JP2018180763A - Substrate for touch sensor and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To ensure continuity with ACF which is a joining member of a touch sensor substrate with a flexible substrate. SOLUTION: This is a touch sensor substrate having a metal electrode having a metal layer provided with a metal blackening layer on the upper surface etched and collectively formed, an electrode signal extraction wiring, and an external connection terminal. The external connection terminal is formed of a mesh wiring, a metal layer not covered with the metal blackening layer is exposed on the side surface of the network wiring, and the width of the thin metal wire constituting the network wiring is set to the width of the external connection terminal. Is formed with a width of about the diameter of the conductive particles contained in the heterogeneous conductive particle-containing material electrically connected to the electrode terminals of the flexible circuit. [Selection diagram] FIG. 7

Description

  The present invention relates to a touch sensor substrate of a capacitive touch panel sensor and a method of manufacturing the same.

  2. Description of the Related Art In recent years, touch panel type input devices (hereinafter referred to as touch panel sensors) have been adopted in the operation units of various electronic devices including mobile phones, portable information terminals, car navigation systems and the like. The touch panel sensor is used as an input device for detecting a contact position of a fingertip or a pen tip on a display surface of a display panel such as a liquid crystal display device or an organic EL device. There are various types of touch panel sensors, such as a resistance film type and a capacitance type, depending on the difference in the structure and detection method.

  There are two types of capacitive touch panel sensors: surface type and projection type. In both methods, the change in capacitance between the fingertip and the conductive film is detected to detect the position. As capacitive coupling occurs when the finger approaches the sensor surface, it is possible to perform cursor display before contact. What is required to be held down must be a finger or an electrostatic conductive equivalent to that of the finger, but the alternating current flowing according to the change in capacitance does not depend on the impedance of the contacting medium.

  In particular, the projection-type electrostatic capacitance system can detect multiple points of the fingertip. In general, a projection type has a configuration in which a supporting substrate on which an electrode layer and a control IC are mounted is covered with a protective insulating resin. The electrode layer is a transparent support substrate such as glass or plastic, and a conductive electrode material (a metal material such as copper or a transparent electrode such as ITO) is used to arrange X direction electrodes and Y direction electrodes in a matrix. It is done. When the X-direction electrode and the Y-direction electrode are formed on the same side of the transparent substrate, they are laid maintaining insulation so as not to short at the intersection.

  As the wiring pattern, although it is preferable that the resistance is low, since the metal is light shielding, it is necessary to form the metal sufficiently thin to increase the aperture ratio. There is a problem that the transparent electrode does not have a light shielding property but has a high resistance. Therefore, as in Patent Document 1, the metal fine wire is often used while securing an aperture ratio to some extent. The fine metal wires are formed by applying a standard photolithographic etching method to a metal film in which a metal layer is fixed on a transparent film substrate such as PET.

  The touch panel sensor is grounded when an electrostatic and conductive medium such as a finger or a hand is brought close to the wiring pattern when an alternating current having the same phase and the same voltage is applied to both ends of the metal thin wire. It is an electronic device utilizing the phenomenon that capacitive coupling occurs between a medium to be considered and a metal thin wire (because it is also grounded) and an excessive alternating current flows in the metal thin wire.

  Therefore, it is not necessary for the finger to directly touch the wiring pattern, and the wiring pattern may be in contact or in proximity via a dielectric. When the hand touches the wiring pattern of the sensor unit, the fine metal wires are soiled, so the wiring patterns of the X-direction electrode and the Y-direction electrode are usually coated with antifouling transparent resins and used.

  In principle, it is possible to detect which side of which electrode material is in close proximity by simply placing the electrode material on the substrate, but in order to maintain the accuracy as a position sensor, as shown in FIG. The X direction electrodes and the Y direction electrodes are arranged in a matrix of XY, and it is not located anywhere on which electrode, but which X direction electrode and which Y direction electrode are detected to calculate the position from the intersection point There is. Of course, the electrodes in the X direction and the electrodes in the Y direction need to be insulated.

  There are many reports of adopting copper as a material of low electrical resistance as a metal fine wire constituting a wiring pattern. A wiring pattern composed mainly of pure copper has a high reflectance, and the wiring visually recognized is not very visible, which is not preferable. Therefore, when applied to a touch panel, low reflection processing is performed to suppress surface reflection of the wiring portion. Is essential for practical use.

  Patent Document 1 is a proposal relating to a laminated film having a blackening layer (film formation by sputtering) containing copper nitride, and the surface (upper surface) is subjected to a low reflection (blackening) treatment by wiring patterning of the laminated film. It is suitable for obtaining a wiring pattern.

  Patent Document 2 is a proposal relating to a touch panel wiring pattern in which a copper oxide film is to be formed on the wiring surface (upper surface, side surface) by chemical treatment after wiring patterning of a copper layer.

Patent No. 6099875 JP, 2013-206315, A

  A blackened layer made of copper oxide, copper nitride, copper oxynitride or the like has a higher electrical resistance than pure copper, and it is required from the touch wiring part and lead wiring to an external circuit (touch signal processing and device operation signal transmission) Most of the connection conductivity is carried by the lower layer copper (pure copper).

  If a blackened layer is formed on the terminals (pads) in the connection region with the external wiring and the lead-out wiring which does not need to be visually subjected to low reflection processing, it only causes a decrease in connection reliability, but oxidation And the like, and it can not be left as pure pure copper, so the blackening layer is also required to have a role as a protective film.

  An object of the present invention is to secure connection reliability in a terminal (pad) portion in a connection region between a lead wiring and an external circuit while having a blackening layer.

  An FPC (flexible wiring) is generally used for connection with a terminal (pad) portion in a connection region with an external circuit, and an ACF (anisotropic conduction) which is an adhesive film in which conductive particles are dispersed as a bonding member There is much adoption of membrane). It is presumed that the cause of the connection failure with the blackening layer is that the contact between the conductive particles in the ACF and the lower layer (pure copper) of the blackening layer is not sufficiently secured.

  In addition to the conduction failure due to the blackening layer, there are many reports on adhesion failure.

In order to solve the above problems, the present invention provides a metal electrode, an electrode signal output wiring, and an external connection terminal, which are collectively formed by etching a metal layer provided with a metal blackening layer on the upper surface. A substrate for a touch sensor,
The external connection terminal is formed of a net-like wiring,
The metal layer not covered with the metal blackening layer is exposed on the side surface of the mesh wiring,
The width of the metal fine wire constituting the mesh-like wiring is formed to be about the diameter of the conductive particle included in the material containing anisotropic conductive particles for electrically connecting the external connection terminal to the electrode terminal of the flexible circuit. It is a touch sensor substrate to be used.

In the present invention, according to this configuration, the conductive particles contained in the anisotropic conductive particle-containing material are connected to the metal layer exposed on the side surface of the metal fine wire of the mesh wiring, whereby the terminal for external connection is the conductive particle There is an effect that electrical connection can be reliably made with the electrode terminal of the flexible circuit via

The present invention is the touch sensor substrate as described above,
The mesh pattern of the mesh wiring is formed to have a pitch of 20 μm to 100 μm.

The present invention is also a method of manufacturing a touch sensor substrate, in which the metal electrodes of the X direction electrode wiring on both sides of the transparent substrate and the Y direction electrode wiring are opposed to each other.
The step of disposing on a transparent substrate a metal layer provided with a metal blackening layer on the side to be observed by a user, and etching the metal layer, the metal electrode, the electrode signal extraction wiring, and the external connection Including the step of collectively forming the
The external connection terminal is formed into a net-like wiring by the etching;
Exposing a metal layer not covered by the metal blackening layer on the side surface of the mesh wiring,
The width of the metal fine wire constituting the mesh-like wiring is formed to be about the diameter of the conductive particle included in the anisotropic conductive particle-containing material for electrically connecting the external connection terminal to the electrode terminal of the flexible circuit. It is a manufacturing method of the substrate for touch sensors made into.

Further, according to the present invention, there is provided a method of manufacturing the touch sensor substrate described above,
In the method of manufacturing a touch sensor substrate, the mesh pitch of the mesh wiring is formed in the range of 20 μm to 100 μm.

Further, according to the present invention, there is provided a method of manufacturing the touch sensor substrate described above,
Bonding a metal layer to the insulating resin film;
Forming a metal blackening layer on the surface of the metal layer;
A method of manufacturing a substrate for a touch sensor, comprising the step of collectively forming the metal electrode, the electrode signal extraction wiring, and the external connection terminal by etching the metal layer and the metal blackening layer. It is a method.

Further, according to the present invention, there is provided a method of manufacturing the touch sensor substrate described above,
Bonding the metal layer on which the metal blackening layer is formed to the insulating resin film;
A method of manufacturing a substrate for a touch sensor, comprising the step of collectively forming the metal electrode, the electrode signal extraction wiring, and the external connection terminal by etching the metal layer and the metal blackening layer. It is a method.

Further, according to the present invention, there is provided a method of manufacturing the touch sensor substrate described above,
A method of manufacturing a touch sensor substrate, including the step of bonding a metal layer having a metal blackening layer formed on both sides to an insulating resin film.

  The present invention has a metal electrode, an electrode signal extraction wiring, and an external connection terminal formed by collectively etching a metal layer provided with a metal blackening layer, and the external connection terminal has a net shape. It is a board | substrate for touch sensors which was formed by wiring and the metal layer which is not covered with a metal blackening layer exposed to the side surface.

  Since the external connection terminals are mesh-like, junctions with ACF are intertwined intricately, and even at the opening of the mesh, the conductor layer under the blackening layer is more exposed at the side of the wire, and the conductive particles in the ACF The probability of contact is increased, the anchor effect is improved, and both the electrical conductivity and the adhesion are improved.

  Thus, when the external connection terminal of the touch sensor substrate is thermocompression-bonded to the electrode terminal of the flexible circuit using the anisotropic conductive particle-containing material, the metal blackening layer of the external connection terminal is not covered. The metal layer has an effect of reliably electrically connecting to the electrode terminal of the flexible circuit through the conductive particles.

(A) It is a top view of the board | substrate for touch sensors of embodiment of this invention. (B) It is a side view of the touch sensor substrate. It is a top view which shows the outline of the pattern of the mesh-like wiring of the terminal for external connection of the board | substrate for touch sensors of embodiment of this invention. It is sectional drawing which shows the outline of the pattern of the mesh-like wiring of the terminal for external connection of the board | substrate for touch sensors of embodiment of this invention. It is process drawing of the cross sectional view which shows typically the manufacturing process of the board | substrate for touch sensors of embodiment of this invention. (A) It is a top view which shows the process of installing an anisotropically conductive particle containing material in the terminal for external connection of the board | substrate for touch sensors of embodiment of this invention. (B) It is the same sectional drawing. (A) It is a top view which shows the process of thermocompression-bonding the terminal for external connection of the board | substrate for touch sensors of embodiment of this invention to the electrode terminal of a flexible circuit via anisotropic conductive particle containing material. (B) It is the same sectional drawing. (A) A cross section showing a configuration in which conductive particles of an anisotropic conductive particle-containing material are connected to the mesh wiring of the external connection terminal of the touch sensor substrate of the embodiment of the present invention and connected to the electrode terminal of the flexible circuit. FIG. (B) It is a perspective view.

  Hereinafter, a touch sensor according to an embodiment of the present invention will be described with reference to FIGS. 1 to 4. The present invention manufactures a touch sensor substrate 10 as shown in FIG.

  As shown in the plan view of FIG. 1A and the side view of FIG. 1B, the touch sensor substrate 10 has the mesh structure X direction electrode wiring 4 and Y direction electrode wiring 5 on both sides of the transparent substrate 3. Deploy.

  That is, in the touch sensor substrate 10, rectangular regions of a mesh structure are formed of metal thin wires as the X direction electrode wiring 4 and the Y direction electrode wiring 5 on the transparent substrate 3. The line width of the thin metal wire is 20 μm or less and 5 μm or more so as not to be visually noticeable.

  The X-direction electrode wiring 4 and the Y-direction electrode wiring 5 of the touch sensor substrate 10 are connected to the external connection terminal 9 through the pattern of the electrode signal output wiring 8.

  The outline of the method of manufacturing the touch sensor substrate 10 is, as shown in FIG. 4, an X-direction electrode wiring 4 and an electrode composed of fine metal wires on an insulating resin film 2 such as PET (polyethylene terephthalate), PEN or polyimide film. An X sensor film in which the signal extraction wiring 8 and the external connection terminal 9 are collectively formed is manufactured.

  Similarly, a Y sensor film in which the Y direction electrode wiring 5 composed of fine metal wires, the electrode signal output wiring 8 and the external connection terminal 9 are collectively formed on the insulating resin film 2 is manufactured. Then, the X sensor film and the Y sensor film are laminated, and a touch sensor substrate 10 having a structure in which the X direction electrode wiring 4 and the Y direction electrode wiring 5 are provided on both sides of the transparent substrate 3 is manufactured.

(X-direction electrode wire 4 and Y-direction electrode wire 5)
The X-direction electrode wiring 4 and the Y-direction electrode wiring 5 of the touch sensor are connected to the external connection terminal 9 through the electrode signal extraction wiring 8. Then, the electronic circuit of the touch sensor detects a change in the current flowing to the external connection terminal 9 to detect the touch position of the finger of the operator.

(Metal blackening layer 1b)
Here, in order to prevent a decrease in visibility due to the metallic gloss of the metal electrode, the surface of the metal electrode of the X-direction electrode wiring 4 and the Y-direction electrode wiring 5 is blackened to form a metal blackening layer 1b. Low reflection to improve visibility.

  Therefore, as shown in FIG. 4A, the entire surface of the copper foil of the metal layer 1 disposed on the transparent insulating resin film 2 is blackened to form the metal blackened layer 1b. Next, the metal layer 1 is etched to collectively form patterns of the X direction electrode wiring 4 having a mesh structure of metal fine wires and the electrode signal extraction wiring 8 and the external connection terminal 9.

  Similarly to the X-direction electrode wire 4, the Y-direction electrode wire 5 is also formed on the transparent insulating resin film 2.

  Then, as shown in FIG. 4C, the X sensor film and the Y sensor film are laminated, and the touch sensor substrate 10 having a structure in which the X direction electrode wiring 4 and the Y direction electrode wiring 5 are provided on both sides of the transparent substrate 3 is manufactured. As shown in the plan view of FIG. 1A, the X-direction electrode wiring 4 and the Y-direction electrode wiring 5 cross each other.

  The entire surface of the X-direction electrode wiring 4 formed on one side of the transparent substrate 3 of the touch sensor substrate 10 is covered and protected with a protective insulating layer 6 such as melamine resin, and the operator can protect the surface of the protective insulating layer 6 Make it a touch surface to touch and operate with your finger. Further, the lower surface of the Y-direction electrode wiring 5 is protected by the protective insulating layer 7. The protective insulating layer 7 can also be used as the insulating resin film 2.

(Terminal 9 for external connection)
The X-direction electrode wires 4 and the Y-direction electrode wires 5 of the touch sensor substrate 10 are, as shown in FIG. 1A, external connection terminals 9 formed of mesh-like wires 9 b via the electrode signal output wires 8. Electrically connected to

(Reticulated wiring 9b)
The external connection terminal 9 is collectively formed together with the X-direction electrode wiring 4 and the Y-direction electrode wiring 5 by etching the copper thin film 1 on which the metal blackening layer 1 b is formed. The external connection terminal 9 is formed into the mesh-like wiring 9b having a mesh structure as shown in FIG. 2 by the etching process.

  As shown in FIG. 7, the external connection terminal 9 configured by the mesh-like wiring 9b of the external connection terminal 9 is a flexible printed wiring board (also referred to as FPC) or a flexible flat cable via an anisotropic conductive particle-containing material ACF. They are thermocompression-bonded and electrically connected to the electrode terminals 21 of a flexible circuit FPC such as (also referred to as FFC).

  The anisotropic conductive particle-containing material ACF is an anisotropic conductive particle-containing film, an anisotropic conductive particle-containing paste, or the like for thermocompression bonding, and the anisotropic conductive particle-containing material ACF has a thickness of several μm to several tens of μm. The conductive particles 31 of up to the particle size are included. The external connection terminal 9 is electrically connected to the electrode terminal 21 of the flexible circuit FPC via the conductive particle 31. The conductive particles 31 have a particle size of 2 μm to 20 μm.

  In order to electrically connect the external connection terminal 9 and the conductive particle 31 reliably, the line width of the metal thin wire of the mesh structure of the mesh wiring 9b of the external connection terminal 9 is 2 μm or more of the particle diameter of the conductive particle 31 The line width is formed to 20 μm or less. Further, the mesh pitch of the mesh wiring 9b is formed to be 20 μm or more and 100 μm or less.

  The shape of the mesh wiring 9b can be formed into a mesh structure as shown in FIG. 2 (a). Also, the mesh-like wiring 9b can be formed in a stripe shape in which metal thin wires are parallel as shown in FIG. 2 (b). Alternatively, the mesh wiring 9b can be formed in a honeycomb shape as shown in FIG. 2 (c).

  The external connection terminal 9 has the metal blackening layer 1b on the surface of the mesh-like wiring 9b of the external connection terminal 9 as shown in the sectional view of FIG. 3. However, the side surface 9c of the mesh-like wiring 9b newly formed by etching The metal layer 1 is exposed to the Further, when the metal layer 1 is etched, the side surface is etched into a shape having a foot 9 d, whereby the foot 9 d in which the metal layer 1 is exposed is formed.

(Thermal pressure bonding with flexible circuit FPC)
As shown in the plan view of FIG. 5 (a) and the side view of FIG. 5 (b), the anisotropically conductive particle-containing film ACF, the anisotropically conductive particle-containing film 9, and the external connection terminal 9 are shown. An anisotropic conductive particle-containing material ACF such as a conductive particle-containing paste ACP is placed.

  Next, as shown in FIG. 6, the flexible circuit FPC is placed on the anisotropic conductive particle-containing material ACF, and the electrode terminals 21 of the flexible circuit FPC are connected to the external connection terminals 9 of the touch sensor substrate 10. Align. Then, an appropriate temperature and pressure are applied, and the electrode terminal 21 is thermocompression-bonded to the external connection terminal 9 and joined.

(Conductive particle 31 of anisotropic conductive particle-containing material ACF)
While sandwiching an anisotropically conductive particle-containing material ACF such as ACF or ACP between the external connection terminal 9 and the electrode terminal 21, the electrode terminal 21 is pressed and pressed onto the external connection terminal 9 by thermocompression bonding. Then, as shown in the cross-sectional view of FIG. 7A, the anisotropic conductive particle-containing material ACF is separated by the thin metal wires of the mesh wiring 9b having a line width of 2 μm to 20 μm by the pressure of the thermocompression bonding.

  Then, as in the cross-sectional view of FIG. 7A and the perspective view of FIG. 7B, the conductive particles 31 contained in the anisotropic conductive particle-containing material ACF are the network of the metal thin wires of the mesh wiring 9b. The recessed part in the opening part 9e is accumulated in the opening part 9e.

  The conductive particles 31 are connected to the metal layer 1 exposed to the side surface 9c and the bottom 9d of the metal thin wire of the mesh wiring 9b. Thereby, there is an effect that the external connection terminal 9 can be electrically connected to the electrode terminal 21 of the flexible circuit FPC reliably via the conductive particles 31.

  Thereby, regardless of the presence of the metal blackening layer 1b having a high surface resistance on the upper surface of the external connection terminal 9, the electrode terminal 21 of the flexible circuit FPC and the external connection terminal 9 of the touch sensor substrate 10 can be conducted. it can.

(Modification 1)
As a first modification, the metal layer 1 is disposed on both sides of the insulating resin film 2, and the patterns of the X direction electrode wiring 4 and the Y direction electrode wiring 5 are formed on each of the metal layers 1 on both sides 10 can also be manufactured.

  At that time, the metal layer 1 forming the pattern of the electrode wiring on the lower side of the touch sensor substrate 10 is the surface on which the metal blackening layer 1b is formed and the metal layer 1 on which the metal blackening layer 1b is formed in advance Is bonded to the insulating resin film 2.

Thereby, the metal black layer 1b of the metal layer 1 on the lower side of the touch sensor substrate 10 faces upward. As a result, the metal black layer 1 b can be provided on the upper surface of the touch sensor substrate 10 observed by the user to reduce the reflection on the surface of the metal electrode and improve the visibility.

(Modification 2)
As a second modification, the metal layer 1 bonded to the insulating resin film 2 can be used by bonding the metal layer 1 in which the metal blackening layer 1 b is formed on both surfaces of the metal layer 1. Thereby, the metal blackened layer 1 b with low reflection is observed on the surface of the metal layer 1 even if the user observes from either side of the touch sensor substrate 10, and the visibility can be improved. There is.

(Production method)
Hereinafter, a method of manufacturing a touch panel sensor according to the present invention will be described with reference to FIG. In the manufacture of the touch panel sensor shown in FIG. 4, a metal-foiled film 2 a in which a metal layer 1 having a predetermined thickness is disposed on one main surface of an insulating resin film 2 such as PET is a starting base material for a series of processes.

  The thickness of the insulating resin film 2 can be 10 μm or more and 200 μm or less, but in order to increase the sensor sensitivity, it is preferable to set the thickness as thin as possible.

  For example, a film 2a with copper foil in which a metal film 1 of copper foil with a thickness of 12 μm is bonded to a PET film 2 with a thickness of 100 μm is used as a starting base material for processing.

  Next, as shown in FIG. 4 (a), the metallic gloss of the metal layer 1 from the surface of the copper foil is reduced to give a metallic blackening layer 1b by applying a blackening treatment to the metal layer 1 to prevent reflection. Form.

  Alternatively, the electrodeposited copper foil 1 in which the metal blackening layer 1b is formed in advance on the surface may be bonded to the PET film 2. In the blackening treatment, the surface of the metal layer 1 is made uneven to form a black film for anti-reflection, and the plating condition of the copper pyrophosphate solution in the plating bath is changed.

  As shown in FIG. 4 (b), the copper foil 1 and the metal blackening layer 1b are etched by applying the photolithographic method to the copper foil attached film 2a having the metal blackening layer 1b formed on the surface of the metal layer 1, thereby forming stripes. Form a metal wiring pattern of By this processing, the X sensor film in which the X direction electrode wiring 4 is formed and the Y sensor film in which the Y direction electrode wiring 5 is formed are manufactured.

  By laminating the X sensor film and the Y sensor film manufactured in the above-described steps via the transparent adhesive OCA (Optical clear adhesive) or an adhesive film so that the X direction electrode wiring 4 and the Y direction electrode wiring 5 are orthogonal to each other. As shown in FIG. 4C, the touch sensor substrate 10 is manufactured.

  The lamination of the X sensor film and the Y sensor film bonds the back and flank so that the metal blackening layer 1b faces upward. Thereby, the metal blackening layer 1 b is provided on the upper surface of the touch sensor substrate 10 observed by the user to reduce the reflection on the surface of the metal electrode, thereby improving the visibility.

  Finally, as shown in FIG. 4D, the surface of the upper sensor film is covered with a transparent adhesive OCA, and then covered with a protective insulating layer 6 such as a cover glass to complete the desired touch panel sensor substrate 10 Let

  Next, as shown in FIG. 5, on the external connection terminal 9 of the X direction electrode wiring 4 of the touch panel sensor substrate 10 and the external connection terminal 9 of the Y direction electrode wiring 5, an anisotropic conductive particle containing film ACF or An anisotropically conductive particle-containing material ACF such as an anisotropically conductive particle-containing paste ACP is formed.

  Next, as shown in FIG. 6, the flexible circuit FPC is placed on the external connection terminal 9 on which the anisotropic conductive particle-containing material ACF is formed, and the electrode terminal 21 of the flexible circuit FPC is attached to the external connection terminal 9. Join by thermocompression bonding.

  Thereby, as shown in FIG. 7, the conductive particles 31 of the anisotropic conductive particle-containing material ACF formed on the external connection terminal 9 are in the opening 9e of the mesh between the metal fine wires of the mesh wiring 9b. They are integrated and connected to the metal layer 1 exposed to the side surface 9c and the foot 9d of the fine metal wire of the mesh wiring 9b. Thereby, the external connection terminal 9 is electrically connected to the electrode terminal 21 of the flexible circuit FPC via the conductive particle 31.

  By thermocompression-bonding the external connection terminal 9 to the electrode terminal 21 of the flexible circuit FPC, the X-direction electrode wiring 4 and the Y-direction electrode wiring 5 are connected to the electronic circuit of the touch sensor through the flexible printed wiring board 20 . Then, the electronic circuit of the touch sensor detects a change in the current flowing to the external connection terminal 9 to detect the touch position of the finger of the operator.

  The present invention is not limited to the above embodiment, and the metal black layer 1b on the surface of the metal layer 1 of the present invention is formed of copper oxide, copper nitride, copper oxynitride described in the above embodiment. It is not limited to the metal blackening layer 1b, or the metal blackening layer 1b formed by roughening the surface which made the surface of the metal layer 1 uneven. Besides, it is also possible to form the metal blackening layer 1b using black nickel plating, black chromium plating, black Sn-Ni alloy plating, Sn-Ni-Cu alloy plating, black zinc chromate treatment, or the like.

1 ・ ・ ・ Metal layer (copper foil)
1b ... (metal) blackening layer 2 ... insulating resin film 2 a ... film with metal foil 3 ... transparent substrate 4, wiring pattern (X sensor)
5, wiring pattern (Y sensor)
6, 7 · · · Protective insulating layer 8 · · · Electrode signal extraction wiring 9 · · · Terminals for external connection 9 · · · Network wiring 9c · · · Side surface 9d of mesh wiring · · · · 9 9 · · · -Opening portion 10 of mesh-Substrate for touch sensor 21-Electrode terminal 31 of flexible circuit-Conductive particle ACF of anisotropic conductive particle containing material-anisotropic conductive particle containing material FPC- · · Flexible circuit OCA · · · Transparent adhesive

Claims (7)

A substrate for a touch sensor, comprising a metal electrode formed by collectively etching a metal layer provided with a metal blackening layer on the upper surface, an electrode signal extraction wiring, and an external connection terminal,
The external connection terminal is formed of a net-like wiring,
The metal layer not covered with the metal blackening layer is exposed on the side surface of the mesh wiring,
The width of the metal fine wire constituting the mesh-like wiring is formed to be about the diameter of the conductive particle included in the material containing anisotropic conductive particles for electrically connecting the external connection terminal to the electrode terminal of the flexible circuit. A substrate for touch sensor. The touch sensor substrate according to claim 1, wherein
The substrate for a touch sensor, wherein the mesh pitch of the mesh wiring is formed in a range of 20 μm to 100 μm. It is a manufacturing method of a substrate for touch sensors which makes metal electrodes of X direction electrode wiring on both sides of a transparent substrate, and metal electrode of Y direction electrode wiring oppose,
The step of disposing on a transparent substrate a metal layer provided with a metal blackening layer on the side to be observed by a user, and etching the metal layer, the metal electrode, the electrode signal extraction wiring, and the external connection Including the step of collectively forming the
The external connection terminal is formed into a net-like wiring by the etching;
Exposing a metal layer not covered by the metal blackening layer on the side surface of the mesh wiring,
The width of the metal fine wire constituting the mesh-like wiring is formed to be about the diameter of the conductive particle included in the anisotropic conductive particle-containing material for electrically connecting the external connection terminal to the electrode terminal of the flexible circuit. And a method of manufacturing a touch sensor substrate. The method for manufacturing a touch sensor substrate according to claim 3,
The method for manufacturing a touch sensor substrate, wherein the mesh pitch of the mesh wiring is formed in a range of 20 μm to 100 μm. The method for manufacturing a touch sensor substrate according to claim 3,
Bonding a metal layer to the insulating resin film;
Forming a metal blackening layer on the surface of the metal layer;
A method of manufacturing a substrate for a touch sensor, comprising the step of collectively forming the metal electrode, the electrode signal extraction wiring, and the external connection terminal by etching the metal layer and the metal blackening layer. Method. The method for manufacturing a touch sensor substrate according to claim 3,
Bonding the metal layer on which the metal blackening layer is formed to the insulating resin film;
A method of manufacturing a substrate for a touch sensor, comprising the step of collectively forming the metal electrode, the electrode signal extraction wiring, and the external connection terminal by etching the metal layer and the metal blackening layer. Method. 7. The method for manufacturing a touch sensor substrate according to claim 6, wherein
A method for producing a touch sensor substrate, comprising the step of bonding a metal layer having a metal blackening layer formed on both sides to an insulating resin film.