical conductivity and adhesion are improved.

As a result, when the external connection terminal of the touch sensor substrate is heat-bonded to the electrode terminal of the flexible circuit using the anisotropic conductive particle-containing material, the external connection terminal is not covered with the metal blackening layer. The metal layer has the effect of reliably electrically connecting to the electrode terminals of the flexible circuit via the conductive particles.

(A) It is a top view of the substrate for a touch sensor of embodiment of this invention. (B) The same is a side view of the touch sensor substrate. It is a top view which shows the outline of the net-like wiring pattern of the external connection terminal of the touch sensor substrate of the embodiment of this invention. It is sectional drawing which shows the outline of the net-like wiring pattern of the external connection terminal of the touch sensor substrate of the embodiment of this invention. It is a process diagram of the cross-sectional view which shows typically the manufacturing process of the substrate for a touch sensor of embodiment of this invention. (A) It is a top view which shows the process of installing an anisotropic conductive particle-containing material in the external connection terminal of the touch sensor substrate of the embodiment of this invention. (B) The same is a cross-sectional view. (A) It is a top view which shows the process of thermocompression bonding the external connection terminal of the touch sensor substrate of the embodiment of this invention to the electrode terminal of a flexible circuit through an anisotropic conductive particle containing material. (B) The same is a cross-sectional view. (A) A cross section showing a configuration in which conductive particles of an anisotropic conductive particle-containing material are connected to the network wiring of external connection terminals of the touch sensor substrate according to the embodiment of the present invention and are connected to electrode terminals of a flexible circuit. It is a figure. (B) The same is a perspective view.

Hereinafter, the touch sensor according to the embodiment of the present invention will be described with reference to FIGS. 1 to 4. The present invention manufactures a touch sensor substrate 10 as shown in FIG.

As shown in the plan view of FIG. 1A and the side view of FIG. 1B, the touch sensor substrate 10 has the X-direction electrode wiring 4 and the Y-direction electrode wiring 5 having a mesh structure on both sides of the transparent substrate 3. Deploy.

That is, on the touch sensor substrate 10, a rectangular region having a mesh structure is formed of thin metal wires as the X-direction electrode wiring 4 and the Y-direction electrode wiring 5 on the transparent substrate 3. The line width of the thin metal wire is formed to be 20 μm or less and 5 μm or more, which is not visually noticeable.

The X-direction electrode wiring 4 and the Y-direction electrode wiring 5 of the touch sensor substrate 10 are connected to the external connection terminal 9 via the pattern of the electrode signal extraction wiring 8.

As shown in FIG. 4, the outline of the manufacturing method of the touch sensor substrate 10 is as follows: X-direction electrode wiring 4 and electrodes composed of fine metal wires on an insulating resin film 2 such as PET (polyethylene terephthalate), PEN, or polyimide film. An X sensor film in which the signal extraction wiring 8 and the external connection terminal 9 are collectively formed is manufactured.

Similarly, a Y sensor film is manufactured in which the Y-direction electrode wiring 5 composed of fine metal wires, the electrode signal extraction wiring 8, and the external connection terminal 9 are collectively formed on the insulating resin film 2. Then, the X-sensor film and the Y-sensor film are laminated to manufacture a touch sensor substrate 10 having a structure having an X-direction electrode wiring 4 and a Y-direction electrode wiring 5 on both sides of the transparent substrate 3.

(X-direction electrode wiring 4 and Y-direction electrode wiring 5)
The X-direction electrode wiring 4 and the Y-direction electrode wiring 5 of the touch sensor are connected to the external connection terminal 9 via the electrode signal extraction wiring 8. Then, the electronic circuit of the touch sensor detects the touch position of the operator's finger by detecting the change in the current flowing through the external connection terminal 9.

(Metal blackening layer 1b)
Here, in order to prevent a decrease in visibility due to the metallic luster of the metal electrode, a metal blackening layer 1b is formed on the surfaces of the metal electrodes of the X-direction electrode wiring 4 and the Y-direction electrode wiring 5 by blackening treatment to form a metal blackening layer 1b on the metal electrode surface. To reduce the reflection and improve the visibility.

Therefore, as shown in FIG. 4A, the entire surface of the copper foil of the metal layer 1 arranged on the transparent insulating resin film 2 is blackened to form the metal blackening layer 1b. Next, the metal layer 1 is etched to collectively form a pattern of the X-direction electrode wiring 4 having a mesh structure of fine metal wires, the electrode signal extraction wiring 8, and the external connection terminal 9.

The Y-direction electrode wiring 5 is also formed on the transparent insulating resin film 2 in the same manner as the X-direction electrode wiring 4.

Then, as shown in FIG. 4C, the X-sensor film and the Y-sensor film are laminated to manufacture a touch sensor substrate 10 having a structure having an X-direction electrode wiring 4 and a Y-direction electrode wiring 5 on both sides of the transparent substrate 3. Then, as shown in the plan view of FIG. 1A, the X-direction electrode wiring 4 and the Y-direction electrode wiring 5 intersect.

The entire surface of the X-direction electrode wiring 4 formed on one side of the transparent substrate 3 of the touch sensor substrate 10 is covered with a protective insulating layer 6 such as melamine resin to protect the surface of the protective insulating layer 6, and the operator can cover the surface of the protective insulating layer 6. Make it a touch surface that can be operated by touching it with your finger. Further, the lower surface of the Y-direction electrode wiring 5 is protected by the protective insulating layer 7. The protective insulating layer 7 can also serve as the insulating resin film 2.

(External connection terminal 9)
As shown in FIG. 1A, the individual X-direction electrode wiring 4 and the Y-direction electrode wiring 5 of the touch sensor substrate 10 are connected to an external connection terminal 9 composed of a network wiring 9b via the electrode signal extraction wiring 8. Electrically connect to.

(Reticulated wiring 9b)
The external connection terminal 9 is formed together with the X-direction electrode wiring 4 and the Y-direction electrode wiring 5 by etching the copper thin film 1 on which the metal blackening layer 1b is formed. The external connection terminal 9 is formed into a mesh-structured network wiring 9b as shown in FIG. 2 by its etching process.

As shown in FIG. 7, the external connection terminal 9 composed of the network wiring 9b of the external connection terminal 9 is a flexible printed wiring board (also referred to as FPC) or a flexible flat cable via an anisotropic conductive particle-containing material ACF. It is thermocompression-bonded to the electrode terminal 21 of a flexible circuit FPC (also referred to as FFC) and electrically connected.

The anisotropic conductive particle-containing material ACF is an anisotropic conductive particle-containing film for heat-bonding, an anisotropic conductive particle-containing paste, or the like, and the anisotropic conductive particle-containing material ACF is several μm to several tens of μm. Includes conductive particles 31 having a particle size of up to. The external connection terminal 9 is electrically connected to the electrode terminal 21 of the flexible circuit FPC via the conductive particles 31. The conductive particles 31 have a particle size of 2 μm or more and 20 μm or less.

In order to ensure electrical connection between the external connection terminal 9 and the conductive particles 31, the line width of the thin metal wire of the mesh structure of the mesh wiring 9b of the external connection terminal 9 is 2 μm or more, which is about the particle size of the conductive particles 31. It is formed to have a line width of 20 μm or less. Further, the mesh pitch of the network wiring 9b is formed to be 20 μm or more and 100 μm or less.

The shape of the net-like wiring 9b can be formed into a mesh structure as shown in FIG. 2A. Further, the net-like wiring 9b can also be formed in a striped shape in which thin metal wires are parallel as shown in FIG. 2B. Alternatively, the net-like wiring 9b can be formed in a honeycomb shape as shown in FIG. 2C.

As shown in the cross-sectional view of FIG. 3, the external connection terminal 9 has a metal blackening layer 1b on the surface of the network wiring 9b of the external connection terminal 9, but the side surface 9c of the network wiring 9b newly formed by etching. The metal layer 1 is exposed on the surface. Further, when the metal layer 1 is etched, the side surface is etched into a shape having a skirt 9d, so that the skirt 9d with the metal layer 1 exposed is formed.

(Thermocompression bonding with flexible circuit FPC)
On the external connection terminal 9, as shown in the plan view of FIG. 5 (a) and the side view of FIG. 5 (b), the anisotropic conductive particle-containing film ACF or the anisotropic is formed on the external connection terminal 9. An anisotropic conductive particle-containing material ACF such as a conductive particle-containing paste ACP is placed.

Next, as shown in FIG. 6, a flexible circuit FPC is installed on the anisotropic conductive particle-containing material ACF, and the electrode terminal 21 of the flexible circuit FPC is connected to the external connection terminal 9 of the touch sensor substrate 10. Align. Then, an appropriate temperature and pressure are applied, and the electrode terminal 21 is thermocompression-bonded to the external connection terminal 9 to be joined.

(Conductive particles 31 of the anisotropic conductive particle-containing material ACF)
An anisotropic conductive particle-containing material ACF such as ACF or ACP is sandwiched between the external connection terminal 9 and the electrode terminal 21, and the electrode terminal 21 is pressed and pressed onto the external connection terminal 9 by thermocompression bonding. Then, as shown in the cross-sectional view of FIG. 7A, the anisotropic conductive particle-containing material ACF is pressed by the thin metal wire of the network wiring 9b having a line width of 2 μm or more and 20 μm or less due to the pressing force of thermocompression bonding.

Then, as shown in the cross-sectional view of FIG. 7A and the perspective view of FIG. 7B, the conductive particles 31 contained in the anisotropic conductive particle-containing material ACF form a mesh between the fine metal wires of the network wiring 9b. It falls into the opening portion 9e and is accumulated in the opening portion 9e.

The conductive particles 31 are connected to the metal layer 1 exposed on the side surface 9c and the base 9d of the thin metal wire of the network wiring 9b. As a result, the external connection terminal 9 has the effect of being reliably electrically connected to the electrode terminal 21 of the flexible circuit FPC via the conductive particles 31.

As a result, the electrode terminal 21 of the flexible circuit FPC and the external connection terminal 9 of the touch sensor substrate 10 can be made conductive regardless of the presence of the metal blackening layer 1b having a high surface resistance on the upper surface of the external connection terminal 9. it can.

(Modification example 1)
As a modification 1, metal layers 1 are arranged on both sides of the insulating resin film 2, and patterns of X-direction electrode wiring 4 and Y-direction electrode wiring 5 are formed on each of the metal layers 1 on both sides to form a touch sensor substrate. 10 can also be manufactured.

At that time, the metal layer 1 forming the pattern of the electrode wiring on the lower side of the touch sensor substrate 10 is a surface on which the metal blackening layer 1b is formed in advance on the surface and the metal blackening layer 1b is formed. Is attached to the insulating resin film 2.

As a result, in the metal layer 1 on the lower side of the touch sensor substrate 10, the metal blackening layer 1b faces upward. As a result, the metal blackening layer 1b can be provided on the upper surface of the touch sensor substrate 10 to be observed by the user, the surface of the metal electrode can be made low in reflection, and the visibility can be improved.

(Modification 2)
As a modification 2, the metal layer 1 to be adhered to the insulating resin film 2 can be used by adhering the metal layer 1 having the metal blackening layer 1b formed on both surfaces of the metal layer 1. As a result, regardless of which side of the touch sensor substrate 10 the user observes, the low-reflection metal blackening layer 1b is observed on the surface of the metal layer 1, and the visibility can be improved. There is.

(Production method)
Hereinafter, a method for manufacturing a touch panel sensor according to the present invention will be described with reference to FIG. In the manufacture of the touch panel sensor shown in FIG. 4, a film 2a with a metal foil in which a metal layer 1 having a predetermined thickness is provided on one main surface of an insulating resin film 2 such as PET serves as a starting base material for a series of processing.

The thickness of the insulating resin film 2 can be 10 μm or more and 200 μm or less, but it is preferably set as thin as possible in order to increase the sensor sensitivity.

For example, a film 2a with a copper foil obtained by adhering a metal layer 1 of a copper foil having a thickness of 12 μm to a PET film 2 having a thickness of 100 μm is used as a starting base material for processing.

Next, as shown in FIG. 4A, the metal layer 1 is subjected to a blackening treatment for reducing the metallic luster from the copper foil surface of the metal layer 1 and preventing reflection to form the metal blackening layer 1b. Form.

Alternatively, the electrolytic copper foil 1 on which the metal blackening layer 1b is previously formed on the surface may be attached to the PET film 2. In the blackening treatment, the surface of the metal layer 1 is made uneven to form a black film for antireflection, which is formed by changing the plating conditions of the copper pyrophosphate solution in the plating bath.

As shown in FIG. 4B, the copper foil 1 and the metal blackening layer 1b are etched by applying the photolitho method to the copper foil-attached film 2a in which the metal blackening layer 1b is formed on the surface of the metal layer 1 to form a stripe. Form a metal wiring pattern. By this process, an X sensor film on which the X direction electrode wiring 4 is formed and a Y sensor film on which the Y direction electrode wiring 5 is formed are manufactured.

By laminating the X-sensor film and the Y-sensor film manufactured in the above steps via a transparent adhesive OCA (Optical clear adhesive) or an adhesive film so that the X-direction electrode wiring 4 and the Y-direction electrode wiring 5 are orthogonal to each other. , The touch sensor substrate 10 is manufactured as shown in FIG. 4 (c).

In the lamination of the X sensor film and the Y sensor film, the dorsoventral surface is adhered so that the metal blackening layer 1b faces upward. As a result, the metal blackening layer 1b is provided on the upper surface of the touch sensor substrate 10 to be observed by the user, the surface of the metal electrode is made low in reflection, and the visibility is improved.

Finally, as shown in FIG. 4D, the surface of the upper sensor film is coated with the transparent adhesive OCA, and then covered with the protective insulating layer 6 such as a cover glass to complete the desired touch panel sensor substrate 10. Let me.

Next, as shown in FIG. 5, on the external connection terminal 9 of the X-direction electrode wiring 4 of the touch panel sensor substrate 10 and the external connection terminal 9 of the Y-direction electrode wiring 5, an anisotropic conductive particle-containing film ACF or An anisotropic conductive particle-containing material ACF such as an anisotropic conductive particle-containing paste ACP is formed.

Next, as shown in FIG. 6, a flexible circuit FPC is installed on the external connection terminal 9 on which the anisotropic conductive particle-containing material ACF is formed, and the electrode terminal 21 of the flexible circuit FPC is attached to the external connection terminal 9. , Join by thermocompression bonding.

As a result, as shown in FIG. 7, the conductive particles 31 of the anisotropic conductive particle-containing material ACF formed on the external connection terminal 9 are placed in the mesh opening portion 9e between the fine metal wires of the network wiring 9b. It is integrated and connected to the metal layer 1 exposed on the side surface 9c and the base 9d of the thin metal wire of the network wiring 9b. As a result, the external connection terminal 9 is electrically connected to the electrode terminal 21 of the flexible circuit FPC via the conductive particles 31.

By thermocompression bonding the external connection terminal 9 to the electrode terminal 21 of the flexible circuit FPC, the X-direction electrode wiring 4 and the Y-direction electrode wiring 5 are connected to the electronic circuit of the touch sensor via the flexible printed wiring board 20. .. Then, the electronic circuit of the touch sensor detects the touch position of the operator's finger by detecting the change in the current flowing through the external connection terminal 9.

The present invention is not limited to the above embodiments, and the metal blackening layer 1b on the surface of the metal layer 1 of the present invention is formed of copper oxide, copper nitride, and copper oxynitride described in the above embodiments. It is not limited to the metal blackening layer 1b or the metal blackening layer 1b formed by roughening the surface of the metal layer 1 having an uneven surface. In addition, the metal blackening layer 1b can be formed by using black nickel plating, black chrome plating, black Sn—Ni alloy plating, Sn—Ni—Cu alloy plating, black zinc chromate treatment, or the like.

1 ... Metal layer (copper foil)
1b ... (metal) blackening layer 2 ... insulating resin film 2a ... film with metal foil 3 ... transparent substrate 4, wiring pattern (X sensor)
5. Wiring pattern (Y sensor)
6, 7 ... Protective insulation layer 8 ... Electrode signal extraction wiring 9 ... External connection terminal 9b ... Network wiring 9c ... Side surface of network wiring 9d ... Base of network wiring 9e ...・ Opening portion 10 of the mesh ・ ・ ・ Substrate for touch sensor 21 ・ ・ ・ Electrode terminal 31 of flexible circuit ・ ・ ・ Conductive particle ACF of heteroconductive particle-containing material ・ ・ ・ FPC of heteroconductive particle-containing material・ ・ Flexible circuit OCA ・ ・ ・ Transparent adhesive

Claims (7)

A metal electrode metal layer metal blackening layer is provided is collectively formed by etching the upper surface, and the electrode signal output lead, a substrate for a touch sensor and a external connection terminal,
The external connection terminal is formed of network wiring,
A metal layer that is not covered with the metal blackening layer is exposed on the side surface of the network wiring.
The width of the thin metal wire constituting the network wiring is formed to be about the diameter of the conductive particles contained in the anisotropic conductive particle-containing material that electrically connects the external connection terminal to the electrode terminal of the flexible circuit .
A touch characterized in that the distance between the upper surfaces of the adjacent thin metal wires is larger than the diameter of the conductive particles so that the conductive particles are connected to the metal layer exposed on the side surface of the network wiring. Substrate for sensor. The touch sensor substrate according to claim 1.
A substrate for a touch sensor, characterized in that the mesh pitch of the network wiring is formed to be 20 μm or more and 100 μm or less. A method for manufacturing a touch sensor substrate, which comprises facing metal electrodes of X-direction electrode wiring and Y-direction electrode wiring on both sides of a transparent substrate.
A process of arranging a metal layer provided with a metal blackening layer on the surface on the side to be observed by the user on a transparent substrate, and by etching the metal layer, the metal electrode, the electrode signal extraction wiring, and an external connection are made. and use terminal comprising the step of forming collectively,
By the etching, the external connection terminal is formed into a network wiring, and the external connection terminal is formed into a network wiring.
A metal layer that is not covered with the metal blackening layer is exposed on the side surface of the network wiring.
The width of the thin metal wire constituting the network wiring is formed to be about the diameter of the conductive particles contained in the anisotropic conductive particle-containing material that electrically connects the external connection terminal to the electrode terminal of the flexible circuit.
A touch characterized in that the distance between the upper surfaces of the adjacent thin metal wires is larger than the diameter of the conductive particles so that the conductive particles are connected to the metal layer exposed on the side surface of the network wiring. Manufacturing method of substrate for sensor. The method for manufacturing a touch sensor substrate according to claim 3.
A method for manufacturing a substrate for a touch sensor, which comprises forming the mesh pitch of the network wiring to 20 μm or more and 100 μm or less. The method for manufacturing a touch sensor substrate according to claim 3.
The process of adhering the metal layer to the insulating resin film and
The step of forming a metal blackening layer on the surface of the metal layer and
The metal layer and by etching the metal black layer, and the metal electrode, and the electrode signal output lead, a substrate for a touch sensor, characterized in that it comprises a step of collectively forming an external connection terminal Production method. The method for manufacturing a touch sensor substrate according to claim 3.
The process of adhering the metal layer on which the metal blackening layer is formed to the insulating resin film,
The metal layer and by etching the metal black layer, and the metal electrode, and the electrode signal output lead, a substrate for a touch sensor, characterized in that it comprises a step of collectively forming an external connection terminal Production method. The method for manufacturing a touch sensor substrate according to claim 6.
A method for manufacturing a substrate for a touch sensor, which comprises a step of adhering a metal layer having a blackened metal layer on both sides to an insulating resin film.